TWM649319U - Finned heat sinks - Google Patents

Abstract

This invention proposes a fin-type radiator. The fin-type radiator has a base plate, at least a first heat conduction member, a second heat conduction member, and a heat dissipation fin assembly. The base plate is connected to the heat source. The first heat-conducting member is a curved heat pipe and has a heat-absorbing section and two heat-dissipating sections. The heat-absorbing section is connected to the base plate. The heat dissipation sections are respectively connected to the opposite ends of the heat absorption section. The second heat-conducting member is connected to the heat-absorbing section and has at least one extended heat-conducting portion and a connecting heat-conducting portion. The connecting heat conduction part and the substrate jointly surround the heat dissipation section. The extended thermal conductive part is a heat pipe and extends away from the substrate. The heat dissipation fin assembly is connected to and penetrated by each heat dissipation section and each extended heat conduction portion. In this way, the first heat-conducting member and the second heat-conducting member can share and accelerate the conduction of heat energy, so that the heat source can dissipate heat more efficiently, thereby achieving higher performance.

Description

fin radiator

The invention relates to a radiator, in particular to a fin type radiator.

With the rapid development of technology, the performance and computing power of electronic devices are becoming more and more powerful. However, the powerful performance and computing power make electronic devices dissipate more heat energy. Thermal energy will increase the operating temperature of electronic equipment, further affecting circuit operation and increasing energy consumption. Therefore, it is necessary to deal with the heat dissipation problem.

Fin heat sinks are an existing heat dissipation technology. The fin radiator has a plurality of metal sheet bodies and a thermal conductive base. Each metal sheet body is arranged parallel and side by side, and one of the metal sheet bodies is connected to the thermal conductive base. A heat source component, such as a central processing unit (English: Central Processing Unit, abbreviation: CPU) or a graphics processor (English: Graphics Processing Unit, abbreviation: GPU), etc., is connected to the heat-conducting base to transfer heat energy to the fins through heat conduction. on each metal plate body of the radiator. Usually there is a cold source connected to the fin radiator, such as a water cooling pipe or an air cooling fan, to exchange heat with the fin radiator to achieve a heat dissipation effect.

However, with the introduction of a new generation of high-speed data processing and fast computing heating components, the heat dissipation requirements of electronic equipment have also increased, and the existing fin radiators have become increasingly overwhelmed.

This creation mainly proposes a fin-type radiator that can be used to dissipate heat more efficiently.

In order to achieve the above purpose, this invention proposes a fin-type heat sink, which is used to dissipate heat from a heat source and has: A substrate having: One side is connected to the heat source; At least one first thermal conductive member having: a heat-absorbing section connected to the substrate and having two opposite ends; Two heat dissipation sections, which are respectively connected to the opposite ends of the heat absorption section and extend away from the substrate; A second heat-conducting member is connected to the heat-absorbing section and has: At least one extended thermal conductive portion extending away from the substrate; A heat dissipation fin assembly having: Several heat dissipation fins are aligned with each other; each heat dissipation fin has: a first segment having opposite ends and having: At least one first hole is provided in the first segment; the at least one first hole on each of the heat dissipation fins is aligned with each other; all the first holes that are aligned with each other are collectively passed through by one of the extended thermal conductive parts; 2. Second segments, which are respectively connected to the opposite ends of the first segment, and respectively have: At least one second hole is provided on the second segment; the at least one second hole on each of the heat dissipation fins is aligned with each other; all the second holes aligned with each other are jointly covered by one of the first heat conductive members. This heat dissipation section passes through.

With the above structure, the advantage of this invention is that the first thermal conductive member and the second thermal conductive member can share and accelerate the conduction of heat energy, so that the heat source can dissipate heat more efficiently, thereby achieving higher performance.

As the fin-type heat sink mentioned above, the fin-type heat sink has a plurality of first heat-conducting members; each heat-absorbing section is arranged side by side on the substrate.

As mentioned above, each fin type radiator has: Several extension holes; each extension hole on each heat dissipation fin is connected to each first hole or each second hole on each heat dissipation fin.

As mentioned above, each fin type radiator has: Several annular fins are respectively arranged around each hole and connected around the heat dissipation section or the extended heat conduction part.

The fin type heat sink as mentioned above, wherein the second heat conducting member has: A connecting thermal conductive part, which is connected to the extended thermal conductive part and to the heat absorbing section; The substrate is connected to the connecting heat conduction part, and together with the connection heat conduction part, surrounds the heat dissipation section.

The fin type heat sink as mentioned above, wherein the extended heat conduction part is a heat pipe.

The fin type heat sink as mentioned above, wherein the at least one first heat conducting member is a heat pipe.

As mentioned above, the fin-type heat sink has: a first side, which is attached to the substrate, and the first side and the substrate together surround the heat dissipation section; A second side is opposite to the first side, and the area of the second side is larger than the area of the first side.

Please refer to Figures 1 to 4. This invention proposes a fin-type heat sink, which is used to dissipate heat from a heat source. The fin type heat sink has a base plate 10, at least a first heat conductive member 20, a second heat conductive member 30, and a heat dissipation fin assembly 40.

The substrate 10 has a side surface 11 . The side 11 is connected to the heat source, and the heat source transfers the emitted heat energy through the substrate 10 to the fin-type heat sink through thermal conduction.

The first heat conductive member 20 has a heat absorption section 21 and two heat dissipation sections 22 . The heat-absorbing section 21 is connected to the substrate 10 and has two opposite ends. The heat dissipation sections 22 are respectively connected to two opposite ends of the heat absorption section 21 and extend away from the substrate 10 . The first heat conducting member 20 is a curved heat pipe, and the heat absorbing section 21 and the two heat dissipating sections 22 form a U-shaped or U-shaped heat pipe. In this embodiment, the fin-type heat sink has several first heat conductive members 20 , and each heat absorbing section 21 is attached to the substrate 10 side by side and parallel to each other. The substrate 10 transfers the heat energy to the heat absorbing section 21, and then the heat absorbing section 21 transfers the heat energy to the heat dissipating sections 22 at both ends through the structure of the heat pipe.

The second heat conducting member 30 is connected to the heat absorbing section 21 and has at least one extending heat conducting portion 31 and a connecting heat conducting portion 32 . Each extended thermal conductive portion 31 is a heat pipe and extends away from the substrate 10 . The connecting heat conduction part 32 has a first side and a second side. The first side surface is attached to the substrate 10 and together with the substrate 10 surrounds the heat dissipation section 22 . The extended heat conducting part 31 and the connecting heat conducting part 32 are connected to the second side surface. The area of the second side is greater than the area of the first side. The connecting thermal conductive part 32 is used to absorb the thermal energy on the heat dissipation section 22 and the substrate 10 and transfer the thermal energy to the extended thermal conductive part 31 , and then transfer the thermal energy out through the heat pipe structure of the extended thermal conductive part 31 . In this embodiment, the connecting heat conducting part 32 is a plate, and the connecting heat conducting part 32 is composed of multiple plates of different sizes stacked in a ladder form from small to large, thereby enlarging the surface area and improving heat dissipation efficiency.

The heat dissipation fin assembly 40 is connected to and penetrated by each heat dissipation section 22 and each extended heat conduction portion 31 . Please refer to Figure 2, Figure 4, and Figure 5. The heat dissipation fin assembly 40 has a plurality of heat dissipation fins 41 . The heat dissipation fins 41 are aligned with each other. The heat dissipation fin is divided into a first segment 42 and two second segments 43, and has a plurality of extension holes 412 and a plurality of annular fins 413. The first segment 42 has two opposite ends and has at least one first hole 421 . The first hole 421 is provided in the first segment 42 . The first holes 421 on all the heat dissipation fins are aligned with each other. All the first holes 421 aligned with each other are passed through by one of the extended heat conducting portions 31 . The two second segments 43 are respectively connected to opposite ends of the first segment 42 and have at least one second hole 431 respectively. The second hole 431 is provided on the second segment 43 . The second holes 431 on each heat dissipation fin are aligned with each other. The mutually aligned second holes 431 are collectively passed through by one of the heat dissipation sections 22 of one of the first heat conductive members 20 .

Each extension hole 412 is connected to each first hole 421 or each second hole 431 respectively. Each extension hole 412 is aligned on the heat dissipation fin assembly 40 to form a flow channel. Each annular protrusion 413 is arranged around each first hole 421 or each second hole 431 , and is connected around the heat dissipation section 22 passing through each first hole 421 or the extended heat conduction portion 31 passing through each second hole 431 . The heat dissipation section 22 and the extended heat conduction portion 31 conduct heat energy to the heat dissipation fins 41 respectively through the first holes 421 and the second holes 431 and the annular fins 413 around them.

When the heat dissipation fin assembly 40 of the present invention is equipped with an air cooling device, such as a fan, the cold air is directed between the heat dissipation fins 41, and the cold air can pass through the flow channel formed by the extension hole 412, and the heat dissipation fins 41, The heat dissipation section 22 and the extended heat conduction part 31 perform heat exchange to achieve the heat dissipation effect.

From the perspective of heat energy transfer, the heat source transfers heat energy to the substrate 10 by contacting the side 11 of the substrate 10 . The thermal energy is then transferred from the substrate 10 to the first thermal conductive member 20 and the second thermal conductive member 30 . The first heat conductive member 20 transfers heat energy to the heat dissipation fin assembly 40 through the heat pipe structure of the extended heat dissipation section 22 . The second heat-conducting member 30 transmits heat energy to the heat-dissipating fin assembly 40 through the heat pipe structure extending out of the extended heat-conducting portion 31 . Finally, the air cooling device performs heat exchange when the heat energy is taken away from the fin radiator.

The advantage of this invention is that the first thermal conductive member 20 and the second thermal conductive member 30 can share and accelerate the conduction of heat energy, so that the heat source can dissipate heat more efficiently, thereby achieving higher performance. The annular fins 413 increase the contact area between the heat dissipation fins 41 and the first heat conductive member 20 and the second heat conductive member 30, making heat conduction more efficient.

10:Substrate

11:Side

20:The first thermal conductor

21: Endothermic section

22:Heating section

30:Second thermal conductor

31: Extended thermal conductive part

32: Connect the thermal conductive part

40: Cooling fin assembly

41: Cooling fins

42: First clip

43:Second clip

421:The first hole

431:Second hole

412:Extension hole

413: Annular tab

Figure 1 is a three-dimensional schematic diagram of this creation. Figure 2 is an exploded schematic diagram of this creation. Figure 3 is an exploded schematic diagram of the substrate, the first thermal conductive member, and the second thermal conductive member of this invention. Figure 4 is a schematic side view of this creation. Figure 5 is a top view of this creation.

10:Substrate

11:Side

20:The first thermal conductor

22:Heating section

30:Second thermal conductor

31: Extended thermal conductive part

32: Connect the thermal conductive part

40: Cooling fin assembly

41: Cooling fins

412:Extension hole

413: Annular tab

42: First clip

43:Second clip

Claims (8)

A fin-type heat sink, which is used to dissipate heat from a heat source, and has: a base plate, which has: a side surface connected to the heat source; at least a first heat conductive member, which has: a heat absorption section connected to the heat source. on the substrate, and has two opposite ends; two heat dissipation sections, which are respectively connected to the opposite ends of the heat absorption section, and extend away from the substrate; a second heat conductive member, which is connected to the heat absorption section, and has: at least an extended thermal conductive portion extending away from the substrate; a heat dissipation fin assembly having: a plurality of heat dissipation fins, which are aligned with each other; each heat dissipation fin has: a first segment with two opposite ends, And it has: at least one first hole, which is provided in the first segment; the at least one first hole on each of the heat dissipation fins is aligned with each other; all the first holes that are aligned with each other are collectively passed through by one of the extended thermal conductive parts ; Two second segments, which are respectively connected to the opposite ends of the first segment, and each have: at least one second hole, which is provided on the second segment; the at least one second hole on each of the heat dissipation fins Aligned with each other; all the second holes aligned with each other are collectively passed through by one of the heat dissipation sections of one of the first heat conductive members. The fin-type heat sink according to claim 1, the fin-type heat sink has a plurality of first heat conductive parts; each of the heat-absorbing sections is arranged side by side on the substrate. The fin type radiator as described in claim 1, wherein each of the cooling fins has: Several extension holes; each extension hole on each heat dissipation fin is connected to each first hole or each second hole on each heat dissipation fin. The fin-type heat sink according to claim 3, wherein each of the heat dissipation fins has: a plurality of annular fins, which are respectively ringed around each of the holes and connected to the heat dissipation section or the extended heat conduction part. The fin-type heat sink according to claim 1, wherein the second thermal conductive member has: a connecting thermal conductive part connected to the extended thermal conductive part and connected to the heat absorption section; the substrate is connected to the connecting thermal conductive part , and together with the connecting heat conduction part, surround the heat dissipation section. The fin heat sink of claim 1, wherein the extended heat conduction part is a heat pipe. The fin heat sink of claim 1, wherein the at least one first heat conductive member is a heat pipe. The fin-type heat sink according to claim 5, wherein the connecting heat conduction part has: a first side surface that is attached to the base plate, and the first side surface and the base plate together surround the heat dissipation section; Two side surfaces are opposite to the first side surface, and the area of the second side surface is larger than the area of the first side surface.