TWM647448U - Enhanced heat-dissipation type fluid heat sink - Google Patents

Abstract

A heat dissipation-enhanced fluid cooling device includes: a condensation module, a plate heat exchanger, a compressor, a water-cooling head and a water pump connected to the water-cooling head. The plate heat exchanger includes first and second heat exchange plates that are attached to each other; a coolant circuit is formed through connections between the water pump, water cooling head and the first heat exchange plate, and between the refrigerant radiator, the compressor and the second heat exchanger The plates are connected to form a refrigerant circuit. The heat carried by the coolant circuit can be heat exchanged to the refrigerant circuit through the plate heat exchanger. In this way, in addition to using the coolant to dissipate heat, the refrigerant can also be used to enhance the heat dissipation. Therefore, it has an enhanced heat dissipation effect and is suitable for electronic products with increasingly higher power requirements and relatively higher temperatures.

Description

Thermal Enhanced Fluid Cooling Device

This application relates to a heat dissipation device that uses fluid to dissipate heat, and in particular, refers to a heat dissipation-enhanced fluid heat dissipation device.

Existing liquid-cooling heat dissipation devices include a water-cooled head, a pump and a water-cooled radiator connected to each other to form a loop. The heat source transfers heat to the water-cooled head, and the pump drives the cooling liquid to circulate in the loop to remove the heat from the heat source. The heat is dissipated through the water-cooling radiator and then flows back to the water-cooling head.

However, recently, the operating performance requirements of electronic products have become higher and higher, which has caused the temperature generated to become higher and higher. As a result, the heat dissipation efficiency of existing liquid cooling devices no longer meets the requirements of increasingly high operating performance electronic products. There is indeed a need for improvement.

Therefore, how to overcome the above-mentioned problems of the prior art is a major issue that the creators of this application urgently want to solve.

The purpose of this application is to provide a heat dissipation-enhanced fluid heat dissipation device that uses two fluids, coolant and refrigerant, to dissipate heat, so that its heat dissipation efficiency is better than that of using only coolant to dissipate heat.

In order to achieve the above purpose, the present application provides a heat dissipation-enhanced fluid heat dissipation device, which is used to dissipate heat from a heat source and includes: a water pump; a water cooling head, connected to the water pump and attached to the heat source, The water-cooling head is provided with a first liquid inlet and a first liquid outlet for the circulation of coolant; a condensation module includes a refrigerant radiator, and the refrigerant radiator is provided with a first refrigerant inlet for the circulation of refrigerant. and a first refrigerant outlet; a plate heat exchanger, including a first heat exchange plate and a second heat exchange plate that are attached to each other, and the first heat exchange plate is provided with a second heat exchanger for the cooling liquid to circulate. A liquid inlet and a second liquid outlet. The second heat exchange plate is provided with a second refrigerant inlet and a second refrigerant outlet for the refrigerant to circulate. The first liquid outlet is connected to the second liquid inlet. And the first liquid inlet is connected to the second liquid outlet to form a cooling liquid circuit between the water pump, the water cooling head and the first heat exchange plate; and a compressor is provided with a refrigerant for circulation a third refrigerant inlet and a third refrigerant outlet, the second refrigerant outlet is connected to the third refrigerant inlet, the third refrigerant outlet is connected to the first refrigerant inlet, and the first refrigerant outlet is connected to the second refrigerant inlet. A refrigerant circuit is formed between the refrigerant radiator, the compressor and the second heat exchange plate.

Compared with the previous technology, this application has the following effects: in addition to using coolant for heat dissipation, it also uses refrigerant to enhance heat dissipation. Therefore, it has an enhanced heat dissipation effect and is suitable for applications where operating performance requirements are getting higher and higher, and the relative temperature is also getting higher. The higher the electronic products.

100:Fluid cooling device

1: Water cooling head assembly

11:Water block

11a: First liquid inlet

11b: First liquid outlet

12:Water pump

2: Condensation module

21:Refrigerant radiator

21a: First refrigerant inlet

21b: First refrigerant outlet

211: Drainage pipe

212: Cooling fins

213: First refrigerant container

214: Second refrigerant container

22:Fan

3: Plate heat exchanger

31: First heat exchange plate

31a: Second liquid inlet

31b: Second liquid outlet

32: Second heat exchange plate

32a: Second refrigerant inlet

32b: Second refrigerant outlet

35:Flow channel

36: Fin set

4: Compressor

41a:Third refrigerant inlet

41b: The third refrigerant outlet

5:Power supply

6:Controller

61: Temperature sensor

7: Frame

71:First side frame

711: relatively inside

712: Relatively outside

72:Second side frame

721: relatively inside

722: Relatively outside

900:Heat source

L1: Coolant circuit

L2: Refrigerant circuit

T1, T2: fluid tube

Figure 1 is a three-dimensional schematic diagram of the fluid heat dissipation device of the present application.

Figure 2 is a partial perspective view of the fluid heat dissipation device of the present application.

Figure 3 is a partial plan view of the fluid heat dissipation device of the present application.

Figure 4 is a partial cross-sectional schematic diagram of the fluid heat dissipation device of the present application.

Figure 5 is a schematic cross-sectional view of the fluid heat dissipation device of the present application.

Figure 6 is a schematic plan view of the present application based on Figure 2.

The detailed description and technical content of the present application are described below with reference to the drawings. However, the attached drawings are only for reference and illustration and are not intended to limit the present application.

The present application provides a heat dissipation-enhanced fluid heat dissipation device (hereinafter referred to as: fluid heat dissipation device 100), as shown in Figure 1, used to dissipate heat from a heat source 900 with two fluids, which includes: a water-cooling head assembly 1, a condensation head The module 2, a plate heat exchanger 3 and a compressor 4 specifically also include a power supply 5. In one embodiment, it also includes a controller 6 and a frame 7.

The water-cooling head assembly 1 can be a single-piece structure in which the water pump 12 is installed in the water-cooling head 11 as shown in the figure, or it can be a structure in which the water-cooling head 11 and the water pump 12 are separated from each other (the water pump 12 is externally connected to the water-cooling head 11). The two-piece structure (not shown in the figure) is explained in this embodiment by taking the single-piece structure as shown in the figure as an example.

The water-cooling head assembly 1 is connected to the heat source 900 with the water-cooling head 11, and the water-cooling head assembly 1 is provided with a first liquid inlet 11a and a first liquid outlet 11b for circulating cooling liquid. Among them, the coolant is one of the two aforementioned fluids.

The condensation module 2 includes a refrigerant heat sink 21 and, in one embodiment, at least one fan 22 . The refrigerant radiator 21 is provided with a first refrigerant inlet 21a and a first refrigerant outlet 21b for circulation of refrigerant. The fan 22 is disposed on the refrigerant radiator 21, and the fan 22 is used to generate airflow to take away the heat on the refrigerant radiator 21. Among them, the refrigerant is the other of the two aforementioned fluids.

This application does not limit the structure of the refrigerant radiator 21. As shown in Figures 1 and 3, in this embodiment, it includes a plurality of radiator tubes 211, a plurality of radiator fins 212 and two refrigerant containers (a first refrigerant container 213, The structure of the second refrigerant container (214) will be described as an example, in which the first refrigerant container 213 and the second refrigerant container 214 are used to contain refrigerant. Each row of tubes 211 is bridged side by side between the first refrigerant container 213 and the second refrigerant container 214. Each heat dissipation fin 212 is connected between any two adjacent rows of tubes 211. The first refrigerant container 213 is provided with the aforementioned first refrigerant. The inlet 21a and the first refrigerant outlet 21b.

The plate heat exchanger 3 includes a first heat exchange plate 31 and a second heat exchange plate 32 that are adjacent to each other for heat conduction. The first heat exchange plate 31 and the second heat exchange plate 32 respectively allow the aforementioned cooling liquid and refrigerant to circulate. Among them, the first change The hot plate 31 is provided with a second liquid inlet 31a and a second liquid outlet 31b that communicate with each other. The second liquid inlet 31a and the second liquid outlet 31b are used for cooling liquid to circulate; the second heat exchange plate 32 A second refrigerant inlet 32a and a second refrigerant outlet 32b are provided that communicate with each other. The second refrigerant inlet 32a and the second refrigerant outlet 32b are used for circulating refrigerant.

Specifically, as shown in FIGS. 4 and 5 , both the first heat exchange plate 31 and the second heat exchange plate 32 have a first channel 35 and two fin groups 36 . The flow channel 35 is divided to form two spaces (not labeled with reference numerals) that communicate with each other. The two spaces are respectively provided with the aforementioned second liquid inlet 31a and second liquid outlet 31b (or the second refrigerant inlet 32a and the second liquid outlet 31b). The two refrigerant outlets 32b) and the two fin groups 36 are respectively arranged in these two spaces. In this way, the coolant can exchange heat with the fin set 36 through the flow channel 35 in the first heat exchange plate 31, and the fin set 36 is connected to the metal shell (not shown) of the first heat exchange plate 31. (indicated by component symbol) to transfer heat; the refrigerant can exchange heat with the fin set 36 through the flow channel 35 in the second heat exchange plate 32, and the fin set 36 is also connected to the second heat exchange plate 32. The metal shell (no component symbol is marked) can conduct heat.

As shown in Figure 3, the compressor 4 is provided with a third refrigerant inlet 41a and a third refrigerant outlet 41b for circulation of refrigerant. The compressor 4 is used to allow the refrigerant to flow between the refrigerant radiator 21 and the second heat exchange plate 32 . Among them, the electricity required by the compressor 4 comes from the power supply 5 .

As shown in Figures 1 and 3, by connecting the first liquid outlet 11b to the second liquid inlet 31a, and connecting the first liquid inlet 11a to the second liquid outlet 31b, the water-cooling head assembly 1 and A coolant circuit L1 is formed between the first heat exchange plates 31 (see Figure 1).

Then, the second refrigerant outlet 32b is connected to the third refrigerant inlet 41a, the third refrigerant outlet 41b is connected to the first refrigerant inlet 21a, and the first refrigerant outlet 21b is connected to the second refrigerant inlet 32a, so that the refrigerant heat sink 21 , a refrigerant circuit L2 is formed between the compressor 4 and the second heat exchange plate 32 (see Figure 1). Among them, as shown in Figure 1, the coolant circuit L1 and the refrigerant circuit L2 are independent of each other and not connected to each other, and only rely on the plate heat exchanger 3 for heat exchange.

Thus, as shown in Figure 6 together with Figures 1 to 3, the first is the coolant circuit L1. The heat generated by the heat source 900 is transferred to the coolant through the water-cooling head 11, and then the water pump 12 is used to allow the heated coolant to flow from The first liquid outlet 11b is output, and then is input into the first heat exchange plate 31 through the second liquid inlet 31a for heat exchange; the heat-exchanged cooling liquid is output from the second liquid outlet 31b, and is passed through the first inlet. The liquid port 11a is input into the water-cooling head 11, so that the heat source 900 is exchanged with the cooling liquid that has been cooled through heat exchange. Next is the refrigerant circuit L2. The metal shell of the first heat exchange plate 31 and the metal shell of the second heat exchange plate 32 can perform heat exchange by being attached to each other. Therefore, the second heat exchange plate 32 can carry out heat exchange with the refrigerant inside. Remove the heat on the first heat exchange plate 31, and use the compressor 4 to output the heated refrigerant from the second refrigerant outlet 32b, enter the compressor 4 through the third refrigerant inlet 41a, and then output it through the third refrigerant outlet 41b. And is input into the first refrigerant container 213 through the first refrigerant inlet 21a, and then flows in each row pipe 211 for heat exchange. The cooled refrigerant after heat exchange is output from the first refrigerant outlet 21b, and passes through the second refrigerant inlet. 32a returns to the second heat exchange plate 32, so that the first heat exchange plate 31 and the second heat exchange plate 32 circulate for heat exchange.

Therefore, in addition to using coolant for heat dissipation, the present application also uses refrigerant to enhance heat dissipation, thereby enhancing the heat dissipation effect, and is suitable for electronic products that have increasingly higher operating performance requirements and relatively higher temperatures.

It should be noted that this application does not limit how the inlet and outlet of the two fluids are connected. As shown in Figures 1 and 6, in this embodiment, the fluid pipe T1 is connected at each inlet of the coolant circuit L1. , liquid outlet, and fluid pipe T2 is used to connect each refrigerant inlet and outlet of the refrigerant circuit L2.

As shown in FIGS. 1 to 4 , the fluid heat dissipation device 100 of the present application further includes a body 7 . The frame body 7 has a first side frame 71 and a second side frame 72 that are opposite to each other, and the first side frame 71 and the second side frame 72 both have a relative inner side 711, 721 and a relative outer side 712, which are opposite to each other. 722. The frame 7 is located between the water-cooling head assembly 1 and the condensation module 2. The plate heat exchanger 3 is fixed on the opposite inner side 711 of the first side frame 71, and the refrigerant radiator 21 is fixed on the opposite outer side 722 of the second side frame 72. Compression The machine 4 is fixed between the first side frame 71 and the second side frame 72 in the frame body 7 . In addition, as shown in Figures 3 and 4, the second liquid inlet 31a and the second liquid inlet 31a of the plate heat exchanger 3 The liquid outlet 31b is correspondingly arranged on the first side frame 71, and the first refrigerant inlet 21a and the first refrigerant outlet 21b of the refrigerant radiator 21 are correspondingly arranged on the second side frame 72.

As shown in FIGS. 1 to 3 , the fluid heat dissipation device 100 of the present application also includes a controller 6 and a temperature sensor 61 . The temperature sensor 61 is arranged on the plate heat exchanger 3 to sense the temperature of the plate heat exchanger 3 . The compressor 4 and the temperature sensor 61 are both connected to the controller 6, and the power supply 5 is connected to the controller 6 to provide power to the controller 6.

In this way, the controller 6 can automatically adjust the output of the compressor 4 at any time based on the temperature of the second heat exchange plate 32 sensed by the temperature sensor 61. For example, when the sensed temperature is higher than the preset value, Increase the output of the compressor 4; when the sensed temperature is lower than the preset value, decrease the output of the compressor 4.

100:Fluid cooling device

1: Water cooling head assembly

11:Water block

11a: First liquid inlet

11b: First liquid outlet

12:Water pump

2: Condensation module

21:Refrigerant radiator

213: First refrigerant container

214: Second refrigerant container

22:Fan

3: Plate heat exchanger

31: First heat exchange plate

32: Second heat exchange plate

4: Compressor

6:Controller

7: Frame

71:First side frame

72:Second side frame

L1: Coolant circuit

L2: Refrigerant circuit

T1, T2: fluid tube

Claims (9)

A heat-dissipation-enhanced fluid heat dissipation device used to dissipate heat from a heat source and includes: a water pump; a water-cooling head connected to the water pump and attached to the heat source; the water-cooling head is provided with a first inlet for cooling liquid to circulate port and a first liquid outlet; a condensation module, including a refrigerant radiator, the refrigerant radiator is provided with a first refrigerant inlet and a first refrigerant outlet for refrigerant circulation; a plate heat exchanger, including each other A first heat exchange plate and a second heat exchange plate are attached. The first heat exchange plate is provided with a second liquid inlet and a second liquid outlet for the cooling liquid to circulate. The second heat exchanger is The hot plate is provided with a second refrigerant inlet and a second refrigerant outlet for the refrigerant to circulate. The first liquid outlet is connected to the second liquid inlet and the first liquid inlet is connected to the second liquid outlet. A coolant circuit is formed between the water pump, the water-cooled head and the first heat exchange plate; and a compressor is provided with a third refrigerant inlet and a third refrigerant outlet for the refrigerant to circulate, the second The refrigerant outlet is connected to the third refrigerant inlet, the third refrigerant outlet is connected to the first refrigerant inlet, and the first refrigerant outlet is connected to the second refrigerant inlet. Between the refrigerant radiator, the compressor and the second heat exchange plate A refrigerant circuit is formed between them. The heat dissipation enhanced fluid heat dissipation device as claimed in claim 1, wherein the water pump and the water cooling head are separated from each other, and the water pump is externally connected to the water cooling head. The heat dissipation-enhanced fluid heat dissipation device as claimed in claim 1, wherein the water pump is disposed in the water-cooling head and is combined with each other in one piece to form a water-cooling head assembly. The heat dissipation enhanced fluid heat dissipation device according to claim 1, wherein the condensation module further includes at least one fan, and the at least one fan is disposed on the refrigerant heat dissipation row. The heat dissipation enhanced fluid heat dissipation device as described in claim 1, wherein the refrigerant radiator includes a plurality of row pipes, a plurality of radiating fins and two refrigerant containers, each of the row pipes is bridged between the two refrigerant containers, and each of the radiating fins The piece is connected between any two adjacent row pipes, and one of the two refrigerant containers is provided with the first refrigerant inlet and the first refrigerant outlet. The heat dissipation enhanced fluid heat dissipation device according to claim 1 further includes a power supply connected to the compressor. The heat dissipation enhanced fluid heat dissipation device as claimed in claim 1 further includes a controller and a temperature sensor. The compressor and the temperature sensor are both connected to the controller. The temperature sensor is configured on the plate heat exchanger. device. The heat dissipation enhanced fluid heat dissipation device as claimed in claim 1, further comprising a frame body having a first side frame and a second side frame, both of the first side frame and the second side frame having a The plate heat exchanger is arranged on the opposite inner side of the first side frame, the refrigerant heat dissipation row is arranged on the opposite outer side of the second side frame, and the compressor is arranged on the opposite side of the frame body. between the first side frame and the second side frame. The heat dissipation enhanced fluid heat dissipation device as claimed in claim 1, wherein both the first heat exchange plate and the second heat exchange plate have a flow channel and two fin sets corresponding to the flow channel.