TWM635920U - Porous ceramic heat spreader - Google Patents

Abstract

The invention provides a porous ceramic heat spreader. The porous ceramic heat spreader includes: a ceramic heat dissipation base, including a first heat dissipation surface and a second heat dissipation surface, wherein the first heat dissipation surface and the second heat dissipation surface are parallel; a ceramic outer heat dissipation top, coupled to the first heat dissipation surface of the ceramic heat dissipation base; and a composite metal heat dissipation layer, a composite metal sintered on the second heat dissipation surface of the ceramic heat dissipation base; wherein, the ceramic outer heat dissipation top and the ceramic heat dissipation base are integrally formed.

Description

Porous Ceramic Fins

The invention relates to the technical field of heat dissipation fins, in particular to a porous ceramic heat dissipation fin.

The heat generated during the operation of high-power electronic components needs to be discharged through conduction, convection, and radiation to reduce the operating temperature of electronic products, thereby maintaining the stability and reliability of system operation.

The commonly used heat dissipation method for electronic components is the heat sink. The heat sink is a thermally conductive material fixed on the surface of the electronic component, so as to conduct the heat generated by the electronic component to the surrounding environment. Its structure is mostly composed of a base plate and fins. In contact with electronic components, the main function is to heat uniformly, so that the heat can be quickly conducted and diffused; the function of the fin part is to dissipate heat, and the heat diffused through the bottom plate is transferred by increasing the surface area, and the heat is transferred from the fins by air convection The surface spreads to the surrounding environment.

The larger the fin surface area, the better the heat dissipation effect. However, due to the material characteristics and processing formula of the material itself, bottlenecks have been found after years of development. When it is necessary to increase the heat dissipation area of the fins, it is necessary to increase the mechanical processing formula and increase the cost of man-hours, and increase the cost by CNC. The cooling area is limited.

In recent years, due to the rapid development of semiconductor technology, electronic products are becoming thinner, smaller, faster and multi-functional. The high-power electronic components used in them generate more and more heat, making the heat dissipation of electronic products a thorny problem.

In order to achieve the heat dissipation effect, the heat dissipation effect of the old aluminum heat sink is no longer satisfactory. Porous ceramic heat sink has the characteristics of light and thin, high melting point, non-conductor, and easy mass production, and has the advantages of high thermal shock resistance, low thermal expansion coefficient, light and thin, porous heat dissipation, and reduced EMI interference. One of the mainstreams of natural convection cooling for electronic products.

The performance of porous materials is mainly determined by porosity, and its influence weight exceeds all other influence factors. TW No. I189036 Invention Patent discloses "Ceramic heat sink with hole structure". It is mainly composed of a heat dissipation layer and a heat conduction layer. The heat dissipation layer uses the principle of microscopic chemical liquid phase change to disperse unevenly with latex-like slurry to form a microcellular structure of ceramic powder and combine it with sub-micron powder, and then sinter it into a ceramic powder. A heat dissipation layer with a hollow crystal structure and a hole structure. The porosity of the heat dissipation layer is between 5% and 40%, and the particle size of the powder is between 0.125 and 0.49 μm. It has a layer of heat conduction layer on the contact surface with the heat source. The high surface area of the porous structure uses air as the heat dissipation medium to improve the heat dissipation capacity of the heat sink.

In order to further improve the heat dissipation capability of the heat sink, TW Patent No. I299975 discloses a "composite multi-layer porous structure ceramic heat sink", as shown in Figure 1. The composite multi-layer multi-hole structure ceramic radiator (2) mainly includes a heat dissipation layer (21) of ceramic material, a heat absorption layer (22) of metal material, and a conductor between the heat dissipation layer (21) and the heat absorption layer (22). The connecting layer (23); the heat dissipation layer (21) has a heat dissipation base (211) and an outer heat dissipation top (213). Since the conductive layer (23) uses solder paste to weld the heat dissipation base (211) and the heat absorption layer (22) by soldering or use thermally conductive glue, heat conduction paste or other heat conduction adhesives to weld the heat dissipation base (211) and the heat absorption layer (22) ) bonding, therefore, in addition to the inconvenience of the overall manufacturing process of the radiator, the heat uniformity of the radiator on the XY plane is not very good.

This creation provides a multi-hole ceramic heat dissipation fin, including: a ceramic heat dissipation base, including a first heat dissipation surface and a second heat dissipation surface, wherein the first heat dissipation surface is parallel to the second heat dissipation surface; a ceramic outer surface a heat dissipation top, coupled with the first heat dissipation surface of the ceramic heat dissipation base; and a metal heat dissipation layer, sintering a composite metal on the second heat dissipation surface of the heat dissipation base; wherein, the ceramic outer heat dissipation top and the ceramic heat dissipation base are connected One piece.

As previously mentioned, the present work discloses porous ceramic fins. The ceramic outer heat dissipation top and the ceramic heat dissipation base of the porous ceramic heat dissipation fins are integrally formed, and a composite metal is sintered on a second heat dissipation surface of the heat dissipation base. Therefore, the overall manufacturing process of the heat dissipation fins is quite convenient, and the heat uniformity of the heat sink on the XY plane can also be greatly improved.

100, 200, 300, 400: porous ceramic fins

101: ceramic heat dissipation base

1011: the first cooling surface

1012: the second cooling surface

1021, 1022, 1023, 1024: ceramic heat sink top

103: Composite metal heat dissipation layer

600: Manufacturing flow chart of porous ceramic fins

601, 602, 603, 604, 605: steps

2: Composite multi-layer porous structure ceramic radiator (prior technology)

21: heat dissipation layer

22: Heat absorbing layer of metal material

23: Conduction layer

211: heat dissipation base

213: External cooling top

Figure 1 Prior art.

Fig. 2 The multi-hole ceramic cooling fin according to the first embodiment of the invention.

Fig. 3 The multi-hole ceramic cooling fin according to the second embodiment of the invention.

Fig. 4 According to the porous ceramic heat dissipation fin of the third embodiment of the present invention.

Fig. 5 The multi-hole ceramic heat dissipation fin according to the fourth embodiment of the present invention.

Figure 6 is a flow chart of manufacturing porous ceramic fins according to this invention.

The following will give a detailed description of the embodiments of the invention. Although the invention is described and illustrated through these embodiments, it should be noted that the invention is not limited to these embodiments. On the contrary, this work covers all alternatives, modifications and equivalents within the spirit and scope of the work as defined by the appended claims. In the following detailed description of this creation, in order to provide a A complete understanding of this creation is spelled out in great detail. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known schemes, procedures, components and circuits have not been described in detail in order to highlight the gist of the invention.

FIG. 2 is a multi-hole ceramic cooling fin 100 according to the first embodiment of the present invention. The porous ceramic heat dissipation fin 100 includes a ceramic heat dissipation base (101), including a first heat dissipation surface (1011) and a second heat dissipation surface (1012), wherein the first heat dissipation surface (1011) and the second heat dissipation surface The surfaces (1012) are parallel; a ceramic outer heat dissipation top (1021), coupled to the first heat dissipation surface (1011) of the ceramic heat dissipation base (101); and a composite metal heat dissipation layer (103), a composite metal sintered on the The second heat dissipation surface (1012) of the ceramic heat dissipation base (101); wherein, the ceramic outer heat dissipation top (1021) and the ceramic heat dissipation base (101) are integrally formed. In another embodiment, the ceramic heat dissipation top (1021) and the ceramic heat dissipation base (101) are horizontal, and the ceramic heat dissipation base (101) includes but is not limited to a square or a rectangle.

The composite metal heat dissipation layer (103) of the porous ceramic heat dissipation fin 100 is attached to a heat source (not shown) to absorb the heat of the heat source and pass through the ceramic heat dissipation base (101) and the ceramic heat dissipation top (1021), by convection Take the heat source away to reduce the temperature of the heat source.

In one embodiment, the outer heat dissipation top (1021) and the heat dissipation base (101) are formed by sintering a ceramic powder and a glass powder at 910°C. The methods of sintering include but are not limited to high-pressure extrusion followed by roll forming, or stamping, mixing into slurry infusion molding, spray granulation or wet granulation. In one embodiment, the glass powder is selected from aluminum oxide Al2O3, silicon dioxide SiO2, boron trioxide B2O3, bismuth trioxide Bi2O3, zinc oxide ZnO, calcium oxide CaO, magnesium oxide MgO, strontium oxide SrO Any one of the group consisting of sodium oxide Na2O. In another embodiment, the ceramic powder is aluminum nitride AlN, silicon nitride SiN, boron nitride BN, silicon carbide SiC or graphene powder, and the ratio of the ceramic powder to the glass powder is 0.001˜0.2.

A paste-like composite metal composed of copper (Cu) powder or aluminum (Al) powder and a glass powder is coated on the second heat dissipation surface (1012) of the ceramic heat dissipation base (101), and is sintered at a high temperature to form a form the A composite metal heat dissipation layer (103). In one embodiment, the ratio of copper (Cu) powder or aluminum (Al) powder to glass powder in the composite metal is 0.001˜0.25. In another embodiment, the glass powder is selected from aluminum oxide Al2O3, silicon dioxide SiO2, boron trioxide B2O3, bismuth trioxide Bi2O3, zinc oxide ZnO, calcium oxide CaO, magnesium oxide MgO, strontium oxide Any one of the group consisting of SrO and sodium oxide Na2O.

Since the composite metal and the heat dissipation base (101) both have glass powder components, the composite metal can be sintered outside the second heat dissipation surface (1012) at a relatively low temperature, and the composite metal and the second heat dissipation surface can be improved. Adhesion between (1012). In this way, the copper or aluminum components with high thermal conductivity in the composite metal can absorb the heat from the heat source and carry away the heat from the heat source to the air through convection through the ceramic heat dissipation base (101) and the ceramic heat dissipation top (1021).

In one embodiment, the sintering temperature of the composite metal including copper (Cu) powder sintered on the second heat dissipation surface (1012) is 750-900°C. In another embodiment, the sintering temperature of the composite metal including aluminum (Al) powder on the second heat dissipation surface (1012) is 700-800°C.

According to the heat dissipation requirements of the heat dissipation fins, the ceramic outer heat dissipation top (102) can have different shapes. Fig. 3 is a multi-hole ceramic cooling fin 200 according to the second embodiment of the present invention. The porous ceramic heat dissipation fin 200 includes a ceramic heat dissipation base (101), including a first heat dissipation surface (1011) and a second heat dissipation surface (1012), wherein the first heat dissipation surface (1011) and the second heat dissipation surface The surfaces are parallel (1012); a ceramic outer heat dissipation top (1022), coupled to the first heat dissipation surface (1011) of the ceramic heat dissipation base (101); and a composite metal heat dissipation layer (103), a composite metal sintered on the The second heat dissipation surface (1012) of the ceramic heat dissipation base (101); wherein, the ceramic outer heat dissipation top (1022) and the ceramic heat dissipation base (101) are integrally formed. The methods of sintering include but are not limited to high-pressure extrusion followed by roll forming, or stamping, mixing into slurry infusion molding, spray granulation or wet granulation. In one embodiment, the ceramic heat dissipation top (1022) and the ceramic heat dissipation base (101) are vertical. In another embodiment, the ceramic heat dissipation base (101) is not limited to a square or a rectangle.

The composite metal heat dissipation layer (103) of the porous ceramic heat dissipation fin 100 is attached to a heat source (not shown) to absorb the heat of the heat source and pass through the ceramic heat dissipation base (101) and the ceramic heat dissipation top (1022), by convection Take the heat source away to reduce the temperature of the heat source.

In one embodiment, the outer heat dissipation top (1022) and the heat dissipation base (101) are formed by sintering a ceramic powder and a glass powder at 910°C. The methods of sintering include but are not limited to high-pressure extrusion followed by roll forming, or stamping, mixing into slurry infusion molding, spray granulation or wet granulation. In one embodiment, the glass powder is selected from aluminum oxide Al2O3, silicon dioxide SiO2, boron trioxide B2O3, bismuth trioxide Bi2O3, zinc oxide ZnO, calcium oxide CaO, magnesium oxide MgO, strontium oxide SrO Any one of the group consisting of sodium oxide Na2O. In another embodiment, the ceramic powder is aluminum nitride AlN, silicon nitride SiN, boron nitride BN, silicon carbide SiC or graphene powder, and the ratio of the ceramic powder to the glass powder is 0.001˜0.2.

The composite metal of the pasty body composed of copper (Cu) powder or aluminum (Al) powder and a glass powder is coated on the second heat dissipation surface (1012) of the ceramic heat dissipation base (101), and is sintered at a high temperature. The composite metal heat dissipation layer (103) is formed. In one embodiment, the ratio of copper (Cu) powder or aluminum (Al) powder to glass powder in the composite metal is 0.001˜0.25. In another embodiment, the glass powder is selected from aluminum oxide Al2O3, silicon dioxide SiO2, boron trioxide B2O3, bismuth trioxide Bi2O3, zinc oxide ZnO, calcium oxide CaO, magnesium oxide MgO, strontium oxide Any one of the group consisting of SrO and sodium oxide Na2O.

Since the composite metal and the heat dissipation base (101) both have glass powder components, the composite metal can be sintered outside the second heat dissipation surface (1012) at a relatively low temperature, and the composite metal and the second heat dissipation surface can be improved. Adhesion between (1012). In this way, the copper or aluminum components with high thermal conductivity in the composite metal can absorb the heat from the heat source and carry away the heat from the heat source to the air through the ceramic heat dissipation base (101) and the ceramic external heat dissipation top (1022) by convection.

In one embodiment, the sintering temperature of the composite metal including copper (Cu) powder sintered on the second heat dissipation surface (1012) is 750-900°C. In another embodiment, the sintering temperature of the composite metal including aluminum (Al) powder on the second heat dissipation surface (1012) is 700-800°C.

Fig. 4 is a multi-hole ceramic cooling fin 300 according to the third embodiment of the present invention. The porous ceramic heat dissipation fin 300 includes a ceramic heat dissipation base (101), including a first heat dissipation surface (1011) and a second heat dissipation surface (1012), wherein the first heat dissipation surface (1011) and the second heat dissipation surface The surfaces are parallel (1012); a ceramic outer heat dissipation top (1023), coupled to the first heat dissipation surface (1011) of the ceramic heat dissipation base (101); and a composite metal heat dissipation layer (103), a composite metal sintered on the The second heat dissipation surface (1012) of the ceramic heat dissipation base (101); wherein, the ceramic outer heat dissipation top (1023) and the ceramic heat dissipation base (101) are integrally formed. The methods of sintering include but are not limited to high-pressure extrusion followed by roll forming, or stamping, mixing into slurry infusion molding, spray granulation or wet granulation. In one embodiment, the ceramic heat dissipation top (1023) and the ceramic heat dissipation base (101) are vertical. In another embodiment, the ceramic heat dissipation base (101) is not limited to a square or a rectangle.

The composite metal heat dissipation layer (103) of the porous ceramic heat dissipation fin 100 is bonded to a heat source (not shown) to absorb the heat from the heat source and pass through the ceramic heat dissipation base (101) and the ceramic heat dissipation top (1023), by convection Take the heat source away to reduce the temperature of the heat source.

In one embodiment, the outer heat dissipation top (1023) and the heat dissipation base (101) are formed by sintering a ceramic powder and a glass powder at 910°C. The methods of sintering include but are not limited to high-pressure extrusion followed by roll forming, or stamping, mixing into slurry infusion molding, spray granulation or wet granulation. In one embodiment, the glass powder is selected from aluminum oxide Al2O3, silicon dioxide SiO2, boron trioxide B2O3, bismuth trioxide Bi2O3, zinc oxide ZnO, calcium oxide CaO, magnesium oxide MgO, strontium oxide SrO Any one of the group consisting of sodium oxide Na2O. In another embodiment, the ceramic powder is aluminum nitride AlN, silicon nitride SiN, boron nitride BN, silicon carbide SiC or graphene powder, and the ratio of the ceramic powder to the glass powder is 0.001˜0.2.

A paste-like composite metal composed of copper (Cu) powder or aluminum (Al) powder and a glass powder is coated on the second heat dissipation surface (1012) of the ceramic heat dissipation base (101), and is sintered at a high temperature to form a The composite metal heat dissipation layer (103) is formed. In one embodiment, the ratio of copper (Cu) powder or aluminum (Al) powder to glass powder in the composite metal is 0.001˜0.25. In another embodiment, the glass powder is selected from aluminum oxide Al2O3, silicon dioxide SiO2, boron trioxide B2O3, bismuth trioxide Bi2O3, zinc oxide ZnO, calcium oxide CaO, magnesium oxide MgO, strontium oxide Any one of the group consisting of SrO and sodium oxide Na2O.

Since the composite metal and the heat dissipation base (101) both have glass powder components, the composite metal can be sintered outside the second heat dissipation surface (1012) at a relatively low temperature, and the composite metal and the second heat dissipation surface can be improved. Adhesion between (1012). In this way, the copper or aluminum component with high thermal conductivity in the composite metal can absorb the heat from the heat source and carry away the heat from the heat source to the air through convection through the ceramic heat dissipation base (101) and the ceramic external heat dissipation top (1023).

In one embodiment, the sintering temperature of the composite metal including copper (Cu) powder sintered on the second heat dissipation surface (1012) is 750-900°C. In another embodiment, the sintering temperature of the composite metal including aluminum (Al) powder on the second heat dissipation surface (1012) is 700-800°C.

FIG. 5 is a multi-hole ceramic cooling fin 400 according to the fourth embodiment of the present invention. The porous ceramic heat dissipation fin 400 includes a ceramic heat dissipation base (101), including a first heat dissipation surface (1011) and a second heat dissipation surface (1012), wherein the first heat dissipation surface (1011) and the second heat dissipation surface The surfaces are parallel (1012); a ceramic outer heat dissipation top (1024), coupled to the first heat dissipation surface (1011) of the ceramic heat dissipation base (101); and a composite metal heat dissipation layer (103), a composite metal sintered on the The second heat dissipation surface (1012) of the ceramic heat dissipation base (101); wherein, the ceramic outer heat dissipation top (1024) and the ceramic heat dissipation base (101) are integrally formed. The methods of sintering include but are not limited to high-pressure extrusion followed by roll forming, or stamping, mixing into slurry infusion molding, spray granulation or wet granulation. In one embodiment, the ceramic heat dissipation top (1024) and the ceramic heat dissipation base (101) are vertical. In another embodiment, the ceramic heat dissipation base (101) includes but is not limited to a square or a rectangle.

The composite metal heat dissipation layer (103) of the porous ceramic heat dissipation fin 100 is attached to a heat source (not shown) to absorb the heat of the heat source and pass through the ceramic heat dissipation base (101) and the ceramic heat dissipation top (1024), by convection Take the heat source away to reduce the temperature of the heat source.

In one embodiment, the outer heat dissipation top (1024) and the heat dissipation base (101) are formed by sintering a ceramic powder and a glass powder at 910°C. The methods of sintering include but are not limited to high-pressure extrusion followed by roll forming, or stamping, mixing into slurry infusion molding, spray granulation or wet granulation. In one embodiment, the glass powder is selected from aluminum oxide Al2O3, silicon dioxide SiO2, boron trioxide B2O3, bismuth trioxide Bi2O3, zinc oxide ZnO, calcium oxide CaO, magnesium oxide MgO, strontium oxide SrO Any one of the group consisting of sodium oxide Na2O. In another embodiment, the ceramic powder is aluminum nitride AlN, silicon nitride SiN, boron nitride BN, silicon carbide SiC or graphene powder, and the ratio of the ceramic powder to the glass powder is 0.001˜0.2.

A paste-like composite metal composed of copper (Cu) powder or aluminum (Al) powder and a glass powder is coated on the second heat dissipation surface (1012) of the ceramic heat dissipation base (101), and is sintered at a high temperature to form a The composite metal heat dissipation layer (103) is formed. In one embodiment, the ratio of copper (Cu) powder or aluminum (Al) powder to glass powder in the composite metal is 0.001˜0.25. In another embodiment, the glass powder is selected from aluminum oxide Al2O3, silicon dioxide SiO2, boron trioxide B2O3, bismuth trioxide Bi2O3, zinc oxide ZnO, calcium oxide CaO, magnesium oxide MgO, strontium oxide Any one of the group consisting of SrO and sodium oxide Na2O.

Since the composite metal and the heat dissipation base (101) both have glass powder components, the composite metal can be sintered outside the second heat dissipation surface (1012) at a relatively low temperature, and the composite metal and the second heat dissipation surface can be improved. Adhesion between (1012). In this way, the copper or aluminum components with high thermal conductivity in the composite metal can absorb the heat from the heat source and carry away the heat from the heat source to the air through convection through the ceramic heat dissipation base (101) and the ceramic heat dissipation top (1024).

In one embodiment, the sintering temperature of the composite metal including copper (Cu) powder sintered on the second heat dissipation surface (1012) is 750-900°C. In another embodiment, the sintering temperature of the composite metal including aluminum (Al) powder on the second heat dissipation surface (1012) is 700-800°C.

FIG. 6 is a flowchart 600 of a manufacturing method of a multi-hole ceramic cooling fin according to the present invention. Step 601 , preparing raw materials for ceramic cooling fins. The raw material of the ceramic cooling fin is uniformly mixed with a ceramic powder and a glass powder. In one embodiment, the glass powder is selected from aluminum oxide Al2O3, silicon dioxide SiO2, boron trioxide B2O3, bismuth trioxide Bi2O3, zinc oxide ZnO, calcium oxide CaO, magnesium oxide MgO, strontium oxide SrO Any one of the group consisting of sodium oxide Na2O. In another embodiment, the ceramic powder is aluminum nitride AlN, silicon nitride SiN, boron nitride BN, silicon carbide SiC or graphene powder, and the ratio of the ceramic powder to the glass powder is 0.001˜0.2.

Step 602, forming a ceramic heat dissipation fin. The ceramic heat dissipation fin system includes: a ceramic heat dissipation base, including a first heat dissipation surface and a second heat dissipation surface, wherein the first heat dissipation surface is parallel to the second heat dissipation surface; and a ceramic outer heat dissipation top, coupled to The first heat dissipation surface of the heat dissipation base; wherein, the ceramic outer heat dissipation top and the heat dissipation base are integrally formed. The methods of sintering include but are not limited to high-pressure extrusion followed by roll forming, or stamping, mixing into slurry infusion molding, spray granulation or wet granulation.

Step 603, sintering the ceramic heat dissipation fins. The ceramic cooling fins are sintered at a temperature of 750-1200°C. In one embodiment, the outer heat dissipation top (1021) and the heat dissipation base (101) are formed by sintering a ceramic powder and a glass powder at 910°C.

Step 604 , coating a composite metal on the ceramic heat dissipation fin. The composite metal is composed of copper powder or aluminum powder and a glass powder to form paste and coated on the second heat dissipation surface of the heat dissipation base. In one embodiment, the ratio of copper (Cu) powder or aluminum (Al) powder to glass powder in the composite metal is 0.001˜0.25. In another embodiment, the glass powder is selected from aluminum oxide Al2O3, silicon dioxide SiO2, boron trioxide B2O3, bismuth trioxide Bi2O3, zinc oxide ZnO, calcium oxide CaO, magnesium oxide MgO, strontium oxide Any one of the group consisting of SrO and sodium oxide Na2O.

Step 605, sintering the composite metal on the ceramic heat dissipation fin to form the composite metal heat dissipation layer (103). In one embodiment, the sintering temperature of the composite metal including copper (Cu) powder sintered on the second heat dissipation surface (1012) is 750-900°C. In another embodiment, the sintering temperature of the composite metal including aluminum (Al) powder on the second heat dissipation surface (1012) is 700-800°C.

As previously mentioned, the present work discloses porous ceramic fins. The ceramic outer heat dissipation top and the ceramic heat dissipation base of the porous ceramic heat dissipation fins are integrally formed, and a composite metal is sintered on a second heat dissipation surface of the heat dissipation base. Since both the composite metal and the heat dissipation base have glass powder, the exterior of the composite metal and the heat dissipation base can be sintered at a low temperature, and the adhesion between the composite metal and the second heat dissipation surface of the heat dissipation base can be improved. In this way, the overall manufacturing process of the heat dissipation fins is quite convenient, and the heat uniformity of the heat sink on the XY plane can also be greatly improved.

The words and expressions used herein are for the purpose of illustration and not limitation, and the use of these words and expressions does not exclude from the scope of creation any equivalent (or partial equivalent) of the characteristics illustrated and described herein. Various modifications may exist within the scope of the patent application. Other modifications, variations and alternatives are also possible. Accordingly, the patent application is intended to cover all such equivalents.

100: porous ceramic fins

101: ceramic heat dissipation base

1011: the first cooling surface

1012: the second cooling surface

1021: Ceramic external cooling top

103: Composite metal heat dissipation layer

Claims (15)

A porous ceramic heat dissipation fin, comprising: a ceramic heat dissipation base, including a first heat dissipation surface and a second heat dissipation surface, wherein the first heat dissipation surface is parallel to the second heat dissipation surface; a ceramic outer heat dissipation top, coupled connected to the first heat dissipation surface of the ceramic heat dissipation base; and a composite metal heat dissipation layer, a composite metal sintered on the second heat dissipation surface of the ceramic heat dissipation base; wherein, the ceramic outer heat dissipation top and the ceramic heat dissipation base are integrally formed . The porous ceramic heat dissipation fin according to claim 1, wherein the outer heat dissipation top and the heat dissipation base are formed by uniformly mixing and sintering a ceramic powder and a glass powder. The porous ceramic heat dissipation fin according to claim 2, wherein the ceramic powder is aluminum nitride AlN, silicon nitride SiN, boron nitride BN, silicon carbide SiC or graphene powder. Porous ceramic cooling fins as claimed in claim 2, wherein the glass powder is selected from Al ₂ O ₃ , SiO ₂ , B ₂ O ₃ , and Bi ₂ Any one of the group consisting of O ₃ , zinc oxide ZnO, calcium oxide CaO, magnesium oxide MgO, strontium oxide SrO, and sodium oxide Na ₂ O. The porous ceramic heat dissipation fin according to claim 1, wherein the composite metal is composed of a copper powder or an aluminum powder and a glass powder. Porous ceramic cooling fins as in claim 5, wherein _the glass powder is selected from _{Al2O3 , SiO2} , _B2O3 , _Bi2O3 Any one of the group consisting of O ₃ , zinc oxide ZnO, calcium oxide CaO, magnesium oxide MgO, strontium oxide SrO, and sodium oxide Na ₂ O. The porous ceramic cooling fin according to claim 2, wherein the ratio of the ceramic powder to the glass powder is 0.001-0.2. The porous ceramic heat dissipation fin according to claim 5, wherein the ratio of the copper powder or the aluminum powder to the glass powder of the composite metal is 0.001-0.25. The porous ceramic heat dissipation fin according to claim 2, wherein the ceramic powder and the glass powder are sintered at 910°C. The porous ceramic heat dissipation fin according to claim 8, wherein the sintering temperature of the copper powder and the glass powder of the composite metal is 750-900°C. The porous ceramic heat dissipation fin according to claim 8, wherein the sintering temperature of the aluminum powder of the composite metal is 700-800°C. The porous ceramic heat dissipation fin according to claim 1, wherein the ceramic heat dissipation top and the ceramic heat dissipation base are horizontal. The porous ceramic heat dissipation fin according to claim 1, wherein the ceramic heat dissipation top and the ceramic heat dissipation base are vertical. The porous ceramic heat dissipation fin according to claim 1, wherein the ceramic heat dissipation base is square. The porous ceramic heat dissipation fin according to claim 1, wherein the ceramic heat dissipation base is rectangular.

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