TWM631263U - Main board set and electronic device - Google Patents

Abstract

A mainboard assembly is used for installing an interface device and a heat dissipation device. The main board set includes a circuit board, an interface card fixing mechanism and a buckle column. The interface card fixing mechanism protrudes from the circuit board and is used for fixing the interface device. The clasp protrudes from a side of the interface card fixing mechanism away from the circuit board, and is used for clasping a clasp portion of a heat sink disposed on the interface device.

Description

Motherboard Sets and Electronic Devices

The new model relates to a mainboard assembly and an electronic device, in particular to a mainboard assembly that can be installed without tools and an electronic device including the same.

Since solid state drives generate a lot of heat during operation, heat sinks are usually installed on fixed hard drives to effectively dissipate heat to the outside world. Also, the thermal contact between the heat sink and the chip of the solid state drive will affect the heat transfer efficiency between the heat sink and the chip. In view of this, the heat sink is usually screwed to the housing of the connector for the solid state drive to be inserted into, so as to ensure thermal contact between the heat sink and the chip.

Of course, because the heat sink is fixed to the connector housing by screws, it is necessary to use tools to disassemble the screws to install the heat sink to the connector housing or remove the heat sink from the connector housing. As a result, there is a problem of inconvenient assembly between the heat sink and the housing of the connector.

The present invention provides a mainboard assembly and an electronic device, so that the expansion card can be disassembled and assembled in a tool-free manner.

The motherboard assembly disclosed in one embodiment of the present invention is used for installing an interface device and a heat dissipation device. The mainboard set includes a circuit board, an interface card fixing mechanism and a buckle column. The interface card fixing mechanism protrudes from the circuit board and is used for fixing the interface device. The clasp protrudes from a side of the interface card fixing mechanism away from the circuit board, and is used for clasping a clasp portion of a heat sink disposed on the interface device.

Another embodiment of the present invention discloses an electronic device including a motherboard set, an interface device and a heat dissipation device. The main board set includes a circuit board, an electrical connector, an interface card fixing mechanism and a buckle column. The electrical connector is arranged on the circuit board and has an electrical slot and at least one card slot. The interface card fixing mechanism protrudes out of the circuit board. The buckle post protrudes from a side of the interface card fixing mechanism away from the circuit board. One side of the interface device is inserted into the electrical connector. The other side of the interface device is fixed by the interface card fixing mechanism. The heat dissipation device includes a heat dissipation part, at least one buckle part and a lock part. At least one snap portion and the lock portion are respectively disposed on opposite sides of the heat dissipation portion. At least one clasp portion is engaged with at least one clasp of the electrical connector. The locking part is fastened to the locking post.

Another embodiment of the present invention discloses a motherboard assembly for installing an interface device and a heat dissipation device. The main board set includes a circuit board, an electrical connector and a buckle column. The electrical connector protrudes from the circuit board and is used for inserting the interface device. The clasp protrudes from a side of the electrical connector away from the circuit board, and is used for clasping a clasp portion of a heat sink disposed on the interface device.

According to the motherboard assembly and the electronic device of the above-mentioned embodiments, since the column of the buckle column protrudes from the side of the interface card fixing mechanism away from the circuit board or the side of the electrical connector away from the circuit board, the column of the buckle column does not need to be installed In the circuit board, it can reduce the hole of the circuit board and increase the wiring area of the circuit board.

In addition, through the matching of the locking post with the locking portion in the heat dissipation device, the heat dissipation device can be disassembled from the expansion card in a tool-free manner. Likewise, the heat sink can also be installed on the expansion card in a tool-free manner. Therefore, the heat sink can be attached to and detached from the expansion card in a simple and efficient manner.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and provide further explanation of the scope of the patent application of the present invention.

See Figures 1 through 3. FIG. 1 is a schematic perspective view of an electronic device 1 according to a first embodiment of the present invention. FIG. 2 is an exploded schematic view of FIG. 1 . FIG. 3 is a schematic partial side view of FIG. 1 .

The electronic device 1 of this embodiment includes a motherboard assembly 10 , an interface device 20 and a heat dissipation device 30 . The motherboard assembly 10 includes a circuit board 100 , an electrical connector 200 , an interface card fixing mechanism 300 and a stud 400 . The electrical connector 200 is disposed on the circuit board 100 and has an electrical slot 210 and two card slots 220 . The electrical socket 210 is, for example, an M.2 standard socket, and is used for inserting the interface device 20 . The card slot 220 is used for engaging the heat dissipation device 30 , which will be described later.

In this embodiment, the number of the card slots 220 is two, but not limited thereto. In other embodiments, the number of the card slots can also be changed to a single one.

The interface card fixing mechanism 300 includes a fixing column 310 and a rotating fastener 320 . The fixing posts 310 are fixed and protruded from the circuit board 100 . The fixing post 310 is locked to the screwing portion 110 of the circuit board 100 by screwing, for example. The rotating fastener 320 is rotatably disposed on the fixing post 310 and can be rotated to a snap-fit position. The rotating fastener 320 located at the buckled position is used to buckle the interface device 20 . Specifically, the fixing column 310 has an assembly groove 311 . The rotating fastener 320 includes a bearing portion 321 , a fastener portion 322 and an operating portion 323 . The bearing portion 321 is sleeved on the fixing column 310 and is located in the assembling groove 311 . The buckle portion 322 is connected to the bearing portion 321 and forms a buckle slot S together with the bearing portion 321 . The snap-fit slot S is used for accommodating at least part of the interface device 20 . The operating portion 323 is connected to the buckle portion 322 to drive the buckle portion 322 and the bearing portion 321 to rotate relative to the fixing column 310 .

In the present embodiment, the interface device 20 is fastened and fixed by the rotary fastener 320, but it is not limited thereto. In other embodiments, the interface device can also be fixed by a sliding type of sliding fasteners, or can be fixed by other types of fasteners.

The buckle column 400 includes a column body 410 and a buckle body 420 . The column 410 protrudes from a side of the interface card fixing mechanism 300 away from the circuit board 100 . The buckle body 420 is connected to a side of the column body 410 away from the circuit board 100 , and the width W1 of the buckle body 420 is greater than the width W2 of the column body 410 . A side of the buckle body 420 away from the cylinder body 410 has an arc guide surface 421 , and the function of the arc guide surface 421 will be described later. Since the column body 410 protrudes from the side of the interface card fixing mechanism 300 away from the circuit board 100 , the column body 410 of the buckle column 400 does not need to be installed on the circuit board 100 , so the holes of the circuit board 100 can be reduced and the circuit board 100 can be increased. wiring area.

In this embodiment, the column body 410 of the buckle column 400 and the fixing column 310 are disposed coaxially, that is, the axis X of the column body 410 of the buckle column 400 and the axis X of the fixing column 310 overlap, but not limited thereto. In other embodiments, the column body of the buckle column and the fixing column can also be arranged non-coaxially, that is, the axis of the column body of the buckle column and the axis of the fixing column do not overlap.

The interface device 20 is, for example, an M.2 standard SSD memory, and one side 22 of the interface device 20 is inserted into the electrical connector 200 , and the other side 24 of the interface device 20 is held by the rotating fastener 320 of the interface card fixing mechanism 300 . The buckle portion 322 is buckled and fixed.

The heat dissipation device 30 includes a heat dissipation portion 32 , two locking portions 34 and a locking portion 35 . The heat dissipation portion 32 is thermally coupled to the interface device 20 through, for example, heat dissipation glue. In addition, the heat dissipation portion 32 has, for example, but not limited to, a fin structure. The two snap portions 34 are disposed on one side of the heat dissipation portion 32 , and each snap portion 34 has, for example, a head with a larger size, so as to be engaged with the slot of the electrical connector 200 through the head of the snap portion 34 . 220. The locking portion 35 is slidably disposed on the other side of the heat dissipation portion 32, for example. Specifically, the locking portion 35 has a plurality of guide grooves 36 and a locking hole 37 . The heat dissipation device 30 may further include a plurality of guide posts 38 and a reset member 39 . The guide posts 38 pass through the guide grooves 36 respectively and are combined with the heat dissipation portion 32 , and the guide posts 38 can slide in the guide grooves 36 respectively, so that the locking portion 35 can slide relative to the heat dissipation portion 32 . The restoring member 39 is, for example, a compression spring. One end of the reset piece 39 is fixed to the heat dissipation portion 32, and the other end of the reset piece 39 is fixed to the lock portion 35, so as to drive the lock portion 35 to a locking position through the elastic force of the reset piece 39 to be fastened to the lock Column 400.

In this embodiment, the locking portion 35 slides relative to the heat dissipation portion 32 through the matching of the guide groove 36 and the guide post 38 , but it is not limited thereto. In other embodiments, the locking portion can also slide relative to the heat dissipation portion through the sliding rail structure.

In this embodiment, the locking portion 35 is slidably disposed on the heat dissipation portion 32, but it is not limited thereto. In other embodiments, the locking portion can also be rotatably disposed on the heat dissipation portion.

In this embodiment, the number of the buckle portions 34 is two, but not limited thereto. In other embodiments, the number of the snap parts can also be changed to a single one.

Please refer to Figure 4 and Figure 5. 4 and 5 are schematic diagrams of assembly of the electronic device 1 of FIG. 1 . As shown in FIG. 2 and FIG. 4 , one side 22 of the interface device 20 has been inserted into the electrical socket 210 of the electrical connector 200 , and the other side 24 of the interface device 20 is held by the rotating fastener 320 at the snap-fit position The buckle portion 322 is pressed and fixed. In addition, the latching portion 34 of the heat dissipation device 30 is firstly buckled to the latching slot 220 of the electrical connector 200 , and then the latching portion 35 of the heat dissipation device 30 is pressed down in the direction A, so that the latching portion 35 is received by the latching body 420 . The arc guide surface 421 moves along the direction B guided by the guide surface 421 . Next, as shown in FIG. 5 , continue to press down the locking portion 35 along the direction A. When the locking body 420 passes through the locking hole 37 and the cylinder 410 is positioned in the locking hole 37 , the locking portion 35 will be driven by the reset member 39 . Then move to the locking position along the direction C, and let the locking portion 35 lock the locking body 420 of the locking column 400 close to one side of the circuit board 100 to complete the fixing of the heat sink 30 .

In the above embodiment, the locking post 400 is disposed on the interface card fixing mechanism 300 , but it is not limited thereto. In other embodiments, the studs can also be disposed on other components on the circuit board, such as electrical connectors or other fixing structures, assembling structures, and the like.

According to the motherboard assembly and the electronic device of the above-mentioned embodiments, since the cylinder of the clasp protrudes from the side of the interface card fixing mechanism away from the circuit board, the cylinder of the clasp does not need to be installed on the circuit board, so the circuit board can be reduced. The hole is broken to increase the wiring area of the circuit board.

In addition, through the combination of the buckle column and the sliding locking part in the heat sink, the heat sink can be disassembled from the expansion card in a tool-free manner. Likewise, the heat sink can also be installed on the expansion card in a tool-free manner. Therefore, the heat sink can be attached to and detached from the expansion card in a simple and efficient manner.

Although the present invention is disclosed by the above-mentioned embodiments, it is not intended to limit the present invention. Anyone who is familiar with similar techniques can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for a new model shall be determined by the scope of the patent application attached to this specification.

1: Electronic device 10: Motherboard group 20: Interface Device 22: one side 24: The other side 30: Cooling device 32: heat dissipation department 34: Buckle part 35: Locking part 36: Guide groove 37: button hole 38: Guide column 39: reset piece 100: circuit board 110: Screw part 200: Electrical Connector 210: Electrical socket 220: Card slot 300: Interface card fixing mechanism 310: Fixed column 311: Assembly slot 320: Rotary Fastener 321: Bearing Department 322: Buckle 323: Operation Department 400: Buckle Post 410: Cylinder 420: Buckle 421: arc guide surface A~C: Direction W1, W2: width X: axis S: Snap groove

FIG. 1 is a three-dimensional schematic diagram of an electronic device according to a first embodiment of the present invention. FIG. 2 is an exploded schematic view of FIG. 1 . FIG. 3 is a schematic partial side view of FIG. 1 . FIG. 4 and FIG. 5 are schematic diagrams of assembly of the electronic device of FIG. 1 .

1: Electronic device

10: Motherboard group

20: Interface Device

22: one side

24: The other side

30: Cooling device

32: heat dissipation department

34: Buckle part

35: Locking part

36: Guide groove

37: button hole

38: Guide column

39: reset piece

100: circuit board

110: Screw part

200: Electrical Connector

210: Electrical socket

220: Card slot

300: Interface card fixing mechanism

310: Fixed column

311: Assembly slot

320: Rotary Fastener

321: Bearing Department

322: Buckle

323: Operation Department

400: Buckle Post

410: Cylinder

420: Buckle

S: Snap groove

Claims (10)

A mainboard set for installing an interface device and a heat dissipation device, the mainboard set includes: a circuit board; an interface card fixing mechanism protruding from the circuit board and used for fixing the interface device; and a button post protruding from a side of the interface card fixing mechanism away from the circuit board and used for the heat dissipation A locking portion of the device is snapped. The motherboard assembly of claim 1, wherein the interface card fixing mechanism comprises: a fixing post, fixed and protruding from the circuit board; and a rotating fastener, the rotational fastener is rotatably disposed on the fixing post and can be rotated to a snap-fit position, and the rotational fastener located at the snap-fit position used to depress the interface device. The motherboard assembly of claim 2, wherein the fixing column has an assembling slot, the rotating fastener includes a bearing portion, a buckle portion and an operating portion, the bearing portion is sleeved on the fixing column and located at the an assembly groove, the buckle part is connected to the bearing part and forms a buckle groove together with the bearing part, the buckle groove is used for accommodating at least part of the interface device, the operation part is connected to the buckle part to drive the buckle The part and the bearing part rotate relative to the fixing column. The motherboard assembly of claim 2, wherein the buckle column and the fixing column are coaxially arranged. The motherboard assembly of claim 1 further includes an electrical connector, which is disposed on the circuit board and is used for the interface device to be plugged in. An electronic device comprising: A motherboard set includes: a circuit board; an electrical connector disposed on the circuit board and having an electrical slot and at least one card slot; an interface card fixing mechanism protruding from the circuit board; and a a button post protruding from a side of the interface card fixing mechanism away from the circuit board; an interface device, one side of the interface device is inserted into the electrical connector, and the other side of the interface device is supported by the interface card fixing mechanism fixing; and a heat dissipation device, comprising a heat dissipation part, at least one buckle part and a lock part, the at least one buckle part and the lock part are respectively arranged on opposite sides of the heat dissipation part, the at least one buckle part The locking portion is engaged with the at least one locking groove of the electrical connector, and the locking portion is engaged with the locking post. The electronic device of claim 6, wherein the interface card fixing mechanism comprises: a fixing post, fixed and protruding from the circuit board; and a rotating fastener, the rotational fastener is rotatably disposed on the fixing post and can be rotated to a snap-fit position, and the rotational fastener located at the snap-fit position used to depress the interface device. The electronic device as claimed in claim 7, wherein the fixing column has an assembly slot, the rotating fastener includes a bearing portion, a buckle portion and an operating portion, the bearing portion is sleeved on the fixing column and is located in the assembly a slot, the buckle part is connected to the bearing part and forms a buckle slot together with the bearing part, the buckle slot is used for accommodating at least part of the interface device, the operation part is connected to the buckle part to drive the buckle part The fixed column rotates relative to the bearing portion. The electronic device as claimed in claim 7, wherein the buckle column and the fixing column are coaxially arranged. A mainboard set for installing an interface device and a heat dissipation device, the mainboard set includes: a circuit board; an electrical connector protruding from the circuit board for inserting the interface device; and a button post protruding from a side of the electrical connector away from the circuit board for dissipating heat A locking portion of the device is snapped.

Images