TWM631263U - 主機板組及電子裝置 - Google Patents

主機板組及電子裝置 Download PDF

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Publication number
TWM631263U
TWM631263U TW111205571U TW111205571U TWM631263U TW M631263 U TWM631263 U TW M631263U TW 111205571 U TW111205571 U TW 111205571U TW 111205571 U TW111205571 U TW 111205571U TW M631263 U TWM631263 U TW M631263U
Authority
TW
Taiwan
Prior art keywords
buckle
circuit board
interface device
column
fixing
Prior art date
Application number
TW111205571U
Other languages
English (en)
Chinese (zh)
Inventor
徐瑋男
沈裕淵
楊倉和
謝容珊
Original Assignee
微星科技股份有限公司
大陸商恩斯邁電子（深圳）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 微星科技股份有限公司, 大陸商恩斯邁電子（深圳）有限公司 filed Critical 微星科技股份有限公司
Priority to TW111205571U priority Critical patent/TWM631263U/zh
Priority to CN202221762718.0U priority patent/CN217936059U/zh
Priority to DE202022104224.1U priority patent/DE202022104224U1/de
Priority to JP2022002532U priority patent/JP3239281U/ja
Publication of TWM631263U publication Critical patent/TWM631263U/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184—Mounting of motherboards

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
TW111205571U 2022-05-27 2022-05-27 主機板組及電子裝置 TWM631263U (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW111205571U TWM631263U (zh) 2022-05-27 2022-05-27 主機板組及電子裝置
CN202221762718.0U CN217936059U (zh) 2022-05-27 2022-07-07 主机板组及电子装置
DE202022104224.1U DE202022104224U1 (de) 2022-05-27 2022-07-26 Motherboard-Anordnung und elektronische Vorrichtung
JP2022002532U JP3239281U (ja) 2022-05-27 2022-08-01 マザーボードアセンブリおよび電子デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111205571U TWM631263U (zh) 2022-05-27 2022-05-27 主機板組及電子裝置

Publications (1)

Publication Number Publication Date
TWM631263U true TWM631263U (zh) 2022-08-21

Family

ID=83005511

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111205571U TWM631263U (zh) 2022-05-27 2022-05-27 主機板組及電子裝置

Country Status (4)

Country Link
JP (1) JP3239281U (de)
CN (1) CN217936059U (de)
DE (1) DE202022104224U1 (de)
TW (1) TWM631263U (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI823736B (zh) * 2022-12-30 2023-11-21 技嘉科技股份有限公司 散熱裝置與其電子裝置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI823736B (zh) * 2022-12-30 2023-11-21 技嘉科技股份有限公司 散熱裝置與其電子裝置

Also Published As

Publication number Publication date
CN217936059U (zh) 2022-11-29
JP3239281U (ja) 2022-10-03
DE202022104224U1 (de) 2022-08-09

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004