TWM621845U - Press testing mechanism - Google Patents

Press testing mechanism Download PDF

Info

Publication number
TWM621845U
TWM621845U TW110210383U TW110210383U TWM621845U TW M621845 U TWM621845 U TW M621845U TW 110210383 U TW110210383 U TW 110210383U TW 110210383 U TW110210383 U TW 110210383U TW M621845 U TWM621845 U TW M621845U
Authority
TW
Taiwan
Prior art keywords
contact
groove
pressure measuring
measuring mechanism
openings
Prior art date
Application number
TW110210383U
Other languages
Chinese (zh)
Inventor
張啟正
吳宗穎
曾漢仁
Original Assignee
致茂電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 致茂電子股份有限公司 filed Critical 致茂電子股份有限公司
Priority to TW110210383U priority Critical patent/TWM621845U/en
Publication of TWM621845U publication Critical patent/TWM621845U/en

Links

Images

Landscapes

  • Measuring Leads Or Probes (AREA)

Abstract

A pressure measuring mechanism includes a carrier, a depressing device and a conductive electrode portion. The conductive electrode portion includes a first electrode and a second electrode with opposite polarities. The carrier includes an accommodating slot and two fixing areas. A plurality of openings are formed in the accommodating slot. Each opening simultaneously exposes the first electrode and the second electrode, and the sizes of the openings are different from each other, so as to accept DUTs with different sizes. The fixing areas are respectively located on different sides of the accommodating slot. The depressing device is selectively fixed on one of the fixing areas for pressing down the DUT in one of the openings.

Description

壓測機構Pressure testing mechanism

本創作有關於一種壓測機構,且特別是關於一種阻抗量測之壓測機構。This creation is about a pressure measuring mechanism, and especially about a pressure measuring mechanism for impedance measurement.

傳統阻抗量測機構透過下壓件將待測元件按壓至載台上,使得待測元件之腳位能夠緊密地接觸載台之電極接點,從而提供後端系統進行測試。此外,阻抗量測機構能夠針對多種不同型號的待測元件進行單獨測試。每當阻抗量測機構改為測試另個不同型號的待測元件時,為了讓下壓件能夠有效壓迫這個不同型號之待測元件,使用者需要改變載台之配置方位,使得待測元件移至下壓件下方之有效位置。The traditional impedance measurement mechanism presses the device to be tested on the stage through the pressing member, so that the pins of the device to be tested can closely contact the electrode contacts of the stage, so as to provide the back-end system for testing. In addition, the impedance measurement mechanism can perform individual tests for a variety of different types of components under test. Whenever the impedance measuring mechanism is changed to test a different type of component to be tested, in order to allow the pressing member to effectively press the component to be measured of this different type, the user needs to change the configuration orientation of the stage so that the component to be measured moves. to the effective position below the lower pressing piece.

然而,由於阻抗量測機構的載台內部包含許多複雜且彼此層疊的組件,為了改變載台之配置方位,使用者必須將載台內部的這些組件依序取出、接著依序旋轉方位,再依序裝回載台內,如此,不僅相當耗時與費力,又可能因為錯誤安裝,導致待測元件之損傷。However, since the stage of the impedance measurement mechanism contains many complex and stacked components, in order to change the arrangement orientation of the stage, the user must take out these components in the stage in sequence, then rotate the orientation in sequence, and then follow the It is not only time-consuming and laborious, but also may cause damage to the component to be tested due to wrong installation.

由此可見,上述技術顯然仍存在不便與缺陷,而有待加以進一步改良。因此,如何有效地尋找一種解決方案,以克服上述不便與缺陷,實屬當前重要研發課題之一,亦成爲當前相關領域亟需改進的目標。It can be seen that the above-mentioned technology obviously still has inconvenience and defects, and needs to be further improved. Therefore, how to effectively find a solution to overcome the above-mentioned inconveniences and defects is one of the current important research and development issues, and it has also become an urgent target for improvement in the current related fields.

本創作之一目的在於提供一種壓測機構,用以解決以上先前技術所提到的困難。One purpose of the present invention is to provide a pressure measurement mechanism to solve the above difficulties mentioned in the prior art.

本創作之一實施例提供一種壓測機構。壓測機構包括一載台、一下壓裝置與一電極部。電極部包含極性相反之第一接點與第二接點。載台包含一容置槽及二固定區。容置槽內具有多個開口。每個開口同時曝露出第一接點與第二接點,且開口之尺寸彼此不同,用以接受不同尺寸之待測元件。固定區分別位於容置槽之不同側。下壓裝置選擇性地鎖固於其中一固定區,用以下壓至開口內之待測元件。An embodiment of the present invention provides a pressure measurement mechanism. The pressure measuring mechanism includes a stage, a lower pressure device and an electrode part. The electrode portion includes a first contact and a second contact with opposite polarities. The carrier includes an accommodating slot and two fixing areas. The accommodating groove has a plurality of openings. Each opening exposes the first contact point and the second contact point at the same time, and the sizes of the openings are different from each other, so as to accept components to be tested of different sizes. The fixing areas are respectively located on different sides of the accommodating groove. The pressing device is selectively locked in one of the fixed areas, and is used to press down the device to be tested in the opening.

依據本創作一或複數個實施例,上述之壓測機構中,這些固定區分別包含至少一第一固定孔與至少一第二固定孔。第一固定孔與第二固定孔分別位於容置槽之二相鄰側。下壓裝置包含至少一固定栓。固定栓鎖入其中一第一固定孔與第二固定孔,使得下壓裝置固定於底座上。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the fixing regions respectively include at least one first fixing hole and at least one second fixing hole. The first fixing hole and the second fixing hole are respectively located on two adjacent sides of the accommodating groove. The pressing device includes at least one fixing pin. The fixing bolt is locked into one of the first fixing hole and the second fixing hole, so that the pressing device is fixed on the base.

依據本創作一或複數個實施例,上述之壓測機構中,下壓裝置包含一底座、一支架及一下壓桿。底座鎖固於載台上。支架固設於底座之頂面上。下壓桿可升降地設於支架上,用以下移至開口內之待測元件。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the pressing device includes a base, a bracket and a lower pressing rod. The base is locked on the stage. The bracket is fixed on the top surface of the base. The lowering rod can be raised and lowered on the bracket, and is used to move the component to be tested in the opening.

依據本創作一或複數個實施例,上述之壓測機構中,下壓裝置更包含一第一溝縫。第一溝縫開設於底座上,固定栓穿過第一溝縫。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the pressing device further includes a first groove. The first groove is opened on the base, and the fixing bolt passes through the first groove.

依據本創作一或複數個實施例,上述之壓測機構中,下壓裝置更包含一推動件、一第二溝縫、一鎖迫件及一彈簧元件。推動件樞設於支架上。第二溝縫開設於推動件之一端,以供下壓桿穿過,且第二溝縫正交第一溝縫。鎖迫件固設於下壓桿相對容置槽之一端,且將下壓桿限位於推動件上。彈簧元件套設至下壓桿上,且連接下壓桿及支架。故當推動推動件之另端並使下壓桿抽離容置槽時,彈簧元件受到壓縮並儲存一回復力,回復力用以將下壓桿推回容置槽內。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the pressing device further includes a pushing member, a second groove, a locking member and a spring element. The push piece is pivoted on the bracket. The second groove is opened at one end of the pusher for the pressing rod to pass through, and the second groove is orthogonal to the first groove. The locking and forcing piece is fixed on one end of the pressing rod opposite to the accommodating groove, and restricts the pressing rod to the pushing piece. The spring element is sleeved on the pressing rod and is connected with the pressing rod and the bracket. Therefore, when the other end of the pusher is pushed and the lower pressure rod is pulled out of the accommodating groove, the spring element is compressed and stores a restoring force, and the restoring force is used to push the downward pressure rod back into the accommodating groove.

依據本創作一或複數個實施例,上述之壓測機構中,底座之底面更具有一引導溝槽。載台具有至少一第一凸塊與至少一第二凸塊。第一凸塊與第二凸塊分別位於容置槽之二相鄰側。第一凸塊與第二凸塊其中之一可滑移地位於引導溝槽內。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the bottom surface of the base further has a guide groove. The stage has at least one first bump and at least one second bump. The first bump and the second bump are respectively located on two adjacent sides of the accommodating groove. One of the first bump and the second bump is slidably located in the guide groove.

依據本創作一或複數個實施例,上述之壓測機構中,電極部更包含一絕緣環,絕緣環圍繞第一接點,且位於第一接點與第二接點之間。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the electrode portion further includes an insulating ring, and the insulating ring surrounds the first contact and is located between the first contact and the second contact.

依據本創作一或複數個實施例,上述之壓測機構中,第二接點包含一導電環及一導電片。導電環圍繞絕緣環與第一接點,導電片包含一金屬片與一貫穿口,金屬片覆蓋且電連接導電環,貫穿口形成於該金屬片上,且外露出該第一接點。According to one or more embodiments of the present invention, in the aforementioned pressure measuring mechanism, the second contact includes a conductive ring and a conductive sheet. The conductive ring surrounds the insulating ring and the first contact. The conductive sheet includes a metal sheet and a through opening. The metal sheet covers and is electrically connected to the conductive ring. The through opening is formed on the metal sheet and exposes the first contact.

依據本創作一或複數個實施例,上述之壓測機構中,載台更包含一對位墊片與一上蓋。對位墊片覆蓋導電片、絕緣環與第一接點。開口開設於對位墊片上,且每個開口露出導電片之一部分、絕緣環之一部分與第一接點之一部分。上蓋將對位墊片固定於導電片上,上蓋包含一同時露出這些開口之貫孔。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the stage further includes a pair of alignment spacers and an upper cover. The alignment gasket covers the conductive sheet, the insulating ring and the first contact. The openings are opened on the alignment pad, and each opening exposes a part of the conductive sheet, a part of the insulating ring and a part of the first contact. The upper cover fixes the alignment pad on the conductive sheet, and the upper cover includes a through hole exposing the openings at the same time.

依據本創作一或複數個實施例,上述之壓測機構中,載台更包含一基座與一載板,載板可移除地組裝於基座上,容置槽及這些固定區皆同時位於載板上。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the carrier further includes a base and a carrier, the carrier is removably assembled on the base, and both the accommodating groove and the fixing areas are at the same time. on the carrier board.

如此,透過以上各實施例之所述架構,本創作能夠快速變更下壓裝置及待測元件之相對關係,避免手動改變載台之配置方位,進而達到省時與省力之目的。In this way, through the structures of the above embodiments, the present invention can quickly change the relative relationship between the pressing device and the device to be tested, avoid manually changing the arrangement orientation of the stage, and thus achieve the purpose of saving time and effort.

以上所述僅係用以闡述本創作所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本創作之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above descriptions are only used to describe the problems to be solved by the present creation, the technical means for solving the problems, and the effects produced by them.

以下將以圖式揭露本創作之複數個實施例,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本創作。也就是說,在本創作實施例中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。Several embodiments of the present invention will be disclosed in the drawings below. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the present creation. That is, in this creative embodiment, these practical details are unnecessary. In addition, for the purpose of simplifying the drawings, some well-known structures and elements will be shown in a simple and schematic manner in the drawings.

除非另有定義,本文所使用的所有詞彙(包括技術和科學術語)具有其通常的意涵,其意涵係能夠被熟悉此領域者所理解。更進一步的說,上述之詞彙在普遍常用之字典中之定義,在本說明書的內容中應被解讀為與本創作相關領域一致的意涵。除非有特別明確定義,這些詞彙將不被解釋為理想化的或過於正式的意涵。Unless otherwise defined, all terms (including technical and scientific terms) used herein have their ordinary meanings as can be understood by those skilled in the art. Furthermore, the definitions of the above words in commonly used dictionaries should be interpreted as meanings consistent with the relevant fields of the present creation in the content of this specification. Unless specifically defined, these terms are not to be construed in an idealized or overly formal sense.

第1圖為本創作一實施例之壓測機構10的局部分解圖。第2圖為第1圖之壓測機構10的載台100的局部上視圖。第3圖為第1圖之壓測機構10的示意圖及其局部M1的放大圖。如第1圖至第3圖所示,壓測機構10包括一載台100、一下壓裝置200與一電極部300。電極部300位於載台100內,且電極部300包含極性相反之第一接點310(如正極)與第二接點320(如負極)。載台100包含一容置槽101、第一固定區170及第二固定區180。容置槽101內排列有多個開口151。每個開口151同時曝露出第一接點310與第二接點320,且開口151之尺寸彼此不同。每個開口151接受不同尺寸之待測元件400(第3圖)。舉例來說,待測元件400例如為被動元件(例如電感L、電容C、電阻R),且被動元件依據功能或特性被製成不同型號之元件,型號例如為 0402、0603、0805、1206 (單位:英吋)。第一固定區170及第二固定區180分別位於容置槽101之不同側。下壓裝置200選擇性地鎖固於第一固定區170或第二固定區180上,使得下壓裝置200能夠移至待測元件400之正上方,以便有效地下壓至其中一開口151內之待測元件400,如此,待測元件400之腳位(圖中未示)能夠分別緊密接觸此開口151內之第一接點310與第二接點320。FIG. 1 is a partial exploded view of a pressure measuring mechanism 10 according to an embodiment of the invention. FIG. 2 is a partial top view of the stage 100 of the pressure measuring mechanism 10 of FIG. 1 . FIG. 3 is a schematic diagram of the pressure measuring mechanism 10 of FIG. 1 and an enlarged view of a part M1 thereof. As shown in FIGS. 1 to 3 , the pressure measurement mechanism 10 includes a stage 100 , a lower pressure device 200 and an electrode part 300 . The electrode portion 300 is located in the stage 100 , and the electrode portion 300 includes a first contact 310 (eg, a positive electrode) and a second contact 320 (eg, a negative electrode) with opposite polarities. The stage 100 includes an accommodating groove 101 , a first fixing area 170 and a second fixing area 180 . A plurality of openings 151 are arranged in the accommodating groove 101 . Each opening 151 exposes the first contact 310 and the second contact 320 simultaneously, and the sizes of the openings 151 are different from each other. Each opening 151 accepts a different size of the device under test 400 (FIG. 3). For example, the element to be tested 400 is, for example, a passive element (such as an inductance L, a capacitance C, and a resistance R), and the passive elements are made into different types of elements according to their functions or characteristics, such as 0402, 0603, 0805, 1206 ( Unit: inches). The first fixing area 170 and the second fixing area 180 are respectively located on different sides of the accommodating groove 101 . The pressing device 200 is selectively locked on the first fixing area 170 or the second fixing area 180 , so that the pressing device 200 can be moved directly above the device under test 400 so as to be effectively pressed into one of the openings 151 As for the device under test 400 , the pins (not shown in the figure) of the device under test 400 can be in close contact with the first contact 310 and the second contact 320 in the opening 151 respectively.

具體來說,載台100更包含一基座110與一載板120。基座110具有一破口111。載板120可移除地嵌入基座110內,且載板120之一部分從基座110之破口111所外露。容置槽101、第一固定區170及第二固定區180皆同時位於載板120上,且從基座110之破口111所外露。Specifically, the carrier 100 further includes a base 110 and a carrier board 120 . The base 110 has a breach 111 . The carrier board 120 is removably embedded in the base 110 , and a part of the carrier board 120 is exposed from the opening 111 of the base 110 . The accommodating groove 101 , the first fixing area 170 and the second fixing area 180 are all located on the carrier board 120 at the same time, and are exposed from the opening 111 of the base 110 .

容置槽101呈圓形,這些開口151分別圍繞容置槽101之中心。這些開口151,例如呈矩形,且其中二開口151之長軸方向(如X或Y軸)彼此相交或甚至正交(第2圖)。然而,本創作不限於此。The accommodating groove 101 is circular, and the openings 151 surround the center of the accommodating groove 101 respectively. These openings 151 are, for example, rectangular, and the major axis directions (eg, X or Y axis) of the two openings 151 intersect with each other or are even orthogonal to each other (FIG. 2). However, the present creation is not limited to this.

在本實施例中,第一固定區170及第二固定區180分別位於容置槽101之二相鄰側,並非容置槽101之同側。舉例來說,第一固定區170包含多個(例如2個)第一固定孔171,第二固定區180包含多個(例如2個)第二固定孔181。這些第一固定孔171與這些第二固定孔181分別位於容置槽101之二相鄰側,換句話說,此些第一固定孔171之間的假想連線與此些第二固定孔181之間的假想連線彼此相交,甚至彼此正交。下壓裝置200透過多個(例如2個)固定栓290分別鎖入第一固定孔171內,使得下壓裝置200能夠固定於第一固定區170上,且位於容置槽101之其一側(第3圖)。然而,本創作不限於此。In this embodiment, the first fixing area 170 and the second fixing area 180 are respectively located on two adjacent sides of the accommodating groove 101 , not on the same side of the accommodating groove 101 . For example, the first fixing area 170 includes a plurality of (eg, two) first fixing holes 171 , and the second fixing area 180 includes a plurality of (eg, two) second fixing holes 181 . The first fixing holes 171 and the second fixing holes 181 are located on two adjacent sides of the accommodating groove 101 respectively. In other words, the imaginary connection line between the first fixing holes 171 and the second fixing holes 181 The imaginary lines between them intersect with each other, or even orthogonal to each other. The pressing device 200 is respectively locked into the first fixing hole 171 through a plurality of (for example, two) fixing bolts 290 , so that the pressing device 200 can be fixed on the first fixing area 170 and located on one side of the accommodating groove 101 . (Figure 3). However, the present creation is not limited to this.

第4圖為本實施例之壓測機構10的另一示意圖及其局部M2的放大圖。如第1圖與第4圖,當使用者改讓另個待測元件401放入另個開口151時,使用者只需將固定栓290脫離第一固定孔171,改為鎖入第二固定孔181內,使得下壓裝置200從容置槽101之原側改固定於容置槽101之相鄰側,進而能夠有效下壓至另個開口151內之待測元件401。FIG. 4 is another schematic diagram of the pressure measuring mechanism 10 of this embodiment and an enlarged view of a part M2 thereof. As shown in FIG. 1 and FIG. 4, when the user changes another component to be tested 401 into another opening 151, the user only needs to disengage the fixing bolt 290 from the first fixing hole 171 and lock it into the second fixing hole 171 instead. In the hole 181 , the pressing device 200 can be fixed from the original side of the accommodating groove 101 to the adjacent side of the accommodating groove 101 , so that the device 401 under test in the other opening 151 can be effectively pressed down.

更具體地,如第1圖與第4圖所示,下壓裝置200包含一底座210、一支架240及一下壓桿280。底座210透過固定栓290鎖固於載台100上。支架240固設於底座210之頂面211上。下壓桿280可升降地設於支架240上,用以下移至開口151內之待測元件400。更具體地,支架240呈Z字形,支架240具有相對之第一端241與第二端242,第一端241與第二端242彼此具有高度差,支架240之第一端241固定於底座210之頂面211上,支架240之第二端242位於容置槽101之上方,且承載上述之下壓桿280。More specifically, as shown in FIGS. 1 and 4 , the pressing device 200 includes a base 210 , a bracket 240 and a lower pressing rod 280 . The base 210 is locked on the stage 100 through the fixing bolt 290 . The bracket 240 is fixed on the top surface 211 of the base 210 . The pressing rod 280 can be lifted and lowered on the bracket 240 to use the device to be tested 400 moved to the opening 151 below. More specifically, the bracket 240 is Z-shaped, the bracket 240 has a first end 241 and a second end 242 opposite to each other, the first end 241 and the second end 242 have a height difference with each other, and the first end 241 of the bracket 240 is fixed to the base 210 On the top surface 211 , the second end 242 of the bracket 240 is located above the accommodating groove 101 and supports the above-mentioned lower pressing rod 280 .

更具體地,下壓裝置200更包含多個(例如2個)第一溝縫220。第一溝縫220分別開設於底座210上,且這些第一溝縫220之長軸方向(如X軸)彼此同軸。每個固定栓290穿過其中一第一溝縫220,且鎖迫於其中一第一固定孔171中。舉例來說,每個固定栓290為螺栓,且每個第一固定孔171及第二固定孔181皆為螺孔。More specifically, the pressing device 200 further includes a plurality of (eg, two) first grooves 220 . The first slits 220 are respectively opened on the base 210 , and the long axis directions (eg, the X axis) of the first slits 220 are coaxial with each other. Each fixing bolt 290 passes through one of the first grooves 220 and is locked in one of the first fixing holes 171 . For example, each fixing bolt 290 is a bolt, and each of the first fixing hole 171 and the second fixing hole 181 is a screw hole.

如此,當下壓裝置200透過固定栓290而組裝至容置槽101之一側之前,下壓裝置200能夠沿著第一溝縫220滑移,以調整下壓裝置200與容置槽101之對應位置。同理,當下壓裝置200組裝至容置槽101之相鄰側之前,下壓裝置200也能夠沿著第一溝縫220滑移,以調整下壓裝置200與容置槽101之對應位置。In this way, before the pressing device 200 is assembled to one side of the accommodating groove 101 through the fixing bolt 290 , the pressing device 200 can slide along the first groove 220 to adjust the correspondence between the pressing device 200 and the accommodating groove 101 Location. Similarly, before the pressing device 200 is assembled to the adjacent side of the accommodating groove 101 , the pressing device 200 can also slide along the first groove 220 to adjust the corresponding positions of the pressing device 200 and the accommodating groove 101 .

更進一步地,底座210之底面212更具有一引導溝槽230。引導溝槽230之長軸方向與第一溝縫220之長軸方向(如X軸)平行。載台100之載板120具有多個(例如2個)第一凸塊130與多個(例如2個)第二凸塊140。此些第一凸塊130與第二凸塊140分別位於容置槽101之二相鄰側。換句話說,此些第一凸塊130之間的假想連線與此些第二凸塊140之間的假想連線彼此相交,甚至彼此正交。第一凸塊130可滑移地位於引導溝槽230內。如此,當下壓裝置200沿著第一溝縫220滑移時,透過第一凸塊130在引導溝槽230內之配合,下壓裝置200能夠順利地沿著第一溝縫220滑移。同理,當下壓裝置200透過第二凸塊140在引導溝槽230內之配合,下壓裝置200於容置槽101之相鄰側能夠順利地沿著第一溝縫220滑移。Furthermore, the bottom surface 212 of the base 210 further has a guide groove 230 . The long axis direction of the guide groove 230 is parallel to the long axis direction (eg, X axis) of the first groove 220 . The carrier board 120 of the stage 100 has a plurality of (eg, two) first bumps 130 and a plurality of (eg, two) second bumps 140 . The first bumps 130 and the second bumps 140 are respectively located on two adjacent sides of the accommodating groove 101 . In other words, the imaginary lines between the first bumps 130 and the imaginary lines between the second bumps 140 intersect with each other, or are even orthogonal to each other. The first bump 130 is slidably located in the guide groove 230 . In this way, when the pressing device 200 slides along the first groove 220 , the pressing device 200 can smoothly slide along the first groove 220 through the cooperation of the first protrusions 130 in the guiding groove 230 . Similarly, the pressing device 200 can smoothly slide along the first groove 220 on the adjacent side of the accommodating groove 101 through the cooperation of the second protrusion 140 in the guide groove 230 .

然而,本創作不限於此,其他實施例中,也可以更改第一溝縫220之設計(圖中未示),使第一溝縫220之延伸方向(如Y軸)穿過容置槽101,如此,下壓裝置200能夠在容置槽101之一側沿著第一溝縫220滑移,以便調整下壓裝置200與容置槽101之相隔距離。However, the present invention is not limited to this. In other embodiments, the design of the first groove 220 (not shown in the figure) can also be changed, so that the extending direction (eg, the Y axis) of the first groove 220 passes through the accommodating groove 101 In this way, the pressing device 200 can slide along the first slot 220 on one side of the accommodating groove 101 , so as to adjust the distance between the pressing device 200 and the accommodating groove 101 .

此外,第5圖為本實施例之壓測機構10的載台100的分解圖。如第1圖與第5圖所示,下壓裝置200更包含一推動件250、一鎖迫件260及一彈簧元件270。推動件250透過一樞軸253樞設於支架240上,使得推動件250能夠相對支架240樞轉。推動件250具有一第二溝縫254。第二溝縫254之長軸方向(如Y軸)正交第一溝縫220之長軸方向(如X軸)。第二溝縫254開設於推動件250之前端251,以供下壓桿280相對容置槽101之一端穿過。下壓桿280能夠沿著第二溝縫254移動,以調整下壓桿280之傾斜程度。鎖迫件260固設於下壓桿280相對容置槽101之一端,且將下壓桿280限位於推動件250上。支架240之第二端242具有一狹長開槽243。彈簧元件270位於狹長開槽243內,套設至下壓桿280上,且抵接下壓桿280及狹長開槽243內之擋塊281。狹長開槽243之長軸方向(如Z軸)分別正交第一溝縫220之長軸方向(如X軸)及第二溝縫254之長軸方向(如Y軸)。In addition, FIG. 5 is an exploded view of the stage 100 of the pressure measuring mechanism 10 of the present embodiment. As shown in FIG. 1 and FIG. 5 , the pressing device 200 further includes a pushing element 250 , a locking element 260 and a spring element 270 . The push member 250 is pivoted on the bracket 240 through a pivot shaft 253 , so that the push member 250 can pivot relative to the bracket 240 . The pushing member 250 has a second groove 254 . The long axis direction (eg, the Y axis) of the second slit 254 is orthogonal to the long axis direction (eg, the X axis) of the first slit 220 . The second slot 254 is formed at the front end 251 of the push member 250 for passing through one end of the lower pressing rod 280 opposite to the accommodating groove 101 . The pressing rod 280 can move along the second slot 254 to adjust the inclination of the pressing rod 280 . The locking member 260 is fixed on one end of the lower pressing rod 280 opposite to the accommodating groove 101 , and restricts the lower pressing rod 280 to the pushing member 250 . The second end 242 of the bracket 240 has an elongated slot 243 . The spring element 270 is located in the elongated slot 243 , is sleeved on the lower pressing rod 280 , and abuts against the lower pressing rod 280 and the stopper 281 in the elongated slot 243 . The long axis direction (eg, Z axis) of the elongated slot 243 is orthogonal to the long axis direction (eg, X axis) of the first slot 220 and the long axis direction (eg, Y axis) of the second slot 254 , respectively.

如此,當一使用者將推動件250之後端252推向支架240,使得推動件250之前端251向上拉起下壓桿280,而讓下壓桿280抽離容置槽101時,彈簧元件270受到壓縮並儲存一回復力。反之,當使用者釋放推動件250之後端252,使得彈簧元件270之回復力將下壓桿280推回容置槽101內。In this way, when a user pushes the rear end 252 of the push member 250 toward the bracket 240, so that the front end 251 of the push member 250 pulls up the lower pressure rod 280, and the lower pressure rod 280 is pulled away from the accommodating slot 101, the spring element 270 is compressed and stores a restoring force. On the contrary, when the user releases the rear end 252 of the pushing member 250 , the restoring force of the spring element 270 pushes the pressing rod 280 back into the accommodating slot 101 .

如第2圖與第5圖所示,更進一步地,電極部300更包含一絕緣環340,第一接點310包含一金屬中柱311。第二接點320包含一導電環321及一導電片330。絕緣環340圍繞金屬中柱311,且直接位於金屬中柱311與導電環321之間。導電環321圍繞絕緣環340與金屬中柱311。導電片330包含一金屬片331與一貫穿口332,金屬片331覆蓋至導電環321之一面上,且電連接導電環321。貫穿口332形成於金屬片331上,且金屬中柱311穿過貫穿口332。As shown in FIGS. 2 and 5 , further, the electrode portion 300 further includes an insulating ring 340 , and the first contact 310 includes a metal center post 311 . The second contact 320 includes a conductive ring 321 and a conductive sheet 330 . The insulating ring 340 surrounds the metal center pillar 311 and is directly located between the metal center pillar 311 and the conductive ring 321 . The conductive ring 321 surrounds the insulating ring 340 and the metal center post 311 . The conductive sheet 330 includes a metal sheet 331 and a through opening 332 . The metal sheet 331 covers one surface of the conductive ring 321 and is electrically connected to the conductive ring 321 . The through hole 332 is formed on the metal sheet 331 , and the metal center post 311 passes through the through hole 332 .

載台100更包含一對位墊片150與一上蓋160。對位墊片150覆蓋導電片330、絕緣環340與第一接點310。開口151開設於對位墊片150上,且每個開口151露出導電片330之一部分、絕緣環340之一部分與第一接點310之一部分。上蓋160將對位墊片150固定於導電片330上,上蓋160包含一同時露出這些開口151之貫孔161。對位墊片150直接夾合於載板120與金屬片331之間(第1圖)。金屬片331直接夾合於導電環321與對位墊片150之間。載板120具有一開孔121。開孔121同時露出對位墊片150與導電環321。上蓋160覆蓋載板120之開孔121。此外,導電環321之一面具有導柱322,上蓋160、載板120、對位墊片150、導電片330依序重疊至導電環321後,受到導柱322之依序貫穿。The carrier 100 further includes a pair of alignment spacers 150 and an upper cover 160 . The alignment pad 150 covers the conductive sheet 330 , the insulating ring 340 and the first contact 310 . Openings 151 are opened on the alignment pad 150 , and each opening 151 exposes a part of the conductive sheet 330 , a part of the insulating ring 340 and a part of the first contact 310 . The upper cover 160 fixes the alignment gasket 150 on the conductive sheet 330 , and the upper cover 160 includes a through hole 161 exposing the openings 151 at the same time. The alignment spacer 150 is directly sandwiched between the carrier plate 120 and the metal sheet 331 (FIG. 1). The metal sheet 331 is directly sandwiched between the conductive ring 321 and the alignment pad 150 . The carrier board 120 has an opening 121 . The opening 121 exposes the alignment pad 150 and the conductive ring 321 at the same time. The upper cover 160 covers the opening 121 of the carrier board 120 . In addition, one surface of the conductive ring 321 has a guide post 322 . The upper cover 160 , the carrier plate 120 , the alignment pad 150 , and the conductive sheet 330 are sequentially stacked on the conductive ring 321 and then penetrated by the guide post 322 in sequence.

如此,透過以上各實施例之所述架構,本創作能夠快速變更下壓裝置及待測元件之相對關係,避免手動改變載台之配置方位,進而達到省時與省力之目的。In this way, through the structures of the above embodiments, the present invention can quickly change the relative relationship between the pressing device and the device to be tested, avoid manually changing the arrangement orientation of the stage, and thus achieve the purpose of saving time and effort.

最後,上述所揭露之各實施例中,並非用以限定本創作,任何熟習此技藝者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾,皆可被保護於本創作中。因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。Finally, the above disclosed embodiments are not intended to limit the present creation. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of the present creation, and they can be protected in this book. in creation. Therefore, the scope of protection of this creation should be determined by the scope of the appended patent application.

10:壓測機構 100:載台 101:容置槽 110:基座 111:破口 120:載板 121:開孔 130:第一凸塊 140:第二凸塊 150:對位墊片 151:開口 160:上蓋 161:貫孔 170:第一固定區 171:第一固定孔 180:第二固定區 181:第二固定孔 200:下壓裝置 210:底座 211:頂面 212:底面 220:第一溝縫 230:引導溝槽 240:支架 241:第一端 242:第二端 243:狹長開槽 250:推動件 251:前端 252:後端 253:樞軸 254:第二溝縫 260:鎖迫件 270:彈簧元件 280:下壓桿 281:擋塊 290:固定栓 300:電極部 310:第一接點 311:金屬中柱 320:第二接點 321:導電環 322:導柱 330:導電片 331:金屬片 332:貫穿口 340:絕緣環 400、401:待測元件 M1、M2:局部 X、Y、Z:軸 10: Pressure measuring mechanism 100: stage 101: accommodating slot 110: Pedestal 111: Break 120: carrier board 121: Opening 130: First bump 140: Second bump 150: Alignment spacer 151: Opening 160: top cover 161: Through hole 170: First Fixed Area 171: The first fixing hole 180:Second fixed area 181: Second fixing hole 200: Press down device 210: Base 211: top surface 212: Underside 220: First groove seam 230: Guide groove 240: Bracket 241: First End 242: Second End 243: long and narrow slot 250: Pusher 251: Front End 252: Backend 253: Pivot 254: Second groove seam 260: Lock forcing 270: Spring element 280: Press down lever 281: Stop 290:Fixed Bolt 300: Electrode part 310: First Contact 311: Metal center column 320: Second Contact 321: Conductive Ring 322: Guide post 330: Conductive sheet 331: Metal Sheet 332: Penetration 340: Insulation ring 400, 401: Component to be tested M1, M2: local X, Y, Z: axis

為讓本創作之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖為本創作一實施例之壓測機構的局部分解圖; 第2圖為第1圖之壓測機構的載台的局部上視圖; 第3圖為第1圖之壓測機構的示意圖及其局部M1的放大圖; 第4圖為本實施例之壓測機構的另一示意圖及其局部M2的放大圖;以及 第5圖為本實施例之壓測機構的載台的分解圖。 In order to make the above-mentioned and other objects, features, advantages and embodiments of the present creation more obvious and easy to understand, the descriptions of the accompanying drawings are as follows: Figure 1 is a partial exploded view of a pressure measuring mechanism according to an embodiment of the creation; Figure 2 is a partial top view of the stage of the pressure measuring mechanism of Figure 1; Figure 3 is a schematic diagram of the pressure measuring mechanism in Figure 1 and an enlarged view of its part M1; FIG. 4 is another schematic diagram of the pressure measuring mechanism of this embodiment and an enlarged view of a part M2 thereof; and FIG. 5 is an exploded view of the stage of the pressure measuring mechanism of this embodiment.

10:壓測機構 10: Pressure measuring mechanism

100:載台 100: stage

101:容置槽 101: accommodating slot

110:基座 110: Pedestal

111:破口 111: Break

120:載板 120: carrier board

130:第一凸塊 130: First bump

140:第二凸塊 140: Second bump

170:第一固定區 170: First Fixed Area

171:第一固定孔 171: The first fixing hole

180:第二固定區 180:Second fixed area

181:第二固定孔 181: Second fixing hole

200:下壓裝置 200: Press down device

210:底座 210: Base

211:頂面 211: top surface

212:底面 212: Underside

220:第一溝縫 220: First groove seam

230:引導溝槽 230: Guide groove

240:支架 240: Bracket

250:推動件 250: Pusher

251:前端 251: Front End

280:下壓桿 280: Press down lever

290:固定栓 290:Fixed Bolt

X、Y、Z:軸 X, Y, Z: axis

Claims (10)

一種壓測機構,包括: 一電極部,包含極性相反之一第一接點與一第二接點; 一載台,包含一容置槽及二固定區,該容置槽內具有複數個開口,每一該些開口同時曝露出該第一接點與該第二接點,且該些開口之尺寸彼此不同,用以接受不同尺寸之待測元件,該些固定區分別位於該容置槽之不同側;以及 一下壓裝置,鎖固於該些固定區其中之一,用以下壓至該些開口其中之一內之該待測元件。 A pressure measuring mechanism, comprising: an electrode portion including a first contact and a second contact with opposite polarities; A stage includes an accommodating groove and two fixing areas, the accommodating groove has a plurality of openings, each of the openings exposes the first contact and the second contact at the same time, and the size of the openings They are different from each other and are used to accept components to be tested with different sizes, and the fixing areas are located on different sides of the accommodating groove; and The lower pressing device is locked in one of the fixed areas, and is used to lower the device to be tested in one of the openings. 如請求項1所述之壓測機構,其中該些固定區分別包含至少一第一固定孔與至少一第二固定孔,該至少一第一固定孔與該至少一第二固定孔分別位於該容置槽之二相鄰側;以及 該下壓裝置包含至少一固定栓,該至少一固定栓鎖入該至少一第一固定孔與該至少一第二固定孔其中之一,使得該下壓裝置固定於該載台上。 The pressure measuring mechanism according to claim 1, wherein the fixing areas respectively comprise at least one first fixing hole and at least one second fixing hole, and the at least one first fixing hole and the at least one second fixing hole are respectively located in the two adjacent sides of the receiving groove; and The pressing device includes at least one fixing bolt, and the at least one fixing bolt is locked into one of the at least one first fixing hole and the at least one second fixing hole, so that the pressing device is fixed on the stage. 如請求項2所述之壓測機構,其中該下壓裝置包含: 一底座,鎖固於該載台上; 一支架,固設於該底座之頂面;以及 一下壓桿,可升降地設於該支架上,用以下移至該其中一開口內之該待測元件。 The pressure measuring mechanism as claimed in claim 2, wherein the pressing device comprises: a base, which is locked on the carrier; a bracket fixed on the top surface of the base; and A lower pressing rod, which can be lifted and lowered on the bracket, is used to move the device under test into one of the openings. 如請求項3所述之壓測機構,其中該下壓裝置更包含一第一溝縫,該第一溝縫開設於該底座上,其中該固定栓穿過該第一溝縫。The pressure measuring mechanism according to claim 3, wherein the pressing device further comprises a first groove, the first groove is opened on the base, and the fixing bolt passes through the first groove. 如請求項4所述之壓測機構,其中該下壓裝置更包含: 一推動件,樞設於該支架上; 一第二溝縫,開設於該推動件之一端,以供該下壓桿穿過,且該第二溝縫正交該第一溝縫; 一鎖迫件,固設於該下壓桿相對該容置槽之一端,且將該下壓桿限位於該推動件上; 一彈簧元件,套設至該下壓桿上,且連接該下壓桿及該支架, 其中當推動該推動件之另端並使該下壓桿抽離該容置槽時,該彈簧元件受到壓縮並儲存一回復力,該回復力用以將該下壓桿推回該容置槽內。 The pressure measuring mechanism as claimed in claim 4, wherein the pressing device further comprises: a pusher, pivoted on the bracket; A second groove is opened at one end of the pusher for the push-down rod to pass through, and the second groove is orthogonal to the first groove; a locking and forcing piece fixed on one end of the lower pressing rod opposite to the accommodating groove, and restraining the downward pressing rod on the pushing piece; A spring element is sleeved on the pressing rod and is connected with the pressing rod and the bracket, When the other end of the pusher is pushed and the pressing rod is pulled out of the accommodating groove, the spring element is compressed and stores a restoring force, and the restoring force is used to push the pressing rod back to the accommodating groove Inside. 如請求項4所述之壓測機構,其中該底座之底面更具有一引導溝槽,該載台具有至少一第一凸塊與至少一第二凸塊,該至少一第一凸塊與該至少一第二凸塊分別位於該容置槽之二相鄰側, 其中該至少一第一凸塊與該至少一第二凸塊其中之一可滑移地位於該引導溝槽內。 The pressure measuring mechanism according to claim 4, wherein the bottom surface of the base further has a guide groove, the stage has at least one first bump and at least one second bump, the at least one first bump and the At least one second bump is located on two adjacent sides of the accommodating groove, respectively, One of the at least one first bump and the at least one second bump is slidably located in the guide groove. 如請求項1所述之壓測機構,其中該電極部更包含一絕緣環,該絕緣環圍繞該第一接點,且位於該第一接點與該第二接點之間。The pressure measuring mechanism according to claim 1, wherein the electrode portion further comprises an insulating ring, the insulating ring surrounds the first contact and is located between the first contact and the second contact. 如請求項7所述之壓測機構,其中該第二接點包含一導電環及一導電片,該導電環圍繞該絕緣環與該第一接點,該導電片包含一金屬片與一貫穿口,該金屬片覆蓋且導接該導電環,該貫穿口形成於該金屬片上,且外露出該第一接點。The pressure measuring mechanism according to claim 7, wherein the second contact includes a conductive ring and a conductive sheet, the conductive ring surrounds the insulating ring and the first contact, and the conductive sheet includes a metal sheet and a through-hole an opening, the metal sheet covers and conducts the conductive ring, the through opening is formed on the metal sheet and exposes the first contact. 如請求項8所述之壓測機構,其中該載台更包含: 一對位墊片,覆蓋該導電片、該絕緣環與該第一接點,其中該些開口開設於該對位墊片上,且每一該些開口露出該導電片之一部分、該絕緣環之一部分與該第一接點之一部分;以及 一上蓋,將該對位墊片固定於該導電片上,包含一同時露出該些開口之貫孔。 The pressure measuring mechanism according to claim 8, wherein the carrier further comprises: A pair of alignment pads covering the conductive sheet, the insulating ring and the first contact, wherein the openings are opened on the alignment pad, and each of the openings exposes a part of the conductive sheet, the insulating ring a part and a part of the first contact; and an upper cover, the alignment pad is fixed on the conductive sheet, and includes a through hole exposing the openings at the same time. 如請求項1所述之壓測機構,其中該載台更包含一基座與一載板,該載板可移除地組裝於該基座上,該容置槽及該些固定區皆同時位於該載板上。The pressure measuring mechanism according to claim 1, wherein the carrier further comprises a base and a carrier, the carrier is removably assembled on the base, the accommodating groove and the fixing areas are both at the same time on the carrier board.
TW110210383U 2021-09-02 2021-09-02 Press testing mechanism TWM621845U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110210383U TWM621845U (en) 2021-09-02 2021-09-02 Press testing mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110210383U TWM621845U (en) 2021-09-02 2021-09-02 Press testing mechanism

Publications (1)

Publication Number Publication Date
TWM621845U true TWM621845U (en) 2022-01-01

Family

ID=80785362

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110210383U TWM621845U (en) 2021-09-02 2021-09-02 Press testing mechanism

Country Status (1)

Country Link
TW (1) TWM621845U (en)

Similar Documents

Publication Publication Date Title
US9726720B2 (en) Integrated circuit test device and integrated circuit test equipment
US8013623B2 (en) Double sided probing structures
CN208089857U (en) A kind of Urine Analyzer movement carrying machinery
JP2001183415A (en) Ic socket for bare chip
US6917212B2 (en) Test fixture for printed circuit board assembly
TWI351524B (en) Apparatus for planarizing a probe card and method
CN205091435U (en) PCB testing arrangement
TWM621845U (en) Press testing mechanism
KR20130005874A (en) Test socket for semiconductor package
TWM514004U (en) Integrated circuit inspection device and inspection equipment
CN109387767B (en) Be applied to positioning jig of PCB board
CN216013502U (en) Pressure measuring mechanism
KR20210124913A (en) Probe card and probe module thereof
CN209000548U (en) A kind of SSD Testing device of electrical parameter
JPH11162602A (en) Socket for electric component
TW200413740A (en) Adapter for testing one or more conductor assemblies
CN215833511U (en) A general device that bears for test of paster components and parts electrical performance
CN209878823U (en) Automatic locking type BGA aging testing device
CN105699876B (en) General adapting fixture
TWI402509B (en) Flat head probe test socket
KR102213079B1 (en) Test socket
JP4068280B2 (en) Socket for electrical parts
CN219285337U (en) Chip test system and test platform
CN220626521U (en) Flip type impedance tool
CN215678642U (en) Mainboard function testing device