TWM621845U - Press testing mechanism - Google Patents
Press testing mechanism Download PDFInfo
- Publication number
- TWM621845U TWM621845U TW110210383U TW110210383U TWM621845U TW M621845 U TWM621845 U TW M621845U TW 110210383 U TW110210383 U TW 110210383U TW 110210383 U TW110210383 U TW 110210383U TW M621845 U TWM621845 U TW M621845U
- Authority
- TW
- Taiwan
- Prior art keywords
- contact
- groove
- pressure measuring
- measuring mechanism
- openings
- Prior art date
Links
Images
Landscapes
- Measuring Leads Or Probes (AREA)
Abstract
Description
本創作有關於一種壓測機構,且特別是關於一種阻抗量測之壓測機構。This creation is about a pressure measuring mechanism, and especially about a pressure measuring mechanism for impedance measurement.
傳統阻抗量測機構透過下壓件將待測元件按壓至載台上,使得待測元件之腳位能夠緊密地接觸載台之電極接點,從而提供後端系統進行測試。此外,阻抗量測機構能夠針對多種不同型號的待測元件進行單獨測試。每當阻抗量測機構改為測試另個不同型號的待測元件時,為了讓下壓件能夠有效壓迫這個不同型號之待測元件,使用者需要改變載台之配置方位,使得待測元件移至下壓件下方之有效位置。The traditional impedance measurement mechanism presses the device to be tested on the stage through the pressing member, so that the pins of the device to be tested can closely contact the electrode contacts of the stage, so as to provide the back-end system for testing. In addition, the impedance measurement mechanism can perform individual tests for a variety of different types of components under test. Whenever the impedance measuring mechanism is changed to test a different type of component to be tested, in order to allow the pressing member to effectively press the component to be measured of this different type, the user needs to change the configuration orientation of the stage so that the component to be measured moves. to the effective position below the lower pressing piece.
然而,由於阻抗量測機構的載台內部包含許多複雜且彼此層疊的組件,為了改變載台之配置方位,使用者必須將載台內部的這些組件依序取出、接著依序旋轉方位,再依序裝回載台內,如此,不僅相當耗時與費力,又可能因為錯誤安裝,導致待測元件之損傷。However, since the stage of the impedance measurement mechanism contains many complex and stacked components, in order to change the arrangement orientation of the stage, the user must take out these components in the stage in sequence, then rotate the orientation in sequence, and then follow the It is not only time-consuming and laborious, but also may cause damage to the component to be tested due to wrong installation.
由此可見,上述技術顯然仍存在不便與缺陷,而有待加以進一步改良。因此,如何有效地尋找一種解決方案,以克服上述不便與缺陷,實屬當前重要研發課題之一,亦成爲當前相關領域亟需改進的目標。It can be seen that the above-mentioned technology obviously still has inconvenience and defects, and needs to be further improved. Therefore, how to effectively find a solution to overcome the above-mentioned inconveniences and defects is one of the current important research and development issues, and it has also become an urgent target for improvement in the current related fields.
本創作之一目的在於提供一種壓測機構,用以解決以上先前技術所提到的困難。One purpose of the present invention is to provide a pressure measurement mechanism to solve the above difficulties mentioned in the prior art.
本創作之一實施例提供一種壓測機構。壓測機構包括一載台、一下壓裝置與一電極部。電極部包含極性相反之第一接點與第二接點。載台包含一容置槽及二固定區。容置槽內具有多個開口。每個開口同時曝露出第一接點與第二接點,且開口之尺寸彼此不同,用以接受不同尺寸之待測元件。固定區分別位於容置槽之不同側。下壓裝置選擇性地鎖固於其中一固定區,用以下壓至開口內之待測元件。An embodiment of the present invention provides a pressure measurement mechanism. The pressure measuring mechanism includes a stage, a lower pressure device and an electrode part. The electrode portion includes a first contact and a second contact with opposite polarities. The carrier includes an accommodating slot and two fixing areas. The accommodating groove has a plurality of openings. Each opening exposes the first contact point and the second contact point at the same time, and the sizes of the openings are different from each other, so as to accept components to be tested of different sizes. The fixing areas are respectively located on different sides of the accommodating groove. The pressing device is selectively locked in one of the fixed areas, and is used to press down the device to be tested in the opening.
依據本創作一或複數個實施例,上述之壓測機構中,這些固定區分別包含至少一第一固定孔與至少一第二固定孔。第一固定孔與第二固定孔分別位於容置槽之二相鄰側。下壓裝置包含至少一固定栓。固定栓鎖入其中一第一固定孔與第二固定孔,使得下壓裝置固定於底座上。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the fixing regions respectively include at least one first fixing hole and at least one second fixing hole. The first fixing hole and the second fixing hole are respectively located on two adjacent sides of the accommodating groove. The pressing device includes at least one fixing pin. The fixing bolt is locked into one of the first fixing hole and the second fixing hole, so that the pressing device is fixed on the base.
依據本創作一或複數個實施例,上述之壓測機構中,下壓裝置包含一底座、一支架及一下壓桿。底座鎖固於載台上。支架固設於底座之頂面上。下壓桿可升降地設於支架上,用以下移至開口內之待測元件。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the pressing device includes a base, a bracket and a lower pressing rod. The base is locked on the stage. The bracket is fixed on the top surface of the base. The lowering rod can be raised and lowered on the bracket, and is used to move the component to be tested in the opening.
依據本創作一或複數個實施例,上述之壓測機構中,下壓裝置更包含一第一溝縫。第一溝縫開設於底座上,固定栓穿過第一溝縫。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the pressing device further includes a first groove. The first groove is opened on the base, and the fixing bolt passes through the first groove.
依據本創作一或複數個實施例,上述之壓測機構中,下壓裝置更包含一推動件、一第二溝縫、一鎖迫件及一彈簧元件。推動件樞設於支架上。第二溝縫開設於推動件之一端,以供下壓桿穿過,且第二溝縫正交第一溝縫。鎖迫件固設於下壓桿相對容置槽之一端,且將下壓桿限位於推動件上。彈簧元件套設至下壓桿上,且連接下壓桿及支架。故當推動推動件之另端並使下壓桿抽離容置槽時,彈簧元件受到壓縮並儲存一回復力,回復力用以將下壓桿推回容置槽內。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the pressing device further includes a pushing member, a second groove, a locking member and a spring element. The push piece is pivoted on the bracket. The second groove is opened at one end of the pusher for the pressing rod to pass through, and the second groove is orthogonal to the first groove. The locking and forcing piece is fixed on one end of the pressing rod opposite to the accommodating groove, and restricts the pressing rod to the pushing piece. The spring element is sleeved on the pressing rod and is connected with the pressing rod and the bracket. Therefore, when the other end of the pusher is pushed and the lower pressure rod is pulled out of the accommodating groove, the spring element is compressed and stores a restoring force, and the restoring force is used to push the downward pressure rod back into the accommodating groove.
依據本創作一或複數個實施例,上述之壓測機構中,底座之底面更具有一引導溝槽。載台具有至少一第一凸塊與至少一第二凸塊。第一凸塊與第二凸塊分別位於容置槽之二相鄰側。第一凸塊與第二凸塊其中之一可滑移地位於引導溝槽內。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the bottom surface of the base further has a guide groove. The stage has at least one first bump and at least one second bump. The first bump and the second bump are respectively located on two adjacent sides of the accommodating groove. One of the first bump and the second bump is slidably located in the guide groove.
依據本創作一或複數個實施例,上述之壓測機構中,電極部更包含一絕緣環,絕緣環圍繞第一接點,且位於第一接點與第二接點之間。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the electrode portion further includes an insulating ring, and the insulating ring surrounds the first contact and is located between the first contact and the second contact.
依據本創作一或複數個實施例,上述之壓測機構中,第二接點包含一導電環及一導電片。導電環圍繞絕緣環與第一接點,導電片包含一金屬片與一貫穿口,金屬片覆蓋且電連接導電環,貫穿口形成於該金屬片上,且外露出該第一接點。According to one or more embodiments of the present invention, in the aforementioned pressure measuring mechanism, the second contact includes a conductive ring and a conductive sheet. The conductive ring surrounds the insulating ring and the first contact. The conductive sheet includes a metal sheet and a through opening. The metal sheet covers and is electrically connected to the conductive ring. The through opening is formed on the metal sheet and exposes the first contact.
依據本創作一或複數個實施例,上述之壓測機構中,載台更包含一對位墊片與一上蓋。對位墊片覆蓋導電片、絕緣環與第一接點。開口開設於對位墊片上,且每個開口露出導電片之一部分、絕緣環之一部分與第一接點之一部分。上蓋將對位墊片固定於導電片上,上蓋包含一同時露出這些開口之貫孔。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the stage further includes a pair of alignment spacers and an upper cover. The alignment gasket covers the conductive sheet, the insulating ring and the first contact. The openings are opened on the alignment pad, and each opening exposes a part of the conductive sheet, a part of the insulating ring and a part of the first contact. The upper cover fixes the alignment pad on the conductive sheet, and the upper cover includes a through hole exposing the openings at the same time.
依據本創作一或複數個實施例,上述之壓測機構中,載台更包含一基座與一載板,載板可移除地組裝於基座上,容置槽及這些固定區皆同時位於載板上。According to one or more embodiments of the present invention, in the above-mentioned pressure measuring mechanism, the carrier further includes a base and a carrier, the carrier is removably assembled on the base, and both the accommodating groove and the fixing areas are at the same time. on the carrier board.
如此,透過以上各實施例之所述架構,本創作能夠快速變更下壓裝置及待測元件之相對關係,避免手動改變載台之配置方位,進而達到省時與省力之目的。In this way, through the structures of the above embodiments, the present invention can quickly change the relative relationship between the pressing device and the device to be tested, avoid manually changing the arrangement orientation of the stage, and thus achieve the purpose of saving time and effort.
以上所述僅係用以闡述本創作所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本創作之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above descriptions are only used to describe the problems to be solved by the present creation, the technical means for solving the problems, and the effects produced by them.
以下將以圖式揭露本創作之複數個實施例,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本創作。也就是說,在本創作實施例中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。Several embodiments of the present invention will be disclosed in the drawings below. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the present creation. That is, in this creative embodiment, these practical details are unnecessary. In addition, for the purpose of simplifying the drawings, some well-known structures and elements will be shown in a simple and schematic manner in the drawings.
除非另有定義,本文所使用的所有詞彙(包括技術和科學術語)具有其通常的意涵,其意涵係能夠被熟悉此領域者所理解。更進一步的說,上述之詞彙在普遍常用之字典中之定義,在本說明書的內容中應被解讀為與本創作相關領域一致的意涵。除非有特別明確定義,這些詞彙將不被解釋為理想化的或過於正式的意涵。Unless otherwise defined, all terms (including technical and scientific terms) used herein have their ordinary meanings as can be understood by those skilled in the art. Furthermore, the definitions of the above words in commonly used dictionaries should be interpreted as meanings consistent with the relevant fields of the present creation in the content of this specification. Unless specifically defined, these terms are not to be construed in an idealized or overly formal sense.
第1圖為本創作一實施例之壓測機構10的局部分解圖。第2圖為第1圖之壓測機構10的載台100的局部上視圖。第3圖為第1圖之壓測機構10的示意圖及其局部M1的放大圖。如第1圖至第3圖所示,壓測機構10包括一載台100、一下壓裝置200與一電極部300。電極部300位於載台100內,且電極部300包含極性相反之第一接點310(如正極)與第二接點320(如負極)。載台100包含一容置槽101、第一固定區170及第二固定區180。容置槽101內排列有多個開口151。每個開口151同時曝露出第一接點310與第二接點320,且開口151之尺寸彼此不同。每個開口151接受不同尺寸之待測元件400(第3圖)。舉例來說,待測元件400例如為被動元件(例如電感L、電容C、電阻R),且被動元件依據功能或特性被製成不同型號之元件,型號例如為 0402、0603、0805、1206 (單位:英吋)。第一固定區170及第二固定區180分別位於容置槽101之不同側。下壓裝置200選擇性地鎖固於第一固定區170或第二固定區180上,使得下壓裝置200能夠移至待測元件400之正上方,以便有效地下壓至其中一開口151內之待測元件400,如此,待測元件400之腳位(圖中未示)能夠分別緊密接觸此開口151內之第一接點310與第二接點320。FIG. 1 is a partial exploded view of a
具體來說,載台100更包含一基座110與一載板120。基座110具有一破口111。載板120可移除地嵌入基座110內,且載板120之一部分從基座110之破口111所外露。容置槽101、第一固定區170及第二固定區180皆同時位於載板120上,且從基座110之破口111所外露。Specifically, the
容置槽101呈圓形,這些開口151分別圍繞容置槽101之中心。這些開口151,例如呈矩形,且其中二開口151之長軸方向(如X或Y軸)彼此相交或甚至正交(第2圖)。然而,本創作不限於此。The
在本實施例中,第一固定區170及第二固定區180分別位於容置槽101之二相鄰側,並非容置槽101之同側。舉例來說,第一固定區170包含多個(例如2個)第一固定孔171,第二固定區180包含多個(例如2個)第二固定孔181。這些第一固定孔171與這些第二固定孔181分別位於容置槽101之二相鄰側,換句話說,此些第一固定孔171之間的假想連線與此些第二固定孔181之間的假想連線彼此相交,甚至彼此正交。下壓裝置200透過多個(例如2個)固定栓290分別鎖入第一固定孔171內,使得下壓裝置200能夠固定於第一固定區170上,且位於容置槽101之其一側(第3圖)。然而,本創作不限於此。In this embodiment, the
第4圖為本實施例之壓測機構10的另一示意圖及其局部M2的放大圖。如第1圖與第4圖,當使用者改讓另個待測元件401放入另個開口151時,使用者只需將固定栓290脫離第一固定孔171,改為鎖入第二固定孔181內,使得下壓裝置200從容置槽101之原側改固定於容置槽101之相鄰側,進而能夠有效下壓至另個開口151內之待測元件401。FIG. 4 is another schematic diagram of the
更具體地,如第1圖與第4圖所示,下壓裝置200包含一底座210、一支架240及一下壓桿280。底座210透過固定栓290鎖固於載台100上。支架240固設於底座210之頂面211上。下壓桿280可升降地設於支架240上,用以下移至開口151內之待測元件400。更具體地,支架240呈Z字形,支架240具有相對之第一端241與第二端242,第一端241與第二端242彼此具有高度差,支架240之第一端241固定於底座210之頂面211上,支架240之第二端242位於容置槽101之上方,且承載上述之下壓桿280。More specifically, as shown in FIGS. 1 and 4 , the
更具體地,下壓裝置200更包含多個(例如2個)第一溝縫220。第一溝縫220分別開設於底座210上,且這些第一溝縫220之長軸方向(如X軸)彼此同軸。每個固定栓290穿過其中一第一溝縫220,且鎖迫於其中一第一固定孔171中。舉例來說,每個固定栓290為螺栓,且每個第一固定孔171及第二固定孔181皆為螺孔。More specifically, the
如此,當下壓裝置200透過固定栓290而組裝至容置槽101之一側之前,下壓裝置200能夠沿著第一溝縫220滑移,以調整下壓裝置200與容置槽101之對應位置。同理,當下壓裝置200組裝至容置槽101之相鄰側之前,下壓裝置200也能夠沿著第一溝縫220滑移,以調整下壓裝置200與容置槽101之對應位置。In this way, before the
更進一步地,底座210之底面212更具有一引導溝槽230。引導溝槽230之長軸方向與第一溝縫220之長軸方向(如X軸)平行。載台100之載板120具有多個(例如2個)第一凸塊130與多個(例如2個)第二凸塊140。此些第一凸塊130與第二凸塊140分別位於容置槽101之二相鄰側。換句話說,此些第一凸塊130之間的假想連線與此些第二凸塊140之間的假想連線彼此相交,甚至彼此正交。第一凸塊130可滑移地位於引導溝槽230內。如此,當下壓裝置200沿著第一溝縫220滑移時,透過第一凸塊130在引導溝槽230內之配合,下壓裝置200能夠順利地沿著第一溝縫220滑移。同理,當下壓裝置200透過第二凸塊140在引導溝槽230內之配合,下壓裝置200於容置槽101之相鄰側能夠順利地沿著第一溝縫220滑移。Furthermore, the
然而,本創作不限於此,其他實施例中,也可以更改第一溝縫220之設計(圖中未示),使第一溝縫220之延伸方向(如Y軸)穿過容置槽101,如此,下壓裝置200能夠在容置槽101之一側沿著第一溝縫220滑移,以便調整下壓裝置200與容置槽101之相隔距離。However, the present invention is not limited to this. In other embodiments, the design of the first groove 220 (not shown in the figure) can also be changed, so that the extending direction (eg, the Y axis) of the
此外,第5圖為本實施例之壓測機構10的載台100的分解圖。如第1圖與第5圖所示,下壓裝置200更包含一推動件250、一鎖迫件260及一彈簧元件270。推動件250透過一樞軸253樞設於支架240上,使得推動件250能夠相對支架240樞轉。推動件250具有一第二溝縫254。第二溝縫254之長軸方向(如Y軸)正交第一溝縫220之長軸方向(如X軸)。第二溝縫254開設於推動件250之前端251,以供下壓桿280相對容置槽101之一端穿過。下壓桿280能夠沿著第二溝縫254移動,以調整下壓桿280之傾斜程度。鎖迫件260固設於下壓桿280相對容置槽101之一端,且將下壓桿280限位於推動件250上。支架240之第二端242具有一狹長開槽243。彈簧元件270位於狹長開槽243內,套設至下壓桿280上,且抵接下壓桿280及狹長開槽243內之擋塊281。狹長開槽243之長軸方向(如Z軸)分別正交第一溝縫220之長軸方向(如X軸)及第二溝縫254之長軸方向(如Y軸)。In addition, FIG. 5 is an exploded view of the
如此,當一使用者將推動件250之後端252推向支架240,使得推動件250之前端251向上拉起下壓桿280,而讓下壓桿280抽離容置槽101時,彈簧元件270受到壓縮並儲存一回復力。反之,當使用者釋放推動件250之後端252,使得彈簧元件270之回復力將下壓桿280推回容置槽101內。In this way, when a user pushes the
如第2圖與第5圖所示,更進一步地,電極部300更包含一絕緣環340,第一接點310包含一金屬中柱311。第二接點320包含一導電環321及一導電片330。絕緣環340圍繞金屬中柱311,且直接位於金屬中柱311與導電環321之間。導電環321圍繞絕緣環340與金屬中柱311。導電片330包含一金屬片331與一貫穿口332,金屬片331覆蓋至導電環321之一面上,且電連接導電環321。貫穿口332形成於金屬片331上,且金屬中柱311穿過貫穿口332。As shown in FIGS. 2 and 5 , further, the
載台100更包含一對位墊片150與一上蓋160。對位墊片150覆蓋導電片330、絕緣環340與第一接點310。開口151開設於對位墊片150上,且每個開口151露出導電片330之一部分、絕緣環340之一部分與第一接點310之一部分。上蓋160將對位墊片150固定於導電片330上,上蓋160包含一同時露出這些開口151之貫孔161。對位墊片150直接夾合於載板120與金屬片331之間(第1圖)。金屬片331直接夾合於導電環321與對位墊片150之間。載板120具有一開孔121。開孔121同時露出對位墊片150與導電環321。上蓋160覆蓋載板120之開孔121。此外,導電環321之一面具有導柱322,上蓋160、載板120、對位墊片150、導電片330依序重疊至導電環321後,受到導柱322之依序貫穿。The
如此,透過以上各實施例之所述架構,本創作能夠快速變更下壓裝置及待測元件之相對關係,避免手動改變載台之配置方位,進而達到省時與省力之目的。In this way, through the structures of the above embodiments, the present invention can quickly change the relative relationship between the pressing device and the device to be tested, avoid manually changing the arrangement orientation of the stage, and thus achieve the purpose of saving time and effort.
最後,上述所揭露之各實施例中,並非用以限定本創作,任何熟習此技藝者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾,皆可被保護於本創作中。因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。Finally, the above disclosed embodiments are not intended to limit the present creation. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of the present creation, and they can be protected in this book. in creation. Therefore, the scope of protection of this creation should be determined by the scope of the appended patent application.
10:壓測機構
100:載台
101:容置槽
110:基座
111:破口
120:載板
121:開孔
130:第一凸塊
140:第二凸塊
150:對位墊片
151:開口
160:上蓋
161:貫孔
170:第一固定區
171:第一固定孔
180:第二固定區
181:第二固定孔
200:下壓裝置
210:底座
211:頂面
212:底面
220:第一溝縫
230:引導溝槽
240:支架
241:第一端
242:第二端
243:狹長開槽
250:推動件
251:前端
252:後端
253:樞軸
254:第二溝縫
260:鎖迫件
270:彈簧元件
280:下壓桿
281:擋塊
290:固定栓
300:電極部
310:第一接點
311:金屬中柱
320:第二接點
321:導電環
322:導柱
330:導電片
331:金屬片
332:貫穿口
340:絕緣環
400、401:待測元件
M1、M2:局部
X、Y、Z:軸
10: Pressure measuring mechanism
100: stage
101: accommodating slot
110: Pedestal
111: Break
120: carrier board
121: Opening
130: First bump
140: Second bump
150: Alignment spacer
151: Opening
160: top cover
161: Through hole
170: First Fixed Area
171: The first fixing hole
180:Second fixed area
181: Second fixing hole
200: Press down device
210: Base
211: top surface
212: Underside
220: First groove seam
230: Guide groove
240: Bracket
241: First End
242: Second End
243: long and narrow slot
250: Pusher
251: Front End
252: Backend
253: Pivot
254: Second groove seam
260: Lock forcing
270: Spring element
280: Press down lever
281: Stop
290:Fixed Bolt
300: Electrode part
310: First Contact
311: Metal center column
320: Second Contact
321: Conductive Ring
322: Guide post
330: Conductive sheet
331: Metal Sheet
332: Penetration
340:
為讓本創作之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖為本創作一實施例之壓測機構的局部分解圖; 第2圖為第1圖之壓測機構的載台的局部上視圖; 第3圖為第1圖之壓測機構的示意圖及其局部M1的放大圖; 第4圖為本實施例之壓測機構的另一示意圖及其局部M2的放大圖;以及 第5圖為本實施例之壓測機構的載台的分解圖。 In order to make the above-mentioned and other objects, features, advantages and embodiments of the present creation more obvious and easy to understand, the descriptions of the accompanying drawings are as follows: Figure 1 is a partial exploded view of a pressure measuring mechanism according to an embodiment of the creation; Figure 2 is a partial top view of the stage of the pressure measuring mechanism of Figure 1; Figure 3 is a schematic diagram of the pressure measuring mechanism in Figure 1 and an enlarged view of its part M1; FIG. 4 is another schematic diagram of the pressure measuring mechanism of this embodiment and an enlarged view of a part M2 thereof; and FIG. 5 is an exploded view of the stage of the pressure measuring mechanism of this embodiment.
10:壓測機構 10: Pressure measuring mechanism
100:載台 100: stage
101:容置槽 101: accommodating slot
110:基座 110: Pedestal
111:破口 111: Break
120:載板 120: carrier board
130:第一凸塊 130: First bump
140:第二凸塊 140: Second bump
170:第一固定區 170: First Fixed Area
171:第一固定孔 171: The first fixing hole
180:第二固定區 180:Second fixed area
181:第二固定孔 181: Second fixing hole
200:下壓裝置 200: Press down device
210:底座 210: Base
211:頂面 211: top surface
212:底面 212: Underside
220:第一溝縫 220: First groove seam
230:引導溝槽 230: Guide groove
240:支架 240: Bracket
250:推動件 250: Pusher
251:前端 251: Front End
280:下壓桿 280: Press down lever
290:固定栓 290:Fixed Bolt
X、Y、Z:軸 X, Y, Z: axis
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110210383U TWM621845U (en) | 2021-09-02 | 2021-09-02 | Press testing mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110210383U TWM621845U (en) | 2021-09-02 | 2021-09-02 | Press testing mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM621845U true TWM621845U (en) | 2022-01-01 |
Family
ID=80785362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110210383U TWM621845U (en) | 2021-09-02 | 2021-09-02 | Press testing mechanism |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM621845U (en) |
-
2021
- 2021-09-02 TW TW110210383U patent/TWM621845U/en unknown
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9726720B2 (en) | Integrated circuit test device and integrated circuit test equipment | |
US8013623B2 (en) | Double sided probing structures | |
CN208089857U (en) | A kind of Urine Analyzer movement carrying machinery | |
JP2001183415A (en) | Ic socket for bare chip | |
US6917212B2 (en) | Test fixture for printed circuit board assembly | |
TWI351524B (en) | Apparatus for planarizing a probe card and method | |
CN205091435U (en) | PCB testing arrangement | |
TWM621845U (en) | Press testing mechanism | |
KR20130005874A (en) | Test socket for semiconductor package | |
TWM514004U (en) | Integrated circuit inspection device and inspection equipment | |
CN109387767B (en) | Be applied to positioning jig of PCB board | |
CN216013502U (en) | Pressure measuring mechanism | |
KR20210124913A (en) | Probe card and probe module thereof | |
CN209000548U (en) | A kind of SSD Testing device of electrical parameter | |
JPH11162602A (en) | Socket for electric component | |
TW200413740A (en) | Adapter for testing one or more conductor assemblies | |
CN215833511U (en) | A general device that bears for test of paster components and parts electrical performance | |
CN209878823U (en) | Automatic locking type BGA aging testing device | |
CN105699876B (en) | General adapting fixture | |
TWI402509B (en) | Flat head probe test socket | |
KR102213079B1 (en) | Test socket | |
JP4068280B2 (en) | Socket for electrical parts | |
CN219285337U (en) | Chip test system and test platform | |
CN220626521U (en) | Flip type impedance tool | |
CN215678642U (en) | Mainboard function testing device |