TWM610991U - Wind scooper assembly and electronic device using the same - Google Patents

Wind scooper assembly and electronic device using the same Download PDF

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Publication number
TWM610991U
TWM610991U TW110200039U TW110200039U TWM610991U TW M610991 U TWM610991 U TW M610991U TW 110200039 U TW110200039 U TW 110200039U TW 110200039 U TW110200039 U TW 110200039U TW M610991 U TWM610991 U TW M610991U
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Taiwan
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heating element
electronic device
wind deflector
switch
opening
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TW110200039U
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Chinese (zh)
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吳文仁
黃蔚荏
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和碩聯合科技股份有限公司
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Priority to TW110200039U priority Critical patent/TWM610991U/en
Publication of TWM610991U publication Critical patent/TWM610991U/en
Priority to CN202122277059.3U priority patent/CN215991749U/en

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Abstract

本創作揭露一種導風罩組件,應用於一電子裝置,其包括一發熱元件區域。導風罩組件包括一導風罩、一遮蔽件、一開關以及一控制模組。導風罩用以罩設發熱元件區域。導風罩包括一第一側、一第二側、一入風口及一開孔。入風口位於第一側,開孔設置於第二側。遮蔽件可移動地設置於導風罩,並對應於開孔。開關連接於遮蔽件,以控制遮蔽件於一開啟位置及一遮蔽位置之間移動。控制模組電性連接於開關。控制模組包括一溫度感測單元,以偵測發熱元件區域的一環境溫度。當環境溫度大於一第一預設值,控制模組開啟開關,使遮蔽件移動至開啟位置。This creation discloses a wind deflector assembly applied to an electronic device, which includes a heating element area. The wind guide assembly includes a wind guide, a shield, a switch and a control module. The wind hood is used to cover the heating element area. The wind deflector includes a first side, a second side, an air inlet and an opening. The air inlet is located on the first side, and the opening is provided on the second side. The shielding member is movably arranged on the wind deflector and corresponds to the opening. The switch is connected to the shielding element to control the shielding element to move between an open position and a shielding position. The control module is electrically connected to the switch. The control module includes a temperature sensing unit to detect an ambient temperature in the heating element area. When the ambient temperature is greater than a first preset value, the control module turns on the switch to move the shielding member to the open position.

Description

導風罩組件及其應用之電子裝置Wind hood assembly and electronic device used therefor

本創作係關於一種導風罩組件,特別是關於一種應用在電子裝置的導風罩組件。This creation is about a wind deflector assembly, especially a wind deflector assembly applied to an electronic device.

隨著科技的快速發展,電子裝置的運作速度及效能不斷地提高,進而使內部的電子元件的發熱功率也不斷地攀升。為了避免電子元件因過熱而失效,必須提供足夠的散熱效能。例如,電子裝置內部會裝設風扇,利用風扇產生的氣流將電子元件所產生的熱氣帶出電子裝置外。又,對於高發熱功率之電子元件,例如中央處理單元或是繪圖晶片等,通常會加裝散熱鰭片、或其他類型的散熱模組,搭配風扇所產生的氣流,以降低這些電子元件的溫度。With the rapid development of technology, the operating speed and performance of electronic devices have been continuously improved, and the heating power of the internal electronic components has also been continuously increased. In order to prevent electronic components from failing due to overheating, sufficient heat dissipation performance must be provided. For example, a fan is installed inside the electronic device, and the air flow generated by the fan is used to take the heat generated by the electronic component out of the electronic device. In addition, for electronic components with high heating power, such as central processing units or graphics chips, heat dissipation fins or other types of heat dissipation modules are usually added to match the airflow generated by the fan to reduce the temperature of these electronic components. .

另外,電子裝置以伺服器(Server)為例,伺服器的殼體內通常還會配置有輔助散熱的導流結構,以增加熱對流的效率。例如,將導風罩設置於伺服器之主機板的外側,並將風扇配置於主機板的一側,並對應於導風罩的入風口。風扇所吹出的氣流能經過導風罩的引導,進而將主機板上之電子元件所產生的熱能散逸出殼體外,進而降低伺服器的溫度而穩定其運作。In addition, the electronic device takes a server as an example, and the housing of the server is usually equipped with a diversion structure to assist heat dissipation to increase the efficiency of heat convection. For example, the air deflector is arranged on the outside of the main board of the server, and the fan is arranged on one side of the main board and corresponds to the air inlet of the air deflector. The air flow blown by the fan can be guided by the wind deflector, and then the heat generated by the electronic components on the motherboard can be dissipated out of the casing, thereby reducing the temperature of the server and stabilizing its operation.

若還須增加散熱效果,一般是藉由增加風扇的轉速,進而提升氣流的流量,以散逸電子元件所產生的熱能。然而,此種增加風扇轉速的方式相當耗能,實有改良的必要。If it is necessary to increase the heat dissipation effect, it is generally by increasing the speed of the fan to increase the flow rate of the airflow to dissipate the heat generated by the electronic components. However, this method of increasing the fan speed is quite energy-consuming, and there is a need for improvement.

有鑑於上述課題,本創作之主要目的係在提供一種電子裝置及導風扇組件,導風罩組件包括導風罩及遮蔽件,遮蔽件用以遮蔽或開啟導風罩的開孔,藉由前述新穎的結構,以解決習知透過增加風扇的轉速以提升散熱效果反而產生耗能的問題。In view of the above-mentioned problems, the main purpose of this creation is to provide an electronic device and a fan assembly. The wind guide assembly includes a wind guide and a shielding member. The shielding member is used to cover or open the opening of the wind guide. The novel structure solves the conventional problem of energy consumption by increasing the speed of the fan to improve the heat dissipation effect.

為達成上述之目的,本創作提供一種導風罩組件,應用於一電子裝置。電子裝置包括一發熱元件區域。導風罩組件包括一導風罩、一遮蔽件、一開關以及一控制模組。導風罩用以罩設發熱元件區域。導風罩包括一第一側、一第二側、一入風口及至少一開孔。入風口位於導風罩的第一側,開孔設置於導風罩的第二側。第一側與第二側位於不同軸向。遮蔽件可移動地設置於導風罩,並對應於開孔。開關連接於遮蔽件,以控制遮蔽件於一開啟位置及一遮蔽位置之間移動。控制模組電性連接於開關。控制模組包括一溫度感測單元,溫度感測單元偵測發熱元件區域的一環境溫度。當環境溫度大於一第一預設值,控制模組開啟開關,使遮蔽件移動至開啟位置。In order to achieve the above-mentioned purpose, this invention provides a wind deflector assembly applied to an electronic device. The electronic device includes a heating element area. The wind guide assembly includes a wind guide, a shield, a switch and a control module. The wind hood is used to cover the heating element area. The wind deflector includes a first side, a second side, an air inlet and at least one opening. The air inlet is located on the first side of the wind deflector, and the opening is arranged on the second side of the wind deflector. The first side and the second side are located in different axial directions. The shielding member is movably arranged on the wind deflector and corresponds to the opening. The switch is connected to the shielding element to control the shielding element to move between an open position and a shielding position. The control module is electrically connected to the switch. The control module includes a temperature sensing unit, and the temperature sensing unit detects an ambient temperature in the area of the heating element. When the ambient temperature is greater than a first preset value, the control module turns on the switch to move the shielding member to the open position.

為達成上述之目的,本創作另提供一種電子裝置,包括一發熱元件區域、一導風罩組件以及一控制模組。導風罩組件用以罩設發熱元件區域。導風罩組件包括一導風罩、一遮蔽件以及一開關。導風罩包括一第一側、一第二側、一入風口及至少一開孔。入風口位於導風罩的第一側,開孔設置於導風罩的第二側。第一側與第二側位於不同軸向。遮蔽件可移動地設置於導風罩,並對應於開孔。開關連接於遮蔽件,以控制遮蔽件於一開啟位置及一遮蔽位置之間移動。控制模組電性連接於開關。控制模組包括一溫度感測單元,溫度感測單元偵測發熱元件區域的一環境溫度。當環境溫度大於一第一預設值,控制模組開啟開關,使遮蔽件移動至開啟位置。In order to achieve the above-mentioned purpose, the present invention provides another electronic device, which includes a heating element area, a wind deflector assembly, and a control module. The wind hood assembly is used to cover the heating element area. The wind guide assembly includes a wind guide, a shield and a switch. The wind deflector includes a first side, a second side, an air inlet and at least one opening. The air inlet is located on the first side of the wind deflector, and the opening is arranged on the second side of the wind deflector. The first side and the second side are located in different axial directions. The shielding member is movably arranged on the wind deflector and corresponds to the opening. The switch is connected to the shielding element to control the shielding element to move between an open position and a shielding position. The control module is electrically connected to the switch. The control module includes a temperature sensing unit, and the temperature sensing unit detects an ambient temperature in the area of the heating element. When the ambient temperature is greater than a first preset value, the control module turns on the switch to move the shielding member to the open position.

根據本創作之一實施例,當環境溫度小於一第二預設值,控制模組關閉開關,使遮蔽件移動至遮蔽位置。According to an embodiment of the present invention, when the ambient temperature is less than a second preset value, the control module turns off the switch to move the shielding member to the shielding position.

根據本創作之一實施例,入風口的軸向垂直開孔的軸向。According to an embodiment of the present invention, the axial direction of the air inlet is perpendicular to the axial direction of the opening.

根據本創作之一實施例,當遮蔽件位於遮蔽位置時,電子裝置內部的氣流自入風口流經發熱元件區域。According to an embodiment of the present invention, when the shielding member is located at the shielding position, the airflow inside the electronic device flows through the heating element area from the air inlet.

根據本創作之一實施例,當遮蔽件位於開啟位置時,電子裝置內部的氣流自入風口及開孔流經發熱元件區域。According to an embodiment of the present invention, when the shielding member is in the open position, the airflow inside the electronic device flows through the heating element area from the air inlet and the opening.

根據本創作之一實施例,導風罩的該些開孔對應於發熱元件區域。According to an embodiment of the present invention, the openings of the wind deflector correspond to the heating element area.

承上所述,依據本創作之電子裝置及導風罩組件,導風罩組件包括導風罩、遮蔽件及開關。其中,導風罩設置於發熱元件區域的外側,並包括入風口及開孔。遮蔽件可移動地設置於導風罩,並對應於開孔。開關與遮蔽件連接,以控制遮蔽件於開啟位置及遮蔽位置之間移動。又,電子裝置或導風罩組件的控制模組與開關電性連接。當環境溫度大於第一預設值,控制模組開啟開關,使遮蔽件移動至開啟位置,以增加冷空氣進入發熱元件區域的風量,進而可降低發熱元件區域的環境溫度。因此,透過控制遮蔽件的移動,此種幾乎不用耗能的方式,即可達到提升散熱效果的作用。Based on the above, according to the electronic device and wind deflector assembly of this creation, the wind deflector assembly includes the wind deflector, the shield and the switch. Wherein, the wind deflector is arranged outside the heating element area, and includes an air inlet and an opening. The shielding member is movably arranged on the wind deflector and corresponds to the opening. The switch is connected with the shield to control the shield to move between the open position and the shield position. In addition, the control module of the electronic device or the wind deflector assembly is electrically connected to the switch. When the ambient temperature is greater than the first preset value, the control module turns on the switch to move the shielding member to the open position to increase the volume of cold air entering the heating element area, thereby reducing the ambient temperature of the heating element area. Therefore, by controlling the movement of the shielding member, the effect of improving the heat dissipation effect can be achieved in such a way that hardly consumes energy.

為能讓 貴審查委員能更瞭解本創作之技術內容,特舉較佳具體實施例說明如下。In order to let your review committee know more about the technical content of this creation, some preferred specific embodiments are described as follows.

圖1為本創作之一實施例之電子裝置的示意圖,圖2為圖1所示之導風罩於內側的示意圖,請參考圖1及圖2所示。電子裝置E可例如但不限於電腦、或伺服器等裝置,且電子裝置E包括一發熱元件區域H。須說明的是,為求圖面簡潔,電子裝置E僅繪製發熱元件區域H的部分。具體而言,電子裝置E具有多個運作時會產生熱能的電子元件C,而這些電子元件C設置的區域於此稱為發熱元件區域H。例如,發熱元件區域H可以是配置主機板的區域。FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the creation, and FIG. 2 is a schematic diagram of the air deflector shown in FIG. 1 on the inner side. Please refer to FIG. 1 and FIG. 2. The electronic device E can be, for example, but not limited to, a computer, or a server, and the electronic device E includes a heating element area H. It should be noted that, in order to simplify the drawing, the electronic device E only draws the part of the heating element area H. Specifically, the electronic device E has a plurality of electronic components C that generate heat during operation, and the area where these electronic components C are arranged is referred to as the heating element area H herein. For example, the heating element area H may be an area where the main board is arranged.

在本實施例中,電子裝置E包括一導風罩組件1。其中,導風罩組件1包括一導風罩10、一遮蔽件20以及一開關30。其中,導風罩組件1的導風罩10設置於發熱元件區域H的外側。例如,導風罩10可以為罩體,以罩設於發熱元件區域H(如主機板)的外側。在本實施例中,導風罩10可包括一入風口11、一出風口12及至少一開孔13。爲清楚說明入風口11、出風口12及開孔13的設置位置,將導風罩10區分為第一側14及第二側15,且第一側14與第二側15位於不同軸向。具體而言,導風罩10包括第一側14及第二側15,第一側14為導風罩10的側面(本實施例以四側面為例),而第二側15為導風罩10的頂側,使第一側14實質上垂直於第二側15。In this embodiment, the electronic device E includes a wind deflector assembly 1. Wherein, the wind hood assembly 1 includes a wind hood 10, a shield 20 and a switch 30. Wherein, the wind hood 10 of the wind hood assembly 1 is arranged outside the area H of the heating element. For example, the wind deflector 10 may be a cover body to cover the outside of the heating element area H (such as the main board). In this embodiment, the air guide hood 10 may include an air inlet 11, an air outlet 12 and at least one opening 13. In order to clearly illustrate the positions of the air inlet 11, the air outlet 12, and the opening 13, the air deflector 10 is divided into a first side 14 and a second side 15, and the first side 14 and the second side 15 are located in different axial directions. Specifically, the wind deflector 10 includes a first side 14 and a second side 15. The first side 14 is the side surface of the wind deflector 10 (four sides are taken as an example in this embodiment), and the second side 15 is the wind deflector The top side of 10 makes the first side 14 substantially perpendicular to the second side 15.

其中,入風口11與出風口12皆位於導風罩10的第一側14,,且入風口11與出風口12分別位於導風罩10的第一側14的相對二端。具體而言,入風口11位於第一側14的其中一端141,而出風口12位於第一側14的相對另一端142。須說明的是,由於第一側14相對的一端141與另一端142分別具有入風口11與出風口12,故以圖1、圖2及圖3分別以箭頭表示其位置。The air inlet 11 and the air outlet 12 are both located on the first side 14 of the wind deflector 10, and the air inlet 11 and the air outlet 12 are respectively located at two opposite ends of the first side 14 of the wind deflector 10. Specifically, the air inlet 11 is located at one end 141 of the first side 14, and the air outlet 12 is located at the opposite end 142 of the first side 14. It should be noted that since the opposite end 141 and the other end 142 of the first side 14 respectively have the air inlet 11 and the air outlet 12, their positions are indicated by arrows in FIGS. 1, 2 and 3 respectively.

另外,本實施例之導風罩10是以複數個開孔13為例說明。具體而言,開孔13設置於導風罩10的一第二側15,本實施例是以頂側為例。由於第一側14與第二側15位於不同軸向,使得入風口11與開孔13亦位於不同軸向。具體而言,本實施例之導風罩10的側面(或截面)為倒U字型結構。除了二側的側面以外,更具有第二側15,第一側14與一第二側15相互垂直,因此第二側15與入風口11相互垂直。又,本實施例之開孔13設置於第二側15,使入風口11與具有開孔13的第二側15相互垂直,即入風口11與開孔13不重疊,且入風口11的軸向垂直開孔13的軸向。較佳的,導風罩10的開孔13對應於發熱元件區域H。In addition, the wind deflector 10 of this embodiment is illustrated by taking a plurality of openings 13 as an example. Specifically, the opening 13 is provided on a second side 15 of the wind deflector 10, and this embodiment takes the top side as an example. Since the first side 14 and the second side 15 are located in different axial directions, the air inlet 11 and the opening 13 are also located in different axial directions. Specifically, the side surface (or cross section) of the wind deflector 10 of this embodiment is an inverted U-shaped structure. In addition to the two sides, there is a second side 15. The first side 14 and a second side 15 are perpendicular to each other, so the second side 15 and the air inlet 11 are perpendicular to each other. In addition, the opening 13 of this embodiment is arranged on the second side 15, so that the air inlet 11 and the second side 15 with the opening 13 are perpendicular to each other, that is, the air inlet 11 and the opening 13 do not overlap, and the axis of the air inlet 11 To the axial direction of the vertical opening 13. Preferably, the opening 13 of the wind deflector 10 corresponds to the area H of the heating element.

如圖2所示,遮蔽件20設置於導風罩10,並對應於開孔13。例如遮蔽件20可設置於第二側15。在本實施例中,遮蔽件20是可移動地設置於導風罩10,以遮蔽或露出開孔13,如圖2及圖3所示。圖3為圖2所示之遮蔽件遮蔽開孔的示意圖。具體而言,開關30連接於遮蔽件20,以控制遮蔽件20於一開啟位置(如圖2所示)及一遮蔽位置(如圖3所示)之間移動。例如,開關30具有因開、關而作動的連桿(圖未示),並透過連桿與遮蔽件20連接。當開關30被開啟時,連桿可帶動遮蔽件20移動至開啟位置,如圖2所示,以露出開孔13。當開關30被關閉時,連桿可帶動遮蔽件20移動至遮蔽位置,如圖3所示,以遮蔽開孔13。在其他實施例中,開關30亦可以其他結構連接至遮蔽件20,本創作並不限制,僅需可控制遮蔽件20於開啟位置及遮蔽位置之間移動。較佳的,導風罩10亦可具有滑槽(圖未示),遮蔽件20可設置於滑槽內,以於開啟位置及遮蔽位置之間移動。As shown in FIG. 2, the shielding member 20 is disposed on the wind guide 10 and corresponds to the opening 13. For example, the shield 20 may be disposed on the second side 15. In this embodiment, the shielding member 20 is movably disposed on the wind deflector 10 to shield or expose the opening 13, as shown in FIGS. 2 and 3. FIG. 3 is a schematic diagram of the opening shown in FIG. 2 being shielded by the shielding member. Specifically, the switch 30 is connected to the shielding member 20 to control the shielding member 20 to move between an open position (as shown in FIG. 2) and a shielding position (as shown in FIG. 3). For example, the switch 30 has a connecting rod (not shown in the figure) that is actuated by opening and closing, and is connected to the shield 20 through the connecting rod. When the switch 30 is turned on, the connecting rod can drive the shield 20 to move to the open position, as shown in FIG. 2, to expose the opening 13. When the switch 30 is closed, the connecting rod can drive the shielding member 20 to move to the shielding position, as shown in FIG. 3, to shield the opening 13. In other embodiments, the switch 30 can also be connected to the shielding member 20 in other structures. The present invention is not limited, and it is only necessary to control the shielding member 20 to move between the open position and the shielding position. Preferably, the wind deflector 10 may also have a sliding groove (not shown), and the shielding member 20 may be arranged in the sliding groove to move between the open position and the shielding position.

又,本實施例之電子裝置E還包括一控制模組40,電性連接於導風罩組件1的開關30。其中,開關30可以為電磁開關,透過控制模組40控制開關30的開啟、關閉。其中,控制模組40可設置於導風罩10或是電子裝置E,本實施例是以設置於電子裝置E為例說明。圖4為1所示之電子裝置的方塊示意圖,請參考圖1、圖2及圖4所示。本實施例之控制模組40包括一溫度感測單元41,溫度感測單元41可偵測發熱元件區域H的一環境溫度。又,控制模組40儲存有一第一預設值及一第二預設值,藉由環境溫度與第一預設值、及第二預設值的關係,以判斷開啟或關閉開關30。In addition, the electronic device E of this embodiment further includes a control module 40 electrically connected to the switch 30 of the wind deflector assembly 1. The switch 30 may be an electromagnetic switch, and the switch 30 is controlled to be turned on and off through the control module 40. Wherein, the control module 40 can be installed in the wind deflector 10 or the electronic device E, and this embodiment is described by taking the installation in the electronic device E as an example. FIG. 4 is a block diagram of the electronic device shown in 1, please refer to FIG. 1, FIG. 2 and FIG. 4. The control module 40 of this embodiment includes a temperature sensing unit 41, and the temperature sensing unit 41 can detect an ambient temperature of the heating element region H. In addition, the control module 40 stores a first preset value and a second preset value, and determines whether to turn on or off the switch 30 based on the relationship between the ambient temperature, the first preset value, and the second preset value.

具體而言,當環境溫度大於第一預設值時,控制模組40開啟開關30,使遮蔽件20移動至開啟位置(如圖2所示)。例如,第一預設值可設定為50°C。當發熱元件區域H內的電子元件C運轉所產生之熱能,使發熱元件區域H的環境溫度超過50°C時,控制模組40可對開關30通電,使開關30被開啟。換言之,導風罩組件1的開關是透過電子裝置E的控制模組40所控制。開關30被開啟後可帶動遮蔽件20移動至開啟位置,以露出開孔13。此時,電子裝置E內部的氣流(例如風扇產生的氣流)可自入風口11及開孔13流經發熱元件區域H,並往出風口12的方向移動,藉此散逸發熱元件區域H中之電子元件C產生的熱能。Specifically, when the ambient temperature is greater than the first preset value, the control module 40 turns on the switch 30 to move the shielding member 20 to the open position (as shown in FIG. 2). For example, the first preset value may be set to 50°C. When the thermal energy generated by the operation of the electronic component C in the heating element area H causes the ambient temperature of the heating element area H to exceed 50°C, the control module 40 can energize the switch 30 to turn on the switch 30. In other words, the switch of the wind deflector assembly 1 is controlled by the control module 40 of the electronic device E. After the switch 30 is turned on, the shielding member 20 can be moved to the open position to expose the opening 13. At this time, the airflow inside the electronic device E (for example, the airflow generated by a fan) can flow from the air inlet 11 and the opening 13 through the heating element area H, and move in the direction of the air outlet 12, thereby dissipating the heating element in the area H Thermal energy generated by the electronic component C.

當發熱元件區域H的環境溫度下降後,控制模組40關閉開關30,使遮蔽件20移動至遮蔽位置。例如,第二預設值可設定為30°C,當環境溫度小於第二預設值(30°C)時,控制模組40可對開關30斷電,使開關30被關閉。開關30被關閉後可帶動遮蔽件20移動至遮蔽位置,以遮蔽開孔13,如圖3所示。此時,電子裝置E內部的氣流是自入風口11流經發熱元件區域H,並往出風口12的方向移動。When the ambient temperature of the heating element area H drops, the control module 40 turns off the switch 30 to move the shielding member 20 to the shielding position. For example, the second preset value may be set to 30°C. When the ambient temperature is lower than the second preset value (30°C), the control module 40 may power off the switch 30 to turn off the switch 30. After the switch 30 is closed, the shielding member 20 can be driven to move to the shielding position to shield the opening 13, as shown in FIG. 3. At this time, the air flow inside the electronic device E flows from the air inlet 11 through the heating element area H and moves in the direction of the air outlet 12.

具體而言,電子裝置E的內部設置有風扇(圖未示)。於一般的狀態下,遮蔽件20是位於遮蔽位置,而風扇產生的氣流可自入風口11流經發熱元件區域H,並往出風口12的方向移動。當電子元件C運轉而產的熱能過多,無法僅透過入風口11及出風口12散逸時,發熱元件區域H的環境溫度將會上升。須說明的是,習知的導風罩也是透過將風扇所產生的氣流自入風口導引至出風口,以散逸發熱元件區域中之電子元件C產生的熱能。然而,環境溫度上升時,習知是透過加大風扇的轉速,以提高散逸熱氣的效率。Specifically, a fan (not shown in the figure) is provided inside the electronic device E. In a general state, the shield 20 is located at the shielding position, and the air flow generated by the fan can flow from the air inlet 11 through the heating element area H and move in the direction of the air outlet 12. When the thermal energy generated by the operation of the electronic component C is too much to dissipate only through the air inlet 11 and the air outlet 12, the ambient temperature of the heating element area H will increase. It should be noted that the conventional air guide hood also guides the air flow generated by the fan from the air inlet to the air outlet to dissipate the heat generated by the electronic component C in the heating element area. However, when the ambient temperature rises, it is conventionally known to increase the speed of the fan to increase the efficiency of heat dissipation.

在本實施例中,則是藉由控制模組40開啟開關30,使遮蔽件20移動至開啟位置(如圖2所示)。此時,除了入風口11以外,風扇所產生的氣流(冷風)還可從開孔13進入導風罩10內部,流經發熱元件區域H後(變成熱風),再自出風口12散逸至發熱元件區域H的外側,藉此降低發熱元件區域H的環境溫度。換言之,可不用以耗能的方式(提高風扇轉速)來冷卻發熱的電子元件C,僅需透過將遮蔽件20移動至開啟位置,即可達到相同冷卻發熱之電子元件C的效果。In this embodiment, the switch 30 is turned on by the control module 40 to move the shielding member 20 to the open position (as shown in FIG. 2). At this time, in addition to the air inlet 11, the air flow (cold air) generated by the fan can also enter the air duct 10 from the opening 13 and flow through the heating element area H (turned into hot air), and then escape from the air outlet 12 to generate heat The outside of the element area H, thereby reducing the ambient temperature of the heating element area H. In other words, it is not necessary to cool the heat-generating electronic component C in an energy-consuming manner (increasing the fan speed), and only by moving the shielding member 20 to the open position, the same effect of cooling the heat-generating electronic component C can be achieved.

本創作另提供一種導風罩組件1,其應用於一電子裝置E。由於電子裝置E與導風罩組件1的主要元件結構及其連接關係,與前述實施例相同,故沿用其元件符號。簡言之,電子裝置E包括發熱元件區域H。另外,請參考圖5所示,圖5為本創作之另一實施例之導風罩組件的方塊示意圖。導風罩組件1包括導風罩10(可參考圖1所示)、遮蔽件20、開關30及控制模組40。控制模組40同樣包括一溫度感測單元41,以偵測發熱元件區域H的環境溫度。控制模組40電性連接於開關30,以控制開關30,使遮蔽件20可於開啟位置及遮蔽位置之間移動。關於導風罩10、遮蔽件20、開關30及控制模組40的結構、連接關係與控制方式皆前述實施例相同,可參考前述實施例,於此不加贅述。The present invention also provides a wind deflector assembly 1 which is applied to an electronic device E. Since the main component structure and connection relationship of the electronic device E and the wind deflector assembly 1 are the same as the previous embodiment, the component symbols are used. In short, the electronic device E includes a heating element area H. In addition, please refer to FIG. 5, which is a block diagram of the wind deflector assembly according to another embodiment of the creation. The wind deflector assembly 1 includes a wind deflector 10 (refer to FIG. 1 ), a shield 20, a switch 30 and a control module 40. The control module 40 also includes a temperature sensing unit 41 to detect the ambient temperature of the heating element area H. The control module 40 is electrically connected to the switch 30 to control the switch 30 so that the shielding member 20 can move between the open position and the shielding position. Regarding the structure, connection relationship, and control method of the wind deflector 10, the shielding member 20, the switch 30, and the control module 40 are the same as the foregoing embodiment, please refer to the foregoing embodiment, which is not repeated here.

綜上所述,依據本創作之電子裝置及導風罩組件,導風罩組件包括導風罩、遮蔽件及開關。其中,導風罩設置於發熱元件區域的外側,並包括入風口及開孔。遮蔽件可移動地設置於導風罩,並對應於開孔。開關與遮蔽件連接,以控制遮蔽件於開啟位置及遮蔽位置之間移動。又,電子裝置或導風罩組件的控制模組與開關電性連接。當環境溫度大於第一預設值,控制模組開啟開關,使遮蔽件移動至開啟位置,以增加冷空氣進入發熱元件區域的風量,進而可降低發熱元件區域的環境溫度。因此,透過控制遮蔽件的移動,此種幾乎不用耗能的方式,即可達到提升散熱效果的作用。To sum up, according to the electronic device and wind deflector assembly of this creation, the wind deflector assembly includes the wind deflector, the shield and the switch. Wherein, the wind deflector is arranged outside the heating element area, and includes an air inlet and an opening. The shielding member is movably arranged on the wind deflector and corresponds to the opening. The switch is connected with the shield to control the shield to move between the open position and the shield position. In addition, the control module of the electronic device or the wind deflector assembly is electrically connected to the switch. When the ambient temperature is greater than the first preset value, the control module turns on the switch to move the shielding member to the open position to increase the volume of cold air entering the heating element area, thereby reducing the ambient temperature of the heating element area. Therefore, by controlling the movement of the shielding member, the effect of improving the heat dissipation effect can be achieved in such a way that hardly consumes energy.

應注意的是,上述諸多實施例係為了便於說明而舉例,本創作所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。It should be noted that many of the above-mentioned embodiments are examples for ease of description, and the scope of rights claimed in this creation should be subject to the scope of the patent application, and not limited to the above-mentioned embodiments.

1:導風罩組件 10:導風罩 11:入風口 12:出風口 13:開孔 14:第一側 141:一端 142:另一端 15:第二側 20:遮蔽件 30:開關 40:控制模組 41:溫度感測單元 C:電子元件 E:電子裝置 H:發熱元件區域 1: Wind hood assembly 10: Wind hood 11: Air inlet 12: Air outlet 13: Hole 14: First side 141: One end 142: The other end 15: second side 20: Shield 30: switch 40: control module 41: temperature sensing unit C: Electronic components E: Electronic device H: Heating element area

圖1為本創作之一實施例之電子裝置的示意圖。 圖2為圖1所示之導風罩於內側的示意圖。 圖3為圖2所示之遮蔽件遮蔽開孔的示意圖。 圖4為1所示之電子裝置的方塊示意圖。 圖5為本創作之另一實施例之導風罩組件的方塊示意圖。 FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the creation. Fig. 2 is a schematic diagram of the air duct shown in Fig. 1 on the inner side. FIG. 3 is a schematic diagram of the opening shown in FIG. 2 being shielded by the shielding member. FIG. 4 is a block diagram of the electronic device shown in 1. FIG. Fig. 5 is a block diagram of the wind deflector assembly according to another embodiment of the creation.

1:導風罩組件 1: Wind hood assembly

10:導風罩 10: Wind hood

11:入風口 11: Air inlet

12:出風口 12: Air outlet

13:開孔 13: Hole

14:第一側 14: First side

141:一端 141: One end

142:另一端 142: The other end

15:第二側 15: second side

20:遮蔽件 20: Shield

30:開關 30: switch

Claims (12)

一種導風罩組件,應用於一電子裝置,該電子裝置包括一發熱元件區域,該導風罩組件包括: 一導風罩,用以罩設該發熱元件區域,該導風罩包括一第一側、一第二側、一入風口及至少一開孔,該入風口位於該第一側,該開孔設置於該第二側,其中該第一側與該第二側位於不同軸向; 一遮蔽件,可移動地設置於該導風罩,並對應於該開孔; 一開關,連接於該遮蔽件,以控制該遮蔽件於一開啟位置及一遮蔽位置之間移動;以及 一控制模組,電性連接於該開關,該控制模組包括一溫度感測單元,該溫度感測單元偵測該發熱元件區域的一環境溫度,當該環境溫度大於一第一預設值,該控制模組開啟該開關,使該遮蔽件移動至該開啟位置。 An air deflector assembly is applied to an electronic device, the electronic device includes a heating element area, and the air deflector assembly includes: A wind hood for covering the heating element area, the wind hood includes a first side, a second side, an air inlet and at least one opening, the air inlet is located on the first side, the opening Disposed on the second side, wherein the first side and the second side are located in different axial directions; A shielding member movably arranged on the wind deflector and corresponding to the opening; A switch connected to the shielding member to control the shielding member to move between an open position and a shielding position; and A control module is electrically connected to the switch, the control module includes a temperature sensing unit, the temperature sensing unit detects an ambient temperature of the heating element area, when the ambient temperature is greater than a first preset value , The control module turns on the switch to move the shield to the open position. 如請求項1所述之導風罩組件,其中當該環境溫度小於一第二預設值,該控制模組關閉該開關,使該遮蔽件移動至該遮蔽位置。The wind deflector assembly according to claim 1, wherein when the ambient temperature is less than a second preset value, the control module turns off the switch to move the shielding member to the shielding position. 如請求項1所述之導風罩組件,其中該入風口的軸向垂直於該開孔的軸向。The air guide assembly according to claim 1, wherein the axial direction of the air inlet is perpendicular to the axial direction of the opening. 如請求項1所述之導風罩組件,其中當該遮蔽件位於該遮蔽位置時,該電子裝置內部的氣流自該入風口流經發熱元件區域。The wind deflector assembly according to claim 1, wherein when the shield is located at the shielding position, the airflow inside the electronic device flows through the heating element area from the air inlet. 如請求項1所述之導風罩組件,其中當該遮蔽件位於該開啟位置時,該電子裝置內部的氣流自該入風口及該開孔流經發熱元件區域。The wind deflector assembly according to claim 1, wherein when the shield is in the open position, the airflow inside the electronic device flows through the heating element area from the air inlet and the opening. 如請求項1所述之導風罩組件,其中該導風罩的該些開孔對應於該發熱元件區域。The wind deflector assembly according to claim 1, wherein the openings of the wind deflector correspond to the heating element area. 一種電子裝置,包括: 一發熱元件區域; 一導風罩組件,用以罩設該發熱元件區域,該導風罩組件包括: 一導風罩,其包括一第一側、一第二側、一入風口及至少一開孔,該入風口位於該第一側,該開孔設置於該第二側,其中該第一側與該第二側位於不同軸向; 一遮蔽件,可移動地設置於該導風罩,並對應於該開孔;及 一開關,連接於該遮蔽件,以控制該遮蔽件於一開啟位置及一遮蔽位置之間移動;以及 一控制模組,電性連接於該開關,該控制模組包括一溫度感測單元,該溫度感測單元偵測該發熱元件區域的一環境溫度,當該環境溫度大於一第一預設值,該控制模組開啟該開關,使該遮蔽件移動至該開啟位置。 An electronic device, including: A heating element area; A wind deflector assembly for covering the heating element area, the wind deflector assembly includes: A wind deflector comprising a first side, a second side, an air inlet and at least one opening, the air inlet is located on the first side, the opening is arranged on the second side, wherein the first side Located on a different axis from the second side; A shielding member movably arranged on the wind deflector and corresponding to the opening; and A switch connected to the shielding member to control the shielding member to move between an open position and a shielding position; and A control module is electrically connected to the switch, the control module includes a temperature sensing unit, the temperature sensing unit detects an ambient temperature of the heating element area, when the ambient temperature is greater than a first preset value , The control module turns on the switch to move the shield to the open position. 如請求項7所述之電子裝置,其中當該環境溫度小於一第二預設值,該控制模組關閉該開關,使該遮蔽件移動至該遮蔽位置。The electronic device according to claim 7, wherein when the ambient temperature is less than a second preset value, the control module turns off the switch to move the shielding member to the shielding position. 如請求項7所述之電子裝置,其中該入風口的軸向垂直於該開孔的軸向。The electronic device according to claim 7, wherein the axial direction of the air inlet is perpendicular to the axial direction of the opening. 如請求項7所述之電子裝置,其中當該遮蔽件位於該遮蔽位置時,該電子裝置內部的氣流自該入風口流經發熱元件區域。The electronic device according to claim 7, wherein when the shielding member is located at the shielding position, the airflow inside the electronic device flows through the heating element area from the air inlet. 如請求項7所述之電子裝置,其中當該遮蔽件位於該開啟位置時,該電子裝置內部的氣流自該入風口及該開孔流經發熱元件區域。The electronic device according to claim 7, wherein when the shielding member is in the open position, the airflow inside the electronic device flows through the heating element area from the air inlet and the opening. 如請求項7所述之電子裝置,其中該導風罩的該些開孔對應於該發熱元件區域。The electronic device according to claim 7, wherein the openings of the wind deflector correspond to the heating element area.
TW110200039U 2021-01-04 2021-01-04 Wind scooper assembly and electronic device using the same TWM610991U (en)

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