TWI491348B - Electronic device - Google Patents

Description

Electronic device

The present invention relates to an electronic device, and more particularly to a server.

In recent years, with the rapid development of technology, the operation speed of electronic devices has been continuously improved. In addition, as the performance of electronic devices increases, the heating power of electronic components of electronic devices continues to rise. In order to prevent temporary or permanent failure of electronic components from overheating, electronic devices must provide sufficient heat dissipation for electronic components. Therefore, for high-heat-power electronic components, such as central processing units or graphics wafers, heat-dissipating modules such as heat-dissipating fins are usually added to reduce the temperature of these electronic components. In addition, electronic components are typically located within the housing of the electronic device. In order to allow the heat absorbed by the heat dissipation module to be fully discharged outside the casing, the heat convection efficiency in the casing is also one of the concerns.

In the case of a server, since the server must have sufficient stability and reliability, the service interruption provided can be avoided. Therefore, a flow guiding structure for assisting heat dissipation is usually disposed in the casing of the server to increase the efficiency of heat convection. For example, the server can be disposed on one side of the motherboard, and a power hood is disposed at the opening of the power module, so that the airflow blown by the fan can be guided by the power hood to flow into the power module. In the group, the heat generated by the power module is dissipated outside the casing, thereby lowering the temperature of the server and stabilizing its operation.

However, the configuration of the power hood affects the heat dissipation efficiency of the power hood. That is, after the airflow passes through the hot electronic component, the airflow entrains the heat generated by the electronic component to raise the temperature. At this point, the same airflow can no longer continue to cool other electronic components. Therefore, it is easy to cause the heat dissipation efficiency of the electronic device to be poor.

The invention provides an electronic device with good heat dissipation efficiency.

The present invention provides an electronic device including a motherboard, a power module, a hard disk module, a fan module, a plurality of heat generating modules, and a power guiding hood. The power module is disposed on a front side of the motherboard along a longitudinal direction and has a power opening. The hard disk module is disposed longitudinally on the front side of the motherboard and stacked on the power module. The fan module is disposed at a lateral direction perpendicular to the longitudinal direction on a rear side of the motherboard relative to the front side and provides a flow of air toward the power supply opening of the power module. The heating module is disposed on the motherboard in a lateral direction and is located between the fan module and the power module. The power guiding hood is disposed on the power module and shields part of the power opening to block a part of the air flowing through the heating module from flowing into the power module, and guiding part of the airflow that does not flow through the heating module to be unshielded from the power hood Part of the power supply opening flows into the power module.

In an embodiment of the invention, the power supply air hood has an air inlet, located at one side of the power hood and corresponding to a portion of the power supply opening that is not shielded by the power hood, so as not to flow through Part of the airflow from the heating module flows into the power module from the air inlet.

In an embodiment of the invention, the power supply hood has a stop The blocking portion is located on the other side of the power hood relative to the air inlet to block a portion of the airflow flowing through the heat generating module from flowing to the plurality of electronic components located on the motherboard.

In an embodiment of the present invention, the electronic device further includes a power cord connected to the motherboard and the power module, wherein the power hood has an inner surface facing the power opening and an outer surface facing the fan module, the power source The wire is fixed to the outside, and part of the airflow that does not flow through the heat generating module flows from the power supply opening to the power module via the inner surface.

In an embodiment of the invention, the power supply air hood has a cable hook, which is located outside the power hood, and the power cable is fixed to the power hood via the cable hook.

In an embodiment of the invention, the electronic device further includes a hard disk air hood, wherein the hard disk module has a hard disk opening, the hard disk opening faces the fan module, and the hard disk air hood is disposed on the hard disk. On the module. When the hard disk air hood shields part of the heat generating module and exposes the hard disk opening, the hard disk air hood can be fixed on the power air hood to block part of the air flowing through the heat generating module from flowing into the hard disk module, and A portion of the airflow that does not flow through the heat generating module flows into the hard disk module, and the hard disk air deflector can rotate relative to the hard disk module to expose the blocked heat generating module.

In an embodiment of the invention, the hard disk air hood has a fixed hook, and the power air hood has a fixing hole located at a top of one of the power hoods. When the hard disk air hood exposes the hard disk opening, the hard disk air hood is fixed to the power air hood by engaging the fixing hook to the fixing hole.

In an embodiment of the invention, the hard disk module includes a hard disk Rack with multiple hard drives. The hard disks are arranged side by side or stacked in the hard disk frame, and the hard disk air hood is disposed on the hard disk frame to shield or expose the hard disk opening on the hard disk frame.

In an embodiment of the invention, the electronic device further includes a fan air hood covering the heat generating module and having a partition extending from the fan module to the power module to allow a part of the airflow from the partition A heat generating module flows between the motherboard and the motherboard, and some of the airflow flows from the upper side of the partition without the heat generating module to the hard disk module, and part of the airflow flows from the interval of the fan air duct to the power module.

In an embodiment of the invention, the fan air hood includes an air inlet and a plurality of air outlets. The air inlet corresponds to the fan module, and the air outlet corresponds to the heat generating module, so that part of the airflow can flow from the air inlet through the air outlet through the heat generating module to the power module, and the power air guiding block blocks the flow through the heating module. Part of the airflow flows into the power module.

Based on the above, the present invention provides an electronic device in which a power supply hood is disposed on a power module and shields a part of the power supply opening to block a part of the airflow flowing through the heating module from flowing into the power module, and guiding the non-flowing heating module. Part of the airflow flows into the power module from the unshielded part of the power supply hood to cool down. Therefore, the electronic device has good heat dissipation efficiency.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a schematic diagram of an electronic device according to an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the electronic device 100 includes a motherboard 110 and a power supply. The module 120, the power cable 130, the fan module 140, the power air hood 150, the hard disk module 160, the hard disk air hood 170, the fan air hood 180, and the plurality of heat generating modules 190. The electronic device 100 is, for example, a server, but the present invention does not limit the type of the electronic device 100.

The power module 120 is disposed on the front side F of the motherboard 110 in the longitudinal direction V and has a power source opening 122. The power line 130 is connected to the motherboard 110 and the power module 120. The hard disk module 160 is disposed on the front side F of the motherboard 110 in the vertical direction V and is stacked on the power module 120. The fan module 140 is located at a rear side B of the main board 110 with respect to the front side F in a lateral direction H perpendicular to the longitudinal direction V and provides airflow toward the power supply opening 122 of the power module 120. In addition, the heat generating module 190 is disposed on the motherboard 110 in the lateral direction H and located between the fan module 140 and the power module 120.

In the embodiment, the fan module 140 is an example in which six fans 142 are disposed in the fan frame 144. However, the present invention does not limit the number of fans 142 of the fan module 140. The fans 142 are arranged in a row in the horizontal direction H in the fan frame 144 and face the power module 120, the hard disk module 160 and the heat generating module 190, so that the fan 142 can provide airflow in the longitudinal direction V.

It can be seen that the fan module 140 provides airflow through the fan 142, and the airflow can flow inside the electronic device 100, so that the thermal energy emitted by the electronic components of the electronic device 100 during operation can be dissipated through the flow of the airflow to The exterior of the electronic device 100. Therefore, the fan module 140 faces the power supply opening 122 of the power module 120, the hard disk module 160, and the heat generating module 190, so that the airflow provided by the fan module 140 can flow to the power module 120 and the hard disk module 160. The heating module 190 lowers its operating temperature.

In this embodiment, the heat generating module 190 is, for example, a central processing unit (CPU) or a memory module, and the like, which generates a large amount of thermal energy during operation. Since the heat generating module 190 is located between the fan module 140 and the power module 120, a part of the airflow flowing from the fan module 140 to the power module 120 first flows through the heat generating module 190 and carries the heat generating module 190. The heat production. At this time, the temperature of the airflow in this part is increased, and if it flows into the power module 120, the heat dissipation efficiency of the power module 120 will be reduced.

Therefore, the power hood 150 is disposed on the power module 120 and shields part of the power source opening 122, so that part of the airflow flowing through the heat generating module 190 can be blocked from flowing into the power module 120, and the portion that does not flow through the heat generating module 190 is guided. The partial airflow flows into the power module 120 from a portion of the power supply opening 122 that is not shielded by the power hood 150.

2 is a schematic view of the power module and the power hood of FIG. 1. Referring to FIG. 1 and FIG. 2, in the embodiment, the power supply hood 150 has an air inlet 152. The air inlet 152 is located at one side of the power hood 150 and corresponds to a portion of the power source opening 122 that is not shielded by the power hood 150 so that a portion of the airflow that does not flow through the heat generating module 190 flows into the power source from the air inlet 152. Module 120.

Further, in the present embodiment, the power supply hood 150 further has a stopper portion 158. The stopping portion 158 is located at the other side of the power hood 150 relative to the air inlet 152 to block a portion of the airflow flowing through the heat generating module 190 from flowing to the plurality of electronic components located on the motherboard 110 (shown in the figure) 1). Therefore, other electronic components on the motherboard 110 can pass directly from the slave fan module 140. The outflowing airflow dissipates heat without being affected by the heat flow of the heat generating module 190 and the temperature rise.

3 is a partially enlarged schematic view of the power hood of FIG. 1. Referring to FIG. 2 and FIG. 3, in the embodiment, the power supply hood 150 further has a cable management function. That is, the power hood 150 has a function of accommodating the power cord 130 to prevent the power cord 130 from interfering with the motherboard 110.

Specifically, in the present embodiment, the power supply hood 150 has an inner surface S1 facing the power source opening 122 and an outer surface S2 facing the fan module 140. The power hood 150 has a cable hook 154 located outside the power hood 150. Therefore, the power cord 130 is fixed to the outer surface S2 of the power supply hood 150 via the cable hook 154, and part of the airflow that does not flow through the heat generating module 190 flows into the power source from the air inlet 152 and the power source opening 122 via the inner surface S1. Module 120. Accordingly, it is possible to prevent the power line 130 from being directly scattered on the motherboard 110 and interfering with the operation of other electronic components on the motherboard 110, and also allowing additional space inside the electronic device 100 for other electronic components to be disposed. There is no need to use an additional harness clip for securing the power cord 130 to the motherboard 110.

On the other hand, please refer to FIG. 1 again. In this embodiment, the hard disk module 160 is stacked on the power module 120 and has a hard disk opening 162, and the fan module facing the power opening 122 of the power module 120. The set 140 also faces the hard disk opening 162 of the hard disk module 160. Therefore, the airflow provided by the fan module 140 can flow to the hard disk module 160 and flow from the hard disk opening 162 into the hard disk module 160 to lower the operating temperature of the hard disk module 160.

In this embodiment, the hard disk module 160 includes a hard disk frame 164 and two Hard disk 166. The hard disk opening 162 is actually formed by the hard disk frame 164, and the hard disks 166 are disposed side by side or stacked in the hard disk frame 164 and exposed to the hard disk opening 162. In addition, the hard disk module 160 of the present embodiment is exemplified by having two hard disks 166, such as a large-sized hard disk (LFF) or other types of hard disks. The present invention does not limit the hard disk. Quantity and type.

On the other hand, the hard disk hood 170 is disposed on the hard disk module 160 and rotatable relative to the hard disk module 160. Therefore, when the hard disk hood 170 is lowered to shield a part of the heat generating module 190 such as a memory module and expose the hard disk opening 162 (as shown in FIG. 1), the hard disk hood 170 can be fixed to The power hood 150 blocks a portion of the airflow that is heated by the heat generating module 190 from flowing into the hard disk module 160, and flows a portion of the air that does not flow through the heat generating module 190 into the hard disk module 160. In addition, the hard disk air deflector 170 can rotate relative to the hard disk module 160 to expose the blocked heat generating module 190.

Specifically, when the hard disk hood 170 is lowered to expose the hard disk opening 162, the hard disk hood 170 forms a continuous interface with the rear end of the fan air hood 180. Therefore, when the airflow provided by the fan module 140 flows from the fan air hood 180 to the hard disk module 160 without passing through the heat generating module 190, the hard disk air hood 170 can guide the airflow to the hard disk mode smoothly. The set 160 flows into the hard disk opening 162 for heat dissipation.

In addition, when the hard disk air hood 170 is lowered to expose the hard disk opening 162, the hard disk air hood 170 can block a part of the airflow that is heated by the heat generating module 190 and blocked by the power hood 150 to flow upward. The hard disk module 160 affects the heat dissipation efficiency of the hard disk module 160, and part of the airflow that is heated by the heat generating module 190 rises along the slope of the stop portion 158 and is electrically connected. The gap between the source module 120 and the hard disk module 160 (not shown) flows to the outside of the electronic device 100.

In addition, when the hard disk hood 170 is lowered to expose the hard disk opening 162, the hard disk hood 170 shields a portion of the heat generating module 190, such as a memory module. Therefore, when the user needs to operate the shielded heat generating module 190, for example, when the memory is plugged and unplugged, the user can expose the hard disk air hood 170 to the blocked heat generating mold by rotating relative to the hard disk module 160. Group 190 for related operations. Accordingly, the power supply hood 150 can provide better operability.

4 is a partial enlarged cross-sectional view of the power hood and the hard disk hood of FIG. 1. Please refer to FIG. 3 and FIG. 4 . Specifically, in the embodiment, the hard disk air hood 170 has a fixed hook 172 , and the power hood 150 has a fixing hole 156 located at the top of the power hood 150 . . The position of the fixing hole 156 corresponds to the position of the fixing hook 172, and the fixing hole 156 penetrates from the inner surface S1 of the power supply hood 150 to the outer surface S2. Therefore, when the hard disk air hood 170 is lowered to expose the hard disk opening 162 (the process is from the state of FIG. 3 to the state of FIG. 4), the hard disk air hood 170 can be fixed to the fixed hook 172. The hole 156 is fixed to the power supply hood 150.

Therefore, the hard disk air hood 170 can be easily fixed to the power hood 150 without any other fixing members, so as to block a part of the air flowing through the heat generating module 190 from flowing into the hard disk module 160, thereby affecting the hard The heat dissipation efficiency of the disk module 160 can also prevent the hard disk air hood 170 from swaying during the transportation of the electronic device 100 to hit other electronic components. In addition, the fixing hook 172 of the hard disk hood 170 is fixed from the outer surface S2 of the power hood 150. The hole 156 is to the inner surface S1 of the power supply hood 150. Therefore, when the hard disk hood 170 rotates relative to the hard disk module 160 to shield the hard disk opening 162, the fixing hook 172 can be easily removed from the fixing hole 156. Accordingly, the power hood 150 can provide better assembly.

Referring to FIG. 1 again, in the embodiment, the fan air hood 180 covers the heat generating module 190 and has a partition 180a extending from the fan module 140 to the power module 120 to allow partial airflow from the partition 180a. Flowing through the heat generating module 190 between the motherboard 110 and a portion of the airflow from the upper portion of the partition 180a without passing through the heat generating module 190 to the hard disk module 160, and part of the airflow flowing from the interval of the fan air guiding cover 180 to Power module 120.

In other words, the fan air hood 180 divides the airflow provided by the fan module 140 into the upper and lower layers to the inside of the electronic device 100 through the partition plate 180a, and part of the airflow can also be from the fan air hood 180. The gap between the fan module 140 or the chassis (not shown) flows into the interior of the electronic device 100 to dissipate heat for different electronic modules. Therefore, it is possible to prevent the airflow from flowing to another electronic module that needs to be dissipated after the heat generation of one of the electronic modules is carried out, thereby reducing the heat dissipation efficiency.

Specifically, the fan air hood 180 has an air inlet 182 and a plurality of air outlets 184, wherein the air inlet 182 corresponds to the fan module 140, and the air outlet 184 corresponds to the heat generating module 190 and faces the power module 120 and the hard disk. Module 160. Therefore, part of the airflow can flow from the air inlet 182 through the air outlet 184 through the heat generating module 190 to the power module 120 and the hard disk module 160, and the power air guiding cover 170 is used to block the flow through the heat generating module 190. Part of the airflow flows into the power module 120.

On the other hand, the fan air hood 180 does not completely shield the fan module 140. Therefore, part of the airflow provided by the fan module 140 enters the air inlet 182 and flows through the heat generating module 190 through the air outlet 184 to heat the heat generated by the heat generating module 190, while the other part of the airflow does not flow into the air inlet 182, but instead The interval above the partition plate 180a and the fan air hood 180 directly flows out. The heat generated airflow of the two parts without the heat generating module 190 can directly flow to the corresponding hard disk module 160 and the power module 120, and flow to other electronic components for heat dissipation. Therefore, the electronic device 100 has good heat dissipation efficiency.

In summary, the present invention provides an electronic device in which a power supply air hood is disposed on a power module and shields a part of the power supply opening to block a part of the airflow flowing through the heating module from flowing into the power module, and guiding the non-flowing heat. Part of the airflow from the module flows into the power module from the unshielded part of the power supply hood to cool down. In addition, the power cord can be fixed to the power hood through the cable hook to prevent the power cord from interfering with the motherboard, and the hard disk hood can be fixed to the power guide by engaging the fixing hook to the fixing hole. Cover the cover to prevent part of the airflow through the heat module from flowing into the hard disk module. Accordingly, the electronic device has good heat dissipation efficiency, and the spatial arrangement degree of the electronic device can be improved by the power supply air hood having multiple functions.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Electronic devices

110‧‧‧ motherboard

120‧‧‧Power Module

122‧‧‧Power opening

130‧‧‧Power cord

140‧‧‧Fan module

142‧‧‧Fan

144‧‧‧Fan rack

150‧‧‧Power air hood

152, 182‧‧ ‧ inlet

154‧‧‧Looking line hook

156‧‧‧Fixed holes

158‧‧‧stop

160‧‧‧hard disk module

162‧‧‧ Hard disk opening

164‧‧‧ Hard disk rack

166‧‧‧ hard disk

170‧‧‧ hard disk air hood

172‧‧‧fixed hook

180‧‧‧fan air duct

180a‧‧‧Baffle

184‧‧ vents

190‧‧‧heating module

Inside S1‧‧‧

S2‧‧ outside

B‧‧‧Back side

F‧‧‧ front side

H‧‧‧ Landscape

V‧‧‧ portrait

1 is a schematic diagram of an electronic device according to an embodiment of the present invention.

2 is a schematic view of the power module and the power hood of FIG. 1.

3 is a partially enlarged schematic view of the power hood of FIG. 1.

4 is a partial enlarged cross-sectional view of the power hood and the hard disk hood of FIG. 1.

100‧‧‧Electronic devices

110‧‧‧ motherboard

120‧‧‧Power Module

122‧‧‧Power opening

130‧‧‧Power cord

140‧‧‧Fan module

142‧‧‧Fan

144‧‧‧Fan rack

150‧‧‧Power air hood

152, 182‧‧ ‧ inlet

160‧‧‧hard disk module

162‧‧‧ Hard disk opening

164‧‧‧ Hard disk rack

166‧‧‧ hard disk

170‧‧‧ hard disk air hood

180‧‧‧fan air duct

180a‧‧‧Baffle

184‧‧ vents

190‧‧‧heating module

B‧‧‧Back side

F‧‧‧ front side

H‧‧‧ Landscape

V‧‧‧ portrait

Claims (10)

An electronic device includes: a motherboard; a power module disposed on a front side of the motherboard along a longitudinal direction and having a power opening; a hard disk module disposed along the longitudinal direction of the front side of the motherboard Casing on the power module; a fan module is disposed along a lateral direction perpendicular to the longitudinal direction of the motherboard relative to a rear side of the front side and facing the power opening of the power module; a heating module disposed along the lateral direction between the fan module and the power module; and a power hood disposed on the power module and shielding a portion of the power opening to block a portion of the heat generating module flows into the power module, and directs a portion of the power module that does not flow through the heat generating module to flow into the power module from an unshielded portion of the power hood. . The electronic device of claim 1, wherein the power hood has an air inlet located on one side of the power hood and corresponding to the power opening not being shielded by the power hood In part, the airflow that does not flow through the heat generating modules flows into the power module from the air inlet. The electronic device of claim 2, wherein the power hood has a stop portion located on the other side of the power hood relative to the air inlet to block the heat flow therethrough Part of the module To multiple electronic parts located on the motherboard. The electronic device of claim 1, further comprising: a power cord connecting the motherboard and the power module, wherein the power hood has an inner surface facing the power opening and facing the fan module An outer portion of the group is fixed to the outside of the power line, and a portion of the airflow module that does not flow through the heat generating modules flows from the power source opening into the power module via the inner surface. The electronic device of claim 4, wherein the power hood has a cable hook located outside the power hood, and the power cable is fixed to the power cable via the cable hook Power supply hood. The electronic device of claim 1, further comprising: a hard disk air hood, wherein the hard disk module has a hard disk opening facing the fan module, the hard disk guiding air The cover is disposed on the hard disk module, and when the hard disk air cover covers a part of the heat generating module and exposes the hard disk opening, the hard disk air guiding cover can be fixed on the power air guiding cover to block a portion of the heat generating module flows into the hard disk module, and the portion of the heat generating module that does not flow through the heat generating module flows into the hard disk module, and the hard disk air deflector can be opposite to the hard disk module The hard disk module rotates to expose the heat generating modules that are shielded. The electronic device of claim 6, wherein the hard disk air hood has a fixed hook, the power air hood having a fixing hole located at a top of one of the power hoods, when the hard When the disk air hood exposes the hard disk opening, the hard disk air hood is fixed to the power air hood by engaging the fixing hook to the fixing hole. The electronic device of claim 6, wherein the hard disk module comprises a hard disk frame and a plurality of hard disks, the hard disks are arranged side by side or stacked in the hard disk frame, and the hard disk guide A windshield is disposed on the hard disk frame to shield or expose the hard disk opening on the hard disk frame. The electronic device of claim 1, further comprising: a fan air hood covering the heat generating modules and having a partition extending from the fan module to the power module, so that A portion of the airflow flows from the partition plate and the motherboard through the heat generating modules, and a portion of the airflow flows from the upper portion of the partition plate to the hard disk module without the heat generating modules. Airflow flows from the fan hood to the power module. The electronic device of claim 9, wherein the fan air hood includes an air inlet and a plurality of air outlets, the air inlets corresponding to the fan modules, and the air outlets correspond to the heat generating modules. So that a portion of the airflow can flow from the air inlet through the air outlets to the power module through the air outlets, and the power air duct blocks a portion of the airflow flowing through the heat generating modules to flow into the power module. Power module.