TWI806154B - Server and casing thereof - Google Patents
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- TWI806154B TWI806154B TW110133849A TW110133849A TWI806154B TW I806154 B TWI806154 B TW I806154B TW 110133849 A TW110133849 A TW 110133849A TW 110133849 A TW110133849 A TW 110133849A TW I806154 B TWI806154 B TW I806154B
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Abstract
Description
本發明係關於一種伺服器及其機殼,特別是一種共用式伺服器及其機殼。 The present invention relates to a server and its casing, in particular to a shared server and its casing.
現今世界係處於一個資訊科技高速發展的時代,不論是企業或個人,皆早已使用個人電腦(如:桌上型電腦、筆記型電腦...等)來處理事務。但隨著通信技術的成熟,跨國性的電子商務取代傳統區域性的商業模式已成為了一種趨勢。如此,一般的個人電腦已無法滿足企業於商場上的需求。因此,電腦業者乃開發出各式不同形式的伺服器(如:機櫃式伺服器、刀鋒式伺服器或直立式伺服等),以解決各企業進行電子化的問題。 Today's world is in an era of rapid development of information technology. Whether it is an enterprise or an individual, they have already used personal computers (such as: desktop computers, notebook computers, etc.) to handle affairs. However, with the maturity of communication technology, transnational e-commerce has become a trend to replace traditional regional business models. In this way, ordinary personal computers are no longer able to meet the needs of enterprises in the market. Therefore, the computer industry has developed various servers in different forms (such as: rack-mounted servers, blade-type servers, or vertical-type servers, etc.) to solve the problem of electronicization in various enterprises.
伺服器一般包含機殼及內部的電子零組件。其中,考量到散熱效率及空間利用率,研發人員一般會以內部的電子零組件的組成物來設計出專用的機殼。然而,因伺服器之機型的更新頻率不低,故若伺服器的內部的電子零組件的組成物有變動,則舊有的專用機殼就不再適用。也就是說,若製造廠商每推出新機型的伺服器,則必需配合新機型 重新設計新的機殼。如此一來,若開發機型的數量一多,則平均下來的研發與製造成本將會增加。 A server generally includes a casing and electronic components inside. Among them, in consideration of heat dissipation efficiency and space utilization, R&D personnel generally design a dedicated casing based on the composition of the internal electronic components. However, since the update frequency of the server model is not low, if the composition of the electronic components inside the server is changed, the old dedicated casing is no longer applicable. That is to say, if the manufacturer introduces a new type of server every time, it must be matched with the new type of server. Redesigned new case. In this way, if the number of developed models increases, the average R&D and manufacturing costs will increase.
本發明在於提供一種伺服器及其機殼,藉以讓機殼共用不同機型,以降低伺服器與機殼的研發製造成本。 The present invention is to provide a server and its casing, so that the casing can share different models, so as to reduce the R&D and manufacturing costs of the server and the casing.
本發明之一實施例所揭露之伺服器機殼包含一殼體及一風扇架。殼體具有相對的一前側及一後側。風扇架可轉向地設置於殼體之前側或後側。 A server casing disclosed in an embodiment of the present invention includes a casing and a fan frame. The casing has a front side and a rear side opposite to each other. The fan frame is turnably arranged on the front side or the rear side of the casing.
本發明之另一實施例所揭露之伺服器包含一機殼及一風扇模組。機殼包含一殼體及一風扇架。殼體具有相對的一前側及一後側。風扇架可轉向地設置於殼體之前側或後側。風扇模組裝設於風扇架。 A server disclosed in another embodiment of the present invention includes a casing and a fan module. The casing includes a casing and a fan frame. The casing has a front side and a rear side opposite to each other. The fan frame is turnably arranged on the front side or the rear side of the casing. The fan module is installed on the fan frame.
根據上述實施例之伺服器及其機殼,由於各功能模組之安裝架,如風扇架、電源安裝架、交換器安裝架皆採獨立拆裝設計,以令伺服器可依需求調整成標準機機型或整機櫃機型。如此一來,將有助於降低伺服器與機殼的研發製造成本。 According to the server and its casing of the above-mentioned embodiment, since the mounting frames of each functional module, such as the fan frame, power supply mounting frame, and switch mounting frame, are all designed to be disassembled independently, so that the server can be adjusted to a standard according to requirements. Machine model or complete cabinet model. In this way, it will help to reduce the R&D and manufacturing costs of the server and the casing.
此外,使用者也可以依據機型之型態調整把手的位置,以令伺服器的配置能更靈活。 In addition, the user can also adjust the position of the handle according to the type of the model, so that the configuration of the server can be more flexible.
此外,風扇架之第一組裝結構與第二組裝結構的結構相異,以確保組裝人員能夠將風扇安裝於正確方向。 In addition, the structure of the first assembly structure of the fan frame is different from that of the second assembly structure, so as to ensure that the assembler can install the fan in the correct direction.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the content of the present invention and the following description of the implementation are used to demonstrate and explain the principle of the present invention, and provide further explanation of the patent application scope of the present invention.
1、1A:伺服器 1. 1A: Server
10:機殼 10: Chassis
20:風扇模組 20: Fan module
22:穿孔 22: perforation
24:定位插銷 24: Positioning pin
26:結合插銷 26:Combine the latch
30:交換器模組 30: Switch module
40:電源模組 40: Power module
50:電源模組 50: Power module
100:殼體 100: Shell
101:前側 101: front side
102:後側 102: Rear side
110:結合孔 110: binding hole
200:風扇架 200: fan bracket
201:入風側 201: wind side
202:出風側 202: Outlet side
210:第一組裝結構 210: The first assembly structure
220:第二組裝結構 220: The second assembly structure
250:風扇背板 250:Fan backplane
300:交換器安裝架 300: Exchanger mounting bracket
400:電源安裝架 400: power supply mounting bracket
500:前窗托盤 500: front window tray
600:把手 600: handle
650:結合件 650: Combination
700:導風罩 700: Wind hood
800:蓋板 800: cover plate
圖1為根據本發明第一實施例所述之伺服器的立體示意圖。 FIG. 1 is a perspective view of a server according to a first embodiment of the present invention.
圖2為圖1之分解示意圖。 FIG. 2 is an exploded schematic diagram of FIG. 1 .
圖3為根據本發明第二實施例所述之伺服器的立體示意圖。 FIG. 3 is a schematic perspective view of a server according to a second embodiment of the present invention.
圖4為圖3之分解示意圖。 FIG. 4 is an exploded schematic diagram of FIG. 3 .
圖5為圖1或圖2之風扇架與風扇的分解示意圖。 FIG. 5 is an exploded schematic view of the fan frame and the fan shown in FIG. 1 or FIG. 2 .
本實施例之伺服器1例如採多圖形處理器(Graphics Processing Unit,GPU)系統。多圖形處理器(Graphics Processing Unit,GPU)系統除了對GPU與中央處理器(Central Processing Unit Processor,CPU)之間有高頻寬性能有需求之外,還要求GPU之間有很高的頻寬能力,即對等網路(Peer to Peer,點對點)頻寬。舉例來說,圖形處理器系統包括:一中央處理器(CPU)、複數個圖形處理器、一匯流排通信協定交換機,或/和一管理板。所述複數個圖形處理器與所述中央處理器通信相連。所述匯流排通信協定交換機與所述複數個圖形處理器相連,用於實現各圖形處理器之間的相互通信。所述管理板與所述匯流
排通信協定交換機分別通信相連,用於對所述匯流排通信協定交換機進行管理。
The
本實施例之伺服器1可以解決GPU相互之間的對等網路通信頻寬偏低的問題,可以給GPU和CPU之間提供高頻寬。將二級PCIE交換機通過網卡接入網路中後,可實現同一網路中的不同GPU系統間的資料直接交換,而不需要經過CPU及其記憶體,極大地提高了GPU系統間的資料交換能力。此外,本發明將GPU間的對等網路通信頻寬最大化和均衡化,理論最大雙向頻寬可達300GB/s,還可以再擴展一個八GPU系統,構成一個十六GPU系統,可實現任意兩GPU的對等網路通信。
The
伺服器1的高度例如但不限於為4U,其包含一機殼10及一風扇模組20。機殼10包含一殼體100及一風扇架200。殼體100具有相對的一前側101及一後側102。殼體100另具有一結合孔110,結合孔110位於殼體100之前側101。風扇架200具有相對的一入風側201及一後側102。風扇架200可轉向地設置於殼體100之前側101或後側102,以令伺服器1呈標準機機型配置或整機櫃機型配置。此外,風扇架200之入風側201較風扇架200之出風側202靠近殼體100之前側101。
The height of the
以標準機機型之伺服器1為例,請參閱圖1至圖2。圖1為根據本發明第一實施例所述之伺服器1的立體示意圖。圖2為圖1之分解示意圖。
Taking the
本實施例之伺服器1例如為標準機機型,並包含一機殼10及一風扇模組20。機殼10包含一殼體100及一風扇架200。殼體100具有相對的一前側101及一後側102。殼體100另具有結合孔110,結合孔110
位於殼體100之前側101與後側102。風扇架200位於殼體100之前側101,並具有相對的一入風側201及一出風側202。風扇架200之入風側201較風扇架200之出風側202靠近殼體100之前側101。風扇模組20裝設於風扇架200。此外,伺服器1還可以包含一風扇背板250,風扇背板250安裝於機殼10,並設有多個電連接器,以供風扇模組20電性連接。
The
在本實施例及其他實施例中,標準機機型之伺服器1之機殼10還可以包含一交換器模組30及一電源模組40。機殼10更包含一交換器安裝架300及一電源安裝架400。交換器安裝架300與電源安裝架400可抽換地安裝於殼體100之前側101。電源安裝架400位於交換器安裝架300上方。交換器模組30裝設於交換器安裝架300。電源模組40安裝於電源安裝架400,以提供伺服器1所需之電力。
In this embodiment and other embodiments, the
在本實施例及其他實施例中,標準機機型之伺服器1之機殼10還可以包含一把手600及結合件650。把手600透過結合件650結合於殼體100之前側101的結合孔110。
In this embodiment and other embodiments, the
在本實施例及其他實施例中,標準機機型之伺服器1之機殼10還可以包含一導風罩700及一蓋板800,導風罩700設置於殼體100,並用以導引風扇模組20產生的氣流。蓋板800安裝於殼體100,以蓋合於殼體100上方。
In this embodiment and other embodiments, the
以整機櫃機型之伺服器1A為例,請參閱圖3至圖4。圖3為根據本發明第二實施例所述之伺服器1A的立體示意圖。圖4為圖3之分解示意圖。 Taking the server 1A of the whole rack type as an example, please refer to Fig. 3 to Fig. 4 . FIG. 3 is a perspective view of a server 1A according to a second embodiment of the present invention. FIG. 4 is an exploded schematic diagram of FIG. 3 .
本實施例之伺服器1A例如為整機櫃機型,並包含一機殼10及一風扇模組20。機殼10包含一殼體100及一風扇架200。殼體100具有相對的一前側101及一後側102。殼體100另具有結合孔110,結合孔110位於殼體100之前側101與後側102。風扇架200位於殼體100之後側102,並具有相對的一入風側201及一出風側202。風扇架200之入風側201較風扇架200之出風側202靠近殼體100之前側101。風扇模組20裝設於風扇架200。此外,伺服器1A還可以包含一風扇背板250。風扇背板250安裝於機殼10,並設有多個電連接器,以供風扇模組20電性連接。
The server 1A of this embodiment is, for example, a complete rack type, and includes a
在本實施例及其他實施例中,整機櫃機型之伺服器1A之機殼10還可以包含一交換器模組30(Switch Module)及一電源模組50。機殼10更包含一交換器安裝架300及多個前窗托盤500。交換器安裝架300與前窗托盤500可抽換地安裝於殼體100之前側101。前窗托盤500位於交換器安裝架300上方。交換器模組30裝設於交換器安裝架300。電源模組50位於風扇架200下方,並用以與機櫃之電源供應排對接,以提供伺服器1A所需之電力。
In this embodiment and other embodiments, the
在本實施例及其他實施例中,整機櫃機型之伺服器1A之機殼10還可以包含一把手600及結合件650。把手600透過結合件650結合於殼體100之前側101的結合孔110。
In this embodiment and other embodiments, the
在本實施例及其他實施例中,整機櫃機型之伺服器1A之機殼10還可以包含一導風罩700及一蓋板800,導風罩700設置於殼體100,並用以導引風扇模組20產生的氣流。蓋板800安裝於殼體100,以蓋合於殼體100上方。
In this embodiment and other embodiments, the
請參閱圖5。圖5為圖1或圖2之風扇架200與風扇的分解示意圖。
See Figure 5. FIG. 5 is an exploded schematic diagram of the
風扇架200具有至少一第一組裝結構210與至少一第二組裝結構220,至少一第一組裝結構210與至少一第二組裝結構220用以供一風扇組裝,且至少一第一組裝結構210與至少一第二組裝結構220的結構相異。舉例來說,至少一第一組裝結構210為半圓孔,且至少一第二組裝結構220為圓孔。風扇模組20具有多個穿孔22,部分穿孔22插設有如膠釘之定位插銷24,其位置與數量匹配於第一組裝結構210的位置與數量。當風扇模組20欲安裝於風扇架200時,由於第一組裝結構210為半圓孔,故組裝人員可直接將風扇模組20塞入風扇架200,並讓定位插銷24卡合於第一組裝結構210。
The
當風扇模組20安裝於風扇架200內時,再透過結合插銷26穿設第二組裝結構220與另一部分穿孔22,以將風扇模組20固定於風扇架200。
When the
根據上述實施例之伺服器及其機殼,由於各功能模組之安裝架,如風扇架、電源安裝架、交換器安裝架皆採獨立拆裝設計,以令伺服器可依需求調整成標準機機型或整機櫃機型。如此一來,將有助於降低伺服器與機殼的研發製造成本。 According to the server and its casing of the above-mentioned embodiment, since the mounting frames of each functional module, such as the fan frame, power supply mounting frame, and switch mounting frame, are all designed to be disassembled independently, so that the server can be adjusted to a standard according to requirements. Machine model or complete cabinet model. In this way, it will help to reduce the R&D and manufacturing costs of the server and the casing.
此外,使用者也可以依據機型之型態調整把手的位置,以令伺服器的配置能更靈活。 In addition, the user can also adjust the position of the handle according to the type of the model, so that the configuration of the server can be more flexible.
此外,風扇架之第一組裝結構與第二組裝結構的結構相異,以確保組裝人員能夠將風扇安裝於正確方向。 In addition, the structure of the first assembly structure of the fan frame is different from that of the second assembly structure, so as to ensure that the assembler can install the fan in the correct direction.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.
1:伺服器 1: Server
10:機殼 10: Chassis
20:風扇模組 20: Fan module
30:交換器模組 30: Switch module
40:電源模組 40: Power module
100:殼體 100: Shell
101:前側 101: front side
102:後側 102: Rear side
110:結合孔 110: binding hole
200:風扇架 200: fan bracket
201:入風側 201: wind side
202:出風側 202: Outlet side
250:風扇背板 250:Fan backplane
300:交換器安裝架 300: Exchanger mounting bracket
400:電源安裝架 400: power supply mounting bracket
600:把手 600: handle
650:結合件 650: Combination
700:導風罩 700: Wind hood
800:蓋板 800: cover plate
Claims (9)
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TW201422123A (en) * | 2012-11-19 | 2014-06-01 | Inventec Corp | Electronic device |
TW202034584A (en) * | 2019-03-08 | 2020-09-16 | 廣達電腦股份有限公司 | Card module and server system |
TW202112209A (en) * | 2019-09-09 | 2021-03-16 | 英業達股份有限公司 | Processing assembly |
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TW201422123A (en) * | 2012-11-19 | 2014-06-01 | Inventec Corp | Electronic device |
TW202034584A (en) * | 2019-03-08 | 2020-09-16 | 廣達電腦股份有限公司 | Card module and server system |
TW202112209A (en) * | 2019-09-09 | 2021-03-16 | 英業達股份有限公司 | Processing assembly |
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