TW202112209A - Processing assembly - Google Patents
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Abstract
Description
本發明係關於一種處理模組,特別是一種用於伺服器的處理模組。The present invention relates to a processing module, in particular to a processing module for a server.
隨著網際網路的普及,結合網際網路與伺服器的雲端服務於近年來迅速發展。一般來說,伺服器會包含有處理模組,藉以將來自網際網路的資料轉換或處理成消費者所需要的資料。為了提供更即時的雲端服務,伺服器需要快速地處理從網際網路得到的資料,因而使得伺服器中的處理模組需要設置更多的處理單元。With the popularization of the Internet, cloud services that combine the Internet and servers have developed rapidly in recent years. Generally speaking, a server will include a processing module to convert or process data from the Internet into data required by consumers. In order to provide more real-time cloud services, the server needs to quickly process the data obtained from the Internet, so that the processing module in the server needs to be equipped with more processing units.
然而,在處理模組有限的空間中,除了要設置處理單元,還需設置諸如控制板(switch)及橋接板(bridge borad)等電子元件,以使處理模組能正常運作。因此,在處理單元及這些電子元件需要一起設置在處理模組中有限之空間的情況下,技術人員需要尋找一種在處理模組中配置處理單元及這些電子元件的合適方式,藉以在處理模組有限的空間中容納更多的處理單元。However, in the limited space of the processing module, in addition to the processing unit, it is also necessary to install electronic components such as a control board (switch) and a bridge board (bridge borad) to enable the processing module to operate normally. Therefore, when the processing unit and these electronic components need to be installed together in a limited space in the processing module, technicians need to find a suitable way to configure the processing unit and these electronic components in the processing module, so as to install the processing unit and these electronic components in the processing module. More processing units can be accommodated in a limited space.
本發明在於提供一種處理模組,藉以在處理模組有限的空間中容納更多的處理單元。The present invention is to provide a processing module, whereby more processing units can be accommodated in the limited space of the processing module.
本發明之一實施例所揭露之一種處理模組,包含一架體、一隔板、二子組接架、二主機板、二控制板以及至少一橋接板。隔板設置於架體中而將架體的內部空間區隔成一第一容置槽及一第二容置槽。二子組接架分別設置於第一容置槽及第二容置槽。二主機板分別設置於二子組接架。二主機板各包含一板體及設置於板體的多個處理單元。二控制板分別設置於二子組接架並分別電性連接於二主機板。至少一橋接板電性連接於二主機板。其中一個主機板介於其中一個控制板及至少一橋接板之間,且另一個主機板介於其中一個控制板及至少一橋接板之間。A processing module disclosed in an embodiment of the present invention includes a frame, a partition, two sub-assembly frames, two main boards, two control boards, and at least one bridge board. The partition board is arranged in the frame body to partition the internal space of the frame body into a first accommodating groove and a second accommodating groove. The two sub-assembly frames are respectively arranged in the first accommodating groove and the second accommodating groove. The two main boards are respectively arranged on the two sub-assembling frames. Each of the two main boards includes a board body and a plurality of processing units arranged on the board body. The two control boards are respectively arranged on the two sub-assembling frames and are electrically connected to the two main boards respectively. At least one bridge board is electrically connected to the two main boards. One of the main boards is between one of the control boards and at least one bridge board, and the other main board is between the one of the control boards and at least one bridge board.
根據上述實施例所揭露的處理模組,由於二子組接架分別設置於第一容置槽及第二容置槽、其中一個主機板介於其中一個控制板及橋接板之間,且另一個主機板介於另一個控制板及橋接板之間,因此二主機板上能設置更多個處理單元。如此一來,便能在處理單元及這些電子元件需要一起設置在處理模組中有限之空間的情況下,使處理模組能容納更多的處理單元。According to the processing module disclosed in the above embodiment, since the two sub-assembling frames are respectively disposed in the first accommodating slot and the second accommodating slot, one of the motherboards is between the one of the control board and the bridge board, and the other The main board is between the other control board and the bridge board, so more processing units can be set on the second main board. In this way, when the processing unit and these electronic components need to be installed together in a limited space in the processing module, the processing module can accommodate more processing units.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the present invention will be described in detail in the following embodiments. The content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and in accordance with the content disclosed in this specification, the scope of patent application and the drawings. Anyone who is familiar with relevant skills can easily understand the purpose and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.
請參閱圖1及圖2。圖1為根據本發明一實施例之處理模組的立體圖。圖2為圖1中的處理模組之分解圖。Please refer to Figure 1 and Figure 2. FIG. 1 is a perspective view of a processing module according to an embodiment of the invention. Fig. 2 is an exploded view of the processing module in Fig. 1.
於本實施例中,處理模組10包含一架體100、一隔板110、二運算組件150、多個安裝架400以及多個橋接板(bridge borad)450。In this embodiment, the
隔板110設置於架體100中而將架體100的內部空間區隔成一第一容置槽101及一第二容置槽102。The
二運算組件150各包含一子組接架200、二凸柱210、二定位柱220、一主機板230、一托盤240、二把手250、二卡扣件260以及一控制板(switch borad)270。The two
二運算組件150的二子組接架200分別設置於第一容置槽101及第二容置槽102。The two
需注意的是,由於二運算組件150於結構上相似,因此為了方便說明,以下僅描述一個運算組件150的詳細結構。It should be noted that since the two
二凸柱210分別凸出於子組接架200的相對兩側,並位於第一容置槽101中。二定位柱220分別凸出於子組接架200的相對兩側,並位於第一容置槽101中。The two protruding
主機板230設置於子組接架200。主機板230包含一板體231及設置於板體231的多個處理單元232。於本實施例中,處理單元232的數量例如為8個,且處理單元232例如為圖形處理器(Graphic Processing Unit,GPU),但本發明並不以此為限;於其他實施例中,處理單元亦可為中央處理器(Central Processing Unit,CPU)或者任何合適的處理器。The
請額外參閱圖3,其中圖3為圖1中的處理模組之托盤及子組接架的分解示意圖。需注意的是,為了說明方便,圖3中僅呈現托盤240的一側及子組接架200的一側。托盤240設置於子組接架200。二把手250分別樞接於托盤240遠離主機板230的一側之兩端。如圖3所示,把手250具有一卡扣結構251,且卡扣結構251可分離地卡合於凸柱210。Please refer to FIG. 3 additionally, where FIG. 3 is an exploded schematic diagram of the tray and the sub-assembly frame of the processing module in FIG. 1. It should be noted that, for the convenience of description, only one side of the
二卡扣件260分別樞接於托盤240的相對兩側。於本實施例中,二卡扣件260各包含相連的一樞接部261及一卡扣部262。各個卡扣件260中,樞接部261樞接於托盤240、卡扣部262遠離樞接部261的一側具有一導引斜面2620,且卡扣部262具有一定位槽2621。二卡扣部262透過各自的定位槽2621分別可分離地卡扣於二定位柱220。也就是說,托盤240係透過把手250及凸柱210的配合以及卡扣件260及定位柱220的配合而可分離地設置於子組接架200。The two
首先說明將托盤240安裝至子組接架200的作動過程。當托盤240安裝至子組接架200時,定位柱220會推抵卡扣部262的導引斜面2620,而令卡扣部262透過樞接部261相對托盤240樞轉而遠離托盤240。接著,當導引斜面2620因卡扣部262的樞轉而脫離於定位柱220時,卡扣部262會因重力的緣故而透過樞接部261相對托盤240樞轉而靠近托盤240,進而令定位柱220可分離地卡扣於卡扣部262的定位槽2621。此外,受扳動的把手250會相對托盤240樞轉,進而令卡扣結構251可分離地卡合於凸柱210。First, the operation process of installing the
接著說明將托盤240從子組接架200拆卸的作動過程。首先需將子組接架200從架體100拆卸,而使卡扣部262暴露於外。接著,扳動暴露於外的卡扣部262而令定位柱220脫離卡扣部262的定位槽2621。如此一來,便能令把手250相對托盤240樞轉,進而令卡扣結構251脫離凸柱210。當定位柱220脫離卡扣部262的定位槽2621且卡扣結構251脫離凸柱210時,便能將托盤240從子組接架200拆卸。Next, the operation process of detaching the
控制板270透過托盤240設置於子組接架200,並例如以板對板(Board to Board)的方式電性連接於主機板230。The
由於需先將子組接架200從架體100拆卸,才能扳動位於第一容置槽101中的卡扣部262,因此在處理模組10運行時,卡扣部262會受架體100遮蔽而難以受扳動。如此一來,便能防止托盤240於處理模組10運行時脫離子組接架200,而防止控制板270脫離與主機板230的電性連接,進而防止處理模組10中各個電子元件的損毀。Since the
運算組件150並不限於包含托盤240;於其他實施例中,處理模組亦可無需包含托盤,而使用螺絲或任何合適的手段來將控制板固定於子組裝架。The
此外,運算組件150並不限於包含二定位柱及二卡扣件;於其他實施例中,處理模組亦可僅包含一定位柱及一卡扣件;於再另一實施例中,處理模組亦可無需包含定位柱及卡扣件。In addition, the
再者,運算組件150並不限於包含二把手及二凸柱;於其他實施例中,處理模組亦可僅包含一把手及一凸柱;於再另一實施例中,處理模組亦可無需包含把手及凸柱。Furthermore, the
請參閱圖2、圖4及圖5,其中圖4為呈現橋接板透過安裝架自架體拆卸的立體圖,且圖5為呈現橋接板透過安裝架安裝於架體的立體圖。此外,由於這些安裝架400具有相似的結構且皆以相似的方式分別將這些橋接板450設置於架體100,因此為了方便描述,以下僅針對一個安裝架400及設置於此安裝架400的橋接板450進行說明。Please refer to FIGS. 2, 4 and 5. FIG. 4 is a perspective view showing that the bridge plate is detached from the frame body through the mounting frame, and FIG. 5 is a perspective view showing the bridge plate is installed on the frame body through the mounting frame. In addition, since the mounting
本實施例中,安裝架400包含一本體401及一把手402,其中把手402包含二樞接部4020、一操作部4021、二推出部4022及二凸部4023。二樞接部4020分別樞接於安裝架400的本體401之相對兩側。操作部4021銜接二樞接部4020。二推出部4022分別連接於二樞接部4020中遠離操作部4021的一側。二凸部4023分別凸出於二樞接部4020,且分別可分離地卡合架體100的二卡槽103。也就是說,本體401係透過把手402設置於架體100。In this embodiment, the mounting
然,把手402並不限於樞接在本體401,且本發明並不以把手402的結構為限;於其他實施例中,把手亦可固定於本體,且於此情況中,把手便僅需包含固定於本體的固定部以及連接於固定部的操作部。Of course, the
此外,本實施例中,處理模組10更包含多個螺柱104及手轉螺絲(thumb screw)403,且本體401例如透過二手轉螺絲403固定在凸出於架體100上的螺柱104,藉以進一步防止本體401相對架體100移動。然,於其他實施例中,處理模組亦可無需包含螺柱及手轉螺絲。In addition, in this embodiment, the
橋接板450例如透過螺絲(未標號)固定於安裝架400的本體401,且例如透過板對板的方式電性連接於二主機板230,而二主機板230彼此電性連接。主機板230介於控制板270及橋接板450之間。The
首先說明透過安裝架400及架體100的配合而使二主機板230脫離與橋接板450的電性連接之作動過程。當操作部4021受推抵而令把手402透過樞接部4020沿一拆卸方向D1相對本體401樞轉時,推出部4022會抵靠於架體100而協助本體401遠離架體100。當本體401遠離架體100時,便會帶動固定於本體401的橋接板450遠離架體100,進而使二主機板230脫離與橋接板450的電性連接。First, the operation process of disengaging the two
接著說明透過安裝架400及架體100的配合而使橋接板450電性連接於二主機板230的作動過程。當操作部4021受推抵而令把手402透過樞接部4020沿相反於拆卸方向D1的一安裝方向D2相對本體401樞轉時,凸部4023會位於卡槽103而抵靠於架體100,進而協助本體401靠近架體100。當本體401靠近架體100時,便會帶動固定於本體401的橋接板450靠近架體100,進而使橋接板450電性連接於二主機板230。Next, the operation process of electrically connecting the
然,處理模組10並不限於包含多個安裝架400;於其他實施例中,處理模組亦可僅包含一安裝架;於再另一實施例中,處理模組亦可無需包含安裝架,而例如以螺絲將橋接板固定於架體。Of course, the
請參閱圖2及圖6,圖6為圖1中的處理模組之子組接架及架體的分解示意圖。處理模組10更包含多個固定柱500。多個固定柱500分別設置於二子組接架200。為了方便呈現,圖7中僅繪示設置於子組接架200的固定柱500。如圖7所示,各個固定柱500的相對兩端分別固定於架體100及子組接架200的多個固定孔201,而防止子組接架200相對架體100移動,且固定柱500位於主機板230及橋接板450之間。Please refer to FIG. 2 and FIG. 6. FIG. 6 is an exploded view of the sub-assembly frame and the frame body of the processing module in FIG. 1. The
然,處理模組10並不限於包含多個固定柱500;於其他實施例中,處理模組亦可僅包含一固定柱;於再另一實施例中,處理模組亦可無需包含固定柱,並例如改使用螺絲來防止子組接架相對架體移動。Of course, the
根據上述實施例所揭露的處理模組,由於二子組接架分別設置於第一容置槽及第二容置槽、其中一個主機板介於其中一個控制板及橋接板之間,且另一個主機板介於另一個控制板及橋接板之間,因此二主機板上能設置更多個處理單元。如此一來,便能在處理單元及這些電子元件需要一起設置在處理模組中有限之空間的情況下,使處理模組能容納更多的處理單元。According to the processing module disclosed in the above embodiment, since the two sub-assembling frames are respectively disposed in the first accommodating slot and the second accommodating slot, one of the motherboards is between the one of the control board and the bridge board, and the other The main board is between the other control board and the bridge board, so more processing units can be set on the second main board. In this way, when the processing unit and these electronic components need to be installed together in a limited space in the processing module, the processing module can accommodate more processing units.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed in the foregoing embodiments as above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.
10:處理模組 100:架體 101:第一容置槽 102:第二容置槽 103:卡槽 104:螺柱 110:隔板 150:運算組件 200:子組接架 201:固定孔 210:凸柱 220:定位柱 230:主機板 231:板體 232:處理單元 240:托盤 250:把手 251:卡扣結構 260:卡扣件 261:樞接部 262:卡扣部 2620:導引斜面 2621:定位槽 270:控制板 400:安裝架 401:本體 402:把手 403:手轉螺絲 4020:樞接部 4021:操作部 4022:推出部 4023:凸部 450:橋接板 500:固定柱 D1:拆卸方向 D2:安裝方向10: Processing module 100: frame 101: first accommodating slot 102: second holding tank 103: card slot 104: Stud 110: partition 150: computing component 200: Sub-assembly frame 201: fixed hole 210: convex column 220: positioning column 230: Motherboard 231: Board 232: Processing Unit 240: Pallet 250: handle 251: buckle structure 260: Clip 261: Pivot 262: buckle 2620: Guide slope 2621: positioning slot 270: control panel 400: Mounting frame 401: body 402: Handle 403: Hand Screw 4020: pivot part 4021: Operation Department 4022: Launch Department 4023: convex 450: Bridge board 500: fixed column D1: Disassembly direction D2: Installation direction
圖1為根據本發明一實施例之處理模組的立體圖。 圖2為圖1中的處理模組之分解圖。 圖3為圖1中的處理模組之托盤及子組接架的分解示意圖。 圖4為呈現橋接板透過安裝架自架體拆卸的立體圖。 圖5為呈現橋接板透過安裝架安裝於架體的立體圖。 圖6為圖1中的處理模組之子組接架及架體的分解示意圖。FIG. 1 is a perspective view of a processing module according to an embodiment of the invention. Fig. 2 is an exploded view of the processing module in Fig. 1. 3 is an exploded schematic view of the tray and sub-assembly frame of the processing module in FIG. 1. Fig. 4 is a perspective view showing that the bridge plate is detached from the frame body through the mounting frame. Fig. 5 is a perspective view showing that the bridge plate is installed on the frame through the mounting frame. FIG. 6 is an exploded schematic diagram of the sub-assembly frame and the frame body of the processing module in FIG. 1.
10:處理模組10: Processing module
100:架體100: frame
150:運算組件150: computing component
400:安裝架400: Mounting frame
Claims (10)
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TW108132458A TWI715188B (en) | 2019-09-09 | 2019-09-09 | Processing assembly |
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TWI715188B TWI715188B (en) | 2021-01-01 |
TW202112209A true TW202112209A (en) | 2021-03-16 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI806154B (en) * | 2021-09-10 | 2023-06-21 | 英業達股份有限公司 | Server and casing thereof |
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Publication number | Priority date | Publication date | Assignee | Title |
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US6483107B1 (en) * | 1999-05-11 | 2002-11-19 | Josef Rabinovitz | Canister having a combined guide rail and light pipe system for use in a computer peripheral enclosure |
US20080130219A1 (en) * | 1999-05-11 | 2008-06-05 | Josef Rabinovitz | Enclosure for computer peripheral devices |
US20130308266A1 (en) * | 2011-11-10 | 2013-11-21 | Jason A. Sullivan | Providing and dynamically mounting and housing processing control units |
TW201806461A (en) * | 2016-08-10 | 2018-02-16 | 英業達股份有限公司 | Server |
CN106647963A (en) * | 2016-11-22 | 2017-05-10 | 英业达科技有限公司 | Server |
CN109710557B (en) * | 2018-12-14 | 2021-11-26 | 郑州云海信息技术有限公司 | Server structure supporting 16GPU |
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- 2019-09-09 TW TW108132458A patent/TWI715188B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI806154B (en) * | 2021-09-10 | 2023-06-21 | 英業達股份有限公司 | Server and casing thereof |
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