TWM605441U - Flexible circuit board with driving hole alignment mark - Google Patents

Abstract

A flexible circuit board with a transmission hole alignment mark is used to solve the problem of position deviation between the transmission hole and the circuit pattern of the conventional flexible circuit board. The system includes: a film substrate with several exposure blocks arranged continuously along a conveying direction; several punching position marks arranged in several rows on the film substrate along the conveying direction; several punching position measurement marks, Corresponding to a number of punching position marks, each of the punching position measurement marks and the corresponding punching position mark has a relative position; a number of exposure boundary identification marks are located before and after each exposure block Two ends; and several exposure offset identification marks, the exposure offset identification mark located at the rear end of a front exposure block coincides with the exposure offset identification mark located at the front end of a rear exposure block.

Description

Flexible circuit board with driving hole alignment mark

This creation is about a carrier board for electronic components and circuits, especially a flexible circuit board with a driving hole alignment mark that prevents the processing process from deviating from the position of the circuit pattern.

Please refer to Fig. 1, which is a conventional flexible circuit board 9, which uses a roll-to-roll technology to unwind a thin strip 91 in a roll-to-roll. A number of continuous circuit patterns 92 are formed on the belt 91. In addition, the subsequent manufacturing process of the flexible circuit board 9, such as packaging, testing, molding and cutting, etc., needs to pass through a number of driving holes 93 located on both sides of each circuit pattern 92 , Transport the flexible circuit board 9 to the correct processing position.

The above-mentioned conventional flexible circuit board 9 may affect the circuit pattern 92 and the number due to process factors such as the deviation of the pattern exposure process, the skew of the punching die, the automatic alignment error of the machine, and the material deformation during the tape conveying process. The relative position between the driving holes 93 enables subsequent processing to be processed at an offset position. In addition, due to the trend of miniaturization of electronic products, the wiring of the circuit pattern 92 must be smaller and tighter. When the circuit pattern 92 and When the relative deviation between the driving holes 93 is greater than the wiring pitch of the circuit pattern 92, the subsequent manufacturing process will be processed in the wrong position. This will cause the electrical test of the flexible circuit board 9 to fail and reduce the product Yield rate.

In view of this, the conventional flexible circuit board does still have to be improved.

In order to solve the above-mentioned problems, the purpose of this creation is to provide a flexible circuit board with a driving hole alignment mark, which can increase product yield and improve process efficiency.

The second purpose of this creation is to provide a flexible circuit board with a drive hole alignment mark, which can be verified by automatic inspection and manual self-inspection.

Another purpose of this creation is to provide a flexible circuit board with a drive hole alignment mark, which can be used by the machine to automatically identify the starting point and ending point of the manufacturing process.

Another purpose of this creation is to provide a flexible circuit board with alignment marks for transmission holes, which can reduce the number of marks and improve inspection efficiency.

The directionality or similar terms used in the full text of this creation, such as "front", "rear", "upper (top)", "inner", "outer", "side", etc., mainly refer to the direction of the attached drawings. The directional or similar terms are only used to assist in explaining and understanding each embodiment of the creation, and not to limit the creation.

The use of the quantifiers "one" or "one" for the elements and components described in the full text of this creation is only for the convenience of use and to provide the usual meaning of the scope of this creation; in this creation, it should be interpreted as including one or at least one, and single The concept of also includes the plural, unless it clearly implies other meanings.

The flexible circuit board with the transmission hole alignment mark of this creation includes: a film substrate with a plurality of exposure blocks arranged continuously along a conveying direction; a plurality of punching position marks arranged in rows along the conveying direction On the film substrate, the plurality of punching position marks are used to locate the positions of the plurality of driving holes of the plurality of exposure blocks; the plurality of punching position measurement marks correspond to the plurality of punching position marks, and each punch There is a relative position between the hole position measurement mark and the corresponding punching position mark; several exposure boundary identification marks are located at the front and back ends of each exposure block; and several exposure offset identification marks, respectively The exposure offset identification mark located at the front and rear ends of each exposure block at the rear end of a front exposure block coincides with the exposure offset identification mark located at the front end of a rear exposure block.

According to this, the flexible circuit board with the transmission hole alignment marks created by this invention can punch the transmission holes according to the positions of the punching position marks, and measure the marks and the plurality of punching position marks by the punching positions. The manual self-check mark confirms that the position of the transmission hole is aligned with each exposure area, and the start point and end point of the punching operation can be distinguished by the pair of the exposure boundary identification marks, and the exposure offset can be identified by the pair The mark monitors the offset of each exposure operation, so that the relative position of the circuit pattern of the flexible circuit board and the driving hole can be controlled within the error range, which has the effects of increasing the product yield of the flexible circuit board and improving the efficiency of the punching process.

Wherein, each of the exposure blocks includes several circuit patterns, and each of the circuit patterns has several punching position marks on both sides. In this way, the punching hole punched according to the punching position mark can be used as the transmission hole of each circuit pattern, which has the effect of improving the processing accuracy of the subsequent process.

Wherein, each of the punching position measurement marks corresponds to the plurality of punching position marks in different rows in the same column. In this way, one punching position measuring mark can detect the positions of several driving holes in the same row, which has the effect of improving inspection efficiency and reducing the number of alignment marks.

Wherein, the exposure boundary identification mark is on the front side or the back side of the adjacent punching position measurement mark. In this way, the machine can identify the front or back end of each exposure block through the relative position of the exposure boundary identification mark and the punching position measurement mark, and has the function of confirming the start point and end point of each process .

Wherein, at the front end of each exposure block, the exposure boundary identification mark is before the punching position measurement mark, and at the rear end of each exposure block, the exposure boundary identification mark is measured at the punching position After the mark. In this way, the machine can determine the position of the exposure block according to the sequence of detecting the exposure boundary identification mark and the punching position measurement mark, which has the effect of improving the positioning accuracy.

Wherein, the exposure offset identification mark at the rear end of the front exposure block is a circle, and the exposure offset identification mark at the front end of the rear exposure block is a pair of dots, and the circle mark is located at Between the pair of dot marks. In this way, the machine can measure the relative distance between the circular mark and the two dot marks to determine the offset direction and distance of two adjacent exposure areas, which has the effect of correcting the exposure position error.

This creation also contains several manual self-inspection marks, punching a transmission hole at the position of the several punching position marks, and punching any one of the manual self-inspection marks. In this way, the operator can check whether the punching is to the edge of the manual self-inspection mark to determine whether the punching position is shifted, which has the function of quickly confirming the accuracy of the punching process.

Wherein, each exposure block has at least one manual self-check mark. In this way, the operator can check the punching results of the same group of transmission holes, which has the effect of improving the efficiency of self-checking.

Among them, each manual self-check mark is located beside the punching position measurement mark. In this way, it can avoid the difference between the judgment results of the automatic inspection of the machine and the self-inspection of the personnel, and has the effect of reducing the probability of false detection.

In order to make the above and other purposes, features and advantages of this creation more obvious and easy to understand, the following is a detailed description of the preferred embodiments of this creation, together with the accompanying drawings:

Please refer to Figures 2 and 3, which is a preferred embodiment of the flexible circuit board with drive hole alignment marks in this creation, which includes a film substrate 1, a plurality of punching position marks 2, and a plurality of punching positions Measurement mark 3, several exposure boundary identification marks 4 and several exposure offset identification marks 5. The punching position marks 2 are located on the film substrate 1 and arranged in several rows, and the punching positions are measured The mark 3, the multiple exposure boundary identification marks 4, and the multiple exposure offset identification marks 5 are located on the outer side edge of the film substrate 1.

Please refer to Figure 2, the film substrate 1 is divided into areas with different functions by two cutting lines C and several exposure boundaries E. The two cutting lines C extend along a conveying direction D of the film substrate 1. The area outside the second cutting line C is the board edge of the flexible circuit board. The finished flexible circuit board is punched along the second cutting line C to remove unnecessary board edges. The previous process (such as: exposure, punching, etc.) ) The required various alignment marks can be placed on the edge of the board, so that the circuit space inside the film substrate 1 can be used more effectively; there is a single exposure block S between the two adjacent exposure boundaries E and conforms to one exposure The size of the film, the film substrate 1 passes through the exposure film and moves along the conveying direction D, so that the circuit patterns can be continuously exposed on the several exposure blocks S.

Please refer to Figures 2 and 3, the punching position marks 2 are located in the line pattern area inside the two cutting lines C, and the punching position marks 2 are arranged in several rows along the conveying direction D. And the two rows of the punching position marks 2 are located on both sides of a whole line pattern. The punching position marks 2 are preferably arranged at equal intervals, and the punching position marks 2 are used for Position the transmission hole positions of the several exposure blocks S. During the punching process of the transmission hole, the machine can detect the positioning point of each punching position mark 2 by the sensor and then perform the punching operation. It can improve the accuracy of the transmission hole position.

The plurality of punching position measuring marks 3 are located in the edge area outside the two cutting lines C, and the positions of the plurality of punching position measuring marks 3 and the plurality of punching position marks 2 of each row are one-to-one Corresponding, that is, the punching position measurement marks 3 correspond to the punching position marks 2 in different rows in the same row. The machine uses the punching position marks 2 to punch the plurality of driving holes and then automatically measure By measuring the relative position between each punching position measurement mark 3 and the corresponding transmission hole, it can be confirmed whether the position of each transmission hole is offset.

Please refer to Figs. 3 and 4. Fig. 4 is an enlarged view of part B of Fig. 3. The two exposure boundary identification marks 4 are respectively located at the front and back ends of an exposure block S, namely the exposure boundary E There is an exposure boundary identification mark 4 on both sides of, wherein the front relative to the conveying direction D is the front end, and the rear relative to the conveying direction D is the rear end. Furthermore, the exposure boundary identification mark 4 may be adjacent to The front side or the back side of the punching position measurement mark 3 can be used by the machine to discern whether the transported part of the film substrate 1 is the front end or the rear end of each exposure block S. In this embodiment, each of the exposure boundary identification marks 4 is cross-shaped, and at the front end of each exposure block S, the exposure boundary identification mark 4 is before the punching position measurement mark 3, and relatively, at each of the At the rear end of the exposure block S, the exposure boundary identification mark 4 is after the punching position measurement mark 3. When the film substrate 1 is being transported, the machine first detects the exposure boundary identification mark 4 and then detects When the punching position measurement mark 3 is reached, it can be determined that it is located at the front end of the exposure block S. Otherwise, the machine first detects the punching position measurement mark 3 and then the exposure boundary identification mark 4. It can be determined that it is located at the back end of the exposure block S. In the process of punching, testing, cutting, etc., by using the exposure boundary identification mark 4 and the punching position measurement mark 3, it is possible to confirm whether the start point and end point of each process are correct.

Please refer to Figures 4 and 5, the exposure offset identification marks 5 are respectively located at the front and rear ends of an exposure block S. During continuous exposure, they are located at the rear end of a front exposure block S1. The exposure offset identification mark 5 is overlapped with the exposure offset identification mark 5 located at the front end of a post-exposure block S2, and the deviation of the exposure position can be judged according to the overlap condition. In this embodiment, the exposure offset identification mark 5 located at the rear end of the front exposure block S1 is a circle, and the exposure offset identification mark 5 located at the front end of the rear exposure block S2 is a pair of dots , When the front exposure block S1 and the back exposure block S2 are formed by successive exposures, the circular mark can be located between the pair of dot marks, and the difference between the plurality of exposure offset identification marks 5 is measured The distance between the two can distinguish the relative offset of the front exposure block S1 and the back exposure block S2.

Please refer to Figure 3, the flexible circuit board with the drive hole alignment mark in this creation can also have several manual self-check marks 6, each of the manual self-check marks 6 can be located next to the punching position measurement mark 3. , When the machine punches the transmission hole according to the position of the several punching position marks 2, the machine can punch any of the manual self-check marks 6 simultaneously, which can be used by the operator to check whether the manual punching Self-check the edge of mark 6 to determine the degree of deviation of the punching position of the transmission hole. Each exposure block S may have at least one manual self-inspection mark 6. In this embodiment, there is a manual self-inspection mark 6 beside each punching position measurement mark 3. However, this creation does not Limit this.

Please refer to Fig. 6, the film substrate 1 is exposed and punched to form a circuit pattern and corresponding driving hole T. The circuit pattern and all the above signs are continuously exposed on the conveyed film substrate 1 through an exposure film To form, please refer to Figure 3. The punching machine punches at the positions of the punching position marks 2 to form the driving holes T, and measures the mark 3 by the punching positions Automatically detect whether the positions of the transmission holes T are correct, and the operator can directly confirm the offset of the punching with the manual self-check mark 6; in addition, the punching machine detects the exposure boundary identification mark The 4 system can confirm the start point and end point of the punching operation, and by detecting the overlap of the exposure offset identification mark 5, determine the relative offset of adjacent exposure blocks S, so that each exposure area The block S can correspond to the precise position of the plurality of driving holes T. When the plurality of driving holes T are used to transport the film substrate 1 in the subsequent process, it can be ensured that each exposure block S on the film substrate 1 can be positioned to Correct processing position.

To sum up, the flexible circuit board with the transmission hole alignment mark created by this invention can punch the transmission hole according to the position of the several punching position marks, and measure the marks and the Several manual self-inspection marks confirm that the position of the transmission hole is aligned with each exposure block, and the start point and end point of the punching operation can be distinguished by the pair of the exposure boundary identification marks, and the pair of the exposure deviation The shift identification mark monitors the offset of each exposure operation, so that the relative position of the circuit pattern of the flexible circuit board and the driving hole can be controlled within the error range, which can increase the product yield of the flexible circuit board and improve the efficiency of the punching process, etc. effect.

Although this creation has been disclosed using the above-mentioned preferred embodiment, it is not intended to limit this creation. Anyone who is familiar with this technique does not depart from the spirit and scope of this creation and makes various changes and modifications relative to the above-mentioned embodiment. The technical scope protected by the creation, therefore, the scope of protection of this creation shall be subject to the scope of the attached patent application.

﹝本 Creation﹞ 1: Thin film substrate 2: Punching position mark 3: Measurement mark of punching position 4: Exposure boundary recognition mark 5: Exposure offset identification mark 6: Manual self-check mark C: Cutting line E: Exposure boundary D: Conveying direction S: Exposure block S1: Front exposure block S2: Post-exposure block T: Transmission hole ﹝Used ﹞ 9: Flexible circuit board 91: thin strip 92: circuit pattern 93: drive hole

[Picture 1] A diagram of a conventional flexible circuit board and its driving hole circuit. [Figure 2] The transmission hole alignment mark circuit diagram of the preferred embodiment of this creation. [Picture 3] An enlarged view of part A as shown in Picture 2. [Figure 4] An enlarged view of part B as shown in Figure 3. [Picture 5] The step-by-step circuit diagram of the continuous exposure process shown in Picture 4. [Figure 6] Circuit diagram of the circuit board with driving holes and alignment marks of the preferred embodiment of this creation.

1: Thin film substrate

2: Punching position mark

3: Measurement mark of punching position

4: Exposure boundary recognition mark

5: Exposure offset identification mark

6: Manual self-check mark

C: Cutting line

E: Exposure boundary

D: Conveying direction

S: Exposure block

Claims (9)

A flexible circuit board with alignment marks for transmission holes, including: A thin film substrate with several exposure blocks arranged continuously along a conveying direction; A plurality of punching position marks are arranged on the film substrate in several rows along the conveying direction, and the plurality of punching position marks are used to locate the positions of the driving holes of the plurality of exposure blocks; Several punching position measurement marks correspond to several punching position marks, and each punching position measurement mark has a relative position with the corresponding punching position mark; Several exposure boundary identification marks are located at the front and back ends of each exposure area; and Several exposure offset identification marks are respectively located at the front and rear ends of each exposure block, the exposure offset identification mark located at the rear end of a front exposure block, and the exposure offset located at the front end of a rear exposure block The identification marks overlap. For example, the flexible circuit board with transmission hole alignment marks of claim 1, wherein each of the exposed areas includes a plurality of circuit patterns, and each side of the circuit pattern has a plurality of punching position marks. For example, the flexible circuit board with transmission hole alignment marks in claim 1, wherein each punching position measurement mark corresponds to the several punching position marks in different rows in the same column. For example, the flexible circuit board with a driving hole alignment mark of claim 1, wherein the exposure boundary identification mark is on the front side or the back side of the adjacent punching position measurement mark. For example, the flexible circuit board with transmission hole alignment mark of claim 4, wherein, at the front end of each exposure area, the exposure boundary identification mark is before the punching position measurement mark, and in each exposure area The rear end of the exposure boundary identification mark is after the punching position measurement mark. For example, the flexible circuit board with transmission hole alignment mark of claim 1, wherein the exposure offset identification mark located at the rear end of the front exposure block is a circle, and the exposure offset located at the front end of the rear exposure block The shift identification mark is a pair of dots, and the circular mark is located between the pair of dot marks after being overlapped. For example, a flexible circuit board with a drive hole alignment mark in any of the requirements 1 to 6, which also contains several manual self-check marks, and a machine punches the drive hole at the position of the several punching position marks. And synchronously punch any of the manual self-check marks. For example, the flexible circuit board with transmission hole alignment marks in claim 7, wherein each of the exposed areas has at least one manual self-check mark. For example, the flexible circuit board with transmission hole alignment marks in claim 7, wherein each manual self-check mark is located beside the punching position measurement mark.

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