CN215008220U - Mask sheet and circuit structure - Google Patents
Mask sheet and circuit structure Download PDFInfo
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- CN215008220U CN215008220U CN202121388155.9U CN202121388155U CN215008220U CN 215008220 U CN215008220 U CN 215008220U CN 202121388155 U CN202121388155 U CN 202121388155U CN 215008220 U CN215008220 U CN 215008220U
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Abstract
The utility model discloses a mask piece and circuit structure, including the substrate, be provided with a plurality of effective circuit design units that are the matrix arrangement on the substrate, the line of these a plurality of effective circuit design units that are the matrix arrangement is parallel with the traffic direction when COF factory operation, and the traffic direction when arranging and COF factory operation is perpendicular, still be provided with first piece mark zone on the substrate, first piece mark zone is provided with the first piece mark that discerns when being used for COF factory operation. The utility model discloses be convenient for carry out position determination with COF product and Mask fast.
Description
Technical Field
The utility model relates to a COF field, in particular to mask piece and circuit structure.
Background
During production of a Chip On Film (COF), which is a technology for packaging a die On a flexible circuit board (flexible printed circuit), a Mask (Mask) design is first performed, a rectangular array of single product effective circuits is formed in a Mask fixing area to form Mask sheets, and images On the Mask sheets are transferred onto a substrate to form product effective circuits through COF related processes. The appearance of the product is also the same. After the effective circuit of the product is formed on the substrate, the solder resist ink is coated on the effective circuit of the product through the screen printing plate by the related process of the back COF. The screen design and Mask design typesetting are the same, a single product effective solder Mask area is arrayed in a rectangular mode in a fixed area on the screen, and solder Mask ink is coated on the relative position of an actual product effective line through fixing CCD Mark alignment. Each individual product made with COF is identical in appearance.
Referring to fig. 1, in fig. 1, a conventional Mask sheet includes a substrate 8, a plurality of effective circuit design units 9 arranged in a matrix are disposed on the substrate 8, and rows of the effective circuit design units 9 arranged in a matrix are parallel to a running direction of a COF factory during operation.
When the conventional Mask sheet is manufactured by a COF (chip on film) process, the following defects exist:
firstly, when the actual product has a fixed point line defect, personnel cannot quickly determine the position of the Mask corresponding to the defect by observing the actual product.
Secondly, when the appearance defects of the solder resist ink at the fixed point of the actual product occur, personnel cannot quickly determine the corresponding defect position of the screen printing plate by observing the actual product.
Thirdly, after the product is cut into single-row products, the Mask where the product is located and the position where the screen printing plate is located cannot be distinguished through the appearance of the product.
In addition, when the conventional Mask sheet is manufactured by a COF process, the defect that the positions of the effective circuit design units 9 on the Mask sheet transferred to the COF circuit board are not uniform exists.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned defect, the utility model provides a Mask piece, this Mask piece are convenient for carry out position determination, the defective position of short-term determination with COF product and Mask fast.
The utility model provides a mask film, including the substrate, be provided with a plurality of effective circuit design units that are the matrix arrangement on the substrate, the line of these a plurality of effective circuit design units that are the matrix arrangement is parallel with the traffic direction when COF factory operation, and the traffic direction when arranging and COF factory operation is perpendicular, still be provided with first piece mark area on the substrate, first piece mark area is provided with the first piece mark that discerns when being used for COF factory operation.
Preferably, the first sheet for identification in the COF factory work is a first sheet mark for identification of defects in the COF factory work.
Preferably, the first mark area is arranged between two adjacent effective line design units of the first column of the effective line design units arranged in a matrix.
Preferably, the distance between each first mark area and the adjacent effective line design unit 9 in the first mark area is more than or equal to 0.2 mm.
Preferably, the size of the first marking zone is 0.02x0.02mm to 1.42x 1.42mm.
Preferably, the shape of the identification mark is a five-star shape, a triangle shape, a regular hexagon shape, a square shape, a T shape or a cross shape.
Preferably, the shape of the first mark is a T shape with an embedded circle, a cross shape with an embedded circle, a square with an embedded circle, a small square embedded in a large square, a small regular hexagon embedded in a large regular hexagon, a small triangle embedded in a large triangle or a small triangle with a small triangle at the upper end and a large triangle at the lower end.
Preferably, the mask sheet is further provided with a substrate alignment hole aligned with the substrate.
The utility model also provides a circuit structure, including the base plate, be provided with a plurality of effective circuit units that are the matrix arrangement on the base plate, the line of these a plurality of effective circuit units that are the matrix arrangement is parallel with the traffic direction when COF factory operation, and the traffic direction when arranging and COF factory operation is perpendicular, still be provided with the identification mark district on the base plate, the identification mark district is provided with the identification mark.
Preferably, the substrate is further provided with a plurality of mask alignment holes and/or a plurality of first punched holes and/or a plurality of second punched holes and/or a plurality of third punched holes.
Compared with the prior art, the utility model discloses a principle and beneficial effect lie in:
the utility model discloses a set up defect position discernment sign at the Mask piece, on the one hand, when fixed point circuit defect took place for the actual product, personnel can confirm corresponding defective position on the Mask through observing the actual product fast. On the other hand, when the appearance defect of the solder resist ink at the fixed point of the actual product occurs, personnel can quickly determine the corresponding defect position on the screen by observing the actual product. Finally, after the product is cut into single-row products, the corresponding positions of the Mask and the screen on which the product is located can be identified by observing the appearance of the product.
The utility model discloses still through the setting that three punched a hole and two punched a hole, make things convenient for follow-up encapsulation processing procedure transmission and panel factory to counterpoint.
Drawings
FIG. 1 is a schematic diagram of the background art of the present invention;
FIG. 2 is a schematic view of the structure of the mask of the present invention
FIG. 3 is a schematic structural view of another mask sheet according to the present invention;
fig. 4 is a schematic diagram of a circuit structure of the present invention;
FIGS. 5a-m are schematic views of different shapes of the first sheet mark or the identification mark of the present invention;
fig. 6 is a schematic diagram of another circuit structure of the present invention.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
In the description of the present invention, it should be noted that the terms "upper" and "lower" are used for indicating the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the indicated device or element must have a specific position, be constructed and operated in a specific position, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless explicitly stated or limited otherwise, the terms "attached" and "connected" are to be interpreted broadly, e.g., "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate medium, and may be welded or packaged, and those skilled in the art can understand the specific meaning of the terms in the present invention in specific situations.
Referring to fig. 2, fig. 2 is a schematic view of a mask sheet according to the present invention.
In fig. 2, a Mask sheet includes a substrate 8, a plurality of effective circuit design units 9 arranged in a matrix are disposed on the substrate 8, rows of the effective circuit design units 9 arranged in a matrix are parallel to a running direction of a COF factory during operation, and columns of the effective circuit design units are perpendicular to the running direction of the COF factory during operation, a first sheet mark region is further disposed on the substrate 8, the first sheet mark region is provided with a first sheet mark 10, and the first sheet mark 10 is copied to a COF circuit board through an image transfer process during operation of the COF factory, so as to quickly determine a fixed defect of a product during a COF process and determine a corresponding position of a single-row product on a Mask and a screen.
Further, the first mark area is disposed between two adjacent effective line design units in the first row of the effective line design units 9 arranged in a matrix.
Furthermore, in the first marked area, the distance between each first marked area and the adjacent effective circuit design unit 9 is more than or equal to 0.2 mm. When the COF circuit board is manufactured, after the first film mark 10 is copied to the COF circuit board through the image transfer process during the operation of the COF factory, the copied identification mark area is positioned outside the cutting line area of the adjacent effective circuit unit, and the effective circuit unit is not influenced.
Further, the size of the first marking area is 0.02x0.02mm to 1.42x 1.42mm.
Referring to fig. 5a-m, fig. 5a-m are schematic diagrams of different shapes of the leading label.
In fig. 5a, the first label is shaped as a five-star.
In fig. 5b, the upper end of the first label is a small triangle and the lower end is a large triangle.
In FIG. 5c, the first piece is marked as a triangle with a side length of 0.5 mm.
In fig. 5d, the first slice is marked as a large triangle with a small triangle embedded inside.
In fig. 5e, the first slice is marked as a large regular hexagon with a small regular hexagon embedded inside.
In fig. 5f, the first slice is marked as a regular hexagon.
In fig. 5g, the first slice is marked as square.
In fig. 5h, the first piece is marked as a large square with a small square embedded.
In fig. 5i, the first slice is marked as a T-shape of the inset circle.
In fig. 5j, the first slice is marked T-shaped.
In fig. 5k, the first slice is marked as a cross with an inset circle.
In fig. 5l, the first piece is marked as a cross.
In fig. 5m, the first slice is marked as a square with an inset circle.
Referring to fig. 3, fig. 3 is a schematic view of another mask sheet structure according to the present invention.
In fig. 3, a Mask sheet includes a substrate 8, a plurality of effective circuit design units 9 arranged in a matrix are disposed on the substrate 8, rows of the effective circuit design units 9 arranged in a matrix are parallel to a running direction of a COF factory during operation, and columns of the effective circuit design units are perpendicular to the running direction of the COF factory during operation, a first sheet mark region is further disposed on the substrate 8, the first sheet mark region is provided with a first sheet mark 10, and the first sheet mark 10 is copied to a COF circuit board through an image transfer process during operation of the COF factory, so as to quickly determine a fixed defect of a product during a COF process and determine a corresponding position of a single-row product on a Mask and a screen. The substrate 8 is further provided with a substrate alignment hole 11, the substrate alignment hole 11 is aligned with the substrate in the COF process, a mask sheet is attached to a COF circuit board before image transfer in the COF process, and the substrate alignment hole 11 facilitates positioning of the mask sheet and the COF circuit board, so that when the image transfer is carried out, the effective circuit unit corresponding to the effective circuit design unit 9 is fixed in position.
Further, the first mark area is disposed between two adjacent effective line design units in the first row of the effective line design units 9 arranged in a matrix.
Furthermore, in the first marked area, the distance between each first marked area and the adjacent effective circuit design unit 9 is more than or equal to 0.2 mm. When the COF circuit board is manufactured, after the first film mark 10 is copied to the COF circuit board through the image transfer process during the operation of the COF factory, the copied identification mark area is positioned outside the cutting line area of the adjacent effective circuit unit, and the effective circuit unit is not influenced.
Further, the size of the first marking area is 0.02x0.02mm to 1.42x 1.42mm.
Referring to fig. 5a-m, fig. 5a-m are schematic diagrams of different shapes of the leading label.
In fig. 5a, the first label is shaped as a five-star.
In fig. 5b, the upper end of the first label is a small triangle and the lower end is a large triangle.
In FIG. 5c, the first piece is marked as a triangle with a side length of 0.5 mm.
In fig. 5d, the first slice is marked as a large triangle with a small triangle embedded inside.
In fig. 5e, the first slice is marked as a large regular hexagon with a small regular hexagon embedded inside.
In fig. 5f, the first slice is marked as a regular hexagon.
In fig. 5g, the first slice is marked as square.
In fig. 5h, the first piece is marked as a large square with a small square embedded.
In fig. 5i, the first slice is marked as a T-shape of the inset circle.
In fig. 5j, the first slice is marked T-shaped.
In fig. 5k, the first slice is marked as a cross with an inset circle.
In fig. 5l, the first piece is marked as a cross.
In fig. 5m, the first slice is marked as a square with an inset circle.
Referring to fig. 4, fig. 4 is a schematic structural diagram of the circuit structure of the present invention.
In fig. 4, a COF circuit structure, the circuit structure includes a substrate 1, a plurality of effective circuit units 2 arranged in a matrix are disposed on the substrate 1, rows of the effective circuit units 2 arranged in a matrix are parallel to a running direction of a COF factory during operation, columns of the effective circuit units are perpendicular to the running direction of the COF factory during operation, a plurality of punched holes 3 are further disposed on an edge of the substrate 1, the plurality of punched holes 3 are parallel to the running direction of the COF factory during operation, a plurality of mask aligning holes 4 are further disposed on an edge of the substrate 1, the plurality of mask aligning holes 4 are parallel to the running direction of the COF factory during operation, an identification mark area is further disposed on the substrate 1, the identification mark area is provided with an identification mark 5, and the identification mark 5 is a defect position identification mark. A plurality of punched holes 3 are used for conveying COF circuit boards during operation in a COF factory. The identification mark 5 is used for rapidly confirming the fixed defect of the product and judging the corresponding position of the single-row product on the Mask and the screen during the COF process.
In the image transfer process during the production of the COF circuit board, the first mark 10 on the mask sheet in fig. 2 and 3 is transferred to the substrate 1 as the effective circuit design unit 9, so as to form the effective circuit unit 2 and the identification mark 5 respectively.
The mask alignment holes 4 are used for matching and aligning with the substrate alignment holes 11 in fig. 2 and 3 before image transfer, so that the positions of effective circuit units corresponding to the effective circuit design units 9 are fixed when image transfer is realized.
The identification mark 5 is arranged between two adjacent effective line units in the first column of the plurality of effective line units 2 arranged in a matrix.
The distance between the identification mark area and the adjacent effective line unit 2 is more than or equal to 0.2mm, and the identification mark area is positioned outside the cutting line area of the adjacent effective line unit 2, so that the effective line unit 2 is not influenced.
The size of the identification mark area is 0.02x 0.02mm-1.42 x 1.42mm.
Referring to fig. 5a-m, fig. 5a-m are schematic diagrams illustrating different shapes of the identification mark.
In fig. 5a, the identification mark 5 has a five-star shape.
In fig. 5b, the identification mark 5 has a small triangle at the upper end and a large triangle at the lower end.
In fig. 5c, the identification mark 5 is a triangle with a side length of 0.5 mm.
In fig. 5d, the identification mark 5 is a large triangle embedded with a small triangle.
In fig. 5e, the identification mark 5 is a large regular hexagon embedded with a small regular hexagon.
In fig. 5f, the identification mark 5 is a regular hexagon.
In fig. 5g, the identification mark 5 is square.
In fig. 5h, the identification mark 5 is a large square embedded with a small square.
In fig. 5i, the identification mark 5 is a T-shape of an inset circle.
In fig. 5j, the identification mark 5 is T-shaped.
In fig. 5k, the identification mark 5 is a cross shape of an embedded circle.
In fig. 5l, the identification mark 5 is a cross.
In fig. 5m, the identification mark 5 is a square with an embedded circle.
In the COF process of the mask sheet, after COF products are cut, a plurality of rows of products are divided into single row products, effective circuit appearances of the products in each row are completely the same, and only marks formed on the products by the identification marks 5 are located at different positions of the single products. The position of the single-row product when the single-row product is not cut can be judged by observing the shape and the position of the identification mark 5 on the single-row product belt.
Referring to fig. 6, fig. 6 is another schematic structural diagram of the circuit structure of the present invention.
In fig. 6, a COF circuit structure, the circuit structure includes a substrate 1, a plurality of effective circuit units 2 arranged in a matrix are disposed on the substrate 1, rows of the effective circuit units 2 arranged in a matrix are parallel to a running direction of a COF factory during operation, columns of the effective circuit units are perpendicular to the running direction of the COF factory during operation, a plurality of punched holes 3 are further disposed on an edge of the substrate 1, the plurality of punched holes 3 are parallel to the running direction of the COF factory during operation, a plurality of mask aligning holes 4 are further disposed on an edge of the substrate 1, the plurality of mask aligning holes 4 are parallel to the running direction of the COF factory during operation, an identification mark area is further disposed on the substrate 1, the identification mark area is provided with an identification mark 5, and the identification mark 5 is a defect position identification mark. A plurality of punched holes 3 are used for conveying COF circuit boards during operation in a COF factory. The identification mark 5 is used for rapidly confirming the fixed defect of the product and judging the corresponding position of the single-row product on the Mask and the screen during the COF process.
A row of three punched holes 6 are respectively arranged above and below each row of effective circuit units, the three punched holes 6 and the effective circuit units 2 are simultaneously formed on the surface of the substrate during the COF process, and the three punched holes are used as transmission holes in the subsequent COF process and the packaging process.
Each effective circuit unit is also provided with two punched holes 7, and the two punched holes 7 are positioned in the cutting line of each effective circuit unit. Two punched holes 7 are formed on the surface of the substrate simultaneously with the effective wiring units 2 during the COF process, and are used as alignment holes in the subsequent panel factory process.
The identification mark 5 is provided between the first column of effective line units of the effective line units 2 arranged in a matrix.
The distance between the identification mark area and the adjacent effective line unit 2 is more than or equal to 0.2mm, and the identification mark area is positioned outside the cutting line area of the adjacent effective line unit 2, so that the design of the effective line unit 2 is not influenced.
The size of the identification mark area is 0.02x 0.02mm-1.42 x 1.42mm.
Referring to fig. 5a-m, fig. 5a-m are schematic diagrams illustrating different shapes of the identification mark.
In fig. 5a, the identification mark 5 has a five-star shape.
In fig. 5b, the identification mark 5 has a small triangle at the upper end and a large triangle at the lower end.
In fig. 5c, the identification mark 5 is a triangle with a side length of 0.5 mm.
In fig. 5d, the identification mark 5 is a large triangle embedded with a small triangle.
In fig. 5e, the identification mark 5 is a large regular hexagon embedded with a small regular hexagon.
In fig. 5f, the identification mark 5 is a regular hexagon.
In fig. 5g, the identification mark 5 is square.
In fig. 5h, the identification mark 5 is a large square embedded with a small square.
In fig. 5i, the identification mark 5 is a T-shape of an inset circle.
In fig. 5j, the identification mark 5 is T-shaped.
In fig. 5k, the identification mark 5 is a cross shape of an embedded circle.
In fig. 5l, the identification mark 5 is a cross.
In fig. 5m, the identification mark 5 is a square with an embedded circle.
The utility model discloses the Mask piece is through setting up first piece mark 10, and first piece mark 10 is formed on the base plate surface with effective circuit unit 2 simultaneously when COF manufacturing process, through visual observation identification mark 5, can distinguish the product through identification mark 5 and take the produced product region of each partial Mask, through discerning and judging identification mark 5 positions, can confirm that single row of product place Mask arranges the position.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The mask film is characterized in that a first film marking area is further arranged on the substrate, and the first film marking area is provided with a first film mark used for identification during operation of a COF factory.
2. The mask sheet according to claim 1, wherein the first sheet for COF factory job identification is a first sheet mark for COF factory job defect identification.
3. The mask sheet of claim 1, wherein the first marking area is disposed between two adjacent effective line design units of the first column of the plurality of effective line design units arranged in a matrix.
4. The mask sheet according to claim 3, wherein each of the first mark areas is spaced from the adjacent effective line design unit 9 by a distance of 0.2mm or more.
5. The mask sheet of claim 4 wherein said first indicia region has a dimension of from 0.02x0.02mm to 1.42x 1.42mm.
6. The mask sheet of claim 1, wherein the first sheet mark is shaped as a five-star, a triangle, a regular hexagon, a square, a T-shape, or a cross.
7. The mask of claim 1, wherein the first mark is shaped as a T-shape with an inset circle, a cross-shape with an inset circle, a square with an inset circle, a small square with a large square, a small regular hexagon with a large regular hexagon, a small triangle with a large triangle, or a small triangle with a small triangle at the top and a large triangle at the bottom.
8. The mask sheet according to any one of claims 1 to 7, wherein the mask sheet is further provided with a substrate alignment hole aligned with the substrate.
9. A circuit structure comprises a substrate, wherein a plurality of effective circuit units arranged in a matrix are arranged on the substrate, the rows of the effective circuit units arranged in the matrix are parallel to the running direction of a COF (chip on film) factory during operation, and the columns of the effective circuit units arranged in the matrix are perpendicular to the running direction of the COF factory during operation.
10. The circuit structure according to claim 9, wherein a plurality of mask alignment holes and/or a plurality of first punched holes and/or a plurality of second punched holes and/or a plurality of third punched holes are further disposed on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121388155.9U CN215008220U (en) | 2021-06-22 | 2021-06-22 | Mask sheet and circuit structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121388155.9U CN215008220U (en) | 2021-06-22 | 2021-06-22 | Mask sheet and circuit structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215008220U true CN215008220U (en) | 2021-12-03 |
Family
ID=79081761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121388155.9U Active CN215008220U (en) | 2021-06-22 | 2021-06-22 | Mask sheet and circuit structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215008220U (en) |
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2021
- 2021-06-22 CN CN202121388155.9U patent/CN215008220U/en active Active
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| GR01 | Patent grant | ||
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Address after: 230000 in Hefei Comprehensive Bonded Zone, Xinzhan District, Hefei City, Anhui Province Patentee after: Hefei Qicai Technology Co.,Ltd. Address before: 230000 in Hefei Comprehensive Bonded Zone, Xinzhan District, Hefei City, Anhui Province Patentee before: Hefei Qizhong Material Technology Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |