TWM604379U - High-brightness LED lamp panel structure - Google Patents
High-brightness LED lamp panel structure Download PDFInfo
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- TWM604379U TWM604379U TW109206029U TW109206029U TWM604379U TW M604379 U TWM604379 U TW M604379U TW 109206029 U TW109206029 U TW 109206029U TW 109206029 U TW109206029 U TW 109206029U TW M604379 U TWM604379 U TW M604379U
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Abstract
一種高亮度LED燈盤結構,其特徵是,一塑膠聚合物板;多顆高亮度發光二極體,係設於該塑膠聚合物板至少一端面,該多顆高亮度發光二極體並電性連接成一體;該塑膠聚合物板設有一接地端及一電源端並電性連接該多顆高亮度發光二極體;藉此,該塑膠聚合物板取代傳統基板,透過該單顆高亮度發光二極體,使經組合之該多顆高亮度發光二極體提升亮度及密度。A high-brightness LED lamp panel structure is characterized by a plastic polymer plate; a plurality of high-brightness light-emitting diodes are arranged on at least one end surface of the plastic polymer plate, and the multiple high-brightness light-emitting diodes are connected in parallel The plastic polymer board is provided with a ground terminal and a power terminal and is electrically connected to the multiple high-brightness light-emitting diodes; thereby, the plastic polymer board replaces the traditional substrate, through the single high-brightness Light-emitting diodes enhance the brightness and density of the combined high-brightness light-emitting diodes.
Description
本創作係有關一種燈盤結構,係指一種高亮度LED燈盤結構。This creation is related to a lamp panel structure, which refers to a high-brightness LED lamp panel structure.
隨著照明的發展及消費者的需求,該LED己取代傳統燈泡所構成之燈盤,傳統LED之燈盤為了提供該LED電性連接,必須準備繁雜電路PCB基板,且傳統LED在製造及組裝繁複且費工費時,更需要芯片座及金線焊接佈線於芯片與電極之間,其單位強度低及熱阻提升與增加熱傳並有多個可能故障點,又該熱量或電流浪湧很容易損壤電路,且其亮度及光密度低,必須用數量龐大LED才能達到所需亮度,造成體積龐大及佔空間與電流消耗,使得其在實用性上大打折扣,此乃為業者及消費者極欲突破之處。With the development of lighting and the needs of consumers, the LED has replaced the lamp panel composed of traditional light bulbs. In order to provide the electrical connection of the LED, the traditional LED lamp panel must prepare a complicated circuit PCB substrate, and the traditional LED is being manufactured and assembled. Complicated and time-consuming, it also requires chip holders and gold wire bonding and wiring between the chip and the electrode. The unit strength is low, the thermal resistance is increased, and the heat transfer is increased. There are multiple possible failure points, and the heat or current surge is very high. It is easy to damage the soil circuit, and its brightness and light density are low. A large number of LEDs must be used to achieve the desired brightness, resulting in a large volume, occupying space and current consumption, which greatly compromises its practicality. This is for the industry and consumers. Where to break through.
為解決上述之現有技術不足之處,本創作主要目的,在於提供一種高亮度LED燈盤結構,透過塑膠聚合物板取代傳統發光二極體(LED)之基板,塑膠聚合物板設有多顆該高亮度發光二極體,以期克服現有技術中之難處。In order to solve the above-mentioned shortcomings of the prior art, the main purpose of this creation is to provide a high-brightness LED lamp panel structure, which replaces the traditional light-emitting diode (LED) substrate with a plastic polymer plate. The high-brightness light-emitting diode is intended to overcome the difficulties in the prior art.
本創作次要目的,在於提供一種高亮度LED燈盤結構,其結構簡單並透過單顆該高亮度發光二極體產生之亮度,使經組合之多顆該高亮度發光二極體整體產生更高亮度。The secondary purpose of this creation is to provide a high-brightness LED lamp panel structure, which has a simple structure and can generate more brightness through a single high-brightness light-emitting diode, so that the combined multiple high-brightness light-emitting diodes can produce more high brightness.
本創作又一目的,在於提供一種高亮度LED燈盤結構,有效提升光密度、密度及降低故障及熱度。Another purpose of this creation is to provide a high-brightness LED lamp panel structure, which can effectively increase the optical density, density and reduce failure and heat.
本創作所欲解決之問題,按傳統LED之燈盤為了提供該LED電性連接,必須準備繁雜電路PCB基板,且傳統LED在製造及組裝繁複且費工費時,更需要芯片座及金線焊接佈線於芯片與電極之間,其單位強度低及熱阻提升與增加熱傳並有多個可能故障點,該熱量或電流浪湧很容易損壤電路,其亮度及光密度低,必須用數量龐大LED才能達到所需亮度,造成體積龐大及佔空間與電流消耗,使得其在實用性上大打折扣。The problem that this creation intends to solve is that in order to provide the electrical connection of the LED, the traditional LED lamp panel must prepare a complicated circuit PCB substrate, and the traditional LED is complicated and time-consuming to manufacture and assemble, and it also requires chip holders and gold wire welding. Wiring between the chip and the electrode, its unit strength is low, the thermal resistance is increased and the heat transfer is increased, and there are multiple possible failure points. The heat or current surge can easily damage the soil circuit, and its brightness and optical density are low, so it must be used in quantity Only a huge LED can achieve the required brightness, resulting in a huge volume, occupying space and current consumption, which greatly reduces its practicality.
解決問題之技術手段,為達上述之目的,本創作係提供一種高亮度LED燈盤結構,其特徵是,該燈盤,包括︰ 一塑膠聚合物板; 多顆高亮度發光二極體,係設於該塑膠聚合物板至少一端面,該多顆高亮度發光二極體並電性連接成一體; 藉此,該塑膠聚合物板取代傳統基板,透過該單顆高亮度發光二極體,使經組合之該多顆高亮度發光二極體提升亮度及密度。 Technical means to solve the problem, in order to achieve the above-mentioned purpose, this creative department provides a high-brightness LED lamp panel structure, which is characterized in that the lamp panel includes: A plastic polymer board; A plurality of high-brightness light-emitting diodes are arranged on at least one end surface of the plastic polymer board, and the plurality of high-brightness light-emitting diodes are electrically connected into one body; In this way, the plastic polymer board replaces the traditional substrate, and through the single high-brightness light-emitting diode, the combined high-brightness light-emitting diode improves the brightness and density.
其中,本創作該高亮度發光二極體係設於該塑膠聚合物板之上端面或下端面或上端面及下端面。Among them, the high-brightness light-emitting diode system of the present invention is arranged on the upper end surface or the lower end surface or the upper end surface and the lower end surface of the plastic polymer board.
. 其中,本創作該高亮度發光二極體係為晶片級封裝發光二極體CSP LED(Chip Scale Package LED)。Among them, the high-brightness light-emitting diode system originally created is a chip-scale package light-emitting diode CSP LED (Chip Scale Package LED).
其中,本創作該塑膠聚合物板設有一接地端及一電源端並電性連接該多顆高亮度發光二極體。Among them, the plastic polymer board of the present invention is provided with a ground terminal and a power terminal and is electrically connected to the plurality of high-brightness light-emitting diodes.
對照先前技術之功效,藉此,透過該塑膠聚合物板取代傳統發光二極體(LED)之基板,該塑膠聚合物板設有多顆該高亮度發光二極體;進而達成,其結構簡單並透過單顆該高亮度發光二極體產生之亮度,使經組合之多顆該高亮度發光二極體整體產生更高亮度;有效提升光密度、密度及降低故障及熱度,符合進步、實用與使用者之所需,足見其增益之處。Compared with the effect of the prior art, the plastic polymer plate is used to replace the traditional light emitting diode (LED) substrate. The plastic polymer plate is provided with multiple high-brightness light-emitting diodes. The structure is simple. And through the brightness generated by a single high-brightness light-emitting diode, the combined multiple high-brightness light-emitting diodes as a whole produce higher brightness; effectively improve optical density, density and reduce failure and heat, which is in line with progress and practicality And the needs of the user show its benefits.
茲將本創作配合附圖,並以實施例之表達形式詳細說明如下,而於文中所使用之圖式,其主旨僅為示意及輔助說明書之用,未必為本創作實施後之真實比例與精準配置,故不應就所附之圖式的比例與配置關係侷限本創作於實際實施上的專利範圍,合先敘明。This creation is hereby combined with the accompanying drawings, and is described in detail in the form of embodiment as follows, and the schematics used in the text are only for illustrative and auxiliary manual purposes, and may not be the true proportions and accuracy of the creation after implementation Therefore, it should not limit the scope of the patent creation in actual implementation on the basis of the ratio and configuration relationship of the attached drawings, and shall be stated first.
請參閱第一圖、第二圖、第三圖所示,係為本創作之立體分解圖、本創作之立體組合圖、本創作之組合剖面圖,本創作之高亮度LED燈盤結構於一較佳之實施例中,該燈盤1,包括︰一塑膠聚合物板11、多顆高亮度發光二極體12。Please refer to the first, second, and third pictures, which are the three-dimensional exploded view of this creation, the three-dimensional combined view of this creation, and the combined cross-sectional view of this creation. The high-brightness LED lamp panel structure of this creation is in one In a preferred embodiment, the
前述之一塑膠聚合物板11,係提供固定單位元件之用。One of the aforementioned
前述之多顆高亮度發光二極體12,係設於該塑膠聚合物板11至少一端面,該多顆高亮度發光二極體12並電性連接成一體,於本實施例該高亮度發光二極體12係設於該塑膠聚合物板11之上端面,但並不以此限制本創作,其亦可設於該塑膠聚合物板11下端面或上端面及下端面,該高亮度發光二極體12係為晶片級封裝發光二極體CSP LED(Chip Scale Package LED),但並不以此限制本創作;再者,本創作該塑膠聚合物板11設有一接地端111及一電源端112並電性連接該多顆高亮度發光二極體12,藉此,該塑膠聚合物板11取代傳統基板,透過該單顆高亮度發光二極體12,使經組合之該多顆高亮度發光二極體12提升亮度及密度。The aforementioned multiple high-brightness light-emitting
本創作其具有以下優點︰ (一)、芯片無需安裝芯片座。 (二)、芯片無需連接金線。 (三)、無需焊接。 (四)、體積小。 (五)、照度提高。 (六)、降低熱阻傳遞路徑。 (七)、減少發熱。 (八)、單位強度高。 (九)、故障少。 (十)、節能。 This creation has the following advantages: (1) The chip does not need to install the chip holder. (2) The chip does not need to be connected to the gold wire. (3) No welding is required. (4) Small size. (5) Improved illumination. (6) Reduce the thermal resistance transfer path. (7) Reduce fever. (8) High unit strength. (9) Few failures. (10) Energy saving.
藉此,本創作透過該塑膠聚合物板11取代傳統發光二極體(LED)基板,該塑膠聚合物板11設有多顆該高亮度發光二極體12;進而達成,其結構簡單並透過單顆該高亮度發光二極體12產生之亮度,使經組合之多顆該高亮度發光二極體12整體產生更高亮度;有效提升光密度、密度及降低故障及熱度。In this way, the present creation replaces the traditional light emitting diode (LED) substrate with the
綜觀上述可知,本創作在突破先前之技術結構下,確實已達到所欲增進之功效,且也非熟悉該項技藝者所易於思及,再者,本創作申請前未曾公開,其所具之進步性、實用性,顯已符合創作專利之申請要件,爰依法提出創作申請,懇請 貴局核准本件創作專利申請案,以勵創作,至感德便。Looking at the above, it can be seen that this creation has indeed achieved the desired enhancement effect under the breakthrough of the previous technical structure, and it is not easy to think about by those who are familiar with the art. Moreover, this creation has not been published before the application. Progressiveness and practicability show that it meets the requirements of the creation patent application. I filed a creation application in accordance with the law, and I implore your bureau to approve this creation patent application to encourage creation, and it is very convenient.
以上所述之實施例僅係為說明本創作之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本創作之內容並據以實施,當不能以之限定本創作之專利範圍,即大凡依本創作所揭示之精神所作之均等變化或修飾,仍應涵蓋在本創作之專利範圍內。The above-mentioned embodiments are only to illustrate the technical ideas and characteristics of this creation, and their purpose is to enable those who are familiar with this art to understand the content of this creation and implement them accordingly. When it cannot be used to limit the scope of patents of this creation, That is to say, all equal changes or modifications made in accordance with the spirit of this creation should still be covered by the scope of the patent of this creation.
1:燈盤 11:塑膠聚合物板 111:接地端 112:電源端 12:高亮度發光二極體 1: Lamp panel 11: Plastic polymer board 111: ground terminal 112: power terminal 12: High-brightness LED
第一圖︰為本創作之立體分解圖。 第二圖︰為本創作之立體組合圖。 第三圖︰為本創作之組合剖面圖。 The first picture: the three-dimensional exploded view of this creation. The second picture: the three-dimensional combined picture of this creation. The third picture: the sectional view of the composition of this creation.
1:燈盤 1: Lamp panel
11:塑膠聚合物板 11: Plastic polymer board
111:接地端 111: ground terminal
112:電源端 112: power terminal
12:高亮度發光二極體 12: High-brightness LED
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TW109206029U TWM604379U (en) | 2020-05-15 | 2020-05-15 | High-brightness LED lamp panel structure |
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TW109206029U TWM604379U (en) | 2020-05-15 | 2020-05-15 | High-brightness LED lamp panel structure |
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