CN201780992U - Packaging structure for serial flexible light-emitting diodes - Google Patents
Packaging structure for serial flexible light-emitting diodes Download PDFInfo
- Publication number
- CN201780992U CN201780992U CN2010201715507U CN201020171550U CN201780992U CN 201780992 U CN201780992 U CN 201780992U CN 2010201715507 U CN2010201715507 U CN 2010201715507U CN 201020171550 U CN201020171550 U CN 201020171550U CN 201780992 U CN201780992 U CN 201780992U
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- led
- wafer
- metal
- coat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides a packaging structure for flexible light-emitting diodes, which comprises a first metal substrate, a light-emitting diode chip, a second metal substrate and a packaging adhesive, wherein the light-emitting diode chip is loaded on the first metal substrate by a conductive adhesive; the second metal substrate is electrically connected with the light-emitting diode chip by routing; an interval is arranged between the first metal substrate and the second metal substrate; and the packaging adhesive is a flexible material and completely coats the light-emitting diode chip and partially coats the first metal substrate and the second metal substrate, so that the surfaces of the lower layers of the first metal substrate and the second metal substrate are exposed. The structure principle can be used for electrically connecting a plurality of light-emitting diodes in parallel or in series. The radiating effect can be effectively improved by using the metal substrates, and the flexible characteristic can be matched with various types of lamps.
Description
Technical field
The utility model is relevant with the LED package field, particularly improves radiating efficiency about a kind of metal substrate carrying diode wafer that utilizes, and the pliability package structure for LED that uses the pliability packing colloid.
Background technology
(Light Emitting Diode, technical development LED) reaches its maturity light-emitting diode, and its application is also very extensively with practical.For example, utilize the LED lamp as the setting in display backlight source, indoor outer electronic board, or directly be used as using of lighting or the like, all visible everywhere its utilization trace.
Yet no matter apply to which kind of field, for strengthening its light-source brightness, way is that a plurality of LED of accumulation use simultaneously usually.The practice like this, though can directly effectively reach its purpose, incident promptly is the problem of radiating efficiency.Again, traditional LED lamp uses the substrate of printed circuit board (PCB) for carrying more, because this substrate material is unfavorable for heat loss through conduction, so light-emitting component easily can't dissipation because of this high temperature, and the situation that produces fault or burn.
In addition, except that using simultaneously most LED lamps for strengthening the intensity of light source, be the moulding and the outward appearance of the various light fixtures of arranging in pairs or groups, traditional LED lamp integral body all belongs to non-bent design.Propose the improver has and utilizes the setting of flexible materials for substrate at this point, and reaches each independently LED lamp bending.But, then still be unreachable to the purpose of bending for a plurality of LED lamp devices in single packing colloid.So for a plurality of LED of accumulation strengthen brightness again for reaching bent purpose, each LED lamp be all individual packages and the condition that also is not in contact with one another under, limited density is set will limits to some extent its configuration.
In view of this, this creator proposes a kind of pliability package structure for LED, reach the high efficiency radiating effect except that changing substrate material, also utilize flexible materials to implement for packing colloid simultaneously, and reach the bent purpose of integral LED lamp for encapsulation.
Summary of the invention
In view of the above problems, the purpose of this utility model is to provide a kind of light-emitting diode that can effectively improve radiating efficiency, change existing rigidity encapsulating structure simultaneously, utilize the also bent enforcement of light-emitting diode after the pliability packing colloid makes encapsulation, and be loaded into all types of fitting structures.
For reaching above-mentioned purpose, the utility model proposes a kind of pliability package structure for LED, comprise: one first metal substrate; One LED wafer is utilized a conducting resinl and is stated from this first metal substrate; One second metal substrate is electrically connected through routing and this LED wafer, wherein, has one between this first metal substrate and this second metal substrate at interval; And a packing colloid, be a flexible materials and coat this LED wafer fully and coat this first metal substrate and this second metal substrate, and make this first metal substrate and this second metal substrate lower floor surface exposed with local.
Wherein this conducting resinl is a tin cream or elargol.And this pliability package structure for LED more comprises: two pins is electrically connected with this first metal substrate and this second metal substrate respectively.
During enforcement, this conducting resinl is a tin cream.
During enforcement, this conducting resinl is an elargol.
For reaching above-mentioned purpose, the utility model also proposes a kind of parallel pliability package structure for LED, comprise: a wafer carrier, have at least one V-type groove and form a plurality of first metal substrates, and utilize a plurality of conducting resinls respectively at a LED wafer is set on these many first metal substrates; One second metal substrate, and be electrically connected with this pilosity optical diode wafer respectively through routing, wherein, have one between this wafer carrier and this second metal substrate at interval; And a packing colloid, be a flexible materials and coat this pilosity optical diode wafer fully and coat this wafer carrier and this second metal substrate, and make this wafer carrier and this second metal substrate lower floor surface exposed with local.
For reaching above-mentioned purpose, the utility model also proposes a kind of tandem pliability package structure for LED, comprises: a plurality of light emitting diodes are being electrically connected of a series connection each other, and wherein this light emitting diode respectively comprises: one first metal substrate; And a LED wafer, utilize a conducting resinl and be stated from this first metal substrate; One second metal substrate, and be electrically connected through routing and this pilosity optical diode unit wherein, has an interval between this each first metal substrate and between this each first metal substrate and this second metal substrate; And a packing colloid, be a flexible materials and coat this pilosity optical diode wafer fully should many first metal substrates and this second metal substrate with local the coating, and make these many first metal substrates and this second metal substrate lower floor surface exposed.
For reaching above-mentioned purpose, the utility model also proposes a kind of pliability package structure for LED, comprises: one first metal substrate; One LED wafer is utilized a conducting resinl and is stated from this first metal substrate; Two second metal substrates are electrically connected with this LED wafer positive and negative electrode end respectively through routing, wherein, have one between this first metal substrate and this two second metal substrates respectively at interval; And a packing colloid, be a flexible materials and coat this LED wafer fully and coat this first metal substrate and this two second metal substrates, and make this first metal substrate and this two second metal substrate lower floors surface exposed with local.
For reaching above-mentioned purpose, the utility model also proposes a kind of pliability package structure for LED, comprises: one first metal substrate; One LED wafer, wherein an end of this LED wafer positive and negative electrode utilizes a conducting resinl and is stated from this first metal substrate; One second metal substrate, wherein the other end of this LED wafer positive and negative electrode utilizes this conducting resinl and is stated from this second metal substrate; Have one between this first metal substrate and this second metal substrate at interval; And a packing colloid, be a flexible materials and coat this LED wafer fully and coat this first metal substrate and this second metal substrate, and make this first metal substrate and this second metal substrate lower floor surface exposed with local.
Compared with prior art, pliability package structure for LED provided by the utility model utilizes the usefulness of metal substrate as the carrying diode wafer.Thus, can significantly promote radiating efficiency, and extensively apply to high power or accumulate the product that a plurality of LED lamps use.The utility model is still bent implement after encapsulation is finished by the pliability packing colloid again and be equipped on all kinds light fixture, thoroughly promote applicability of the present utility model.Simultaneously when serial or parallel connection should pilosity optical diode wafer uses, also still effectively bring into play aforesaid every advantage.
Description of drawings
Fig. 1 is the utility model preferred embodiment schematic perspective view;
Fig. 2 A is the utility model preferred embodiment floor map;
Fig. 2 B is the utility model preferred embodiment structure bending floor map;
Fig. 3 A is the utility model a plurality of LED wafer structure top views in parallel;
Fig. 3 B is the utility model a plurality of LED wafer structure side views in parallel;
Fig. 4 A is the utility model a plurality of LED wafer structure top views of connecting;
Fig. 4 B is the utility model a plurality of LED wafer structure side views of connecting;
Fig. 5 all is positioned at positive preferred embodiment end view for the LED wafer positive and negative electrode of the utility model encapsulating structure;
Fig. 6 all is positioned at the preferred embodiment end view at the back side for the LED wafer positive and negative electrode of the utility model encapsulating structure.
Description of reference numerals: 1-wafer carrier; 10-first metal substrate; The 2-light emitting diode; 20-second metal substrate; The 30-LED wafer; The 40-packing colloid; The 50-conducting resinl; 60-at interval; 70-two pins.
Embodiment
Understand content of the present utility model for your juror can be known, it is graphic sincerely to arrange in pairs or groups in the following instructions, please consult.
See also Fig. 1, Fig. 2 A and Fig. 2 B, be respectively the utility model preferred embodiment schematic perspective view, floor map and structure bending floor map.By the figure sight, the utility model provides a kind of pliability package structure for LED, comprises: one first metal substrate 10, a LED wafer 30, one second metal substrate 20 and a packing colloid 40.Wherein this first metal substrate 10 is in order to carrying the usefulness of this LED wafer 30, places 10 of this LED wafer 30 and this first metal substrates and can utilize a conducting resinl 50 for firm this LED wafer 30.Again, the purpose of using metal substrate is to strengthen the effect of LED heat radiating, so material selects for use so long as the thermal conductivity preferably all can implement, and for example use comprises metalloids such as aluminium or copper.This second metal substrate 20 is electrically connected via routing and this LED wafer 30 again.Wherein this first metal substrate 10 and 20 of this second metal substrates have an interval 60, be able to separate when this first metal substrate 10 is used for positive and negative electrode with this second metal substrate 20, and because this packing colloid 40 is a flexible materials, therefore after this packing colloid 40 coats this first metal substrate 10 and this second metal substrate 20, be able to this interval 60 of mat and be crooked enforcement.
For strengthening the effect of heat radiation, this packing colloid 40 is not to coat this first metal substrate 10 and this second metal substrate 20 fully, make this first metal substrate 10 surface exposed with these second metal substrate, 20 lower floors and directly contact, effectively strengthen whole radiating effect with environment or other external radiating fins.Be coated on fully in this packing colloid 30 as for 30 of this LED wafer, in order to reach the effect of protection.
In addition, this heat-conducting glue 50 can use tin cream or elargol to strengthen the steadiness of this LED wafer 30 on heat conduction efficiency is considered, and effectively conducts heat on this first metal substrate 10.
Except utilizing this first metal substrate 10 and this second metal substrate 20 is the use of positive and negative electrode, more can comprise two pins 70 and be electrically connected with this second metal substrate 20 with this first metal substrate 10 respectively, then can utilize this two pins 70 directly to weld and be located on the various circuit boards.
Please consult Fig. 3 A and Fig. 3 B more in the lump, be the utility model a plurality of LED wafer structure top views in parallel and end view.Present embodiment utilizes the previous embodiment structural principle, includes a wafer carrier 1, one second metal substrate 20 and a packing colloid 40, and forms a plurality of LED wafer 30 in parallel on this wafer carrier 1.On the structure, this wafer carrier 1 has at least one V-shaped groove and forms a plurality of first metal substrates 10, utilizes sticking this pilosity optical diode wafer 30 of establishing of conducting resinl 50 on these many first metal substrates 10 more respectively.And another electrode setting promptly utilizes this second metal substrate 20 and be electrically connected with this pilosity optical diode wafer 30 respectively through routing, wherein has one at interval 60 between this wafer carrier 1 and this second metal substrate 20.In addition, with aforementioned embodiment, for reaching bent purpose, this packing colloid 40 is a flexible materials and coats this LED wafer 30 fully, coat this wafer carrier 1 and this second metal substrate 20 with the part, and make this wafer carrier 1 surface exposed with these second metal substrate, 20 lower floors, and can effectively promote radiating efficiency and bent purpose.
Please consult Fig. 4 A and Fig. 4 B more in the lump, be the utility model connect a plurality of LED wafer structure top views and end view.By the figure sight, present embodiment includes a plurality of light emitting diodes 2, one second metal substrate 20 and a packing colloid 40.Being electrically connected that series connection is provided with adopted in this pilosity optical diode unit 2, and wherein respectively this light emitting diode 2 include one first metal substrate 10 and a LED wafer 30.Identical person with previous embodiment, this LED wafer 30 is utilized a conducting resinl 50 and is stated from this first metal substrate 10.And this second metal substrate 20 is electrically connected via routing and this pilosity optical diode unit 2.One interval 60 is wherein arranged between this each first metal substrate 10 and between this each first metal substrate 10 and this second metal substrate 20.Purpose is all identical with previous embodiment, and except that in order to the configuration that separates each electrode, this interval 60 is mainly the purpose that reaches bent.And this packing colloid 40 is a flexible materials, and is encapsulated the purpose that bending is implemented in the back.Simultaneously this packing colloid 40 and coat this pilosity optical diode wafer 30 fully should many first metal substrates 10 and these second metal substrates 20 with local the coating, and make these many first metal substrates 10 surface exposed with these second metal substrate, 20 lower floors, and can effectively promote its radiating efficiency.
See also Fig. 5, all be positioned at the preferred embodiment end view in front for the LED wafer positive and negative electrode of the utility model encapsulating structure.By the figure sight, the pliability package structure for LED of present embodiment comprises one first metal substrate 10, a LED wafer 30, two second metal substrates 20 and packing colloids 50.This LED wafer 30 is utilized a conducting resinl 50 and is stated from this first metal substrate 10.Because both positive and negative polarity two ends of this LED wafer 30 all are located at the front, therefore, this first metal substrate 10 is only for carrying the usefulness of this LED wafer 30.Both positive and negative polarity as for this LED wafer 30 then utilizes routing and this two second metal substrates 20 to be electrically connected.Simultaneously, in order to reach the purpose that positive and negative electrode is isolated mutually, between this first metal substrate 10 and this two second metal substrates 20, has an interval 60 respectively.Identical person with previous embodiment, in order to reach the whole bent purpose in encapsulation back, this packing colloid 40 is a flexible materials and coats this LED wafer 30 and local this first metal substrate 10 and these two second metal substrates 20 that coat fully, and make this first metal substrate 10 surface exposed with these two second metal substrate 20 lower floors, holding concurrently by this to reach the effect of high cooling efficiency.
See also Fig. 6, all be positioned at the preferred embodiment end view at the back side for the LED wafer positive and negative electrode of the utility model encapsulating structure.By the figure sight, the pliability package structure for LED of present embodiment comprises one first metal substrate 10, a LED wafer 30, one second metal substrate 20 and a packing colloid 50.Because the positive and negative electrode of this LED wafer 30 of present embodiment all is located at its place, back side, thus the both positive and negative polarity of this LED wafer 30 wherein an end utilize a conducting resinl and be stated from this first metal substrate 10; And the other end of the both positive and negative polarity of this LED wafer 30 utilizes this conducting resinl 50 and be stated from this second metal substrate 20.Simultaneously, in order to reach the purpose that positive and negative electrode is isolated mutually, between this first metal substrate 10 and this second metal substrate 20, has an interval 60.Identical person with previous embodiment, in order to reach the whole bent purpose in encapsulation back, this packing colloid 40 is a flexible materials and coats this LED wafer 30 and local this first metal substrate 10 and this second metal substrate 20 that coat fully, and make this first metal substrate 10 surface exposed with these second metal substrate, 20 lower floors, holding concurrently by this to reach the effect of high cooling efficiency.
Effect of the present utility model is that this pliability package structure for LED utilizes the usefulness of metal substrate as the carrying diode wafer.Thus, can significantly promote radiating efficiency, and extensively apply to high power or accumulate the product that a plurality of LED lamps use.The utility model is still bent implement after encapsulation is finished by the pliability packing colloid again and be equipped on all kinds light fixture, thoroughly promote applicability of the present utility model.Simultaneously when serial or parallel connection should pilosity optical diode wafer uses, also still effectively bring into play aforesaid every advantage.
The above person, it only is preferred embodiment of the present utility model, be not in order to limit the scope that the utility model is implemented, therefore those of ordinary skills have done equivalence or have changed easily, not breaking away from the equalization variation of being done under spirit of the present utility model and the scope and modification, all should be covered by in the claim of the present utility model.
Claims (8)
1. a pliability package structure for LED is characterized in that, comprises:
One first metal substrate;
One LED wafer is utilized a conducting resinl and is stated from this first metal substrate;
One second metal substrate is electrically connected through routing and this LED wafer, wherein, has one between this first metal substrate and this second metal substrate at interval; And
One packing colloid is a flexible materials and coat this LED wafer fully and coat this first metal substrate and this second metal substrate with local, and makes this first metal substrate and this second metal substrate lower floor surface exposed.
2. pliability package structure for LED as claimed in claim 1 is characterized in that, this conducting resinl is a tin cream.
3. pliability package structure for LED as claimed in claim 1 is characterized in that, this conducting resinl is an elargol.
4. as claim 1,2 or 3 described pliability package structure for LED, it is characterized in that, more comprise two pins, described two pins is electrically connected with this first metal substrate and this second metal substrate respectively.
5. a parallel pliability package structure for LED is characterized in that, comprises:
One wafer carrier has at least one V-type groove and forms a plurality of first metal substrates, and utilizes a plurality of conducting resinls respectively at a LED wafer is set on these a plurality of first metal substrates;
One second metal substrate, and be electrically connected with this pilosity optical diode wafer respectively through routing, wherein, have one between this wafer carrier and this second metal substrate at interval; And
One packing colloid is a flexible materials and coat this pilosity optical diode wafer fully and coat this wafer carrier and this second metal substrate with local, and makes this wafer carrier and this second metal substrate lower floor surface exposed.
6. a tandem pliability package structure for LED is characterized in that, comprises:
A plurality of light emitting diodes are being electrically connected of a series connection each other, and this light emitting diode respectively wherein comprises:
One first metal substrate; And
One LED wafer is utilized a conducting resinl and is stated from this first metal substrate;
One second metal substrate, and be electrically connected through routing and this pilosity optical diode unit wherein, has an interval between this each first metal substrate and between this each first metal substrate and this second metal substrate; And
One packing colloid is a flexible materials and coat this pilosity optical diode wafer fully and coat these first metal substrates and this second metal substrate with local, and makes these many first metal substrates and this second metal substrate lower floor surface exposed.
7. a pliability package structure for LED is characterized in that, comprises:
One first metal substrate;
One LED wafer is utilized a conducting resinl and is stated from this first metal substrate;
Two second metal substrates are electrically connected with this LED wafer positive and negative electrode end respectively through routing, wherein, have one between this first metal substrate and this two second metal substrates respectively at interval; And
One packing colloid is a flexible materials and coat this LED wafer fully and coat this first metal substrate and this two second metal substrates with local, and makes this first metal substrate and this two second metal substrate lower floors surface exposed.
8. a pliability package structure for LED is characterized in that, comprises:
One first metal substrate;
One LED wafer, wherein an end of this LED wafer positive and negative electrode utilizes a conducting resinl and is stated from this first metal substrate;
One second metal substrate, wherein the other end of this LED wafer positive and negative electrode utilizes this conducting resinl and is stated from this second metal substrate; Have one between this first metal substrate and this second metal substrate at interval; And
One packing colloid is a flexible materials and coat this LED wafer fully and coat this first metal substrate and this second metal substrate with local, and makes this first metal substrate and this second metal substrate lower floor surface exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201715507U CN201780992U (en) | 2010-04-26 | 2010-04-26 | Packaging structure for serial flexible light-emitting diodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201715507U CN201780992U (en) | 2010-04-26 | 2010-04-26 | Packaging structure for serial flexible light-emitting diodes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201780992U true CN201780992U (en) | 2011-03-30 |
Family
ID=43794197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201715507U Expired - Fee Related CN201780992U (en) | 2010-04-26 | 2010-04-26 | Packaging structure for serial flexible light-emitting diodes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201780992U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916112A (en) * | 2012-10-31 | 2013-02-06 | 佛山市国星光电股份有限公司 | Large power LED and manufacturing method thereof |
-
2010
- 2010-04-26 CN CN2010201715507U patent/CN201780992U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916112A (en) * | 2012-10-31 | 2013-02-06 | 佛山市国星光电股份有限公司 | Large power LED and manufacturing method thereof |
| CN102916112B (en) * | 2012-10-31 | 2015-07-29 | 佛山市国星光电股份有限公司 | A kind of high power LED device and manufacture method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203277498U (en) | Light-emitting component and device base of light-emitting device thereof | |
| CN201918430U (en) | Integral heat dissipation structure for LED substrate | |
| TWM397590U (en) | Flexible LED package structure | |
| CN101696790A (en) | High-power LED heat-dissipation packaging structure | |
| CN201741721U (en) | Chip-on-board light emitting diode structure | |
| JP7108326B2 (en) | Flexible LED light bar | |
| CN103199173A (en) | Light emitting diode chip, packaging substrate, packaging structure and manufacturing method thereof | |
| CN201032117Y (en) | High-power LED lighting lamp | |
| CN202708919U (en) | Tower-shaped light-emitting diode (LED) automobile lamp | |
| CN201780992U (en) | Packaging structure for serial flexible light-emitting diodes | |
| CN102364684B (en) | LED (Light-Emitting Diode) module and manufacturing process thereof | |
| US10024530B2 (en) | Lighting device and LED luminaire | |
| CN203363722U (en) | Sandwich type LED light source module with two sides emitting light | |
| CN202796951U (en) | Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source | |
| CN104282671A (en) | Light emitting diode assembly and manufacturing method thereof | |
| CN204240090U (en) | For providing the LED light device of directional beam | |
| CN202633304U (en) | Distributed high-voltage LED die set | |
| CN202678310U (en) | A large-power LED integrated array lighting source based on COB technology | |
| CN203413588U (en) | LED (Light Emitting Diode) light source board assembly, LED lamp wick and LED lighting device | |
| CN202469579U (en) | Double-surface light-emitting planar sheet LED lamp | |
| CN203477980U (en) | Area light source module of white light LEDs | |
| CN103423617A (en) | Light emitting diode module | |
| JP3164969U (en) | Plastic light emitting diode package structure | |
| CN201616431U (en) | Array LED illumination surface light source | |
| CN207909874U (en) | A kind of 360 ° of upside-down mounting self-rectifying is light-emitting LED |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110330 Termination date: 20130426 |