TWM558469U - Flexible high-brightness light-emitting diode - Google Patents

Abstract

A flexible high-brightness light-emitting diode comprising: a flexible insulating transparent substrate; and a conductive and heat-conductive pattern circuit comprising at least one conductive line respectively disposed on two sides of the flexible insulating transparent substrate and at least one a heat conducting line; at least one conductive paste disposed on the conductive line; the plurality of chips not having a back plating reflective layer and forming a positive light emitting surface, and being connected to the conductive line through the conductive adhesive flip chip; at least two sealing glue Provided on the opposite side of the chip and the soft insulating transparent substrate, the flexible insulating transparent substrate and one end of the conductive line are formed by re-folding and forming an insulating plate, or the conductive line is provided with two conductive frames. Make one end form a plug-in. Thereby, high brightness, low energy consumption, overall illumination, improved heat dissipation performance, twisting and multi-directional flexible steering, simplified manufacturing process and improved yield can be achieved.

Description

Flexible high-brightness light-emitting diode

The present invention relates to a light-emitting diode, in particular to a flexible insulating transparent substrate capable of utilizing a light-emitting diode, and having an electrically conductive and heat-conducting pattern line including a conductive line and a heat-conducting line, the conductive line being provided with a conductive paste and having a positive connection The plurality of chip flip-chips or the second conductive frame of the opposite light-emitting surface, the chip and the flexible insulating transparent substrate are provided with a flexible high-brightness light-emitting diode of sealing glue on both sides.

In order to increase the reflection effect, the light-emitting diodes are generally provided with a back-plated reflective layer, so that they can only emit light on one side, and the light source can not be generated on all the upper and lower sides. The wafer is set in ceramic or copper by wire bonding. The aluminum hard substrate and the light-emitting diode can not be achieved by the plug-in method, the manufacturing can not improve the yield, and the lead frame can only be set on both sides, which increases the inconvenience in use, and the illumination range is limited. In order to increase the brightness of the light-emitting diode, it is only possible to increase the current and increase the concentration of a plurality of light-emitting diodes. However, the result is only high energy consumption and high heat energy of the light-emitting diode, and the light-emitting diode is also known for the heat source. There is no structure that is directly taken away quickly, which causes the high temperature abnormality during work to be dissipated. It is easy to burn the LED and reduce the service life. It needs to install a large-sized heat sink and fan to increase cost and space. In addition to the fact that the light-emitting diodes can only be illuminated on one side, and the structure cannot be used, it is greatly reduced in practicality. This is a technician and a consumer of the field. Breakthrough place.

In order to solve the above-mentioned deficiencies of the prior art, this creation is mainly The object of the invention is to provide a flexible high-brightness light-emitting diode, wherein the flexible insulating transparent substrate of the light-emitting diode can be provided with an electrically conductive and heat-conducting pattern line including a conductive line and a heat-conducting line, and the conductive line is provided with conductive glue and connected to each other. A plurality of chip flip-chips or two conductive frames having positive and negative light-emitting surfaces are provided on both sides of the chip and the flexible insulating transparent substrate, so as to overcome the difficulties in the prior art.

A secondary objective of the present invention is to provide a flexible high-brightness light-emitting diode that utilizes a plurality of chips in series to package to provide high brightness and low power consumption of the light-emitting diode.

Another object of the present invention is to provide a flexible high-brightness light-emitting diode, which utilizes light from a chip to directly penetrate both sides of a transparent insulating transparent substrate to generate overall illumination, using conductive and thermally conductive pattern lines and conductive paste, chips or And the conductive frame connection improves heat dissipation performance.

A further object of the present invention is to provide a flexible high-brightness light-emitting diode that utilizes a flexible insulating transparent substrate to bend the light-emitting diode and perform multi-directional flexible steering.

Another object of the present invention is to provide a flexible high-brightness light-emitting diode that utilizes a plug-in and flip-chip package of a light-emitting diode to simplify the manufacturing process and improve yield.

A further object of the present invention is to provide a flexible high-brightness light-emitting diode which can effectively improve the brightness, ease of use and durability of the light-emitting diode.

In order to solve the problem that the creative is to solve, according to the general knowledge, the light-emitting diode is provided with a back-plated reflective layer, so that it can only emit light on one side, and the chip is set in ceramic or copper-aluminum by wire bonding. The hard substrate and the light-emitting diode can not be achieved by the plug-in method, the manufacturing can not improve the yield, and the lead frame can only be set on both sides, which increases the inconvenience in use, and the light-emitting range is limited. Increasing the brightness of the light-emitting diode can only increase the current and increase the concentration of multiple light-emitting diodes, resulting in high Energy consumption and high heat energy, and it is also known that the light-emitting diode does not directly carry away the structure of the heat source, which causes the high temperature abnormality during work to be dissipated, and it is easy to burn the LED and reduce the service life. The addition of large-volume heat-dissipating cymbals and fans increases the cost and space. In addition, the use of light-emitting diodes makes it impossible to use the structure to make it more practicable.

The technical means for solving the problem, in order to achieve the above purpose, the present invention provides a flexible high-brightness light-emitting diode, the light-emitting diode comprising: a soft insulating transparent substrate; a flexible insulating transparent substrate, wherein the conductive and thermally conductive pattern line comprises at least one conductive line and at least one heat conducting line respectively disposed on two sides of the flexible insulating transparent substrate; at least one conductive adhesive is disposed on the conductive line of the conductive and heat conducting pattern line; a chip, the chip does not have a back-plated reflective layer and is formed to have a positively opposite light-emitting surface, and the chip and the conductive paste have a P-pole and an N-pole chip flip-chip connected to the conductive line of the conductive heat-conducting pattern line; The second sealant is encapsulated on the opposite side of the chip, the opposite side of the light-emitting surface, and the other side of the flexible insulating transparent substrate provided with the heat-conducting line, and the side of the flexible insulating transparent substrate which is provided with the conductive line corresponding to the heat-conductive line.

The length of one end of the flexible insulating transparent substrate and the conductive line is greater than the length of one end of the heat conducting line of the flexible insulating transparent substrate.

Wherein, the soft insulating transparent substrate and the length of one end of the conductive line of the flexible insulating transparent substrate are longer than the length of one end of the heat conducting line of the flexible insulating transparent substrate, and are formed by refolding to form an insert and having an insulating plate.

Wherein, the conductive line of the conductive and heat conducting pattern line is provided with two conductive frames, and the two conductive frames have a conductive line of the chip in series and one end forms an insert.

The length of one end of the two conductive frames is greater than the length of one end of the conductive line of the flexible insulating transparent substrate.

Wherein, the conductive lines and the heat conducting lines of the conductive and heat conducting pattern lines are respectively disposed on both sides of the flexible insulating transparent substrate by sputtering.

Among them, the conductive conductive pattern line is made of copper, aluminum or graphite.

Among them, the material of the seal is made of silicone or epoxy resin.

Among them, the sealant is provided with a phosphor powder and an oxidized metal powder.

In contrast to the effects of the prior art, the present invention can utilize the light-insulating transparent substrate of the light-emitting diode to be provided with a conductive and heat-conducting pattern line including a conductive line and a heat-conducting line, the conductive line is provided with a conductive adhesive and is connected to each other with positive and negative a plurality of chip flip-chips or two conductive frames on the light-emitting surface, and the chip and the flexible insulating transparent substrate are provided with a sealant on both sides; and further, the plurality of chips are serially packaged to make the light-emitting diodes have high brightness and low energy consumption, and the chip is utilized. The light directly penetrates both sides of the transparent insulating transparent substrate to generate overall illumination, and the conductive conductive line is connected with the conductive adhesive, the chip or the conductive frame to improve the heat dissipation performance, and the flexible insulating transparent substrate can make the light emitting diode bend and multiply Flexible steering, using the plug-in and flip-chip package of the light-emitting diode to simplify the manufacturing process and improve the yield, effectively improve the brightness, ease of use and durability of the light-emitting diode, in line with the progress, practicality and user Need to see where it is.

100‧‧‧Lighting diode

101‧‧‧plugin

102‧‧‧Insulating sheet

103‧‧‧Extended part

1‧‧‧Soft insulating transparent substrate

2‧‧‧Electrically conductive pattern lines

21‧‧‧Electrical circuit

22‧‧‧Heat conduction line

3‧‧‧Conductive adhesive

4‧‧‧chip

41‧‧‧Lighting surface

5‧‧‧ Conducting frame

51‧‧‧ plugin

6‧‧‧Packing

61‧‧‧Fluorescent powder

62‧‧‧Oxidized metal powder

The first picture: the three-dimensional exploded view of the creation.

The second picture: the three-dimensional combination of the creation.

The third picture: a sectional view of the combination of the creation.

The fourth picture: an example of the embodiment of the overall illuminating of the creation.

Figure 5: A diagram of an embodiment of a multi-directional flexible steering for the creation.

Figure 6 is a perspective exploded view of another embodiment of the present invention.

Figure 7 is a perspective view of another embodiment of the present invention.

Figure 8 is a cross-sectional view showing a combination of another embodiment of the present invention.

Fig. 9 is a view showing an embodiment of the overall illumination of another embodiment of the present invention.

Fig. 10 is a view showing an embodiment of a multidirectional flexible steering of another embodiment of the present invention.

The present invention will be described in detail with reference to the accompanying drawings, and the drawings used in the text are intended to be illustrative only and to assist the specification, and may not be true proportion and precision after the implementation of the creation. Configuration, so the proportion of the attached schema and the configuration relationship should not be limited to the scope of the patent created in the actual implementation, which is described first.

Please refer to the first, second and third figures, which are the three-dimensional exploded view of the creation, the three-dimensional combination of the creation, and the combined sectional view of the creation. The flexible high-brightness light-emitting diode of the creation In a preferred embodiment, the LED 100 includes a flexible insulating transparent substrate 1, an electrically and thermally conductive pattern line 2, at least one conductive paste 3, a plurality of chips 4, and at least two encapsulants 6.

One of the aforementioned flexible insulating transparent substrates 1.

The conductive and thermally conductive pattern line 2 is disposed on the flexible insulating transparent substrate 1 , and the conductive and thermally conductive pattern line 2 includes at least one conductive line 21 and at least one heat conducting line 22 respectively disposed on both sides of the flexible insulating transparent substrate 1 The high-current conduction and the thermal energy dissipation of the plurality of chips 4 described later are respectively provided, and the conductive lines 21 and the heat-conducting lines 22 of the conductive and heat-conductive pattern lines 2 are respectively disposed on both sides of the flexible insulating transparent substrate 1 by sputtering, and the conductive and heat-conductive pattern lines 2 are respectively provided. The material is made of copper, aluminum or graphite, but it is not limited to this creation. In addition to the aforementioned copper, aluminum or ink, it is the protection scope of this creation.

The at least one conductive paste 3 is disposed on the conductive trace 21 of the conductive and thermally conductive pattern line 2.

In the foregoing plurality of chips 4, the chip 4 does not have a back-plated reflective layer and is formed to have a positive-emitting surface 41, and the chip 4 is connected to the chip 4 having a P-pole and an N-pole through the conductive paste 3 The conductive line 21 of the conductive and heat conducting pattern line 2.

The at least two sealants 6 are disposed on the chip 4, and the opposite side of the light-emitting surface 41 and the other side of the flexible insulating transparent substrate 1 provided with the heat-conducting line 22 and the corresponding conductive line 22 are provided with conductive lines 21 On the one side of the flexible insulating transparent substrate 1, the sealing material 6 is made of silicone or epoxy resin in the embodiment, but the invention is not limited thereto, and the sealing compound 6 except the aforementioned silicone or epoxy resin is It belongs to the scope of protection of this creation, and the sealant 6 is designed to optimize the color temperature and brightness of the light and to meet the needs of use. The mixture is provided with different proportions of phosphor powder 61 and oxidized metal powder. 62.

In this embodiment, the length of one end of the flexible insulating transparent substrate 1 and the conductive line 21 is greater than the length of one end of the flexible insulating transparent substrate 1 , and the length of one end of the flexible insulating transparent substrate 1 and the conductive line 21 is greater than that of the flexible insulating transparent substrate 1 The elongated portion 103 of the length of one end of the heat conducting line 22 is formed in a folded state. The insert 101 has an insulating sheet 102, that is, the folded portion 103 is attached to an insulating sheet 102.

Please refer to the sixth, seventh, and eighth figures, which are perspective exploded views of another embodiment of the present creation, a three-dimensional combination diagram of another embodiment of the present creation, and a combined sectional view of another embodiment of the present creation. It is substantially the same as the structure of the first to fifth figures, and the difference is that the first to fifth figures are at one end of the flexible insulating transparent substrate 1 and the conductive line 21, and are not larger than the flexible insulating transparent substrate 1 The length portion 103 of the length of the heat conducting line 22 is not folded to form the insert 101 and is attached to an insulating sheet 102. In another embodiment of the present invention, the conductive line 21 of the conductive and heat conducting pattern line 2 is provided. a second conductive frame 5 having a conductive line 21 of the chip 4 connected in series and having one end forming an insert 51, the two conductive frames 5 being long at one end The degree is greater than the length of one end of the conductive line 21 of the flexible insulating transparent substrate 1.

In one embodiment of the present invention, the flexible insulating transparent substrate 1 and the conductive line 21 have a length longer than the length of the flexible insulating transparent substrate 1 at one end of the heat conducting line 22, and the elongated portion 103 is folded to form a plug-in. And having an insulating plate 102 to form a light bar, the chip 4 electrically connecting the chip 4 having the P pole and the N pole to the conductive line 21 of the conductive and heat conducting pattern line 2 through the conductive adhesive 3 (such as the first The second conductive frame 5 is connected to the conductive line 21 of the conductive and heat conducting pattern line 2 in another embodiment. The conductive frame 5 has a conductive line 21 of the chip 4 connected in series. And one end forms an insert 5 to form a light bar (as shown in the sixth, seventh and eighth figures).

Please refer to the fourth, fifth, and ninth and tenth drawings for the embodiment of the creation of the overall illumination, the embodiment of the multi-directional flexible steering of the creation, and another implementation of the creation. The embodiment of the present invention is a multi-directional flexible steering embodiment of the present invention. The present invention includes at least one conductive line 21 and at least one heat conducting line 22. The conductive heat conducting pattern line 2 is provided in the soft state. The transparent substrate 1 is insulated, and at least one conductive paste 3 is disposed on the conductive line 21 of the conductive and thermally conductive pattern line 2, and the plurality of chips having the P-pole and the N-pole and having no back-plated reflective layer to form the front and back-emitting surface 41 are formed. 4 flip chip (as shown in the first to fifth figures) or two series of conductive strips 5 connected to the conductive line 21 (as shown in the sixth to the tenth figure), packaged in at least two sealants 6 for softness The two sides of the insulating transparent substrate 1 enable the light-emitting diode 100 to emit light as a whole (as shown in the fourth and ninth figures), and at the same time, it can perform multi-directional flexible steering (as shown in the fifth and tenth drawings). Show).

Therefore, the flexible insulating transparent substrate 1 of the present invention can be provided with a conductive and transparent substrate 1 including a conductive line 21 and a heat conducting line 22, and the conductive line 21 is provided with a conductive paste 3 and is connected to each other with a positive and negative polarity. The plurality of chips 4 of the two light-emitting surfaces 41 are over-crystallized or the second conductive frame 5, and the chip 4 and the flexible insulating transparent substrate 1 are provided with a sealant 6 on both sides; The plurality of chips 4 are serially packaged to produce high brightness and low power consumption of the light emitting diode 100, and the light of the chip 4 is directly transmitted through both sides of the flexible insulating transparent substrate 1 to generate overall light, and the conductive and heat conductive pattern line 2 and the conductive adhesive are utilized. 3. The chip 4 or the conductive frame 5 is connected to improve the heat dissipation performance, and the flexible insulating substrate 1 is used to make the light emitting diode 100 bend and multi-directional flexible steering, and the plug-in 101 and the flip chip package of the light-emitting diode 100 are used. In order to simplify the manufacturing process and improve the yield, the brightness, ease of use and durability of the LEDs 100 can be effectively improved, which is in line with the needs of progress, practicality and users, and can be seen in the gain.

Looking at the above, we can see that this creation has achieved the desired effect under the previous technical structure, and it is not easy for people who are familiar with the art to think about it. Moreover, this creation has not been disclosed before the application, and it has Progressive and practical, it has already met the requirements for the creation of patents, and has submitted an application for creation according to law. You are requested to approve the creation of a patent application for this article, so as to encourage creation and to be sensible.

The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equivalent changes or modifications made by the people in accordance with the spirit revealed by this creation should still be covered by the scope of the patent of this creation.

Claims (9)

A flexible high-brightness light-emitting diode comprising: a flexible insulating transparent substrate; an electrically conductive and heat-conducting pattern line disposed on the flexible insulating transparent substrate, wherein the conductive and thermally conductive pattern lines are respectively disposed on the soft Insulating transparent substrate having at least one conductive line on both sides thereof and at least one heat conducting line; at least one conductive paste is disposed on the conductive line of the conductive and heat conducting pattern line; and the plurality of chips, the chip does not have a back plating reflective layer and is formed to have On the opposite side of the light-emitting surface, the chip and the conductive chip have a P-pole and an N-pole chip flip-chip connected to the conductive line of the conductive and heat-conducting pattern line; at least two sealants, the sealant is packaged on the chip, and vice versa The other side of the light-emitting surface and the flexible insulating transparent substrate provided with the heat-conducting line and the soft insulating transparent substrate provided with the conductive line corresponding to the heat-conductive line. The flexible high-brightness light-emitting diode according to claim 1, wherein the sealant is provided with a phosphor powder and an oxidized metal powder. The flexible high-brightness light-emitting diode according to the first or the second aspect of the invention, wherein the flexible insulating transparent substrate and the conductive line have a length longer than one end of the flexible insulating transparent substrate. The flexible high-brightness light-emitting diode according to claim 3, wherein the flexible insulating transparent substrate and the length of one end of the conductive line are longer than the length of one end of the heat-transmissive transparent substrate of the flexible insulating transparent substrate. The fold is formed into an insert and has an insulating sheet. The flexible high-brightness light-emitting diode according to the first or second aspect of the invention, wherein the conductive line of the conductive and heat-conducting pattern line is provided with two conductive frames, and the two conductive frames are electrically connected in series with a chip. Route and make one end form a plug-in. The flexible high-brightness light-emitting diode according to claim 5, wherein the length of one end of the two conductive frames is greater than the length of one end of the conductive line of the flexible insulating transparent substrate. The flexible high-brightness light-emitting diode according to claim 1, wherein the conductive line and the heat-conducting line of the conductive heat-conducting pattern line are respectively disposed on both sides of the flexible insulating transparent substrate by sputtering. The flexible high-brightness light-emitting diode according to claim 1, wherein the conductive heat-conducting pattern line is made of copper, aluminum or graphite. The flexible high-brightness light-emitting diode according to claim 1, wherein the sealant is made of silicone or epoxy resin.