JP3164454U - 3-force light-emitting diode heat sink - Google Patents
3-force light-emitting diode heat sink Download PDFInfo
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- JP3164454U JP3164454U JP2010006367U JP2010006367U JP3164454U JP 3164454 U JP3164454 U JP 3164454U JP 2010006367 U JP2010006367 U JP 2010006367U JP 2010006367 U JP2010006367 U JP 2010006367U JP 3164454 U JP3164454 U JP 3164454U
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- emitting diode
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- heat sink
- light emitting
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Abstract
【課題】放熱性の優れた発光ダイオードユニット及び照明器具を提供する。【解決手段】表面に電源配線プリントされた基板に該基板を貫通する孔部を設け前記基板の裏面にヒートシンクを配設しその底面に放熱部材を備える発光ダイオードを前記孔部に挿入し、放熱部材とヒートシンクとを粘着部材により接合し発光ダイオードの電極端子と基板上の電源配線とを電気的に接続した。これにより、LEDより発生する熱の放熱性を高めることができ結果、発光ダイオードユニットに対して高い値の電流を流すことができLEDの発光輝度を高めることが可能となる。【選択図】図1A light-emitting diode unit and a lighting fixture with excellent heat dissipation are provided. A substrate printed with power supply wiring on the front surface is provided with a hole penetrating the substrate, a heat sink is provided on the back surface of the substrate, and a light emitting diode having a heat dissipation member on the bottom surface is inserted into the hole portion to dissipate heat. The member and the heat sink were joined by an adhesive member, and the electrode terminal of the light emitting diode and the power supply wiring on the substrate were electrically connected. Thereby, the heat dissipation of the heat generated from the LED can be improved, and as a result, a high value current can be passed through the light emitting diode unit, and the light emission luminance of the LED can be increased. [Selection] Figure 1
Description
本考案は、特に発光ダイオードより発生する熱の放熱性に優れた発光ダイオードユニット及び照明器具に関する。The present invention relates to a light emitting diode unit and a lighting fixture that are particularly excellent in heat dissipation of heat generated from the light emitting diode.
照明器具の光源として、高出力、高輝度型の発光ダイオードが用いられるようになっている。
高出力のLEDは、従来のLEDに比べ輝度が高く発熱量も大きい。
放熱対策を施す必要がある。As a light source of a lighting fixture, a high-output, high-luminance light-emitting diode is used.
High-power LEDs have higher brightness and higher heat generation than conventional LEDs.
It is necessary to take heat dissipation measures.
しかしながら従来の発光ダイオードユニットでは、ガラスエポキシや合成樹脂フィルム等の熱伝導性が低い材質により、形成されており効率よく放熱を行うことができない。However, the conventional light emitting diode unit is formed of a material having low thermal conductivity such as glass epoxy or synthetic resin film, and cannot efficiently dissipate heat.
本考案は表面に電源配線がプリントされた基板に、該基板を貫通する孔部を設け基板の裏面にヒートシンクを配設し、その底面に放熱部材を備える発光ダイオードを孔部に挿入し放熱部材とヒートシンクとを接合し、発光ダイオードの電極端子と基板上の電源配線とを電気的に接続。これにより発光ダイオードより生じる熱を効率よく放熱することができ、これにより上記課題を解決するものである。In the present invention, a board having a power wiring printed on the surface thereof is provided with a hole penetrating the board, a heat sink is provided on the back surface of the board, and a light emitting diode provided with a heat radiation member on the bottom surface is inserted into the hole part. And the heat sink are joined, and the electrode terminal of the light emitting diode and the power supply wiring on the substrate are electrically connected. Thereby, the heat generated from the light emitting diode can be efficiently radiated, thereby solving the above-mentioned problems.
本考案に至る3フォース発光ダイオード・ヒートシンクは、基板に孔部を設けLEDの放熱部材とヒートシンクとを直接接合。器具の筐体とヒートシンクとを当接させることにより照明器具全体で放熱することが、可能となり発光ダイオードに対し高値の電流を流すことができるようになり、照射輝度を高めることができ実用性に優れたものである。The three-force light-emitting diode / heatsink that leads to the present invention has a hole in the substrate and directly joins the heat dissipation member of the LED and the heatsink. By bringing the fixture housing and heat sink into contact with each other, it is possible to dissipate heat in the entire lighting fixture, allowing a high value current to flow to the light-emitting diode, increasing the illumination brightness and making it practical. It is excellent.
図1及び図2示すように101は発光ダイオードが実装されてる基板である。
本実施の形態1では基板101として、ガラスエポキシ製のものを使用している。
基板101の表面には薄膜銅などにより電源配線102がプリント形成されている。
103は発光ダイオード(LED)である図2に示すようにその底面に金属製の放熱部材103aを有する高出力タイプのものであり2本の電極端子103bを有している。As shown in FIGS. 1 and 2,
In the first embodiment, the
A
図3に示すように基板101の底面には、アルミやステンレス等の金属部材によりなるヒートシンク105が接合される。本実施の形態において、ヒートシンク105の形状は基板101と同一形状のものとし基板101の裏面前面に接合している。As shown in FIG. 3, a
上記工程により完成した本考案の3フォース発光ダイオード・ヒートシンクは、従来のLEDユニットよりも高いほう熱効果を得ることができる。したがって従来のLEDユニットより高い値の電流を流すことができるようになり、LED103の発光輝度を高めることが可能となった。The 3-force light-emitting diode heat sink of the present invention completed by the above process can obtain a higher heat effect than the conventional LED unit. Accordingly, a current having a higher value than that of the conventional LED unit can be passed, and the light emission luminance of the
100:LEDユニット 103a:放熱部材
101:基板 105:ヒートシンク
102:電源配線
103:LED
103b:電極端子
104:孔部100:
103b: Electrode terminal 104: Hole
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010006367U JP3164454U (en) | 2010-09-07 | 2010-09-07 | 3-force light-emitting diode heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010006367U JP3164454U (en) | 2010-09-07 | 2010-09-07 | 3-force light-emitting diode heat sink |
Publications (1)
Publication Number | Publication Date |
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JP3164454U true JP3164454U (en) | 2010-12-02 |
Family
ID=54875850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2010006367U Expired - Fee Related JP3164454U (en) | 2010-09-07 | 2010-09-07 | 3-force light-emitting diode heat sink |
Country Status (1)
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JP (1) | JP3164454U (en) |
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2010
- 2010-09-07 JP JP2010006367U patent/JP3164454U/en not_active Expired - Fee Related
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