JP3164454U - 3-force light-emitting diode heat sink - Google Patents

3-force light-emitting diode heat sink Download PDF

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JP3164454U
JP3164454U JP2010006367U JP2010006367U JP3164454U JP 3164454 U JP3164454 U JP 3164454U JP 2010006367 U JP2010006367 U JP 2010006367U JP 2010006367 U JP2010006367 U JP 2010006367U JP 3164454 U JP3164454 U JP 3164454U
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emitting diode
substrate
heat sink
light emitting
heat
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数章 上嶋
数章 上嶋
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工藤 唯男
工藤 唯男
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Abstract

【課題】放熱性の優れた発光ダイオードユニット及び照明器具を提供する。【解決手段】表面に電源配線プリントされた基板に該基板を貫通する孔部を設け前記基板の裏面にヒートシンクを配設しその底面に放熱部材を備える発光ダイオードを前記孔部に挿入し、放熱部材とヒートシンクとを粘着部材により接合し発光ダイオードの電極端子と基板上の電源配線とを電気的に接続した。これにより、ＬＥＤより発生する熱の放熱性を高めることができ結果、発光ダイオードユニットに対して高い値の電流を流すことができＬＥＤの発光輝度を高めることが可能となる。【選択図】図１A light-emitting diode unit and a lighting fixture with excellent heat dissipation are provided. A substrate printed with power supply wiring on the front surface is provided with a hole penetrating the substrate, a heat sink is provided on the back surface of the substrate, and a light emitting diode having a heat dissipation member on the bottom surface is inserted into the hole portion to dissipate heat. The member and the heat sink were joined by an adhesive member, and the electrode terminal of the light emitting diode and the power supply wiring on the substrate were electrically connected. Thereby, the heat dissipation of the heat generated from the LED can be improved, and as a result, a high value current can be passed through the light emitting diode unit, and the light emission luminance of the LED can be increased. [Selection] Figure 1

Description

本考案は、特に発光ダイオードより発生する熱の放熱性に優れた発光ダイオードユニット及び照明器具に関する。The present invention relates to a light emitting diode unit and a lighting fixture that are particularly excellent in heat dissipation of heat generated from the light emitting diode.

照明器具の光源として、高出力、高輝度型の発光ダイオードが用いられるようになっている。
高出力のＬＥＤは、従来のＬＥＤに比べ輝度が高く発熱量も大きい。
放熱対策を施す必要がある。As a light source of a lighting fixture, a high-output, high-luminance light-emitting diode is used.
High-power LEDs have higher brightness and higher heat generation than conventional LEDs.
It is necessary to take heat dissipation measures.

しかしながら従来の発光ダイオードユニットでは、ガラスエポキシや合成樹脂フィルム等の熱伝導性が低い材質により、形成されており効率よく放熱を行うことができない。However, the conventional light emitting diode unit is formed of a material having low thermal conductivity such as glass epoxy or synthetic resin film, and cannot efficiently dissipate heat.

本考案は表面に電源配線がプリントされた基板に、該基板を貫通する孔部を設け基板の裏面にヒートシンクを配設し、その底面に放熱部材を備える発光ダイオードを孔部に挿入し放熱部材とヒートシンクとを接合し、発光ダイオードの電極端子と基板上の電源配線とを電気的に接続。これにより発光ダイオードより生じる熱を効率よく放熱することができ、これにより上記課題を解決するものである。In the present invention, a board having a power wiring printed on the surface thereof is provided with a hole penetrating the board, a heat sink is provided on the back surface of the board, and a light emitting diode provided with a heat radiation member on the bottom surface is inserted into the hole part. And the heat sink are joined, and the electrode terminal of the light emitting diode and the power supply wiring on the substrate are electrically connected. Thereby, the heat generated from the light emitting diode can be efficiently radiated, thereby solving the above-mentioned problems.

本考案に至る３フォース発光ダイオード・ヒートシンクは、基板に孔部を設けＬＥＤの放熱部材とヒートシンクとを直接接合。器具の筐体とヒートシンクとを当接させることにより照明器具全体で放熱することが、可能となり発光ダイオードに対し高値の電流を流すことができるようになり、照射輝度を高めることができ実用性に優れたものである。The three-force light-emitting diode / heatsink that leads to the present invention has a hole in the substrate and directly joins the heat dissipation member of the LED and the heatsink. By bringing the fixture housing and heat sink into contact with each other, it is possible to dissipate heat in the entire lighting fixture, allowing a high value current to flow to the light-emitting diode, increasing the illumination brightness and making it practical. It is excellent.

本考案に至る発光ダイオードユニットの基板図Light-emitting diode unit board diagram leading to the present invention 本考案に至る放熱部材・ヒートシンクの一部を構成する正面図Front view of part of heat sink / heat sink leading to the present invention 本考案に至る放熱部材・ヒートシンクの一部を構成する断面図Cross-sectional view of a part of the heat dissipation member / heat sink leading to the present invention

図１及び図２示すように１０１は発光ダイオードが実装されてる基板である。
本実施の形態１では基板１０１として、ガラスエポキシ製のものを使用している。
基板１０１の表面には薄膜銅などにより電源配線１０２がプリント形成されている。
１０３は発光ダイオード（ＬＥＤ）である図２に示すようにその底面に金属製の放熱部材１０３ａを有する高出力タイプのものであり２本の電極端子１０３ｂを有している。As shown in FIGS. 1 and 2, reference numeral 101 denotes a substrate on which a light emitting diode is mounted.
In the first embodiment, the substrate 101 is made of glass epoxy.
A power supply wiring 102 is printed on the surface of the substrate 101 using thin film copper or the like.
Reference numeral 103 denotes a light emitting diode (LED) as shown in FIG. 2, which is a high output type having a metal heat dissipating member 103a on its bottom surface, and has two electrode terminals 103b.

図３に示すように基板１０１の底面には、アルミやステンレス等の金属部材によりなるヒートシンク１０５が接合される。本実施の形態において、ヒートシンク１０５の形状は基板１０１と同一形状のものとし基板１０１の裏面前面に接合している。As shown in FIG. 3, a heat sink 105 made of a metal member such as aluminum or stainless steel is joined to the bottom surface of the substrate 101. In this embodiment mode, the heat sink 105 has the same shape as the substrate 101 and is bonded to the front surface of the back surface of the substrate 101.

上記工程により完成した本考案の３フォース発光ダイオード・ヒートシンクは、従来のＬＥＤユニットよりも高いほう熱効果を得ることができる。したがって従来のＬＥＤユニットより高い値の電流を流すことができるようになり、ＬＥＤ１０３の発光輝度を高めることが可能となった。The 3-force light-emitting diode heat sink of the present invention completed by the above process can obtain a higher heat effect than the conventional LED unit. Accordingly, a current having a higher value than that of the conventional LED unit can be passed, and the light emission luminance of the LED 103 can be increased.

１００：ＬＥＤユニット １０３ａ：放熱部材
１０１：基板 １０５：ヒートシンク
１０２：電源配線
１０３：ＬＥＤ
１０３ｂ：電極端子
１０４：孔部100: LED unit 103a: heat dissipation member 101: substrate 105: heat sink 102: power supply wiring 103: LED
103b: Electrode terminal 104: Hole

Claims (1)

発光ダイオードを光源とする照明器具において、表面に電源配線がプリントされた基板に該基板を貫通する孔部が設けられ、前記基板の裏面にヒートシンクが配設されその底面に放熱部材を備える発光ダイオードが前記孔部に挿入され前記放熱部材とヒートシンクとが接合され、発光ダイオードの電極端子と基板上の電源配線とが電気的に接続されてなる発光ダイオードユニットを備える又発光ダイオードユニットは、交流電源にて駆動することを特徴とする照明器具。In a lighting fixture using a light emitting diode as a light source, a light emitting diode provided with a hole penetrating the substrate on a substrate printed with power supply wiring on the surface, a heat sink disposed on the back surface of the substrate, and a heat dissipation member on the bottom surface Is inserted into the hole, the heat dissipation member and the heat sink are joined, and the electrode terminal of the light emitting diode and the power supply wiring on the substrate are electrically connected. It is driven by, and the lighting fixture characterized by the above-mentioned.
JP2010006367U 2010-09-07 2010-09-07 3-force light-emitting diode heat sink Expired - Fee Related JP3164454U (en)

Priority Applications (1)

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