TWM603619U - Continuous vacuum heating equipment - Google Patents

Abstract

A continuous vacuum heating equipment suitable for heat treatment of circuit boards. The continuous vacuum heating equipment includes a feed cabin, a vacuum heating cabin, and a discharge cabin. The vacuum heating chamber includes at least two heating sections with different temperatures. The feeding chamber will allow the circuit board to be moved in from the outside under ambient pressure, and transfer the circuit board to the vacuum heating chamber under vacuum pressure. The vacuum heating chamber will sequentially perform the heat treatment of the circuit board in the heating sections under vacuum pressure. The discharge chamber will allow the circuit board to be moved in from the vacuum heating chamber under vacuum pressure, and move the circuit board out to the outside under ambient pressure. With the heating sections that have different temperatures and can heat the circuit board back and forth, the purpose of reducing the heat treatment process time of the circuit board and continuous multi-batch production can be achieved.

Description

Continuous vacuum heating equipment

This model relates to a vacuum heating equipment, in particular to a continuous vacuum heating equipment suitable for heat treatment of circuit boards.

With the advent of the 5G era, in order to cope with the need for greater and faster computing and processing power in electronic communication products, the circuit patterns made with metal wires on the motherboard of electronic communication products have to shrink in diameter. Therefore, for metal wires The requirements for the conductivity per unit area have also increased. However, in the heating process of the existing circuit board in the heat treatment process, the metal wire will oxidize with oxygen at a high temperature, resulting in a decrease in the conductivity per unit area of the metal wire. In addition, the existing heat treatment process of the circuit board includes a multi-stage heating process and a cooling process. The multi-stage heating process is to put a batch of circuit boards into the heating device according to the process requirements and sequentially change the temperature in the heating device to perform multi-stage heating. When switching each section of heating parameters, it is necessary to wait for the temperature in the heating equipment to increase or decrease, which leads to a longer process time. The cooling process is after the multi-stage heating process, and it is necessary to wait for the temperature of this batch of circuit boards to return to room temperature in the heating device to take out the circuit boards that have been baked. The multi-stage heating process starts at the same time as the circuit board is undergoing the cooling process. Such a non-continuous single batch production results in the production efficiency cannot be improved.

Therefore, the purpose of the present invention is to provide a circuit board that can be used in a vacuum environment. Heat treatment, continuous multi-batch production of circuit boards, and continuous vacuum heating equipment that reduces the heat treatment process time.

Therefore, the new continuous vacuum heating equipment is suitable for heat treatment of at least one circuit board. The continuous vacuum heating equipment includes a feed cabin, a vacuum heating cabin, and a discharge cabin. The feed compartment is suitable for moving the circuit board into it from the outside, and can controlly adjust the internal pressure value. The vacuum heating cabin is connected to the feeding cabin and allows the circuit board in the feeding cabin to be transferred inside. The vacuum heating cabin can be controlled to adjust the internal pressure value, and the vacuum heating cabin includes at least two heating sections with different temperatures. The discharging chamber is connected to the vacuum heating chamber and allows the circuit board in the vacuum heating chamber to be transferred inside. The discharge chamber can be controlled to adjust the internal pressure value. Wherein, the feeding chamber will allow the circuit board to be moved in from the outside under ambient pressure, and the circuit board will be transferred to the vacuum heating chamber under vacuum pressure. The vacuum heating chamber will sequentially perform the heat treatment of the circuit board in the heating sections under vacuum pressure. The discharge chamber will allow the circuit board to be moved in from the vacuum heating chamber under vacuum pressure, and move the circuit board out to the outside under ambient pressure.

In some embodiments, the discharge chamber includes a discharge chamber body and an air inlet device connected to the discharge chamber body. The air inlet device is used to pass inactive gas to the discharge chamber.

In some embodiments, the air inlet device is a nitrogen generator for injecting nitrogen into the discharge chamber.

In some embodiments, the continuous vacuum heating device further includes a conveying system. The conveying system includes at least one conveyor module. The conveyor module has several conveyors. The conveyors are suitable for carrying and transporting the circuit board so that the circuit board moves along a conveying direction. The conveyors are respectively arranged in the feed compartment, the vacuum heating compartment and the discharge compartment. The output set in the feed compartment The conveyor can transfer the circuit board along the conveying direction to the conveyor arranged in the vacuum heating chamber. The conveyor arranged in the vacuum heating cabin can transfer the circuit board to the conveyor arranged in the discharge cabin along the conveying direction.

In some embodiments, the continuous vacuum heating device further includes a feed temporary storage area adjacent to the feed compartment, and a discharge temporary storage area adjacent to the discharge compartment. The conveyors are also respectively arranged in the input temporary storage area and the discharge temporary storage area. The position of the conveyor set in the feed temporary storage area corresponds to the position of the conveyor set in the feed compartment, so that the circuit board of the conveyor carried in the feed temporary storage area can move along the conveyor The direction is transferred to the conveyor arranged in the feeding cabin. The position of the conveyor set in the discharge temporary storage area corresponds to the position of the conveyor set in the discharge compartment, so that the conveyor set in the discharge temporary storage area can take over from the discharge compartment The circuit board transferred by the conveyor inside.

In some embodiments, the delivery system further includes at least one frame. The frame is in the shape of an upright plate, is suitable for carrying the circuit board, and can be detachably connected to the conveyor module. The frame has an upright frame body, a first board surface and a second board surface formed on two opposite sides of the frame body, and at least one board opening that penetrates the first board surface and the second board surface, And at least one clamping component connected to the frame body and adjacent to the plate opening. The clamping assembly is suitable for fixing the circuit board to the board mounting opening. The number of clamping components corresponds to the number of plate openings. Wherein, when the frame is suitable for carrying the circuit board for heat treatment in the vacuum heating chamber, the vacuum heating chamber can heat the two opposite sides of the circuit board through the board opening.

In some embodiments, the conveying system further includes a feeding robot arm arranged in the feeding temporary storage area and adjacent to the conveyor arranged in the feeding temporary storage area, and a feeding robot arm arranged in the output temporary storage area Area And adjacent to the discharging mechanical arm of the conveyor arranged in the discharging temporary storage area. The feeding robot arm is used to load the circuit board on the frame. The discharging robot arm is used to remove the circuit board from the frame.

In some embodiments, each conveyor has a bottom rail, a top rail, and a conveyor belt that can pivot along a loop path. The bottom rail has a bottom rail body, a bottom groove extending downward from the top surface of the bottom rail body and penetrating two opposite sides of the bottom rail body, and at least one pivotable and connected to the top surface of the bottom rail body Bottom idler group. The bottom idler set is used to rotatably clamp the bottom of the frame, and has a first bottom idler and a second bottom idler located on two opposite sides of the slot of the bottom groove. The first bottom idler and the second bottom idler are spaced apart from each other, and the spacing distance between the first bottom idler and the second bottom idler is greater than the thickness of the frame but less than the groove diameter of the bottom groove. The top rail has a top rail body, a top groove extending upward from the bottom surface of the top rail body and penetrating two opposite sides of the top rail body, and at least one pivotable top idler connected to the bottom surface of the top rail body Round Group. The top idler set is used to rotatably fix the top of the frame, and has a first top idler and a second top idler located on two opposite sides of the slot of the top slot. The first top idler and the second top idler are spaced apart from each other, and the spacing distance between the first top idler and the second top idler is greater than the thickness of the frame but less than the groove diameter of the top groove. The bottom groove and the top groove are suitable for being movably inserted into the bottom and top of the upright frame, so that the frame can be detachably connected to the bottom rail and the top rail. The bottom idler group and the top idler group can keep the frame upright when moving along the conveying direction. The conveyor belt extends along the bottom groove and is used to support the frame, and can drive the frame to move along the conveying direction. The height of the top surface of the conveyor belt relative to the ground is smaller than the height of the top idler relative to the ground, so that the frame can be more stably connected to the bottom rail.

In some embodiments, the vacuum heating chamber further includes at least two heating devices. The heating devices are respectively located in the heating section. Each heating device has two upright heating plates. The heating plates are respectively located on two opposite sides of the conveyor of the vacuum heating chamber and spaced apart from each other. When the frame is suitable for carrying the circuit board for heat treatment in the vacuum heating chamber along the conveying direction, the heating plates can heat the two opposite sides of the circuit board simultaneously through the plate setting opening.

Another object of the present invention is to provide a continuous vacuum heating device such as the foregoing that enables circuit boards to be heat-treated in a vacuum environment, and can continuously produce circuit boards in multiple batches, and reduces the heat treatment process time, while reducing Equipment manufacturing cost of continuous vacuum heating equipment.

Therefore, the new continuous vacuum heating equipment is suitable for heat treatment of at least one circuit board. The continuous vacuum heating equipment includes the aforementioned feed compartment, the aforementioned vacuum heating compartment, and the aforementioned discharge compartment. Wherein, the vacuum heating chamber will sequentially reciprocate heat treatment of the circuit board in the heating sections under vacuum pressure.

The effect of the present invention is that the internal pressure value of the vacuum heating chamber can be controlled to adjust to the vacuum pressure, so that the circuit board can achieve the purpose of heat treatment in a vacuum environment. In addition, because the vacuum heating chamber has at least two heating sections with different temperatures, the circuit board can be continuously produced in a multi-stage heating process without waiting for the temperature of the heating device to change, thereby reducing the heat treatment process time the goal of. In addition, one batch of the multiple batches of circuit boards is transferred to the vacuum heating chamber under vacuum pressure, and heat treatment is performed in sequence, and at the same time, another batch of the multiple batches of circuit boards is moved into the discharge chamber and placed in the discharge chamber. Cooling enables the circuit boards of different batches to undergo a multi-stage heating process and a cooling process at the same time, so as to achieve the purpose of continuously producing the circuit boards in multiple batches in the heat treatment process of the circuit boards. Worth mentioning Yes, when the circuit boards can be sequentially reciprocated for heat treatment in the heating sections of the vacuum heating chamber, the number of the heating sections of the vacuum heating chamber can be only two, and the circuit boards can be The continuous production method performs multi-stage heating, thereby reducing the number of heating stages required, and achieving the goal of reducing the manufacturing cost of the equipment.

1: feed compartment

2: Vacuum heating chamber

21, 21a, 21b, 21c, 21d, 21e: heating section

22: heating device

221: heating plate

3: discharge compartment

31: Discharge cabin

32: intake device

4: Conveying system

41: Conveyor Module

42: Conveyor

43: bottom rail

431: bottom rail body

432: bottom slot

433: bottom idler group

434: First bottom idler

435: second bottom idler

44: top rail

441: Top rail body

442: top slot

443: Top idler group

444: The first top idler

445: second top idler

45: Conveyor belt

46, 46a, 46b, 46c, 46d, 46e, 46f: frame

461: Frame Body

462: first board

463: second board

464: set board mouth

465: clamping assembly

466: clamp

47: Feeding robotic arm

48: Discharge robotic arm

5: Feeding temporary storage area

6: Discharge temporary storage area

71: Control System

72: Vacuum pump

9: Circuit board

X: Conveying direction

The other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Fig. 1 is a perspective view illustrating the relationship between an embodiment of the present invention continuous vacuum heating device and several circuit boards; Figure 2 is a front view illustrating the relationship between the embodiment and the circuit boards; Figure 3 is an incomplete three-dimensional view illustrating a vacuum heating chamber, a discharge chamber, a conveying system and a discharge of the embodiment The relationship between the temporary storage area and the circuit boards; Figure 4 is a cross-sectional view along the line VV in Figure 2, illustrating the relationship between the vacuum heating chamber and the two conveyors of the conveying system; Figure 5 is a diagram along the line VV in Figure 2 A cross-sectional view along the line IV-IV to illustrate the relationship between the vacuum heating chamber and the conveyors; and Figure 6 is a cross-sectional view along the line VI-VI in Figure 2 to illustrate the vacuum heating chamber, the conveyors and the The relationship between the two frames of the conveying system.

Refer to Figures 1 to 3, which are an embodiment of the novel continuous vacuum heating equipment. That continuous The vacuum heating equipment is suitable for heat treatment of at least one circuit board 9. The circuit board 9 can be a single-sided or double-sided coated circuit layer. In this embodiment, the number of the circuit board 9 is an example of multiple pieces, to express that the circuit board 9 can be heated in batches. However, the number of the circuit board 9 can also be only one piece, and is not limited to a specific number. The continuous vacuum heating equipment includes a feed compartment 1, a vacuum heating compartment 2, a discharge compartment 3, a conveying system 4, a feed temporary storage area 5 and a discharge temporary storage area 6.

The feed compartment 1 is suitable for moving the circuit boards 9 into it from the outside, and can control the internal pressure value. The vacuum heating cabin 2 is connected to the feeding cabin 1 and allows the circuit boards 9 in the feeding cabin 1 to be transferred inside. The vacuum heating cabin 2 can be controlled to adjust the internal pressure value, and the vacuum heating cabin 2 includes at least two heating sections 21 with different temperatures and at least two heating devices 22. The heating devices 22 are located in the heating sections 21 respectively. Each heating device 22 has two vertical heating plates 221. The heating plates 221 are spaced apart from each other. In this embodiment, the number of the heating sections 21 is five examples, so that the circuit boards 9 can perform the heat treatment process under up to five heating conditions. However, the number of the heating sections 21 can also be two, three, four or more than six, which can also enable the circuit boards 9 to perform a heat treatment process through at least two different heating conditions. Is limited. More specifically, in this embodiment, each heating section 21 is provided with two heating devices 22, the number of the heating devices 22 of the vacuum heating chamber 2 corresponds to ten of the five heating sections 21, and the heating The number of plates 221 corresponds to ten heating devices 22 and twenty. In this way, the temperature in the heating sections 21 can be made more uniform. However, each heating section 21 can also be provided with only one heating device 22, or each heating section 21 can be provided with more than three heating devices 22; each heating device 22 can also have only one heating plate 221, or each The heating device 22 may have three or more heating plates 221. The number of the heating devices 22 and the number of the heating plates 221 are not specific Is limited. In this embodiment, the heating devices 22 are infrared heaters, so that when the vacuum heating chamber 2 heats the circuit boards 9 in a vacuum environment, the heating devices 22 can heat the circuits through thermal radiation. The plate 9 makes it easier to control the temperature of the vacuum heating chamber 2. However, the types of the heating devices 22 are not limited to infrared heaters.

The discharge chamber 3 is connected to the vacuum heating chamber 2 and allows the circuit boards 9 in the vacuum heating chamber 2 to be transferred inside. The discharge compartment 3 can be controlled to adjust the internal pressure value, and includes a discharge compartment body 31 and an air inlet device 32 communicating with the discharge compartment body 31. The air inlet device 32 is used to pass inert gas into the discharge chamber body 31. The inert gas can be an inert gas (such as helium, neon, etc.), nitrogen, and other gases that are not easily oxidized with metals. In this embodiment, the air intake device 32 is a nitrogen generator, which is used to inject nitrogen into the discharge chamber 31. Especially when the nitrogen source of the air intake device 32 is liquid nitrogen, the low-temperature nitrogen gas volatilized from the liquid nitrogen can cool the circuit boards 9. However, the air inlet device 32 can be omitted, and the pressure and temperature in the discharge chamber 3 can be balanced with the outside through the air inlet valve, and the nitrogen generator is not limited.

The feed temporary storage area 5 is adjacent to the feed compartment 1 and the discharge temporary storage area 6 is adjacent to the discharge compartment 3, both of which can be used to temporarily place the circuit boards 9 to be processed and processed. Wherein, the feed compartment 1 will allow the circuit boards 9 to be moved in from the outside under ambient pressure, that is, the circuit boards 9 will be moved in from the feed temporary storage area 5, and the circuit boards will be moved in under vacuum pressure. 9 is transferred to the vacuum heating chamber 2; the vacuum heating chamber 2 will sequentially perform the heat treatment of the circuit boards 9 in the heating sections 21 under vacuum pressure; the discharge chamber 3 will supply the circuit boards 9 under vacuum pressure The circuit boards 9 are moved in from the vacuum heating chamber 2, and the circuit boards 9 are moved out to the external discharge temporary storage area 6 under ambient pressure. Accordingly, the continuous vacuum heating equipment can be based on The process conditions are set to perform the vacuum heat treatment process of the circuit boards 9.

Referring to FIG. 1, in this embodiment, the continuous vacuum heating device further includes a control system 71. The control system 71 is electrically connected to the conveying system 4, and the control system 71 can control the conveying system 4 so that the circuit boards 9 carried on the conveying system 4 pass through the feeding temporary storage area 5 sequentially The feeding cabin 1, the vacuum heating cabin 2 and the discharging cabin 3 to the discharging temporary storage area 6. The feed compartment 1, the vacuum heating compartment 2 and the discharge compartment 3 are respectively connected with three vacuum pumps 72. The vacuum pumps 72 are respectively electrically connected to the control system 71, so that the control system 71 can control the operation of the vacuum pumps 72 respectively, and then adjust the feed compartment 1, the vacuum heating compartment 2 and the discharge compartment 3 The internal pressure value.

In other embodiments (not shown), the heating sections 21 of the vacuum heating chamber 2 are closed systems that can be opened and closed with each other. Specifically, a plurality of heating sections 21 are provided in the vacuum heating chamber 2. The opened and closed vacuum isolation door divides the heating sections 21 into independent spaces by the vacuum isolation door, so that when the circuit boards 9 are heat-treated under different heating conditions, the temperatures of the heating sections 21 are mutually different. Do not affect each other. In other embodiments (not shown), the heating sections 21 are closed systems that can be opened and closed with each other, and the heating sections 21 are connected to a plurality of vacuum pumps 72 respectively. The number of the vacuum pumps 72 is the same as the number of the heating sections 21. In this way, when the heating sections 21 can be closed, the control system 71 can adjust the internal pressure values of the heating sections 21 respectively.

Referring to FIGS. 1 to 3, the conveying system 4 includes at least one conveyor module 41, a plurality of frames 46, a feeding robotic arm 47 and a discharging robotic arm 48. The conveyor module 41 is suitable for carrying and transporting the circuit boards 9 so that the circuit boards 9 move along a conveying direction X. The conveyor module 41 has several conveyors 42. The conveyors 42 are respectively arranged in the feeding temporary storage area 5, the feeding cabin 1, and the vacuum Conveyors 42 located in different positions in the heating cabin 2, the discharging cabin 3, and the discharging temporary storage area 6 are separated by vacuum isolation doors. The feeding robot arm 47 is arranged in the feeding temporary storage area 5 and adjacent to the conveyor 42 arranged in the feeding temporary storage area 5, and is used to sequentially load the circuit boards 9 on the frame 46. The discharging robot arm 48 is disposed in the discharging temporary storage area 6 and adjacent to the conveyor 42 disposed in the discharging temporary storage area 6, and is used to remove the circuit boards 9 from the frame 46. Each conveyor 42 is suitable for carrying and transporting at least one frame 46. Each frame 46 is suitable for carrying the circuit boards 9. In this embodiment, the number of the conveyor modules 41 is an example of two groups; the number of the conveyors 42 corresponds to the temporary storage area 5, the feed compartment 1, and the vacuum heating compartment 2. Wait for the total number of the heating section 21, the discharging chamber 3 and the discharging temporary storage area 6 to take eighteen examples; the number of the frames 46 carried by each conveyor module 41 corresponds to that in the heat treatment process The three processes are the feeding process, the multi-stage heating process and the discharging process. Three examples are given. That is to say, the two sets of conveyor modules 41 in this embodiment carry a total of six frames 46. More specifically, in this embodiment, two sets of conveyor modules 41 are included. Therefore, in the feeding temporary storage area 5, the feeding cabin 1, the vacuum heating cabin 2, and the discharging cabin 3 The two frames 46 carrying the circuit boards 9 can be simultaneously placed in the discharging temporary storage area 6, so that the circuit boards 9 are in the feeding process, decompression process, multi-stage heating process, cooling and repressing process and In the discharging process, the heat treatment process can be performed with twice the capacity to achieve the purpose of multi-batch production. However, the number of the conveyor modules 41 can also be one group or more than three groups, depending on the volume of the equipment or the capacity requirements, and is not limited to a specific number.

Referring to Figures 1, 3 and 6, in addition, each conveyor module 41 in this embodiment carries three frames 46, which means that the circuit boards 9 can be divided into three batches, and the three batches of circuit boards 9 are in In the feeding process, multi-stage heating process and discharging process at the same time, this can reduce the entire heat treatment process The required process time, and achieve the purpose of continuous production. However, the number of frames 46 carried by each conveyor module 41 can also be one, two, four, or more than five, but it cannot exceed the total number of the conveyors 42 of each conveyor module 41. In this way, the process time can also be reduced, and the goal of continuous production can be achieved, which is not limited. In other embodiments (not shown in the figure), only one of the conveyors 42 may be extended in the five heating sections 21 of the vacuum heating chamber 2, which means that the heating sections 21 are not subjected to The vacuum isolation door is divided into multiple independent spaces. In addition, two, three, four, or more than six of the conveyors 42 may be respectively arranged in the five heating sections 21 of the vacuum heating chamber 2. The arrangement of the conveyors 42 The method is not limited to this, and only needs to achieve the purpose of being able to transfer the circuit boards 9 without affecting the adjustment of the internal pressure value of the vacuum heating chamber 2.

3-6, each conveyor 42 has a bottom rail 43, a top rail 44, and a conveyor belt 45 that can pivot along a loop path (not shown). The bottom rail 43 has a bottom rail body 431, a bottom groove 432 extending downward from the top surface of the bottom rail body 431 and penetrating two opposite sides of the bottom rail body 431, and an array connected to the top surface of the bottom rail body 431 And a pivotable bottom idler group 433. Each bottom idler set 433 is used to rotatably fix the bottom of the frame 46, and has a first bottom idler 434 and a second bottom idler 435 located on opposite sides of the slot of the bottom groove 432 . The first bottom idler 434 and the second bottom idler 435 are spaced apart from each other, and the distance between the first bottom idler 434 and the second bottom idler 435 is greater than the thickness of the frame 46 but less than the bottom groove 432 The groove diameter. The top rail 44 has a top rail body 441, a top groove 442 extending upward from the bottom surface of the top rail body 441 and penetrating two opposite sides of the top rail body 441, and an array connected to the bottom surface of the top rail body 441. Pivoting top idler group 443. Each top idler set 443 is used to rotatably fix the top of the frame 46, and has There are a first top idler 444 and a second top idler 445 on opposite sides of the slot of the top groove 442. The first top idler 444 and the second top idler 445 are spaced apart from each other, and the distance between the first top idler 444 and the second top idler 445 is greater than the thickness of the frame 46 but smaller than the top groove 442 The groove diameter. The bottom groove 432 and the top groove 442 are adapted to be movably inserted into the bottom and top of the vertical frame 46, so that the frame 46 is detachably connected to the bottom rail 43 and the top rail 44. The bottom idler set 433 and the top idler set 443 can keep the frame 46 upright when moving along the conveying direction X. The conveyor belt 45 extends along the bottom groove 432 and is used to support the frame 46 and can drive the frame 46 to move along the conveying direction X. The height of the top surface of the conveyor belt 45 relative to the ground is less than the height of the top idler relative to the ground, so that the frame 46 can be more firmly connected to the bottom rail 43. In this embodiment, the number of the bottom idler sets 433 and the number of the top idler sets 443 can also be only one respectively, which can also achieve the purpose of rotatably securing the frame 46 and reduce equipment cost.

As shown in FIGS. 1 to 6, the frames 46 are suitable for carrying the circuit boards 9 and are respectively carried on the conveyor modules 41 detachably. In this embodiment, the frames 46 run to the conveyors 42 in the feed temporary storage area 5, the vacuum heating chamber 2 and the discharge temporary storage area 6, respectively. Each frame 46 is in the shape of an upright plate and has an upright frame body 461, a first plate surface 462 and a second plate surface 463 formed on two opposite sides of the frame body 461, at least one penetrating through the first plate The surface 462 and the board placement opening 464 of the second board surface 463 and at least one clamping assembly 465 connected to the frame body 461 and adjacent to the board placement opening 464. In this embodiment, the number of the plate setting openings 464 is multiple, and the number of the clamping assembly 465 corresponds to the number of the plate setting openings 464 is also multiple. Each clamping assembly 465 is suitable for fixing any one of the circuit boards 9 to the board placement opening 464. In this embodiment, each clamping assembly 465 has two clamping members 466. The clamping members 466 are spaced apart from each other and connected to the first board surface 462 of the frame 46, and are located above the corresponding board placement opening 464, so that the circuit board 9 can be hung upright on the frame 46, and avoid The circuit board 9 is bent during the operation of the frame 46, and the circuit pattern on the circuit board 9 is damaged. The clamping members 466 can also be connected to the second plate surface 463 of the frame 46, but not limited to this. When the frame 46 carries a plurality of circuit boards 9 hanging upright and runs through one of the heating devices 22 of the heating sections 21, the heating plates 221 of the heating device 22 are respectively located on the heating section 21 The two opposite sides of the conveyor 42 are spaced apart from each other. Since the circuit boards 9 are respectively arranged in the board placement openings 464, the heating plates 221 of the heating device 22 can simultaneously and directly heat the two opposite sides of the circuit boards 9, so that the circuit boards 9 Both double-sided coatings can be heated and baked at the same time to avoid uneven heating and shorten the process time. However, depending on considerations such as the size of the circuit board 9 and the manufacturing process requirements, the number of the board placement openings 464 and the number of the clamping components 465 can also be one, and the number of the clamping members 466 can also be one or More than three, not limited to this.

1 to 6, in order to facilitate the description and simplify the description, the frames 46 are divided into the first frame 46a, the second frame 46b, the third frame 46c, the fourth frame 46d, the fifth frame 46e, and the sixth frame 46f. Example: The heating sections 21 are sequentially exemplified by the first heating section 21a, the second heating section 21b, the third heating section 21c, the fourth heating section 21d and the fifth heating section 21e. When this embodiment is running, the following steps are performed in sequence.

The first step: the feeding robot arm 47 first loads the circuit boards 9 on the first frame 46a and the second frame 46b arranged in the feeding temporary storage area 5 in sequence. When the loading of the first frame 46a and the second frame 46b is completed, the conveyors 42 arranged in the feeding temporary storage area 5 start to operate, and will be arranged at the feeding The first frame 46a and the second frame 46b of the temporary storage area 5 are respectively transferred to the conveyors 42 of the feeding cabin 1.

The second step: the feed compartment 1 is closed, and the vacuum pumps 72 connecting the feed compartment 1 and the vacuum heating compartment 2 are activated through the control system 71, so that the pressure value in the vacuum heating compartment 2 is maintained at 20 Torr, and the pressure value in the feed compartment 1 is reduced from 760 Torr to 20 Torr. When the pressure value in the feed compartment 1 and the pressure value in the vacuum heating compartment 2 are both 20 Torr, the conveyors 42 installed in the feed compartment 1 are running and will be installed in the first of the feed compartment 1. The frame 46a and the second frame 46b are transferred to the conveyors 42 of the vacuum heating chamber 2 respectively.

The third step: the vacuum heating chamber 2 is closed, and the vacuum pumps 72 connecting the vacuum heating chamber 2 and the discharge chamber 3 are activated through the control system 71, so that the vacuum heating chamber 2 and the discharge chamber 3 The internal pressure values are maintained at 20 Torr. At the same time, the temperature in the vacuum heating chamber 2 is adjusted so that the temperature of the first heating section 21a is 100 degrees Celsius, the temperature of the second heating section 21b is 150 degrees Celsius, and the temperature of the third heating section 21c is 200 degrees Celsius. The temperature of the fourth heating section 21d is 275 degrees Celsius and the temperature of the fifth heating section 21e is 250 degrees Celsius. The conveyors 42 of the vacuum heating chamber 2 carry the first frame 46a and the second frame 46b in the conveying direction X through the first heating section 21a, the second heating section 21b, the third heating section 21c, and the fourth heating section in sequence. The section 21d and the fifth heating section 21e are heat-treated. At this time, the third frame 46c and the fourth frame 46d perform actions similar to the first frame 46a and the second frame 46b in the first step. The feeding robot arm 47 sequentially loads the circuit boards 9 on the third frame 46c and the fourth frame 46d arranged in the feeding temporary storage area 5. Then, the first frame 46a and the second frame 46b are transferred to the conveyors 42 of the discharge compartment 3, respectively. At the same time, the third frame 46c and the fourth frame 46d arranged in the feeding temporary storage area 5 are respectively transferred to the conveyors 42 of the feeding cabin 1.

Fourth step: increase the pressure value in the discharge chamber 3 from 20 Torr to 760 Torr through the air inlet device 32, and the temperature of the circuit boards 9 loaded on the first frame 46a and the second frame 46b drop to room temperature . Then, the first frame 46a and the second frame 46b are transferred to the conveyors 42 of the temporary storage area 6 respectively. At this time, the third frame 46c and the fourth frame 46d perform actions similar to the first frame 46a and the second frame 46b in the second step, and are transferred to the conveyors 42 of the vacuum heating chamber 2 respectively.

Fifth step: the discharging robot arm 48 sequentially removes the circuit boards 9 from the first frame 46a and the second frame 46b of the discharging temporary storage area 6. At this time, the third frame 46c and the fourth frame 46d perform actions similar to the first frame 46a and the second frame 46b in the third step, and the fifth frame 46e and the sixth frame 46f perform the first step similar to the first step. Action of the frame 46a and the second frame 46b.

In this way, at least three batches of the circuit boards 9 carried on the frames 46 can be respectively subjected to different heat treatment steps to achieve the purpose of continuous batch production.

1 to 6, in the foregoing description, the vacuum heating chamber 2 and the conveying system 4 are implemented in a configuration corresponding to five heating sections 21, and the circuit boards 9 pass through the first heating section in sequence 21a, the second heating section 21b, the third heating section 21c, the fourth heating section 21d and the fifth heating section 21e are heat treated. However, in different embodiments, the circuit boards 9 can also be reciprocally heat treated in different heating sections 21, for example, only the first heating section 21a and the second heating section 21b are provided, and the third heating section 21c is omitted. , The fourth heating section 21d and the fifth heating section 21e, at the same time, the heating devices 22 and the conveyors 42 are only installed in the first heating section 21a and the second heating section 21b, and correspondingly installed in the third heating section are omitted The heating devices 22 and the conveyors 42 of the section 21c, the fourth heating section 21d and the fifth heating section 21e, so that the second heating section 21b will directly connect the discharge chamber 3, and the circuit boards 9 are based on Order first The heating section 21a, the second heating section 21b, the first heating section 21a, the second heating section 21b,... Are repeatedly heat-treated until the heating is completed and transferred to the discharge chamber 3.

The following specifically describes the operation steps in which the third heating section 21c, the fourth heating section 21d, and the fifth heating section 21e are omitted. The first step, second step, fourth step, and fifth step of this implementation aspect are all the same as the implementation aspect of setting five heating sections 21 in the foregoing description, but the third step is different in implementation: The temperature in the vacuum heating chamber 2 is adjusted so that the temperature of the first heating section 21a is 100 degrees Celsius and the temperature of the second heating section 21b is 150 degrees Celsius. At this time, the conveyors 42 of the vacuum heating chamber 2 carry The first frame 46a and the second frame 46b pass through the first heating section 21a and the second heating section 21b sequentially along the conveying direction X. When the first frame 46a and the second frame 46b run to the second heating section 21, the first heating The temperature control of section 21a is 200 degrees Celsius. Then, the first frame 46a and the second frame 46b travel along the direction opposite to the conveying direction X to the first heating section 21a. At this time, the temperature of the second heating section 21b is adjusted to 275 degrees Celsius. Then, the first frame 46a and the second frame 46b travel along the conveying direction X to the second heating section 21b. At this time, the temperature of the first heating section 21a is adjusted to 250 degrees Celsius. Finally, the first frame 46a and the second frame 46b travel in the opposite direction of the conveying direction X to the first heating section 21a. At this time, the temperature of the second heating section 21b is also adjusted to 250 degrees Celsius, and after the heating is completed, The first frame 46a and the second frame 46b are transferred to the conveyors 42 of the discharge compartment 3 along the conveying direction X, respectively.

In this way, at least three batches of the circuit boards 9 carried on the frames 46 can be heat treated with at least five different process temperatures with less than five heating sections 21 to achieve the purpose of continuous multi-batch production.

In summary, the vacuum heating chamber 2 can be used to controlly adjust the internal pressure to the vacuum pressure The circuit board 9 can achieve the purpose of heat treatment in a vacuum environment. In addition, because the vacuum heating chamber 2 has at least two heating sections 21 with different temperatures, the circuit board 9 can be continuously produced in a multi-stage heating process without waiting for the temperature of the heating device to change, thereby reducing The purpose of the heat treatment process time. In addition, one batch of the multiple batches of circuit boards 9 is transferred to the vacuum heating chamber 2 under vacuum pressure, and heat treatment is sequentially performed, and at the same time, another batch of the multiple batches of circuit boards 9 is moved into the discharge The cabin 3 is placed to cool, so that different batches of circuit boards 9 can simultaneously perform a multi-stage heating process and a cooling process, achieving the purpose of continuously producing the circuit boards 9 in multiple batches during the heat treatment process of the circuit boards 9. It is worth mentioning that when the circuit boards 9 can be sequentially reciprocated for heat treatment in the heating sections 21 of the vacuum heating chamber 2, the number of the heating sections 21 of the vacuum heating chamber 2 can only be two. In this way, the circuit boards 9 can be heated in multiple stages in a continuous production manner, thereby reducing the number of heating sections 21 required, and achieving the goal of reducing the manufacturing cost of the equipment, so it can indeed achieve the goal of new cost.

However, the above are only examples of the present model. When the scope of implementation of the present model cannot be limited by this, all simple equivalent changes and modifications made in accordance with the patent scope of the present model application and the contents of the patent specification still belong to This new patent covers the scope.

1: feed compartment

2: Vacuum heating chamber

21a, 21b, 21c, 21d, 21e: heating section

22: heating device

3: discharge compartment

31: Discharge cabin

32: intake device

4: Conveying system

41: Conveyor Module

42: Conveyor

43: bottom rail

44: top rail

46a, 46b, 46e, 46f: frame

47: Feeding robotic arm

48: Discharge robotic arm

5: Feeding temporary storage area

6: Discharge temporary storage area

71: Control System

72: Vacuum pump

9: Circuit board

X: Conveying direction

Claims (10)

A continuous vacuum heating device is suitable for heat treatment of at least one circuit board, the continuous vacuum heating device includes: a feed compartment, suitable for moving the circuit board into it from the outside, and capable of controlling the internal pressure value; A vacuum heating chamber connected to the feeding chamber and allowing the circuit board in the feeding chamber to be transferred inside, the vacuum heating chamber can be controlled to adjust the internal pressure value, and the vacuum heating chamber includes at least two temperatures Different heating sections; and a discharging chamber connected to the vacuum heating chamber and allowing the circuit board in the vacuum heating chamber to be transferred inside, the discharge chamber can be controlled to adjust the internal pressure value, wherein the The feeding chamber will allow the circuit board to be moved in from the outside under ambient pressure, and transfer the circuit board to the vacuum heating chamber under vacuum pressure; the vacuum heating chamber will proceed in the heating sections under vacuum pressure in sequence Heat treatment of the circuit board; the discharge chamber will allow the circuit board to be moved in from the vacuum heating chamber under vacuum pressure, and move the circuit board out to the outside under ambient pressure. The continuous vacuum heating device according to claim 1, wherein the discharge chamber includes a discharge chamber body and an air inlet device connected to the discharge chamber body, and the air inlet device is used to feed the discharge chamber body Pass in inert gas. The continuous vacuum heating device according to claim 2, wherein the air inlet device is a nitrogen generator for injecting nitrogen into the discharge chamber. The continuous vacuum heating equipment according to claim 1, further comprising a conveying system, the conveying system includes at least one conveyor module, the conveyor module has a plurality of conveyors, the conveyors are suitable for carrying and transporting The circuit board moves the circuit board along a conveying direction, and the conveyors are respectively arranged in the feeding cabin, the vacuum heating cabin and In the discharging compartment, the conveyor arranged in the feeding compartment enables the circuit board to be transferred along the conveying direction to the conveyor arranged in the vacuum heating cabin, and the conveyor arranged in the vacuum heating cabin The function enables the circuit board to be moved along the conveying direction to the conveyor arranged in the discharge cabin. The continuous vacuum heating equipment according to claim 4, further comprising a temporary storage area adjacent to the feed compartment, and a temporary storage area adjacent to the discharge compartment, and the conveyors are also respectively arranged at The feed temporary storage area and the discharge temporary storage area, the position of the conveyor set in the feed temporary storage area corresponds to the position of the conveyor set in the feed cabin, so that the load can be carried on the feed The circuit board of the conveyor in the temporary storage area is moved along the conveying direction to the conveyor arranged in the feeding compartment, and the position of the conveyor arranged in the discharge temporary storage area corresponds to the discharge The position of the conveyor in the cabin enables the conveyor arranged in the discharge temporary storage area to accept the circuit board transferred by the conveyor from the discharge cabin. The continuous vacuum heating device according to claim 5, wherein the conveying system further includes at least one frame, the frame is in the shape of an upright plate, is suitable for carrying the circuit board, and can be removably connected to the conveyor mold Group, the frame has an upright frame body, a first board surface and a second board surface formed on two opposite sides of the frame body, and at least one mounting board penetrating the first board surface and the second board surface Opening, and at least one clamping assembly connected to the frame body and adjacent to the board placement opening, the clamping assembly is suitable for fixing the circuit board to the placement opening, and the number of the clamping assembly corresponds to the number of placement openings , Wherein, when the frame is suitable for carrying the circuit board for heat treatment in the vacuum heating chamber, the vacuum heating chamber can heat the two opposite sides of the circuit board simultaneously through the plate setting opening. The continuous vacuum heating device according to claim 6, wherein the conveying system further includes a conveyor which is arranged in the feed temporary storage area and is adjacent to the conveyor arranged in the feed temporary storage area A feeding robot arm, and a discharging robot arm arranged in the discharging temporary storage area and adjacent to the conveyor arranged in the discharging temporary storage area, the feeding robot arm is used to load the circuit board on the frame , The discharging robot arm is used to remove the circuit board from the frame. The continuous vacuum heating device according to claim 6, wherein each conveyor has a bottom rail, a top rail, and a conveyor belt that can pivot along a loop path, and the bottom rail has a bottom rail body , A bottom groove extending downward from the top surface of the bottom rail body and penetrating two opposite sides of the bottom rail body, and at least one pivotable bottom idler set connected to the top surface of the bottom rail body, the bottom idler The wheel set is used to rotatably clamp the bottom of the frame, and has a first bottom idler and a second bottom idler on opposite sides of the slot of the bottom groove, the first bottom idler and the The second bottom idlers are spaced apart, and the distance between the first bottom idler and the second bottom idler is greater than the thickness of the frame but less than the groove diameter of the bottom groove. The top rail has a top rail body, a Top grooves extending upward from the bottom surface of the top rail body and penetrating two opposite sides of the top rail body, and at least one pivotable top idler group connected to the bottom surface of the top rail body, the top idler group being used for The top of the frame is rotatably clamped, and has a first top idler and a second top idler on opposite sides of the slot of the top slot, the first top idler and the second top idler The wheels are spaced apart, and the distance between the first top idler and the second top idler is greater than the thickness of the frame, but smaller than the groove diameter of the top groove, the bottom groove and the top groove are suitable for the frame to stand upright The bottom and top of the frame are respectively movably inserted, so that the frame can be removably connected to the bottom rail and the top rail. The bottom idler set and the top idler set can keep the frame upright when moving along the conveying direction The conveyor belt extends along the bottom groove and is used to support the frame, and can drive the frame to move along the conveying direction. The top surface of the conveyor belt is relative to the ground. The height is smaller than the height of the top idler relative to the ground, so that the frame can be more stably connected to the bottom rail. The continuous vacuum heating equipment according to claim 6, wherein the vacuum heating chamber further includes at least two heating devices, the heating devices are respectively located in the heating section, and each heating device has two upright heating plates. The heating plates are respectively located on two opposite sides of the conveyor of the vacuum heating chamber and spaced apart from each other. When the frame is suitable for carrying the circuit board for heat treatment in the vacuum heating chamber along the conveying direction, the heating plates penetrate The board opening enables the two opposite sides of the circuit board to be heated simultaneously. A continuous vacuum heating device is suitable for heat treatment of at least one circuit board, the continuous vacuum heating device includes: a feed compartment, suitable for moving the circuit board into it from the outside, and capable of controlling the internal pressure value; A vacuum heating chamber connected to the feeding chamber and allowing the circuit board in the feeding chamber to be transferred inside, the vacuum heating chamber can be controlled to adjust the internal pressure value, and the vacuum heating chamber includes at least two temperatures Different heating sections; and a discharging chamber connected to the vacuum heating chamber and allowing the circuit board in the vacuum heating chamber to be transferred inside, the discharge chamber can be controlled to adjust the internal pressure value, wherein the The feeding chamber will allow the circuit board to be moved in from the outside under ambient pressure and transfer the circuit board to the vacuum heating chamber under vacuum pressure; the vacuum heating chamber will reciprocate in the heating sections under vacuum pressure in sequence Carry out heat treatment of the circuit board; the discharge chamber will allow the circuit board to be moved in from the vacuum heating chamber under vacuum pressure, and move the circuit board out to the outside under ambient pressure.

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