TWM602761U - 晶片型切換裝置 - Google Patents

晶片型切換裝置 Download PDF

Info

Publication number
TWM602761U
TWM602761U TW109204680U TW109204680U TWM602761U TW M602761 U TWM602761 U TW M602761U TW 109204680 U TW109204680 U TW 109204680U TW 109204680 U TW109204680 U TW 109204680U TW M602761 U TWM602761 U TW M602761U
Authority
TW
Taiwan
Prior art keywords
pads
chip
switching device
type switching
pad
Prior art date
Application number
TW109204680U
Other languages
English (en)
Chinese (zh)
Inventor
徐志旭
Original Assignee
拓緯實業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 拓緯實業股份有限公司 filed Critical 拓緯實業股份有限公司
Priority to CN202021104013.0U priority Critical patent/CN212181278U/zh
Publication of TWM602761U publication Critical patent/TWM602761U/zh
Priority to KR1020200156949A priority patent/KR102517409B1/ko
Priority to JP2020005288U priority patent/JP3234113U/ja

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/07—Structure, shape, material or disposition of the bonding areas after the connecting process
    • H01L24/09—Structure, shape, material or disposition of the bonding areas after the connecting process of a plurality of bonding areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
TW109204680U 2019-12-17 2020-04-21 晶片型切換裝置 TWM602761U (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202021104013.0U CN212181278U (zh) 2019-12-17 2020-06-15 芯片型切换装置
KR1020200156949A KR102517409B1 (ko) 2019-12-17 2020-11-20 칩형 스위칭 장치
JP2020005288U JP3234113U (ja) 2019-12-17 2020-12-07 チップ型切換装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962948821P 2019-12-17 2019-12-17
US62/948,821 2019-12-17

Publications (1)

Publication Number Publication Date
TWM602761U true TWM602761U (zh) 2020-10-11

Family

ID=74095143

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109204680U TWM602761U (zh) 2019-12-17 2020-04-21 晶片型切換裝置

Country Status (3)

Country Link
JP (1) JP3234113U (ja)
KR (1) KR102517409B1 (ja)
TW (1) TWM602761U (ja)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08172163A (ja) * 1994-12-19 1996-07-02 Matsushita Electric Ind Co Ltd １入力多出力スイッチおよび多入力１出力スイッチ

Also Published As

Publication number Publication date
KR20210078395A (ko) 2021-06-28
KR102517409B1 (ko) 2023-04-03
JP3234113U (ja) 2021-09-24

Similar Documents

Publication Publication Date Title
US11189611B2 (en) Electrostatic discharge protection semiconductor device
US20140211357A1 (en) Semiconductor integrated circuit device
US10263417B2 (en) Transient voltage suppressing integrated circuit
JP4778464B2 (ja) ブートストラップされた非金属層を用いるフリンジ・キャパシタ
US7405946B2 (en) Ball grid array assignment
TWI694581B (zh) 靜電放電防護裝置與具有電容的整合被動元件
JP2013021249A (ja) 半導体集積装置
TWM602761U (zh) 晶片型切換裝置
US10305276B2 (en) ESD protection circuit and integrated circuit
CN212181278U (zh) 芯片型切换装置
US20190006364A1 (en) Semiconductor device and method of manufacturing the same
US6281529B1 (en) Semiconductor device having optimized input/output cells
JP2004221260A (ja) 半導体装置
JPH04164371A (ja) 半導体集積回路
TW200411783A (en) Manufacturing method of display device
JP2004179184A (ja) 半導体集積回路
JPH07106531A (ja) ゲートアレー構成半導体装置
US20150109705A1 (en) Method and associated apparatus for performing electrostatic discharge protection
TWI512933B (zh) 靜電放電防護元件
JPH02105579A (ja) 論理集積回路
KR20090003745A (ko) 멀티 칩 패키지 및 그 테스트 방법
JP2003124331A (ja) 半導体集積回路装置
US7952120B2 (en) Semiconductor device
TW202418258A (zh) 電路基板以及微發光二極體顯示面板
JP2013120857A (ja) 半導体集積回路