TWM594168U - Hologram pattern transfer device - Google Patents
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- TWM594168U TWM594168U TW108217230U TW108217230U TWM594168U TW M594168 U TWM594168 U TW M594168U TW 108217230 U TW108217230 U TW 108217230U TW 108217230 U TW108217230 U TW 108217230U TW M594168 U TWM594168 U TW M594168U
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Abstract
一種全像圖圖案轉移裝置包含一工作載台、一圓柱形金屬滾輪、一光阻噴淋模組、一微影製程模組以及一電化學加工蝕刻模組。工作載台具有致動構件。圓柱形金屬滾輪水平設置於工作載台上方且致動構件用以轉動圓柱形金屬滾輪。光阻噴淋模組用以形成一光阻層於圓柱形金屬滾輪上。微影製程模組用以將光阻層轉換成一圖案化光阻層。電化學加工蝕刻模組,用以將圖案化光阻層的圖案轉移至圓柱形金屬滾輪上。本創作全像圖圖案轉移裝置,可提高均勻性且縮短製程時間。 A hologram pattern transfer device includes a working stage, a cylindrical metal roller, a photoresist spray module, a lithography process module, and an electrochemical machining etching module. The work stage has an actuating member. The cylindrical metal roller is horizontally arranged above the work stage and the actuating member is used to rotate the cylindrical metal roller. The photoresist spray module is used to form a photoresist layer on the cylindrical metal roller. The lithography process module is used to convert the photoresist layer into a patterned photoresist layer. The electrochemical machining etching module is used to transfer the pattern of the patterned photoresist layer to the cylindrical metal roller. This holographic image pattern transfer device can improve uniformity and shorten process time.
Description
本創作是有關一種圖案轉移裝置,尤指一種全像圖圖案轉移裝置。 This creation is about a pattern transfer device, especially a holographic image pattern transfer device.
以往在製作全像圖圖案轉移時,請參考圖1,先於滾輪10上組裝薄片狀的全像版11,再將全像版11上的全像紋路圖案轉移至材料20上,使材料20具有相對應的全像紋路圖案21。上述全像紋路圖案轉移方式,轉移後的材料20上兩相鄰的全像紋路圖案21之間,會留下對應於全像板11的接縫12的間隙22。因此,轉移後的材料20在後續使用時,因為間隙22的存在而會造成材料20極大的浪費。一種改良的技術如圖3所示,利用製作光阻、顯影以將圖案轉移,其中當形成光阻層時,滾輪10傾斜設置,光阻材料係利用滴塗(drip coating)的方式慢慢塗佈於滾輪10上,此種製程程序需耗費十幾個工作天,且塗佈的均勻度不是非常好。
In the past, when making a hologram pattern transfer, please refer to FIG. 1, first assemble the sheet-
有鑑於上述習知結構之缺失,製造品質良好、符合成本效益又適合於全像圖圖案轉移裝置便是目前極需努力的目標。 In view of the lack of the above-mentioned conventional structure, manufacturing a good quality, cost-effective, and suitable for a hologram pattern transfer device is currently a goal that requires much effort.
本創作提供一種全像圖圖案轉移裝置,用於將一全像圖圖案直接轉移至金屬滾輪上,不僅使圖案更均勻且縮短製程時間,進而提高最終產品品質。 This creation provides a hologram pattern transfer device for transferring a hologram pattern directly to the metal roller, which not only makes the pattern more uniform and shortens the process time, thereby improving the quality of the final product.
本創作一實施例之一種全像圖圖案轉移裝置,其包含一工作載台、一圓柱形金屬滾輪、一光阻噴淋模組、一微影製程模組以及一電化學加工蝕刻模 組。工作載台具有一第一致動構件。圓柱形金屬滾輪設置於工作載台上,第一致動構件用以轉動圓柱形金屬滾輪。光阻噴淋模組設用以將一光阻材料噴灑於圓柱形金屬滾輪上,以形成一光阻層。微影製程模組用以將設置於圓柱形金屬滾輪上的光阻層轉換成一圖案化光阻層於。電化學加工蝕刻模組用以將圖案化光阻層的一圖案轉移至圓柱形金屬滾輪上。 A hologram pattern transfer device according to an embodiment of the present invention includes a work stage, a cylindrical metal roller, a photoresist spray module, a lithography process module, and an electrochemical machining etching mold group. The work stage has a first actuating member. The cylindrical metal roller is arranged on the working stage, and the first actuating member is used to rotate the cylindrical metal roller. The photoresist spray module is configured to spray a photoresist material on the cylindrical metal roller to form a photoresist layer. The lithography process module is used to convert the photoresist layer provided on the cylindrical metal roller into a patterned photoresist layer. The electrochemical machining etching module is used to transfer a pattern of the patterned photoresist layer to the cylindrical metal roller.
以下藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解本創作之目的、技術內容、特點及其所達成之功效。 The following is a detailed description with specific examples and accompanying drawings, so that it is easier to understand the purpose, technical content, characteristics and effects of the creation.
10:滾輪 10: Roller
11:全像版 11: Holographic version
12:接縫 12: Seam
20:材料 20: Material
21:全像紋路圖案 21: Holographic pattern
22:間隙 22: clearance
100:全像圖圖案轉移裝置 100: Holographic image pattern transfer device
110:工作載台 110: Work stage
112:第一致動構件 112: The first actuating member
114:第二致動構件 114: Second actuation member
120:圓柱形金屬滾輪 120: cylindrical metal roller
130:光阻噴淋模組 130: Photoresist spray module
132:噴灑頭 132: sprinkler head
140:微影製程模組 140: lithography process module
142:雷射曝光構件 142: Laser exposure component
144:顯影構件 144: developing member
150:電化學加工蝕刻模組 150: Electrochemical machining etching module
152:電解槽 152: electrolytic cell
154:陽極 154: anode
156:陰極 156: cathode
PR1:光阻層 PR1: photoresist layer
PR2:圖案化光阻層 PR2: patterned photoresist layer
圖1至圖3為一示意圖,顯示本創作之先前技術。 Figures 1 to 3 are schematic diagrams showing the prior art of this creation.
圖4為一方塊示意圖,顯示本創作之一實施例之全像圖圖案轉移裝置。 FIG. 4 is a block diagram showing a hologram pattern transfer device according to an embodiment of the invention.
圖5A、圖5B為一示意圖,顯示本創作之一實施例之全像圖圖案轉移裝置。 5A and 5B are schematic diagrams showing a hologram pattern transfer device according to an embodiment of the present creation.
圖6A、圖6B為一示意圖,顯示本創作之又一實施例之全像圖圖案轉移裝置。 6A and 6B are schematic diagrams showing a hologram pattern transfer device according to another embodiment of the present creation.
圖6C為一示意圖,顯示本創作一實施例中之圖案化光阻層示意圖。 6C is a schematic diagram showing a schematic diagram of a patterned photoresist layer in an embodiment of the present invention.
圖7A、圖7B及圖7D為一示意圖,顯示本創作又一實施例中之全像圖圖案轉移裝置。 7A, 7B and 7D are schematic diagrams showing a hologram pattern transfer device in another embodiment of the present creation.
圖7C為一示意圖,顯示本創作一實施例中蝕刻後於圓柱形金屬滾輪形成全像圖圖案。 FIG. 7C is a schematic diagram showing the formation of a hologram pattern on a cylindrical metal roller after etching in an embodiment of the present invention.
以下將詳述本創作之各實施例,並配合圖式作為例示。除了這些詳細說明之外,本創作亦可廣泛地施行於其它的實施例中,任何所述實施例的輕易替代、修改、等效變化都包含在本創作之範圍內,並以申請專利範圍為準。在說明書的描述中,為了使讀者對本創作有較完整的瞭解,提供了許多特定細節;然而,本創作可能在省略部分或全部特定細節的前提下,仍可實施。此外,眾所周知的步驟或元件並未描述於細節中,以避免對本創作形成不必要之限制。圖式中相同或類似之元件將以相同或類似符號來表示。特別注意的是,圖式僅為示意之用,並非代表元件實際之尺寸或數量,有些細節可能未完全繪出,以求圖式之簡潔。 In the following, each embodiment of the creation will be described in detail, and the drawings will be used as examples. In addition to these detailed descriptions, this creation can also be widely implemented in other embodiments. The easy replacement, modification, and equivalent changes of any of the described embodiments are included in the scope of this creation, and the scope of patent application is quasi. In the description of the specification, in order to allow the reader to have a more complete understanding of this creation, many specific details are provided; however, this creation may still be implemented on the premise that some or all of the specific details are omitted. In addition, well-known steps or elements are not described in detail to avoid unnecessary restrictions on the creation. The same or similar elements in the drawings will be represented by the same or similar symbols. It is important to note that the drawings are for illustrative purposes only, and do not represent the actual size or number of components. Some details may not be fully drawn for simplicity.
請參照圖4、圖5A及圖5B,本創作之一實施例之全像圖圖案轉移裝置100,包含:一工作載台110、一圓柱形金屬滾輪120、一光阻噴淋模組130、一微影製程模組140及一電化學加工蝕刻模組150。工作載台110具有一第一致動構件112。於一實施例中,圓柱形金屬滾輪120為金屬材質。於一實施例中,其材質包含但不限於錫、鉛、鋅、鋁、銅、黃銅、鐵、鎳、不鏽鋼、鈷、鎢、鉻以及其硬度大於鉻的金屬。
Please refer to FIGS. 4, 5A and 5B, a hologram
接續上述,如圖5A所示,圓柱形金屬滾輪120設置於工作載台110上,於一實施例中,光阻噴淋模組130設置於圓柱形金屬滾輪120上方,其中當光阻噴淋模組130將光阻材料噴灑於圓柱形金屬滾輪120時,第一致動構件112轉動圓柱形金屬滾輪120,以將光阻材料均勻塗佈至圓柱形金屬滾輪120上,形成一光阻層PR1。本創作的光阻噴淋模組130,可使光阻塗佈地更均勻且縮短製程時間,亦可製作較薄的光阻膜。
Following the above, as shown in FIG. 5A, the
承上,於一實施例中,光阻噴淋模組130具有一噴灑頭132。而全像圖圖案轉移裝置100更包含一第二致動構件114,用以將光阻噴淋模組130在圓柱形金屬滾輪120上方水平移動,以利將光阻材料較均勻地噴灑在圓柱形金屬滾輪120上。可以理解的是,於又一實施例中,請參考圖5B,光阻噴淋模組130具有複數個噴灑頭132,其中噴灑頭132可以平均分配於圓柱形金屬滾輪120上方。
As mentioned above, in one embodiment, the
接續請參考圖6A及圖6B,微影製程模組140包含一雷射曝光構件142及一顯影構件144,其以適當方式,例如微影製程技術,用以將設置於圓柱形金屬滾輪120上的光阻層PR1圖案化(如圖6C的圖案化光阻層PR2)。再者,具有圖案化光阻層PR2的圓柱形金屬滾輪120,由電化學加工蝕刻模組150進行後續製程。請參考圖7A,電化學加工蝕刻模組150包含一電解槽152,於此實施例中,電解槽152為橫臥式,其裝載一電解液,用以供圓柱形金屬滾輪120置入後,進行一電解蝕刻程序,於一實施例中,圖7B所示,將陽極154設在圓柱形金屬滾輪120、將陰極156設在電解槽152內,以將圖案化光阻層PR2的圖案直接轉移至圓柱形金屬滾輪120,即在圓柱形金屬滾輪120外表面上蝕刻出圖案化光阻層PR2的圖案,如圖7C所示。於又一實施例中,如圖7D所示,可以理解的是,電解槽142亦可成呈直立式設置。
6A and 6B, the
根據上述,本創作之全像圖圖案轉移裝置,其係利用噴灑頭的方式將光阻材料以噴灑方式形成於基材(圓柱形金屬滾輪)上,不僅更光阻膜較均勻且整體製程也更快速,全像圖圖案轉移整體製程時間可從30天大幅降低至5天。此外,噴灑頭的方式形成光阻膜比較不會產生條紋也較不容易剝離。更者,圓柱形金屬滾輪的截面尺寸、長度更為彈性,可依據需求做不同設計。由於,光阻膜的 品質提升,進而全像圖圖案轉移整體的製程良率亦提升,製程成本亦可大幅下降。 According to the above, the holographic image pattern transfer device of this creation uses the spray head to form the photoresist material on the substrate (cylindrical metal roller) by spraying. Not only is the photoresist film more uniform, but the overall process is also Faster, the overall process time for holographic pattern transfer can be greatly reduced from 30 days to 5 days. In addition, the photoresist film formed by the spray head is less likely to cause streaks and is less likely to peel off. Moreover, the cross-sectional size and length of the cylindrical metal rollers are more flexible, and different designs can be made according to requirements. Due to the The quality is improved, and the overall process yield of the whole image pattern transfer is also improved, and the process cost can also be greatly reduced.
綜合上述,本創作之全像圖圖案轉移裝置,用於將一全像圖圖案直接轉移至金屬滾輪上,不僅使圖案更均勻且縮短製程時間,進而提高最終產品品質。 In summary, the holographic image pattern transfer device of the present invention is used to directly transfer a holographic image pattern to a metal roller, which not only makes the pattern more uniform and shortens the process time, thereby improving the quality of the final product.
以上所述之實施例僅是為說明本創作之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本創作之內容並據以實施,當不能以之限定本創作之專利範圍,即大凡依本創作所揭示之精神所作之均等變化或修飾,仍應涵蓋在本創作之專利範圍內。 The above-mentioned embodiments are only to illustrate the technical ideas and characteristics of this creation, and its purpose is to enable those who are familiar with this skill to understand and implement the content of this creation, but should not limit the patent scope of this creation, That is to say, the equal changes or modifications made by Dafan in accordance with the spirit of this creation should still be covered by the patent scope of this creation.
100:全像圖圖案轉移裝置 100: Holographic image pattern transfer device
130:光阻噴淋模組 130: Photoresist spray module
140:微影製程模組 140: lithography process module
150:電化學加工蝕刻模組 150: Electrochemical machining etching module
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI742901B (en) * | 2020-10-30 | 2021-10-11 | 光群雷射科技股份有限公司 | Manufacturing method of transfer roller and manufacturing method of transfer film |
CN113568272A (en) * | 2020-04-28 | 2021-10-29 | 光群雷射科技股份有限公司 | Manufacturing method of transfer printing type roller and transfer printing type roller |
CN113625526A (en) * | 2020-05-08 | 2021-11-09 | 光群雷射科技股份有限公司 | Seamless hologram pattern transfer method |
CN113634831A (en) * | 2020-05-11 | 2021-11-12 | 光群雷射科技股份有限公司 | Seamless hologram pattern transfer method |
-
2019
- 2019-12-25 TW TW108217230U patent/TWM594168U/en unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113568272A (en) * | 2020-04-28 | 2021-10-29 | 光群雷射科技股份有限公司 | Manufacturing method of transfer printing type roller and transfer printing type roller |
CN113568272B (en) * | 2020-04-28 | 2024-02-13 | 光群雷射科技股份有限公司 | Method for manufacturing transfer roller and transfer roller |
CN113625526A (en) * | 2020-05-08 | 2021-11-09 | 光群雷射科技股份有限公司 | Seamless hologram pattern transfer method |
CN113634831A (en) * | 2020-05-11 | 2021-11-12 | 光群雷射科技股份有限公司 | Seamless hologram pattern transfer method |
TWI742901B (en) * | 2020-10-30 | 2021-10-11 | 光群雷射科技股份有限公司 | Manufacturing method of transfer roller and manufacturing method of transfer film |
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