KR102127568B1 - Metal shadow mask and preparation method thereof - Google Patents

Abstract

The present invention discloses a metal shadow mask, the method of manufacturing a metal shadow having different aperture aperture sizes on both sides facing each other by providing a base plate and performing several cycles of coating, exposure, development and electroplating cycles. Acquiring a mask, and through such a change in aperture size, causing the metal shadow mask to have a deposition angle of a stepped structure. The present invention solves the problem that the deposition shadow of the prior art is not uniform and the deposition shadow is easily generated by introducing the deposition angle into the metal shadow mask through the method of electroplating by layer.

Description

METAL SHADOW MASK AND PREPARATION METHOD THEREOF}

The present invention relates to the field of organic light emitting diode display technology, and specifically to a metal shadow mask and a method of manufacturing the same.

An organic light-emitting diode (OLED) display device is manufactured using an organic semiconductor material and is a thin film light-emitting device driven by a DC voltage. The OLED display device has advantages such as slim, light weight, high contrast, and wide viewing angle, and has established itself as the mainstream of next-generation display technology.

The light emitting principle of the OLED display device is that when an electric current is coated through an organic light emitting material, that is, the organic light emitting material coating emits light. Currently, in the manufacturing field of the OLED industry, a method of depositing a shadow mask for single deposition is generally used, and when depositing, the organic material particles are attached to the substrate through the opening of the shadow mask from each angle. However, in the general deposition process, the opening distributed in the shadow mask is taper free, and if the particles face the opening obliquely, some particles are obscured by the opening wall and cannot reach the substrate, resulting in a lack of oblique incident particles. Thus, since the deposition of the substrate is not uniform, a shading effect may occur, and the luminance of the product decreases, thereby affecting the display characteristics of the OLED device.

In the current industry, only the shadow effect, when manufacturing a shadow mask for OLED, is generally produced by using a double-sided etched metal coil material, but this method cannot accurately control the uniformity of the aperture size. In the shadow mask, a reverse taper angle is present in the opening of the contact surface of indium tin oxide (ITO), thereby creating a rectangular area, which affects deposition quality.

An object of the present invention is to provide a metal shadow mask and a method for manufacturing the same, to solve the problem that a shadow effect is easily generated when depositing a glass substrate.

In order to solve the above problem, the present invention provides a method for manufacturing a metal shadow mask, comprising: providing a mother bed; Installing a photosensitive film on the mother plate; Exposing and developing, so that the photosensitive film forms a plurality of first structures on the mother plate; Forming a first layer metal layer on the mother plate; Removing the plurality of first structures to form a plurality of first openings corresponding to the plurality of first structures in the first layer metal layer; Forming the photosensitive film on the first layer metal layer; Forming a plurality of second structures corresponding to the plurality of first openings in the photosensitive film by exposing and developing, and forming a size of the second structure larger than the size of the first opening; Forming a second layer metal layer on the first layer metal layer, and combining the first layer metal layer with a metal shadow mask; And removing the plurality of second structures to form a plurality of second openings corresponding to the plurality of first openings in the second layer metal layer.

The present invention also provides a metal shadow mask manufactured through the above manufacturing method.

Compared with the prior art, the present invention includes the following technical effects.

The metal shadow mask provided in the present invention and a method for manufacturing the metal shadow mask are formed by introducing a deposition angle into an electroplated metal shadow mask through a method of electroplating each layer to form a stepped perforated structure. By controlling the thickness of the one-layer metal layer to 1 to 2 μm, the deposition shadow can be reduced or eliminated. In addition, during deposition, loss of organic material particles incident on the glass substrate may be reduced, thereby improving deposition uniformity and reducing product luminance.

The drawings described herein are an additional understanding of the present invention, and constitute a part of the present invention, and exemplary embodiments and descriptions of the present invention are intended to interpret the present invention and do not limit the present invention. In the drawing,
1 is a method flow diagram of an embodiment of the present invention.
2 is a side view corresponding to different manufacturing steps in the embodiment of the present invention.
3 is a side view corresponding to different manufacturing steps in the embodiment of the present invention.
4 is a side view corresponding to different manufacturing steps in the embodiment of the present invention.
5 is a side view corresponding to different manufacturing steps in the embodiment of the present invention.
6 is a side view corresponding to different manufacturing steps in the embodiment of the present invention.
7 is a side view corresponding to different manufacturing steps in the embodiment of the present invention.
8 is a side view corresponding to different manufacturing steps in the embodiment of the present invention.
9 is a side view corresponding to different manufacturing steps in the embodiment of the present invention.
10 is a cross-sectional view of a metal shadow mask in an embodiment of the present invention.

Hereinafter, the implementation method of the present invention will be described in detail with reference to the drawings and examples, thereby sufficiently understanding and implementing the process of realizing how the present invention solves the technical problem by using the technical solution and achieves the technical effect. Do it.

Any word in the specification and claims refers to a particular member. It is understood by those skilled in the art that the same elements may be referred to by different names in hardware manufacturing. The present specification and claims do not classify members due to differences in names, and members are classified as functional differences. It is to be understood that “inclusive” as referred to in the entire specification and claims is an open term and is “included but not limited to.” “Alternatively” refers to an acceptable error range, and a person skilled in the art solves the above technical problem within a certain error range, and achieves the above technical effect. In addition, the words “coupling” or “electrically connected” include any direct or indirect electrical coupling means. Accordingly, when a sentence in the sentence indicates that the first device is coupled to the second device, the first device is electrically coupled directly to the second device, or through the other device or coupling means to the second device Refers to being electrically coupled indirectly. Subsequent descriptions of the specification are preferred embodiments of the invention, which are still intended to illustrate the general principles of the invention and do not limit the scope of the invention. The scope of protection of the present invention is based on what is determined in the claims.

What should be further explained is not only to include these elements, such as the process, method, product or system of a series of elements, by including the non-exclusive inclusion of changes in the terms “inclusive”, “inclusive” or other forms thereof, as well. Other elements not specifically listed, or further include elements unique to such processes, methods, products or systems. Under the circumstance of no further limitation, the elements of the qualifier "including one..." do not exclude the inclusion of separate identical elements present in the process, method, product or system of the element. .

Example

As shown in FIG. 1, in one embodiment of the present invention, a method of manufacturing a metal shadow mask includes the following steps.

Step S101: Provide a mother bed. Clean the bed of the pretreatment process, or wash the bed with an acidic and alkaline cleaner prior to this step, then rinse with deionized water, then dry to prepare for use.

Step S103: A photosensitive film is installed on the mother board. Mainly, the photosensitive film 20 is pressed to the mother plate 10 at a constant pressure with a roller of a constant temperature, so that the surface of the photosensitive film 20 and the mother plate 10 are sufficiently bonded (shown in FIG. 2).

Step S105: exposure and development, so that the photosensitive film forms a plurality of first structures on the mother board. 2 and 3, in the above step, by exposing the mother plate 10 coated with a photosensitive film 20, the photosensitive film 20 to form a first layer pattern according to the exposure pattern; Next, the mother plate 10 after exposure at a constant temperature is baked, and the photosensitive film 20 subjected to the exposure is sufficiently reacted; Thereafter, the mother plate 10 after exposure is developed to allow the photosensitive film 20 to form a plurality of first structures 30 on the surface of the mother plate 10 (that is, a dry thin film after the photosensitive film is exposed and developed), and many The first structures 30 are spaced apart from each other.

Here, the base plate 10 having a plurality of first structures 30 may be hard-baked or selectively subjected to a UV solidification process, and after development, the base plate 10 is baked at a relatively high temperature, and then The first structure 30 becomes more robust, and the adhesion with the surface of the mother plate 10 becomes stronger.

Step S107: A first layer metal layer is formed on the mother board. As illustrated in FIG. 4, the base plate 10 having a plurality of first structures 30 is electroplated to form a single layer at a position where the first structure 30 is not installed on the surface of the base plate 10. The metal layer 40 is deposited to be the first layer metal layer 40 of the metal shadow mask, and the thickness H1 of the metal layer 40 is approximately 1 to 5 μm, for example, 1 to 2 μm. In this step, the mother plate 10 having a plurality of first structures 30 is left in the electroplating solution, and an electrodeposition process is performed on the mother plate 10 under an appropriate temperature. For example, the mother plate 10 is left in an electroforming solution having a pH value of 2 to 3.5, and an electroforming process is also performed under a temperature of 40 to 60°C. In some embodiments of the present invention, the step of the electroplating base plate may proceed with the electroplating process at a temperature of 50° C. in the electroplating solution having a pH value of 3. In addition, through a rectifier, for example, a double rectifier, the currents of the iron anode and the nickel anode are respectively controlled, where the current supply method can be performed using a direct current having a current value of 4 A/dm ² . Therefore, in the above step, it is possible to obtain an iron nickel alloy layer having a thickness of 1 to 5 um, and also to control the thickness uniformly within the range of 0.1 to 0.5 um.

Here, the components of the electroforming solution are nickel sulfate 40-80 g/L, ferrous sulfate 20-40 g/L, antioxidant 1-2 g/L, positive active agent 10-20 g/L, and complexing agent 0.2-0.4 g/L. Through the electroplating process, an iron nickel alloy layer having an iron content of 40% to 70% can be obtained. In another embodiment of the present invention, the electroplating plating solution may further include a pH buffering agent of 30-45 g/L and/or a composite stabilizer of 2-10 g/L, wherein the use of the composite stabilizer is an iron nickel alloy layer. Brightness can reach level 2 brightness.

Through the electroplating process, a thin side (first layer metal layer) having a uniform thickness of <2um can be plated on the mother plate, thereby obtaining results that are optimized to <10% in terms of uniformity. On this basis, it is possible to realize a stepped structure of a small deposition shadow required for OLED deposition in a multiple gold shadow mask in conjunction with a subsequent manufacturing process.

Step S109: The plurality of first structures are removed to form a plurality of first openings corresponding to the plurality of first structures in the first layer metal layer. 4 and 5, the main plate 10 having a plurality of first structures 30 after the main electroplating is put into a film removal groove to proceed with the film removal process, and the pattern is not patterned in the base plate 10. Remove the photosensitive film cleanly. That is, by removing the plurality of first structures 30 from the mother board, the plurality of first openings 41 are formed in the first layer metal layer 40. The positions and shapes of the plurality of first openings 41 and the positions and shapes of the plurality of first structures 30 match each other.

Then, before proceeding to the next step, the washing and drying processes are selectively performed on the mother board 10 after the film is removed, for example, washed clean with deionized water, and the mother board 10 can be dried. have.

Step S111: A photosensitive film is formed on the first layer metal layer. As shown in FIG. 6, the base plate 10 on which the first layer metal layer 40 is installed is pressed to the metal layer 40 with a constant pressure by using a roller having a constant temperature to press the photosensitive film 20 to the photosensitive film 20. The surface of the metal layer 40 is sufficiently joined.

Step S113: Exposing and developing, to form a plurality of second structures corresponding to the plurality of first openings in the photosensitive film, and the size of the second structure is larger than the size of the first opening. In operation, for the exposure of the base plate to which the photosensitive film is pressed, the photosensitive film is formed to form a second layer pattern according to the exposure pattern. Subsequently, the mother plate after exposure at a constant temperature is baked, and the photosensitive film that has been exposed is sufficiently reacted. Next, as shown in FIGS. 6 and 7, after developing the mother board 10 after exposure, a plurality of second structures 50 on the photosensitive film 20 (that is, drying after exposing and developing the photosensitive film 20) Thin film). The plurality of second structures 50 correspond to the plurality of first openings 41 one by one, the size of the second structure 50 is slightly larger than the size of the first opening 41, and the first opening 41 is opened. Shielding, the first layer metal layer 40 covers the periphery adjacent to the first opening 41.

After this step, a hard baking or UV solidification process may be selectively performed on the mother board 10, and the mother board 10 after development is baked at a relatively high temperature, so that the plurality of second structures 50 are more robust. And the adhesion is further strengthened.

Step S115: A second layer metal layer is formed on the first layer metal layer, and the first layer metal layer is combined with the metal shadow mask. As shown in FIG. 8, the base plate 10 having a plurality of second structures 50 is electroplated, so that one layer is located at a position where the second structure 50 is not installed in the first layer metal layer 40. The metal layer 60 of the metal layer 60 is deposited to be the second layer metal layer 60 of the metal shadow mask, and the thickness H2 of the metal layer 60 is greater than the thickness H1 of the first layer metal layer 40, and both The thickness ratio of may reach 1:5 to 1:25, 1:10, 1:15 or 1:20. For example, when the thickness H1 of the first layer metal layer 40 is 1um, the thickness H2 of the second layer metal layer 60 may be between 5 and 25um, for example, 5um, 15um, or 25um. . When the thickness H1 of the first layer metal layer 40 is 2 μm, the thickness H2 of the second layer metal layer 60 may include, but is not limited to, 10 μm, 20 μm, or 25 μm.

Step S117: The plurality of second structures is removed to form a plurality of second openings corresponding to the plurality of first openings in the second layer metal layer. Referring to FIGS. 8 and 9, in the above step, after the electroplating, the mother plate 10 having a plurality of second structures 50 is placed in the film removal groove to proceed with the film removal process, and the mother plate 10 By controlling the photoresist film cleanly, removing the plurality of second structures 50 from the mother plate 10, and forming a plurality of second openings 61 in the second layer metal layer 60, different metal layer thicknesses and different openings A metal shadow mask 70 having a size is obtained. Here, the positions of the plurality of second openings 61 correspond to each of the plurality of first openings 41, and also communicate with the plurality of first openings 41. It should be explained that, through the above manufacturing process, the center shift amount of the second opening 61 and the corresponding center opening amount of the first opening 41 can be controlled between approximately 0.5 μm and 1 μm. The position of the center point of the opening between the layers is precisely symmetrical, so that the bonding between the layers and the layers is more precise, ensuring the precision of the opening's position, and is advantageous for the production of a small opening metal shadow mask 70.

After the film removal process, a washing and drying process may be selectively performed on the mother plate 10 after the film is removed. Finally, the metal shadow mask 70 is again removed from the mother plate 10 and fixed (shown in FIG. 10).

9 and 10, in an embodiment of the present invention, the metal shadow mask 70 manufactured through the above process includes a first layer metal layer 40 and a second layer metal layer 60. The constituent materials of the first layer metal layer 40 and the second layer metal layer 60 include, but are not limited to, nickel alloys, nickel-cobalt alloys, and iron nickel alloys. The first layer metal layer 40 has a plurality of first openings 41, and the first openings 41 are arranged to be spaced apart from each other, and also penetrate the first layer metal layer 40. The second layer metal layer 60 has a plurality of second openings 61, and the positions of the plurality of second openings 61 correspond to the plurality of first openings 41, and also in the horizontal direction, respectively The size (diameter) of the second opening 61 is larger than the size (diameter) of each of the first openings 41, and the first opening 41 and the second opening (where the metal shadow mask 70 communicates with each other) 61) The stair structure is formed inside. In the above structure, due to the difference in size of the aperture, the first layer metal layer 40 is adjacent to the first opening 41 at the same side of the corresponding first opening 41 and the second opening 61. There is a difference in width (ΔW) between the side edge and one side edge of the second layer metal layer 60 adjacent to the second opening 61. In addition, the first layer 41 of the metal layer 40 is adjacent to each other with the first opening 41 and the second layer metal layer 60 is adjacent to the second opening 61 of the connecting line and the metal shadow mask of the side 70 A narrow angle θ is provided between the surfaces (ie, the surfaces of the first or second layer metal layers 40 and 60), and the angle of the narrow angle θ may be any angle greater than 0° and less than 90°. And preferably, the angle is a narrow angle (θ) of 30 to 60°. Here, the angle size of the narrow angle θ can be adjusted correspondingly through the difference in width ΔW, and when depositing, the organic material particles have a relatively desirable angle of incidence, thereby reducing or eliminating the shading effect.

Besides, the deposition shadow is not only affected by the deposition angle, but also in direct proportion to the vertical distance of the glass substrate and the cut-off point of the deposition material, so for the first layer metal layer contacting the glass substrate, its thickness is 1 It can be controlled between to 5um, for example, 1um or 2um, it is possible to effectively reduce the generation of shading effect.

Although the above description has described a number of preferred embodiments of the present invention, the above is for the understanding of the present invention and does not limit the form disclosed in the text, and should not be regarded as exclusion of other embodiments, various other combinations, corrections And it can be applied to the environment, and within the scope of the concept of the invention of the text can be modified through the skills or knowledge of the prison or related fields. All modifications and changes in the art are within the scope and spirit of the present invention, and all belong to the claims appended to the present invention.

Claims (20)

Providing a mother bed;
Installing a photosensitive film on the mother plate;
Exposing and developing, so that the photosensitive film forms a plurality of spaced apart first structures on the mother plate;
Forming a first layer metal layer on the base plate, wherein the first layer metal layer has a thickness of 1 to 5um;
Removing the plurality of first structures to form a plurality of spaced apart first openings corresponding to the plurality of spaced apart first structures in the first layer metal layer;
Installing a photosensitive film over the entire first metal layer;
Exposing and developing to form a plurality of spaced apart second structures corresponding to the plurality of first spaced apart openings in the photosensitive film, wherein the size of the second structure is greater than the size of the first opening;
Forming a second layer metal layer on the first layer metal layer, combining the first layer metal layer with a metal shadow mask, and the thickness ratio between the first layer metal layer and the second layer metal layer is 1:5 to 1:25 ; And
Removing the plurality of second structures to form a plurality of second openings corresponding to the plurality of first openings in the second layer metal layer; Including,
A width difference is provided between one side of the first layer metal layer adjacent to the first opening and one side of the second layer metal layer adjacent to the second opening, and the first layer metal layer includes the first An angle of the narrow angle is provided between the side of the metal shadow mask and the connection line of the side edge adjacent to the opening and the second layer metal layer adjacent to the second opening and the side of the metal shadow mask, and adjusting the width difference. You can adjust the size correspondingly,
The step of forming the first layer metal layer on the mother plate proceeds with the electroplating process in an electroplating solution having a pH value of 2 to 3.5 and a temperature of 40°C to 60°C,
The electroforming solution is nickel sulfate 40 g/L to 80 g/L, ferrous sulfate 20 g/L to 40 g/L, antioxidant 1 g/L to 2 g/L, positive electrode active agent 10 g/L to 20 g/L, and A complexing agent comprising 0.2 g/L to 0.4 g/L and a complex stabilizer 2 g/L to 10 g/L. According to claim 1,
After the step of exposing and developing, a step of solidifying the plurality of first structures or the plurality of second structures; Method of manufacturing a metal shadow mask further comprising a.
According to claim 1,
After removing the plurality of second structures, removing and fixing the metal shadow mask from the mother board; Method of manufacturing a metal shadow mask further comprising a.
delete delete According to claim 1,
A method for manufacturing a metal shadow mask, wherein the amount of central deviation between the first opening and the second opening is between 0.5 μm and 1 μm.
According to claim 1,
The second opening communicates with the corresponding first opening and forms a stepped structure inside the metal shadow mask.
delete The method of claim 7,
The angle of the narrow angle is greater than 0 ° and less than 90 ° method of manufacturing a metal shadow mask.
The method of claim 9,
Method of manufacturing a metal shadow mask, characterized in that the angle of the narrow angle is between 30 ° to 60 °.
delete delete delete A metal shadow mask, characterized in that it is prepared according to the method of claim 1.
The method of claim 14,
The metal shadow mask, characterized in that the thickness ratio of the first layer metal layer and the second layer metal layer is 1:5 to 1:25.
The method of claim 14,
The metal shadow mask, characterized in that the central deviation of the first opening and the second opening is between 0.5um and 1um.
The method of claim 14,
And the second opening communicates with the corresponding first opening and forms a staircase structure inside the metal shadow mask.
The method of claim 17,
A metal shadow mask characterized in that a width difference is provided between one side of the first layer metal layer adjacent to the first opening and one side of the second layer metal layer adjacent to the second opening.
The method of claim 17,
The first layer metal layer is provided with a narrow angle between the connecting line of the side edge adjacent to the first opening and the second layer metal layer and the second side adjacent to the second opening and the surface of the metal shadow mask. Metal shadow mask characterized in that the angle is greater than 0° and less than 90°.
The method of claim 19,
The angle of the narrow angle is a metal shadow mask, characterized in that between 30 ° to 60 °.

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