CN113625526A - Seamless hologram pattern transfer method - Google Patents
Seamless hologram pattern transfer method Download PDFInfo
- Publication number
- CN113625526A CN113625526A CN202010381971.0A CN202010381971A CN113625526A CN 113625526 A CN113625526 A CN 113625526A CN 202010381971 A CN202010381971 A CN 202010381971A CN 113625526 A CN113625526 A CN 113625526A
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- China
- Prior art keywords
- adhesive layer
- photosensitive adhesive
- wavelength
- cylindrical roller
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000012546 transfer Methods 0.000 title claims abstract description 24
- 239000012790 adhesive layer Substances 0.000 claims abstract description 48
- 238000000059 patterning Methods 0.000 claims abstract description 10
- 238000000206 photolithography Methods 0.000 claims abstract description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 28
- 239000010410 layer Substances 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- -1 polyethylene terephthalate Polymers 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 3
- 238000005457 optimization Methods 0.000 abstract description 3
- 238000010023 transfer printing Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000001548 drop coating Methods 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000004826 seaming Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/76—Patterning of masks by imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Holo Graphy (AREA)
Abstract
A seamless hologram pattern transfer method comprises the following steps: providing a cylindrical roller, wherein the cylindrical roller is provided with a first photosensitive adhesive layer; performing a photolithography process on the first photosensitive adhesive layer by using a default pattern and light with a first wavelength to form a first patterned photosensitive adhesive layer; providing a mother set carrier; and performing a film-to-film patterning process to transfer the pattern of the first patterned photosensitive adhesive layer to the master carrier. The transfer printing process of the photosensitive glue can achieve the optimization of yield and cost.
Description
Technical Field
The present invention relates to a hologram pattern transfer process, and more particularly, to a pattern transfer method for forming a seamless hologram.
Background
In the prior art, referring to fig. 1 and 2, when a hologram pattern is to be transferred, a sheet-like hologram plate 11 is assembled on a roller 10, and then a hologram grain pattern on the hologram plate 11 is transferred onto a material 20, so that the material 20 has a corresponding hologram grain pattern 21. In the hologram grain pattern transfer method, a gap 22 corresponding to the seam 12 of the hologram plate 11 is left between two adjacent hologram grain patterns 21 on the transferred material 20. Therefore, the transferred material 20 is wasted greatly due to the existence of the gap 22 when the material 20 is used later. An improved technique is shown in fig. 3, which uses photoresist fabrication and development to transfer the pattern, wherein the roller 10 is tilted when forming the photoresist layer, and the photoresist material is slowly coated on the roller 10 by means of drop coating (drop coating), which takes tens of days and the coating uniformity is not very good.
In view of the above-mentioned shortcomings of the known structures, a pattern transfer method that is good in manufacturing quality, cost-effective and suitable for hologram pattern transfer is an object of great effort.
Disclosure of Invention
The invention provides a seamless hologram pattern transfer method, which utilizes a photosensitive resist process to execute a transfer process of a cylindrical roller so as to achieve yield and cost optimization.
The seamless hologram pattern transferring method of one embodiment of the invention comprises the following steps: a cylindrical roller is provided, and a first photosensitive adhesive layer is arranged on the cylindrical roller. A photolithography process is performed on the first photosensitive adhesive layer with a light beam of a first wavelength using a default pattern to form a first patterned photosensitive adhesive layer. A master carrier is provided. And performing a film-to-film patterning process to transfer the pattern of the first patterned photosensitive adhesive layer to the master carrier. Wherein the film-to-film patterning process comprises: coating a second photosensitive adhesive layer on the master carrier; imprinting the first patterned photosensitive adhesive layer on the second photosensitive adhesive layer; and curing the imprinted second photosensitive adhesive layer by using light with a second wavelength to pattern the second photosensitive adhesive layer into a second patterned photosensitive adhesive layer, wherein the first wavelength is different from the second wavelength.
The purpose, technical content, features and effects of the present invention will be more readily understood by the following detailed description of the embodiments taken in conjunction with the accompanying drawings.
Drawings
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for facilitating the understanding of the present invention, and do not specifically limit the shapes, the proportional sizes, and the like of the respective members of the present invention. Those skilled in the art, having the benefit of the teachings of this invention, may choose from the various possible shapes and proportional sizes to implement the invention as a matter of case.
Fig. 1 to 3 are schematic views of the prior art of the present invention.
Fig. 4 is a flowchart illustrating a seamless hologram pattern transfer method according to an embodiment of the invention.
Fig. 5-1 to 5-3 are schematic cross-sectional views illustrating a method for fabricating a patterned photosensitive layer according to an embodiment of the invention.
Fig. 6 is a flow chart illustrating a film-to-film (film-to-film) patterning process according to an embodiment of the invention.
Fig. 7 is a schematic structural diagram of a film-to-film (film-to-film) patterning process according to an embodiment of the invention.
Description of reference numerals:
10. a roller;
11. a holographic plate;
12. seaming;
20. a material;
21. hologram grain pattern;
22. a gap;
100. a cylindrical roller;
200. a first photosensitive adhesive layer;
201. an uncured first photosensitive adhesive layer;
202. a first patterned photosensitive adhesive layer;
203. a pitch distance;
204. amplitude height;
300. a master carrier;
400. a second photosensitive adhesive layer;
401. a second patterned photoresist layer;
500. light rays;
s100, providing a cylindrical roller with a first photosensitive adhesive layer thereon;
s101, performing a lithography process on the first photosensitive adhesive layer by using a default pattern and light with a first wavelength to form a first patterned photosensitive adhesive layer;
s102, providing a master carrier;
s103, performing a film-to-film (film-to-film) patterning process to transfer the pattern of the first patterned photoresist layer to the master carrier;
s104, coating a second photosensitive adhesive layer on the master carrier;
s105, stamping the first patterned photosensitive adhesive layer on the second photosensitive adhesive layer;
s106, curing the imprinted second photosensitive adhesive layer by using light with a second wavelength to pattern the second photosensitive adhesive layer into a second patterned photosensitive adhesive layer, wherein the first wavelength is different from the second wavelength.
Detailed Description
The following detailed description of the embodiments of the invention is provided in connection with the accompanying drawings. Aside from the details given herein, this invention is capable of broad application to other embodiments and that various other substitutions, modifications, and equivalents may be made in the embodiments without departing from the scope of the invention as defined by the appended claims. In the description of the specification, numerous specific details are set forth in order to provide a more thorough understanding of the invention; however, the present invention may be practiced without some or all of these specific details. In other instances, well-known steps or elements have not been described in detail so as not to unnecessarily obscure the present invention. The same or similar reference numbers will be used throughout the drawings to refer to the same or like parts. It is noted that the drawings are merely schematic representations, not intended to represent actual sizes or quantities of elements, and some of the details may not be fully shown in order to simplify the drawings.
The invention provides a seamless hologram pattern transfer method, which comprises the following steps: a default pattern is first formed by a photoresist process, and the default pattern is transferred to a cylindrical roller by the photoresist process, and the pattern on the cylindrical roller can be transferred to other carriers by an appropriate method, such as photoresist process, electroforming (electroforming) or hot pressing (hot embossing). The patterning step is described in detail below.
Referring to fig. 4 and fig. 5-1 to 5-3, fig. 4 is a schematic flow chart illustrating a seamless hologram pattern transfer method according to an embodiment of the invention; fig. 5-1 to 5-3 are schematic cross-sectional views illustrating a method for fabricating a patterned photosensitive layer according to an embodiment of the invention. First, referring to fig. 5-1, a cylindrical roller 100(substrate) is provided, in an embodiment, the cylindrical roller is made of a metal material, and a first photoresist layer 200 is disposed on the cylindrical roller 100 (step S100), in an embodiment, the first photoresist layer 200 is ultraviolet resin (UV resin) and is formed on a surface of the cylindrical roller 100 in an appropriate manner. Next, a photolithography process (lithography) is performed on the first photosensitive adhesive layer 200 with a light beam of a first wavelength using a default pattern to form a first patterned photosensitive adhesive layer (step S101), and as shown in fig. 5-2, the uncured first photosensitive adhesive layer 201 is removed to form a first patterned photosensitive adhesive layer 202. In one embodiment, referring to fig. 5-3, the first patterned photoresist layer 202 can be a photoresist layer having a continuous sine wave pattern. In yet another embodiment, the distance 203 between two sine waves of the continuous sine wave pattern is between 0.4um (micrometer) and 2.0um (micrometer). The amplitude height 204 of any sine wave of the continuous sine wave pattern is between 0.2um (microns) to 1.5um (microns). Furthermore, a master carrier is provided, in one embodiment, the master carrier is made of polyethylene terephthalate (PET) (step S102), which may be in a thin film form. Then, a film-to-film (film-to-film) patterning process is performed to transfer the pattern of the first patterned photoresist layer to the master carrier (step S103).
Referring to fig. 6 and 7, the process of patterning the thin film includes: first, a second photoresist layer 400 is coated on the master carrier 300 in a suitable manner (step S104). Next, the first patterned photoresist layer 202 is printed on the second photoresist layer 400 (step S105). Then, the imprinted second photosensitive adhesive layer 400 is cured by using a light 500 with a second wavelength, so that the second photosensitive adhesive layer 400 is patterned into a second patterned photosensitive adhesive layer 401, wherein the first wavelength is different from the second wavelength (i.e., the first wavelength is greater than the second wavelength or the first wavelength is less than the second wavelength) (step S106). In one embodiment, the first wavelength is 365nm (nanometers) and the second wavelength is 405nm (nanometers), however, it is understood that the first wavelength may be 405nm and the second wavelength is 365nm (nanometers) depending on various requirements or process steps. In another embodiment, referring to FIG. 7, the step of imprinting the first patterned photosensitive film 202 on the second photosensitive film 400 includes: providing a cylindrical roller 100 above the master carrier 300, and providing the light 500 with the second wavelength below the master carrier 300; the cylindrical roller 100 and the master carrier 300 are moved relatively to each other to imprint the first patterned photoresist layer 202 on the second photoresist layer 400. Finally, the light 500 with the second wavelength is irradiated on the cylindrical roller 100 to be imprinted at the position of the second photosensitive adhesive layer 400. In yet another embodiment, with continued reference to fig. 7, the method for generating a relative motion between the cylindrical roller 100 and the master carrier 300 includes rotating the cylindrical roller 100 at a fixed point and moving the master carrier 300 toward the cylindrical roller 100. The light with different wavelengths is used for the photosensitive glue process in different stages, so that the aging of the patterned photosensitive glue layer on the cylindrical roller or the master carrier can be avoided.
According to the above, the seamless hologram pattern transfer method of the present invention uses photoresist coating instead of general photoresist coating, and may use or not use electroplating process according to the requirement, and the hardness of the pattern formed by the photoresist is greater than that of the photoresist layer. In addition, the photo-curing photosensitive adhesives with different wavelengths are adopted in different photosensitive adhesive processing steps, so that the aging of the adhesive layer can be effectively avoided. The final seamless hologram product (end product) can use film-to-film (film-to-film) hot pressing process to effectively achieve the seamless purpose.
In summary, the seamless hologram pattern transfer method of the present invention utilizes the photoresist process to perform the transfer process of the cylindrical roller, so as to achieve the yield and cost optimization.
The above-mentioned embodiments are only for illustrating the technical idea and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and to implement the same, so as not to limit the scope of the claims of the present invention, i.e. all equivalent changes or modifications made in the spirit of the present invention should be covered in the scope of the claims of the present invention.
Claims (10)
1. A seamless hologram pattern transfer method is characterized in that the seamless hologram pattern transfer method comprises the following steps:
providing a cylindrical roller, wherein the cylindrical roller is provided with a first photosensitive adhesive layer;
performing a photolithography process on the first photosensitive adhesive layer by using a default pattern and light with a first wavelength to form a first patterned photosensitive adhesive layer;
providing a mother set carrier; and
performing a film-to-film patterning process to transfer the pattern of the first patterned photoresist layer to the master carrier, comprising:
coating a second photosensitive adhesive layer on the master carrier;
imprinting the first patterned photosensitive adhesive layer on the second photosensitive adhesive layer; and
and curing the imprinted second photosensitive adhesive layer by using light with a second wavelength to pattern the second photosensitive adhesive layer into a second patterned photosensitive adhesive layer, wherein the first wavelength is different from the second wavelength.
2. The method according to claim 1, wherein the cylindrical roller is made of metal.
3. The method according to claim 1, wherein the first patterned photoresist layer is a photoresist layer having a continuous sinusoidal pattern.
4. The method according to claim 3, wherein the distance between two sine waves of the continuous sine wave pattern is between 0.4um and 2.0 um.
5. The method according to claim 3, wherein the amplitude height of any sine wave of the continuous sine wave pattern is between 0.2um and 1.5 um.
6. The method according to claim 1, wherein the first wavelength is 365nm and the second wavelength is 405 nm.
7. The method according to claim 1, wherein the first wavelength is 405nm and the second wavelength is 365 nm.
8. The method according to claim 1, wherein the step of imprinting the first patterned photoresist layer onto the second patterned photoresist layer comprises:
providing the cylindrical roller above the master carrier and providing the light with the second wavelength below the master carrier;
making the cylindrical roller and the master mask carrier generate relative motion to press the first patterned photosensitive adhesive layer on the second photosensitive adhesive layer; and
and irradiating the light with the second wavelength on the position of the second photosensitive adhesive layer stamped by the cylindrical roller.
9. The method of claim 8, wherein the step of moving the cylindrical roller relative to the master carrier comprises rotating the cylindrical roller at a fixed point and moving the master carrier in a direction of the cylindrical roller.
10. The method of claim 1, wherein the master carrier is made of polyethylene terephthalate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010381971.0A CN113625526A (en) | 2020-05-08 | 2020-05-08 | Seamless hologram pattern transfer method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010381971.0A CN113625526A (en) | 2020-05-08 | 2020-05-08 | Seamless hologram pattern transfer method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113625526A true CN113625526A (en) | 2021-11-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010381971.0A Pending CN113625526A (en) | 2020-05-08 | 2020-05-08 | Seamless hologram pattern transfer method |
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| Country | Link |
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| CN (1) | CN113625526A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1357802A (en) * | 2000-10-19 | 2002-07-10 | 伊利诺斯器械工程公司 | Light-limiting polyimide film for surface to be knurled |
| TW200412291A (en) * | 2003-01-10 | 2004-07-16 | K Laser Technology Inc | Hologram heat shrink film and method for making same |
| CN203381319U (en) * | 2013-07-23 | 2014-01-08 | 上海宏盾防伪材料有限公司 | Round roller provided with seamless laser pattern and used for direct molding |
| CN203528042U (en) * | 2013-09-26 | 2014-04-09 | 上海宏盾防伪材料有限公司 | Holographic BOPP seamless die-pressing plate roller |
| CN107894691A (en) * | 2013-12-20 | 2018-04-10 | 迪睿合株式会社 | The manufacture method of cylindrical base member material, former disk and former disk |
| TW201826048A (en) * | 2016-12-02 | 2018-07-16 | 日商新克股份有限公司 | Manufacturing method of metallic mold roll for pattern transfer having minute periodical structure and metallic mold roll for pattern transfer |
| TWM594168U (en) * | 2019-12-25 | 2020-04-21 | 光群雷射科技股份有限公司 | Hologram pattern transfer device |
| TW202142965A (en) * | 2020-05-08 | 2021-11-16 | 光群雷射科技股份有限公司 | Pattern transfer method for seamless hologram |
-
2020
- 2020-05-08 CN CN202010381971.0A patent/CN113625526A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1357802A (en) * | 2000-10-19 | 2002-07-10 | 伊利诺斯器械工程公司 | Light-limiting polyimide film for surface to be knurled |
| TW200412291A (en) * | 2003-01-10 | 2004-07-16 | K Laser Technology Inc | Hologram heat shrink film and method for making same |
| CN203381319U (en) * | 2013-07-23 | 2014-01-08 | 上海宏盾防伪材料有限公司 | Round roller provided with seamless laser pattern and used for direct molding |
| CN203528042U (en) * | 2013-09-26 | 2014-04-09 | 上海宏盾防伪材料有限公司 | Holographic BOPP seamless die-pressing plate roller |
| CN107894691A (en) * | 2013-12-20 | 2018-04-10 | 迪睿合株式会社 | The manufacture method of cylindrical base member material, former disk and former disk |
| TW201826048A (en) * | 2016-12-02 | 2018-07-16 | 日商新克股份有限公司 | Manufacturing method of metallic mold roll for pattern transfer having minute periodical structure and metallic mold roll for pattern transfer |
| TWM594168U (en) * | 2019-12-25 | 2020-04-21 | 光群雷射科技股份有限公司 | Hologram pattern transfer device |
| TW202142965A (en) * | 2020-05-08 | 2021-11-16 | 光群雷射科技股份有限公司 | Pattern transfer method for seamless hologram |
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