TWI723947B - Manufacturing method of optical film in transfer manner and manufacturing method of transfer mother die - Google Patents

Abstract

The present invention provides a manufacturing method of an optical film in a transfer manner and a manufacturing method of a transfer mother die. The manufacturing method of the transfer mother die includes: coating a negative photoresist layer onto a surface of a metal roller; using a first wavelength light source to pass through at least one mask to form a two-dimensional patterned light source irradiated on the negative photoresist layer; developing the negative photoresist layer so as to form a plurality of stamping patterns, so that the negative photoresist layer and the metal roller formed as a transfer roller; using the transfer roller to roll on a light-curing material placed on a surface of a mother die substrate so as to form a plurality of transfer micro-structure on the light-curing material; curing the light-curing material by a second wavelength light source, so that the light-curing material and the mother die substrate are jointly defined as a transfer mother die.

Description

Transfer type manufacturing method of optical film and manufacturing method of transfer master mold

The present invention relates to a manufacturing method of an optical film, in particular to a transfer type manufacturing method of an optical film and a manufacturing method of a transfer master mold.

An existing method for manufacturing an optical film is to transfer the optical microstructure on the optical film through a method of imprinting through a flat transfer master mold to form an optical film. However, the existing transfer master mold requires a special process to form a microstructure for transfer on the surface of the master mold (for example, electroforming is used to make a transfer roller, and then the transfer roller is used to imprint the master mold to form the microstructure). The above-mentioned special manufacturing process often consumes a lot of money and time, which greatly increases the manufacturing time and manufacturing cost of the optical film manufactured by the transfer method.

Therefore, the inventor believes that the above-mentioned shortcomings can be improved, and with great concentration of research and the application of scientific principles, we finally propose an invention with reasonable design and effective improvement of the above-mentioned shortcomings.

The embodiment of the present invention is to provide a transfer-type manufacturing method of an optical film and a manufacturing method of a transfer master mold, which can effectively improve the existing transfer-type manufacturing method of an optical film.

The embodiment of the present invention discloses a transfer type manufacturing method of an optical film, which includes: a transfer roller manufacturing step, which includes: a first pre-step: providing a metal roller, the metal roller having a cylindrical shape Outer surface; a coating step: coating a negative photoresist layer around 360 degrees on the outer surface of the metal drum; an exposure step: passing a first wavelength light source through at least one photomask to form a two-dimensional A patterned light source, irradiating the two-dimensional patterned light source on the surface of the negative photoresist layer, so that the part of the negative photoresist layer irradiated by the two-dimensional patterned light source forms a plurality of exposure areas, the The portion of the negative photoresist layer that is not illuminated by the two-dimensional patterned light source forms a plurality of unexposed regions; and a developing step: remove the material of the plurality of unexposed regions on the negative photoresist layer, so that the The negative photoresist layer forms a plurality of imprinted patterns; wherein, the plurality of imprinted patterns surround the outer surface of the metal cylinder, and together with the metal cylinder form a transfer roller; a transfer master The mold manufacturing step includes: a second pre-step: providing a sheet-like master mold base material and a photohardening material layer on the master mold base material; a roller embossing step: through the rotation The printing roller is rolled on the photo-curing material layer so that the photo-curing material layer is formed with a plurality of transfer microstructures whose shapes are complementary to the plurality of embossed patterns; a photo-curing step: irradiating a second A wavelength light source is applied to the photo-curing material layer to cure the photo-curing material layer, so that the photo-curing material layer and the master base material form a transfer master mold; and an optical film transfer step, It includes: a third pre-step: providing a transparent film substrate and a primer layer disposed on the surface of the film substrate; a film embossing step: passing through the transfer master mold Each of the transfer microstructures is imprinted on the primer layer, so that the primer layer forms a plurality of optical microstructures with shapes complementary to the plurality of transfer microstructures; and a thermal curing step: heating the primer layer The primer layer is used to cure the primer layer, so that the film substrate and the primer layer form an optical film.

The embodiment of the present invention also discloses a method for manufacturing a transfer master mold, which includes: a transfer roller manufacturing step, which includes: a first pre-step: providing a metal roller, the metal roller having a cylindrical outer surface A coating step: coating a negative photoresist layer around 360 degrees on the outer surface of the metal drum; an exposure step: passing a first wavelength light source through at least one photomask to form a two-dimensional pattern A light source, irradiating the two-dimensional patterned light source on the surface of the negative photoresist layer, so that the part of the negative photoresist layer irradiated by the two-dimensional patterned light source forms a plurality of exposure areas, the negative light The part of the resist layer not irradiated by the two-dimensional patterned light source forms a plurality of unexposed areas; and a developing step: remove the material of the plurality of unexposed areas on the negative photoresist layer, so that the negative The photoresist layer forms a plurality of embossed patterns, so that the negative photoresist layer and the metal roller together form a transfer roller; a transfer master mold manufacturing step includes: a second pre-step: providing a sheet A master mold substrate and a photo-curing material layer on the master mold substrate; a roller embossing step: rolling on the photo-curing material layer through the transfer roller, so that the The photo-curing material layer is formed with a plurality of transfer microstructures whose shapes are complementary to the multiple embossed patterns; a photo-curing step: irradiating a second wavelength light source on the photo-curing material layer to make the photo-curing material layer Curing, so that the photo-hardening material layer and the master mold base material form a transfer master mold.

In summary, one of the beneficial effects of the present invention is that the method for manufacturing the optical film and the method for manufacturing the transfer master mold provided by the present invention can be passed on the outer surface of the metal roller. The surface is coated with the negative photoresist layer, and a plurality of the imprint patterns are formed on the negative photoresist layer through the exposure step and the development step to form the transfer roller, and then pass through the The transfer roller makes the transfer master mold, and then the optical film is made through the transfer master mold.

Therefore, the present invention can greatly reduce the manufacturing time and manufacturing cost of the transfer master mold and the optical film manufactured by using the transfer master mold.

In order to further understand the features and technical content of the present invention, please refer to the following detailed descriptions and drawings about the present invention, but these descriptions and drawings are only used to illustrate the present invention, and do not make any claims about the protection scope of the present invention. limit.

The following are specific specific examples to illustrate the implementation of the "optical film transfer manufacturing method and transfer master mold manufacturing method" disclosed in the present invention. Those skilled in the art can understand the present disclosure from the content disclosed in this specification. The advantages and effects of the invention. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual size, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another, or one signal from another signal. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

[Example 1]

As shown in FIGS. 1 to 10, the embodiment of the present invention discloses a transfer-type manufacturing method of an optical film 800 and a manufacturing method of a transfer master mold 600 for molding the optical film 800. In order to facilitate the understanding of the transfer-type manufacturing method of the optical film 800, the manufacturing method of the transfer master 600 will be introduced first, and then the method of manufacturing the optical film 800 through the transfer master 600 will be introduced. method.

Please refer to FIG. 1, the manufacturing method of the transfer master mold 600 includes a transfer roller manufacturing step S1 and a transfer master mold manufacturing step S2, and the manufacturing method of the optical film 800 includes the transfer printing Roller manufacturing step S1, the transfer master mold manufacturing step S2, and further include an optical film transfer step S3.

Wherein, the transfer roller manufacturing step S1 includes: a first pre-step S11, a coating step S12, an exposure step S13, and a development step S14. As shown in FIG. 2, the first pre-step S11 is to provide a metal roller 110, the metal roller 110 can define a central axis 111, the metal roller 110 has an outer surface 112, the outer surface 112 is The metal roller 110 is cylindrical, and at least a part of the outer surface 112 of the metal roller 110 is made of nickel metal, chromium metal, copper metal, aluminum metal and other types of metal materials or alloy materials.

As shown in FIG. 2, the coating step S12 is to coat a negative photoresist layer 300 around 360 degrees on the outer surface 112 of the metal drum 110 through a coating device 200. The coating equipment 200 used in this embodiment includes a coating mechanism 210, a rotation module 220 disposed opposite to the coating mechanism 210, a linear drive module 230, and a A carrier 240 under the rotating module 220. Wherein, the metal drum 110 is arranged on the rotating module 220, and the metal drum 110 is driven to rotate around its central axis 111 through the rotating module 220, and the coating mechanism 210 is arranged on the linear drive On the module 230, through the linear drive module 230, the coating mechanism 210 can be driven to move back and forth in a direction parallel to the central axis 111. When the metal drum 110 is driven to rotate by the rotation module 220, the coating mechanism 210 is simultaneously driven by the linear drive module 230 to linearly shift along the direction of the central axis 111, and the negative photoresist The material is coated on the outer surface 112 of the metal roller 110 to form the negative photoresist layer 300.

As shown in FIGS. 2 and 3, after the negative photoresist material is coated on the surface of the metal roller 110, the negative photoresist layer 300 surrounding the outer surface 112 of the metal roller 110 is formed 360 degrees. In this embodiment, the thickness of the negative photoresist layer 300 is in the range of 0.1 micrometers (μm) to 8 micrometers. In particular, the coating step S12 of the present invention is implemented in a manner to maintain the uniformity of the thickness of the negative photoresist layer 300, so the negative photoresist layer 300 does not need to be limited to a thinner thickness.

In this embodiment, the negative photoresist layer 300 is made of a negative photoresist material that can be sensitive to ultraviolet light with a wavelength of 340 nanometers (nm) to 380 nanometers. In more detail, the negative photoresist layer 300 may be made of materials such as polyisoprene rubber or epoxy-based polymer, but the present invention does not take this as limit. For example, in other embodiments not shown in the present invention, the negative photoresist layer 300 may also be made of a negative photoresist material such as Thiol-enes (OSTE) polymer.

As shown in FIGS. 3 and 4, the exposure step S13 is to pass light generated by a first wavelength light source 400 through at least one mask 500 to form a two-dimensional patterned light source 410, and the two-dimensional patterned light source 410 Irradiate the surface of the negative photoresist layer 300, and make the first wavelength light source 400 and the at least one photomask 500 move relative to the surface of the negative photoresist layer 300, so that the negative photoresist layer The part 300 irradiated by the two-dimensional patterned light source 410 forms a plurality of exposed areas 301, and the part not irradiated by the two-dimensional patterned light source 410 forms a plurality of unexposed areas 302. In this embodiment, the first wavelength light source 400 may be used to emit ultraviolet light, and preferably includes at least one light-emitting diode chip capable of emitting ultraviolet light with a wavelength between 340 nm and 380 nm. Therefore, after the light generated by the first wavelength light source 400 is irradiated on the negative photoresist layer 300, the negative photoresist layer 300 can be sensitized.

In more detail, as shown in FIG. 3, in this embodiment, when the exposure step S13 is performed, the metal roller 110 can interact with the first wavelength light source 400 and at least one photomask 500. The central axis 111 is the center of relative rotation, and the first wavelength light source 400 and at least one of the mask 500 can be moved linearly and relatively to the metal roller 110 along a direction parallel to the central axis 111, and The two-dimensional patterned light source 410 can be irradiated to different positions on the surface of the negative photoresist layer 300.

As shown in FIG. 4, at least one of the photomasks 500 has a transparent substrate 510 and a plurality of shielding patterns 520 arranged on the transparent substrate 510. Wherein, the transparent substrate 510 may be a quartz substrate or a glass substrate, the plurality of shielding patterns 520 may be formed by a patterned chromium metal film, and the transparent substrate 510 is not covered by the plurality of shielding patterns 520. A plurality of light-transmitting parts 511 are formed in the shielded position.

As shown in FIG. 5, in this embodiment, the number of at least one photomask 500 used in the exposure step S13 is further limited to one, and the shielding patterns 520 on the photomask 500 are made parallel to each other. A plurality of first axial stripes 521, and a plurality of second axial stripes 522 orthogonal to the plurality of first axial stripes 521, so that the shielding pattern 520 forms a grid-like two A three-dimensional figure, and a plurality of the light-transmitting parts 511 form a rectangular shape.

As shown in FIG. 6, the developing step S14 is to remove the material of the plurality of unexposed regions 302 on the negative photoresist layer 300 so that the negative photoresist layer 300 forms a plurality of embossed patterns 310. In more detail, the developing step S14 may be performed using a developer corresponding to the material of the negative photoresist layer 300. When the developing step S14 is performed, a plurality of the undesired materials on the negative photoresist layer 300 The exposed area 302 can be dissolved and removed by the developer, while the material of the plurality of exposed areas 301 of the negative photoresist layer 300 cannot be dissolved by the developer and is retained on all of the metal roller 110. A plurality of embossed patterns 310 are formed on the outer surface 112, so that the negative photoresist layer 300 and the metal roller 110 together form a transfer roller 100.

In this embodiment, in the developing step S14, the material of the plurality of unexposed regions 302 of the negative photoresist layer 300 is completely removed, so that any two adjacent imprint patterns 310 are A gap is formed through the negative photoresist layer 300 so that the outer surface 112 of the metal roller 110 can be exposed from the gap between any two adjacent imprint patterns 310 .

In this embodiment, in the developing step S14, the height h of any one of the embossed patterns 310 is substantially equal to the thickness of the negative photoresist layer 300, so that the height of any one of the embossed patterns 310 is h is in the range of 1 micrometer to 8 micrometers, the width W of any one of the embossed patterns 310 is between 0.3 micrometers to 0.8 micrometers, and the pitch P of any two adjacent embossed patterns 310 Between 0.6 microns and 1.6 microns.

As shown in FIGS. 1, 7 and 8, the transfer master mold manufacturing step S2 includes: a second pre-step S21, a roller embossing step S22, and a light curing step S23. Wherein, the second pre-step S21 is to provide a sheet-shaped master mold substrate 610 and a photohardening material layer 620 on a surface of the master mold substrate 610. Wherein, the master mold substrate 610 can be a film made of polyethylene terephthalate (PET) material, and the photo-curing material layer 620 can be made of an ultraviolet-curing resin material. In more detail, the photo-curing material layer 620 can be cured by being irradiated with ultraviolet light having a wavelength of 395 nm to 410 nm, and the photo-curing material layer 620 has plasticity before curing.

The roller embossing step S22 in the transfer master mold manufacturing step S2 is to roll on the photo-curable material layer 620 through the transfer roller 100, so that the photo-curable material layer 620 is formed into a shape A plurality of transfer microstructures 630 that are complementary to the plurality of embossed patterns 310. The photo-curing step S23 is to irradiate the light-curing material layer 620 with light generated by a light source 700 of a second wavelength, so that the photo-curing material layer 620 and the plurality of transfer microstructures 630 are cured, and then The photo-curing material layer 620 and the master base material 610 constitute a transfer master 600.

In this embodiment, the second wavelength light source 700 may be used to emit ultraviolet light, and preferably includes at least one light-emitting diode chip capable of emitting ultraviolet light with a wavelength between 395 nm and 410 nm. Therefore, the light hardening material layer 620 can be cured by being irradiated by the light emitted by the second wavelength light source 700.

As shown in FIG. 7, in the embodiment of the present invention, in the roller embossing step S22, the master base material 610 and the photohardening material layer 620 are along the same rotation direction as the transfer roller 100 After passing through the transfer roller 100 from a feeding side 101 of the transfer roller 100, the transfer roller 100 passes through the transfer roller 100 from a discharge side 102. And in this embodiment, the master mold base 610 has light transmittance, and the second wavelength light source 700 is arranged on the side of the master mold base 610 relative to the transfer roller 100, so that The light generated by the second wavelength light source 700 can penetrate the master base material 610 and then irradiate the contact position between the photohardening material layer 620 and the transfer roller 100, thereby making the transfer roller 100 After embossing a plurality of transfer microstructures 630 on the surface of the photohardening material layer 620, it can immediately transmit the light generated by the second wavelength light source 700 to connect the photohardening material layer 620 and The plurality of transfer microstructures 630 are cured, so that the plurality of transfer microstructures 630 can be cured quickly after being formed, and the chance of deformation of the plurality of transfer microstructures 630 is reduced, thereby increasing the number of transfer microstructures 630. The precision of the shape of the transfer microstructure 630. In addition, the wavelength of the light generated by the second wavelength light source 700 used in the manufacturing step S2 of the transfer master mold and the wavelength range of the light generated by the first wavelength light source 400 are different. In other words, the wavelength range of the light generated by the second wavelength light source 700 for curing the photohardening material layer 620 is different from the photosensitive range of the negative photoresist layer 300 on the surface of the transfer roller 100 Therefore, the negative photoresist layer 300 and the plurality of embossed patterns 310 on the surface of the transfer roller 100 will not be affected by the light generated by the second wavelength light source 700.

As shown in FIGS. 1, 9 and 10, the optical film transfer step S3 includes: a third pre-step S31, a film embossing step S32, and a thermal curing step S33. Wherein, the third pre-step S31 is to provide a transparent film substrate 810 and a primer layer 820 disposed on the surface of the film substrate 810. Wherein, the film substrate 810 may be a film made of polyethylene terephthalate (PET) or oriented polypropylene film (Oriented Polypropylene, OPP), and the primer The layer 820 may be made of a transparent thermosetting epoxy resin material (Epoxy), so the primer layer 820 can be cured by heating means, and the primer layer 820 has plasticity before curing.

As shown in FIGS. 9 and 10, the film embossing step S32 is to emboss a plurality of the transfer microstructures 630 of the transfer master 600 on the primer layer 820, so that the The primer layer 820 forms a plurality of optical microstructures 830 whose shapes are complementary to the plurality of transfer microstructures 630.

In the thermal curing step S33, by heating the primer layer 820, the primer layer 820 and the plurality of optical microstructures 830 are thermally cured, so that the primer layer 820 and the film base The materials 810 together constitute the optical film 800.

[Example 2]

Referring to FIG. 11 to FIG. 13, it is the second embodiment of the present invention. It should be noted that this embodiment is similar to the above-mentioned first embodiment, so the similarities between the two embodiments will not be repeated.

As shown in FIGS. 11 and 12, in this embodiment, the at least one photomask 500 used in the exposure step S13 is defined as a first photomask 500a and a second photomask 500b, wherein the The first mask 500a has a first transparent substrate 510a, and a plurality of first shielding patterns 520a arranged on the first transparent substrate 510a along the first axis. The second photomask 500b has a second light-transmitting substrate 510b, and a plurality of second shields arranged on the second light-transmitting substrate 510b along a second axis perpendicular to the first axis. Graphic 520b.

In this embodiment, the exposure step S13 is further divided into a first exposure sub-step S131 and a second exposure sub-step S132. Wherein, the first exposure sub-step S131 is to irradiate the first-wavelength light source 400 through the first mask 500a to form a patterned light source (not shown in the figure) in the first axis to the negative photoresist The surface of the layer 300 is exposed to the negative photoresist layer 300. The second exposure sub-step S132 is to pass the first wavelength light source 400 through the second mask 500b to form a second axial direction A patterned light source (not shown in the figure) irradiates the surface of the negative photoresist layer 300 to expose the negative photoresist layer.

As shown in FIG. 13, after the negative photoresist layer 300 is repeatedly exposed through the first exposure sub-step S131 and the second exposure sub-step S132, multiple exposures can be formed on the surface of the negative photoresist layer 300. Exposure patterns of the exposed area 301 and a plurality of unexposed areas 302. Wherein, in the first exposure sub-step S131 and the second exposure sub-step S132, the negative photoresist layer 300 is not protected by the plurality of first masking patterns 520a and the plurality of second masking patterns 520b A plurality of the exposure regions 301 are formed at the masked positions. In the first exposure sub-step S131 and the second exposure sub-step S132, the negative photoresist layer 300 is shielded by a plurality of the first shielding patterns 520a and a plurality of the second shielding patterns 520b A plurality of unexposed regions 302 are formed in the position.

In particular, in the second embodiment of the present invention, in the first exposure sub-step S131 and the second exposure sub-step S132, the first photomask 500a and the second photomask 500b are respectively used for the negative exposure. The photoresist layer 300 is exposed to light, but the present invention is not limited to this. For example, the present invention can also use the same mask to expose the negative photoresist layer 300 in the first exposure sub-step S131 and the second exposure sub-step S132. In more detail, in the present invention, after the first exposure sub-step S131 is implemented, the first photomask 500a can be rotated by 90 degrees, and then the first photomask 500a rotated by 90 degrees can be aligned with the first photomask 500a. The negative photoresist layer 300 performs the second exposure sub-step S132.

[Example Three]

Refer to Figure 14 and Figure 15, which is the third embodiment of the present invention. It should be noted that this embodiment is similar to the above-mentioned first embodiment, so the similarities between the two embodiments will not be repeated.

As shown in FIGS. 14 and 15, in the present embodiment, in the developing step S14, the material of the plurality of unexposed regions 302 of the negative photoresist layer 300 is removed to a depth less than that of the negative photoresist layer Therefore, the material of the negative photoresist layer 300 in the plurality of unexposed regions 302 is not completely removed, but is shielded on the outer surface 112 of the metal roller 110.

In more detail, in this embodiment, the thickness t of the negative photoresist layer 300 is in the range of 1 micrometer to 10 micrometers, and in the developing step S14, the negative photoresist layer 300 is The depth of the material in the unexposed area 302 that is removed by the developer is between 0.2 μm and 0.6 μm, so that the material in the negative photoresist layer 300 in the plurality of unexposed areas 302 is moved. The depth of the division is less than the thickness t of the negative photoresist layer 300, so that the negative photoresist layer 300 forms a plurality of blind holes at the positions of the plurality of unexposed regions 302, and makes any one of the imprints The height h of the pattern 310 is equal to the material depth of the negative photoresist layer 300 that is removed by the developer in any unexposed area 302, and is between 0.2 μm and 0.6 μm.

[Technical Effects of Embodiments of the Invention]

One of the beneficial effects of the present invention is that the transfer type manufacturing method of the optical film and the manufacturing method of the transfer master mold provided by the present invention can be achieved by coating the outer surface of the metal roller with the A negative photoresist layer, and through the exposure step and the development step, a plurality of the imprint patterns are formed on the negative photoresist layer to form the transfer roller, which is then manufactured through the transfer roller The transfer master mold is then used to manufacture the optical film through the transfer master mold.

Therefore, the present invention can greatly reduce the manufacturing time and manufacturing cost of the transfer master mold and the optical film manufactured by using the transfer master mold.

The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

100: Transfer roller 101: feed side 102: discharge side 110: Metal roller 111: central axis 112: Outer surface 200: Coating equipment 210: coating mechanism 220: Rotating module 230: Linear drive module 240: bearing platform 300: negative photoresist layer 301: exposure area 302: unexposed area 310: Embossed graphics 400: first wavelength light source 410: Two-dimensional graphical light source 500: Mask 510: Transparent substrate 511: Translucent part 520: Shading graphics 521: First axial stripes 522: Second axial stripes 500a: first mask 510a: the first transparent substrate 520a: the first masking figure 500b: second mask 510b: second transparent substrate 520b: The second masking figure 600: transfer master 610: Master base material 620: Light hardening material layer 630: Transfer microstructure 700: second wavelength light source 800: optical diaphragm 810: Diaphragm substrate 820: Primer layer 830: Optical Microstructure S1: manufacturing steps of transfer roller S11: The first pre-step S12: Coating step S13: Exposure step S14: Development step S2: Manufacturing steps of transfer master mold S21: Second pre-step S22: Roller embossing steps S23: Light hardening step S3: Optical film transfer step S31: The third pre-step S32: Film embossing step S33: Thermal curing step P: Pitch of embossed graphics W: Width of embossed graphics h: height of embossed graphics t: thickness of negative photoresist layer

FIG. 1 is a schematic flow chart of a transfer type manufacturing method of an optical film according to Embodiment 1 of the present invention.

2 is a schematic diagram of the coating step of the transfer type manufacturing method of the optical film according to the first embodiment of the present invention.

3 is a three-dimensional schematic diagram of the exposure step of the transfer type manufacturing method of the optical film according to the first embodiment of the present invention.

4 is an enlarged schematic cross-sectional view of the exposure step of the transfer type manufacturing method of the optical film according to the first embodiment of the present invention.

5 is a schematic plan view of the photomask used in the exposure step of the transfer type manufacturing method of the optical film according to the first embodiment of the present invention.

6 is a schematic partial cross-sectional view of the negative photoresist layer and the metal roller after the development step is completed in the first embodiment of the present invention.

FIG. 7 is a schematic diagram of the operation of the manufacturing step of the transfer master mold in the transfer manufacturing method of the optical film according to the first embodiment of the present invention.

Fig. 8 is a partial enlarged schematic view taken from part VIII of Fig. 7.

9 and 10 are schematic diagrams of the optical film transfer step in the transfer manufacturing method of the optical film according to the first embodiment of the present invention.

11 is a schematic plan view of the first photomask used in the first exposure substep of the transfer manufacturing method of the optical film according to the second embodiment of the present invention.

12 is a schematic plan view of the second photomask used in the second exposure substep of the transfer type manufacturing method of the optical film according to the second embodiment of the present invention.

13 is a schematic plan view of the exposure pattern formed on the negative photoresist layer through the first exposure sub-step and the second exposure sub-step in the transfer manufacturing method of the optical film according to the second embodiment of the present invention.

14 is a schematic diagram of the exposure step of the transfer type manufacturing method of the optical film according to the third embodiment of the present invention.

15 is a schematic diagram of the development step of the transfer type manufacturing method of the optical film according to the third embodiment of the present invention.

100: Transfer roller

101: feed side

102: discharge side

110: Metal roller

112: Outer surface

300: negative photoresist layer

310: Embossed graphics

600: transfer master

610: Master base material

620: Light hardening material layer

630: Transfer microstructure

700: second wavelength light source

Claims (10)

A transfer type manufacturing method of an optical film includes: a transfer roller manufacturing step, which includes: a first pre-step: providing a metal roller having a cylindrical outer surface; and a coating Steps: coating a negative photoresist layer surrounding 360 degrees on the outer surface of the metal roller; an exposure step: penetrating a light source of a first wavelength through at least one photomask to form a two-dimensional patterned light source. The two-dimensional patterned light source is irradiated on the surface of the negative photoresist layer, so that the part of the negative photoresist layer irradiated by the two-dimensional patterned light source forms a plurality of exposure areas, and the negative photoresist layer is not The part irradiated by the two-dimensional patterned light source forms a plurality of unexposed areas; and a developing step: remove the material of the plurality of unexposed areas on the negative photoresist layer, so that the negative photoresist layer is formed A plurality of embossed patterns, so that the negative photoresist layer and the metal roller together form a transfer roller; a transfer master mold manufacturing step, which includes: a second pre-step: providing a sheet-shaped master Mold base material and a photo-curing material layer on the master mold base material; a roller embossing step: rolling on the photo-curing material layer through the transfer roller to make the photo-curing material layer A plurality of transfer microstructures with shapes complementary to the plurality of embossed patterns are formed; and a photo-curing step: irradiating a second wavelength light source on the photo-curing material layer to cure the photo-curing material layer, and then So that the photohardening material layer and the master mold base material constitute a transfer master mold; and an optical film transfer step, which includes: a third pre-step: providing a transparent film base material and setting In the film A primer layer on the surface of the sheet substrate; a film embossing step: a plurality of the transfer microstructures of the transfer master mold are embossed on the primer layer, so that the primer layer is formed A plurality of optical microstructures whose shapes are complementary to the plurality of transfer microstructures; and a thermal curing step: heating the primer layer to cure the primer layer, so that the film substrate and the bottom The lacquer layer constitutes an optical film. The transfer type manufacturing method of the optical film according to claim 1, wherein the master base material has light transmittance, and in the light curing step, the second wavelength light source is arranged in the One side of the master base material opposite to the transfer roller, and enables the light generated by the second wavelength light source to pass through the master base material and irradiate the photohardening material layer and the transfer roller. The contact position of the printing roller makes the photohardening material layer and the plurality of transfer microstructures solidify. The transfer type manufacturing method of an optical film according to claim 1, wherein the wavelength of the light emitted by the first wavelength light source is between 340 nanometers (nm) and 380 nanometers, and the second wavelength light source emits light The wavelength ranges from 395nm to 410nm. The transfer type manufacturing method of an optical film according to claim 1, wherein the primer layer is made of a thermosetting resin material, and the thermal curing step is to heat the primer layer to make the The primer layer is cured. The transfer type manufacturing method of an optical film according to claim 1, wherein, in the exposure step, the number of at least one of the photomasks is further limited to one, and the photomask has a light-transmitting substrate, And a plurality of shielding patterns arranged on the light-transmitting substrate, and the shielding pattern is composed of a plurality of first parallel The axial stripes are formed by a plurality of second axial stripes orthogonal to the plurality of the first axial stripes. The transfer type manufacturing method of an optical film according to claim 1, wherein at least one of the photomasks used in the exposing step is defined as a first photomask and a second photomask; wherein the first photomask A photomask has a first transparent substrate and a plurality of first shielding patterns arranged on the first transparent substrate along a first axis; the second photomask has a second transparent substrate , And a plurality of second shielding patterns arranged on the second transparent substrate along a second axis perpendicular to the first axis; the exposure step is further divided into a first exposure sub-step and a second exposure step The second exposure sub-step, wherein the first exposure sub-step is to pass the first wavelength light source through the first photomask and irradiate the surface of the negative photoresist layer; the second exposure sub-step is to The first wavelength light source penetrates the second photomask and irradiates the surface of the negative photoresist layer. The transfer type manufacturing method of an optical film according to claim 1, wherein, in the exposure step, the first wavelength light source and at least one of the photomask and the surface of the negative photoresist layer move relatively, The surface of the negative photoresist layer is irradiated by the two-dimensional patterned light source to form a plurality of the exposed areas and a plurality of the unexposed areas. The transfer type manufacturing method of the optical film according to claim 1, wherein the thickness of the negative photoresist layer is in the range of 0.1 micrometers (μm) to 8 micrometers; in the developing step, a plurality of The negative photoresist layer in the unexposed area is completely removed, so that the outer surface of the metal roller is exposed from a plurality of unexposed areas. The transfer type manufacturing method of the optical film according to claim 1, wherein the thickness of the negative photoresist layer is in the range of 1 micrometer to 10 micrometers; in the developing step, the thickness of the plurality of unexposed areas The negative photoresist layer is not completely removed, but is shielded on the outer surface of the metal roller. A method for manufacturing a transfer master mold includes: a transfer roller manufacturing step, which includes: a first pre-step: providing a metal roller having a cylindrical outer surface; and a coating step: Coating a negative photoresist layer that surrounds 360 degrees on the outer surface of the metal roller; an exposure step: a light source of a first wavelength is penetrated through at least one mask to form a two-dimensional patterned light source, and the two A three-dimensional patterned light source irradiates the surface of the negative photoresist layer, so that the part of the negative photoresist layer irradiated by the two-dimensional patterned light source forms a plurality of exposure areas, and the negative photoresist layer is not exposed to the The part irradiated by the two-dimensional patterned light source forms a plurality of unexposed regions; and a developing step: remove the material of the plurality of unexposed regions on the negative photoresist layer, so that the negative photoresist layer forms a plurality of Embossed graphics; wherein a plurality of the embossed graphics surround the outer surface of the metal roller, and together with the metal roller form a transfer roller; and a transfer master mold manufacturing step, which includes: A second pre-step: providing a sheet-shaped master mold substrate and a photohardening material layer on the master mold substrate; a roller embossing step: rolling on the light through the transfer roller On the hardening material layer, so that the light hardening material layer is formed with a plurality of transfer microstructures whose shapes are complementary to the plurality of embossed patterns; and a light hardening step: irradiating a second wavelength light source on the light hardening Material layer The photo-curable material layer is cured, so that the photo-curable material layer and the master mold base material form a transfer master mold.

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