TWM585675U - Processing apparatus - Google Patents

Processing apparatus Download PDF

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Publication number
TWM585675U
TWM585675U TW108208750U TW108208750U TWM585675U TW M585675 U TWM585675 U TW M585675U TW 108208750 U TW108208750 U TW 108208750U TW 108208750 U TW108208750 U TW 108208750U TW M585675 U TWM585675 U TW M585675U
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Taiwan
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light
processing
workpiece
scanning device
light source
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TW108208750U
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Chinese (zh)
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邱國育
戴閣廷
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新代科技股份有限公司
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Priority to TW108208750U priority Critical patent/TWM585675U/en
Publication of TWM585675U publication Critical patent/TWM585675U/en

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Abstract

A processing apparatus, which is capable of processing a workpiece. The processing apparatus includes an optical assembly and a processing light source, the optical assembly further includes a lens module, an auxiliary light source and at least a first scanning device. The auxiliary light source emits an auxiliary light to the workpiece, wherein a light shape of the auxiliary light is transformed to linear light shape on a surface of the workpiece. The processing apparatus acquires the surface information of the workpiece by scanning the workpiece through the linear light shape. The processing light source emits a processing light, and the processing light is transmitted to process the workpiece by the at least one first scanning device. The processing apparatus of the present utility model can acquire surface information of whole surface of the workpiece by scanning the surface of the workpiece instead of installing extra robotic arms or sliding rails. Thus, the working efficiency of the processing apparatus is enhanced.

Description

加工裝置Processing device

本創作是有關於一種加工裝置,尤其是有關於一種具有輔助光源以掃描工件表面資訊的的加工裝置。This creation relates to a processing device, and more particularly to a processing device with an auxiliary light source to scan the surface information of a workpiece.

現有的光學加工裝置通常都是利用裝置內部的光學系統向工件照射由光源發出的光線,用以進行打標(marking)、曝光(exposure)、蝕刻(etching)、沖孔(punching)、刻劃(scribing)或切割(dicing)等工作。而工件的待加工表面不一定是平整的平面,可能具有多個明顯的凹凸起伏處,因此現有的光學加工裝置中還需要一種外掛式的光學掃描裝置,用於掃描工件的表面資訊以提升光學加工裝置的加工精確度。Existing optical processing devices usually use the optical system inside the device to irradiate the workpiece with light emitted by the light source for marking, exposure, etching, punching, and scoring. (Scribing) or dicing. The surface to be processed of the workpiece is not necessarily a flat surface, and may have multiple obvious bumps and undulations. Therefore, an existing optical processing device also needs an external optical scanning device that scans the surface information of the workpiece to improve the optical quality. Machining accuracy of the processing device.

然而光學掃描裝置與光學加工裝置是兩個各自獨立的設備,因此光學加工裝置的製造廠商或設備整合廠商必須要自行整合這兩種設備,例如將光學掃描裝置與光學加工裝置各自的座標系統相互進行轉換等。而這種外掛式的光學掃描裝置僅能夠取得工件一部分的表面資訊,若要取得工件整體的待加工表面資訊則需要另外替光學掃描裝置加裝機械手臂、滑軌、履帶等移動機構,如此一來會大幅增加設備所需成本。此外,現有的光學加工裝置工作時,需先根據工件的圖面設定加工時程(或程式),再根據從光學掃描裝置得到的表面資訊修改欲加工的位置,如此一來整體工時也會大幅增加。因此,仍有必要提供一種加工裝置以解決現有光學加工裝置的缺點。However, the optical scanning device and the optical processing device are two separate devices. Therefore, the manufacturer of the optical processing device or the device integration manufacturer must integrate the two devices by themselves, for example, the coordinate systems of the optical scanning device and the optical processing device are mutually related. Perform conversions, etc. Such an external optical scanning device can only obtain surface information of a part of the workpiece. To obtain surface information of the entire workpiece to be processed, it is necessary to additionally add a robot arm, a slide rail, a track and other moving mechanisms to the optical scanning device. This will significantly increase the cost of the equipment. In addition, when the existing optical processing device works, it is necessary to first set the processing schedule (or program) according to the drawing of the workpiece, and then modify the position to be processed according to the surface information obtained from the optical scanning device. As a result, the overall working time will also A substantial increase. Therefore, it is still necessary to provide a processing device to solve the disadvantages of the existing optical processing devices.

先前技術段落只是用來幫助了解本創作內容,因此在先前技術段落所揭露的內容可能包含一些沒有構成所屬技術領域中具有通常知識者所知道的習知技術。在先前技術段落所揭露的內容,不代表所述內容或者本創作一個或多個實施例所要解決的問題,在本創作申請前已被所屬技術領域中具有通常知識者所知曉或認知。The prior art paragraphs are only used to help understand the content of the creation, so the content disclosed in the prior art paragraphs may contain some conventional technologies that do not constitute the knowledge of those skilled in the art. The content disclosed in the previous technical paragraphs does not represent the content or the problem to be solved by one or more embodiments of the present invention, and has been known or recognized by those with ordinary knowledge in the technical field to which this invention belongs before the application for this creation.

根據現有技術的缺點,本創作的目的是提供一種加工裝置,其具有輔助光源可掃描待加工的工件表面,以取得整個工件表面的表面資訊。According to the shortcomings of the prior art, the purpose of the present invention is to provide a processing device with an auxiliary light source that can scan the surface of a workpiece to be processed to obtain surface information of the entire workpiece surface.

本創作的另一目的是提供一種加工裝置,其不須另外安裝機械手臂或滑軌等移動設備即可對待加工工件表面進行掃描,以提高加工裝置本身的工作效能。Another purpose of this creation is to provide a processing device that can scan the surface of a workpiece to be processed without installing a mobile device such as a robot arm or a slide rail, so as to improve the working efficiency of the processing device itself.

本創作的其他目的和優點可以從本創作所揭露的技術特徵中得到進一步的了解。Other purposes and advantages of this creation can be further understood from the technical features disclosed in this creation.

為達上述一部分或全部目的或是其他目的,本創作的一實施例揭露一種加工裝置,用於加工一工件,包括光學組件與加工光源,光學組件包括透鏡模組、輔助光源至少一第一掃描裝置,輔助光源用於發出輔助光線,輔助光線穿過透鏡模組並經由至少一第一掃描裝置照射工件,輔助光線經由透鏡模組轉換光形並於工件表面形成線狀光斑,加工裝置透過線狀光斑掃描工件以獲得工件的表面資訊,加工光源用於發出加工光線至光學組件,其中加工光線經由至少一第一掃描裝置加工工件。In order to achieve some or all of the above or other purposes, an embodiment of the present invention discloses a processing device for processing a workpiece, including an optical component and a processing light source. The optical component includes a lens module and an auxiliary light source for at least one first scan. Device, the auxiliary light source is used for emitting auxiliary light, the auxiliary light passes through the lens module and illuminates the workpiece through at least one first scanning device, the auxiliary light transforms the light shape through the lens module and forms a linear light spot on the surface of the workpiece, and the processing device transmits the light The light spot scans the workpiece to obtain the surface information of the workpiece. The processing light source is used to emit processing light to the optical component, wherein the processing light processes the workpiece through at least one first scanning device.

在一實施例中,加工裝置還包括感光元件以及控制單元,輔助光線照射工件並形成反射光,其中控制單元電性連接於透鏡模組、輔助光源、至少一第一掃描裝置、加工光源以及感光元件,且感光元件感測反射光並對應發出感測訊號至控制單元。In one embodiment, the processing device further includes a light receiving element and a control unit, and the auxiliary light irradiates the workpiece to form reflected light. The control unit is electrically connected to the lens module, the auxiliary light source, at least one first scanning device, the processing light source, and the light sensing element. Element, and the light receiving element senses the reflected light and correspondingly sends a sensing signal to the control unit.

在一實施例中,控制單元根據感測訊號控制加工光源與至少一第一掃描裝置以加工工件。In one embodiment, the control unit controls the processing light source and the at least one first scanning device to process the workpiece according to the sensing signal.

在一實施例中,光學組件還包括第二掃描裝置,控制模組電性連接於第二掃描裝置,且加工光線依序經由第二掃描裝置與至少一第一掃描裝置以加工工件。In an embodiment, the optical component further includes a second scanning device, the control module is electrically connected to the second scanning device, and the processing light passes through the second scanning device and at least one first scanning device in order to process the workpiece.

在一實施例中,感測訊號包括多個影像訊號,且控制單元根據這些影像訊號計算工件表面資訊以選擇性地控制加工光源、至少一第一掃描裝置與第二掃描裝置。In one embodiment, the sensing signal includes a plurality of image signals, and the control unit calculates workpiece surface information according to the image signals to selectively control the processing light source, at least one first scanning device and second scanning device.

在一實施例中,透鏡模組包括光形調整透鏡以及切換結構,控制單元控制切換結構以使光形調整透鏡移入或移離輔助光線的光路徑。In one embodiment, the lens module includes a light shape adjustment lens and a switching structure, and the control unit controls the switching structure to move the light shape adjustment lens into or away from a light path of the auxiliary light.

在一實施例中,光學組件還包括場鏡模組,且場鏡模組聚焦加工光線以加工工件。In one embodiment, the optical component further includes a field lens module, and the field lens module focuses processing light to process the workpiece.

在一實施例中,光學組件還包括分光鏡,且加工光線的光路徑與輔助光線的光路徑至少部分重合於分光鏡。In an embodiment, the optical component further includes a beam splitter, and the light path of the processing light and the light path of the auxiliary light at least partially overlap the light splitter.

基於上述,本創作的實施例至少具有以下其中一個優點或功效。在本創作的實施例中,光學組件中具有透鏡模組,輔助光源發出的輔助光線經過透鏡模組轉換並經由至少一第一掃描裝置照射工件,而在工件表面上形成線狀光斑,如此一來即可在不額外安裝機械手臂或滑軌等移動設備的狀況下掃描工件表面並取得整個工件表面的表面資訊,提高加工裝置本身的工作效能。Based on the above, the embodiment of the present invention has at least one of the following advantages or effects. In the embodiment of the present invention, the optical module has a lens module, and the auxiliary light emitted by the auxiliary light source is converted by the lens module and irradiates the workpiece through at least one first scanning device to form a linear light spot on the surface of the workpiece. In this way, the surface of the workpiece can be scanned and the surface information of the entire workpiece surface can be obtained without additional mobile equipment such as a robot arm or a slide rail, thereby improving the working efficiency of the processing device itself.

為讓本創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above features and advantages of this creation more comprehensible, embodiments are described below in detail with the accompanying drawings as follows.

有關本創作之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本創作。The foregoing and other technical contents, features, and effects of this creation will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front, or rear, are only directions referring to the attached drawings. Therefore, the terminology used is used to explain and is not used to limit the creation.

圖1是根據本創作所揭露的一實施例,表示加工裝置的架構示意圖。請參考圖1,加工裝置10適於加工工件40,加工裝置10包括光學組件20與加工光源30。光學組件20還包括透鏡模組22、輔助光源24以及至少一個第一掃描裝置26(圖1中示意性地繪示為2個第一掃描裝置26,但並不以此為限),輔助光源24用於發出輔助光線241,其中輔助光線241穿過透鏡模組22並經由至少一個第一掃描裝置26照射工件40,且輔助光線241經由透鏡模組22將光形由點狀轉換為線狀,並於工件40的表面41形成線狀光斑42,如此一來,加工裝置10可透過線狀光斑42掃描工件40的表面41,以獲得表面41的表面資訊。舉例而言,第一掃描裝置26例如是可旋轉的反射鏡,當第一掃描裝置26旋轉時即可改變輔助光線241的照射方向,也就是說可以改變線狀光斑42於工件40的表面41的位置,使加工裝置10得以透過線狀光斑42掃描表面41上的其他區域。FIG. 1 is a schematic diagram showing a structure of a processing device according to an embodiment disclosed in the present invention. Referring to FIG. 1, the processing device 10 is suitable for processing a workpiece 40. The processing device 10 includes an optical component 20 and a processing light source 30. The optical component 20 further includes a lens module 22, an auxiliary light source 24, and at least one first scanning device 26 (schematically shown as two first scanning devices 26 in FIG. 1, but not limited thereto). 24 is used to emit auxiliary light 241, wherein the auxiliary light 241 passes through the lens module 22 and illuminates the workpiece 40 through at least one first scanning device 26, and the auxiliary light 241 converts the light shape from a point shape to a line shape through the lens module 22 A linear light spot 42 is formed on the surface 41 of the workpiece 40. In this way, the processing device 10 can scan the surface 41 of the workpiece 40 through the linear light spot 42 to obtain surface information of the surface 41. For example, the first scanning device 26 is, for example, a rotatable mirror. When the first scanning device 26 is rotated, the irradiation direction of the auxiliary light 241 can be changed, that is, the linear light spot 42 can be changed on the surface 41 of the workpiece 40. The position allows the processing device 10 to scan other areas on the surface 41 through the linear light spot 42.

請繼續參考圖1,加工光源30用於發出加工光線31至光學組件20,其中加工光線31經由至少一個第一掃描裝置26以加工工件40,也就是說,加工光線31照射至第一掃描裝置26後,當第一掃描裝置26旋轉時即可改變加工光線31的照射方向,以調整加工光線31於工件40的表面41的加工位置。本實施例中,輔助光源24與加工光源30例如是雷射光源,其中加工光源30的功率高於輔助光源24的功率。舉例而言,輔助光源24例如是功率約20mW的雷射光源,較佳的是採用藍光或綠光雷射光源,以提高感測準確性,加工光源30例如是功率約20w至2kW的雷射光源,用以對工件40進行雷射加工,其中雷射光源例如是氦氖雷射、二氧化碳雷射、雷射二極體或其他適當的雷射光源,此外,輔助光源24與加工光源30也可以設計為能夠發出其他波長的光例如紅光、紅外光、紫外光等,也可使用其他功率足夠的光源取代雷射光源,本創作不以此為限。Please continue to refer to FIG. 1, the processing light source 30 is used for emitting processing light 31 to the optical component 20, wherein the processing light 31 passes through at least one first scanning device 26 to process the workpiece 40, that is, the processing light 31 is irradiated to the first scanning device. After 26, when the first scanning device 26 rotates, the irradiation direction of the processing light 31 can be changed to adjust the processing position of the processing light 31 on the surface 41 of the workpiece 40. In this embodiment, the auxiliary light source 24 and the processing light source 30 are, for example, laser light sources, and the power of the processing light source 30 is higher than the power of the auxiliary light source 24. For example, the auxiliary light source 24 is, for example, a laser light source with a power of about 20mW, and a blue or green laser light source is preferably used to improve the sensing accuracy. The processing light source 30 is, for example, a laser with a power of about 20w to 2kW. The light source is used for laser processing the workpiece 40. The laser light source is, for example, helium-neon laser, carbon dioxide laser, laser diode or other appropriate laser light source. In addition, the auxiliary light source 24 and the processing light source 30 are also It can be designed to emit light of other wavelengths such as red, infrared, ultraviolet, etc., or other light sources with sufficient power can be used to replace the laser light source. This creation is not limited to this.

圖2是根據本創作所揭露的一實施例,表示加工裝置的系統方塊示意圖。請參考圖1與圖2,加工裝置10還包括感光元件50以及控制單元60,輔助光線241照射工件40時會形成反射光242,其中控制單元60電性連接於透鏡模組22、輔助光源24、第一掃描裝置26、加工光源30以及感光元件50,且感光元件50感測反射光242並對應發出感測訊號至控制單元60。本實施例中,感光元件50例如是CCD(Charge-coupled Device,感光耦合元件)感光設備,控制單元60例如是有單核心或多核心的中央處理單元(Central Processing Unit,CPU),或是其他可程式化之一般用途或特殊用途的微處理器(Microprocessor)、數位訊號處理器(Digital Signal Processor,DSP)、可程式化控制器、特殊應用積體電路(Application Specific Integrated Circuit,ASIC)或其他類似元件或上述元件的組合搭配,本創作對此並不加以限制。FIG. 2 is a block diagram showing a system of a processing device according to an embodiment disclosed in the present invention. Please refer to FIGS. 1 and 2. The processing device 10 further includes a photosensitive element 50 and a control unit 60. When the auxiliary light 241 irradiates the workpiece 40, a reflected light 242 is formed. The control unit 60 is electrically connected to the lens module 22 and the auxiliary light source 24. , The first scanning device 26, the processing light source 30, and the photosensitive element 50, and the photosensitive element 50 senses the reflected light 242 and correspondingly sends a sensing signal to the control unit 60. In this embodiment, the light sensing element 50 is, for example, a CCD (Charge-coupled Device) light sensing device, and the control unit 60 is, for example, a central processing unit (CPU) with a single core or multiple cores, or other Programmable general-purpose or special-purpose microprocessor (Microprocessor), digital signal processor (DSP), programmable controller, application specific integrated circuit (ASIC) or other Similar components or combinations of the above components are not limited in this creation.

請繼續參考圖1與圖2,透鏡模組22包括光形調整透鏡221與切換結構222,光形調整透鏡221裝設於切換結構222上,控制單元60控制切換結構222以使光形調整透鏡221移入或移離輔助光線241的光路徑。舉例而言,當不需對工件40的表面41進行掃描時,控制單元60可控制切換結構222將光形調整透鏡221移動至位置223。本實施例中,光形調整透鏡221例如是柱狀透鏡(columnar lens)、鮑威爾透鏡(Powell lens)或是其他能夠將點狀光斑在一特定方向上擴展為線狀的光學元件,切換結構222例如是採用氣動式切換機構、旋轉式切換機構、滑軌模組或是其他合適的機構,本創作不以此為限。Please continue to refer to FIG. 1 and FIG. 2. The lens module 22 includes a light shape adjustment lens 221 and a switching structure 222. The light shape adjustment lens 221 is installed on the switching structure 222. The control unit 60 controls the switching structure 222 to make the light shape adjustment lens. 221 moves in or out of the light path of the auxiliary ray 241. For example, when the surface 41 of the workpiece 40 does not need to be scanned, the control unit 60 may control the switching structure 222 to move the light shape adjustment lens 221 to the position 223. In this embodiment, the light shape adjusting lens 221 is, for example, a columnar lens, a Powell lens, or other optical elements capable of expanding a spot light spot into a line shape in a specific direction, and the switching structure 222 For example, a pneumatic switching mechanism, a rotary switching mechanism, a slide rail module, or other suitable mechanisms are used, and this creation is not limited to this.

請參考圖1與圖2,一般而言,工件40的表面41上通常具有多個凹凸不平處(圖中示意性地繪示2個具有特定幾何形狀的凹槽43A、43B,但不限於此),當加工裝置10發出的加工光線31對其中一個凹槽43A進行加工時,控制單元60可同時控制輔助光源24以形成線狀光斑41掃描另一凹槽43B。感光元件50再根據接收到的反射光242所對應發出的感測訊號,例如是包含各凹槽43A、43B的影像資訊,控制單元60根據這些影像資訊進行工件表面41與各凹槽43A、43B的表面資訊的計算,再根據這些表面資訊換算出各種加工資訊,例如工件補償量、焊道位置座標等,如此一來控制單元60即可根據這些加工資訊控制加工光源60與第一掃描裝置26以對工件40進行加工。相較於現有的光加工裝置,本創作的加工裝置10可在不額外安裝機械手臂或滑軌等移動設備的狀況下掃描工件表面並取得整個工件的表面資訊,提高加工裝置10本身的工作效能。此外,本實施例經由透鏡模組22改變輔助光線241的光形而在工件表面41上形成線狀光斑42,因此能夠透過線狀光斑42直接掃描工件40,以獲得表面41的表面資訊並透過控制單元60即時轉換為加工資訊。此外當需要對多個工件進行加工時,加工裝置10也可以同時透過線狀光斑42同時掃描多個工件,如此一來能夠大幅減少加工所需時間。Please refer to FIG. 1 and FIG. 2. In general, the surface 41 of the workpiece 40 usually has a plurality of irregularities (the diagram schematically illustrates two grooves 43A, 43B with a specific geometric shape, but is not limited thereto). ), When the processing light 31 emitted from the processing device 10 processes one of the grooves 43A, the control unit 60 may simultaneously control the auxiliary light source 24 to form a linear light spot 41 to scan the other groove 43B. The light sensing element 50 then according to the sensing signal corresponding to the received reflected light 242, for example, contains image information of each groove 43A, 43B, and the control unit 60 performs the workpiece surface 41 and each groove 43A, 43B according to these image information. According to the calculation of the surface information, various processing information is converted based on the surface information, such as workpiece compensation amount, bead position coordinates, etc., so that the control unit 60 can control the processing light source 60 and the first scanning device 26 according to the processing information. To process the workpiece 40. Compared with the existing optical processing device, the processing device 10 of the present invention can scan the surface of the workpiece and obtain the surface information of the entire workpiece without additional mobile equipment such as a robot arm or a slide rail, thereby improving the working efficiency of the processing device 10 itself. . In addition, in this embodiment, the light shape of the auxiliary light 241 is changed through the lens module 22 to form a linear light spot 42 on the workpiece surface 41. Therefore, the workpiece 40 can be directly scanned through the linear light spot 42 to obtain the surface information of the surface 41 and transmit The control unit 60 is immediately converted into processing information. In addition, when multiple workpieces need to be processed, the processing device 10 can simultaneously scan multiple workpieces through the linear light spot 42 at the same time, so that the time required for processing can be greatly reduced.

請參考圖1,本實施例中,加工裝置10還包括殼體21,殼體21包覆光學組件20內的所有元件與感光元件50,如此一來,使用者不需要自行整合或組裝這些元件,提高加工裝置10的使用便利性。此外,光學組件20還包括至少一分光鏡28(圖中示意性地繪示1個,但不以此為限),分光鏡28例如是半穿透半反射鏡,本實施例中分光鏡28可反射輔助光線241並令加工光線31穿透,如此一來輔助光線241與加工光線31在傳遞至第一掃描裝置26的至少部分光路徑為共用,可簡化光學組件20內部光路徑的複雜度。另外,光學組件20還可選擇性地設置場鏡模組29,場鏡模組29例如是包括F-θ透鏡(F-theta lens,又稱平場聚焦透鏡),用以聚焦輔助光線241與加工光線31,然而本創作並不以此為限,F-θ透鏡可以其他能夠聚焦光線的透鏡取代,光學組件20也可不設置場鏡模組29以降低設備成本。Please refer to FIG. 1. In this embodiment, the processing device 10 further includes a housing 21. The housing 21 covers all the components in the optical module 20 and the light-sensitive components 50. In this way, users do not need to integrate or assemble these components by themselves. , To improve the convenience of use of the processing device 10. In addition, the optical component 20 further includes at least one beam splitter 28 (one is schematically shown in the figure, but not limited to this). The beam splitter 28 is, for example, a semi-transparent half mirror, and the beam splitter 28 in this embodiment The auxiliary light 241 can be reflected and the processing light 31 can be transmitted. In this way, the auxiliary light 241 and the processing light 31 are shared by at least part of the light path transmitted to the first scanning device 26, which can simplify the complexity of the light path inside the optical component 20. . In addition, the optical component 20 may also be optionally provided with a field lens module 29. For example, the field lens module 29 includes an F-theta lens (also known as a flat field focusing lens) for focusing the auxiliary light 241 and processing. Light 31. However, this creation is not limited to this. The F-θ lens can be replaced by other lenses that can focus light. The optical component 20 may not be provided with a field lens module 29 to reduce equipment costs.

圖3是根據本創作所揭露的另一實施例,表示加工裝置的架構示意圖,圖4是根據圖3所揭露的實施例,表示加工裝置的系統方塊示意圖。請參考圖3與圖4,加工裝置10A與圖1、圖2所揭露的加工裝置10相似,相同的元件以相同的標號表示,在此不再加以贅述。加工裝置10A與加工裝置10的差異在於,光學組件20中還包括第二掃描裝置27,控制單元60電性連接於第二掃描裝置27,輔助光源24所發出的輔助光線241依序經由第二掃描裝置27與至少一第一掃描裝置26掃描工件40的表面41,以獲得表面41的表面資訊,加工光源30所發出的加工光線31依序經由第二掃描裝置27與至少一第一掃描裝置26,以對工件40加工。此外,感光元件50所發出的感測訊號例如是包括多個影像訊號,控制單元60根據這些影像訊號進行工件40的表面資訊的計算,以選擇性地控制加工光源30、至少一第一掃描裝置26與第二掃描裝置27,其中第二掃描裝置27例如是至少一透鏡組成。舉例而言,當待加工的工件40的表面41上具有起伏較大的凹槽43A或43B時,控制單元60可控制第一掃描裝置26以調整加工光線31的照射位置或角度,例如是調整垂直於表面41的方向上的照射位置或角度,並透過第二掃描裝置27對加工光線31進行聚焦,如此一來加工裝置10A可在不移動或改變工件40的擺放位置或角度的情形下對表面41上的凹槽43A、43B加工。FIG. 3 is a schematic diagram showing the structure of a processing device according to another embodiment disclosed in the present invention, and FIG. 4 is a schematic block diagram showing a system of the processing device according to the embodiment disclosed in FIG. 3. Please refer to FIG. 3 and FIG. 4. The processing device 10A is similar to the processing device 10 disclosed in FIG. 1 and FIG. 2, and the same components are denoted by the same reference numerals, and details are not described herein again. The difference between the processing device 10A and the processing device 10 is that the optical component 20 further includes a second scanning device 27, the control unit 60 is electrically connected to the second scanning device 27, and the auxiliary light 241 emitted by the auxiliary light source 24 passes through the second sequentially. The scanning device 27 and at least one first scanning device 26 scan the surface 41 of the workpiece 40 to obtain the surface information of the surface 41. The processing light 31 emitted by the processing light source 30 passes through the second scanning device 27 and the at least one first scanning device in sequence. 26. To process the workpiece 40. In addition, the sensing signal sent by the photosensitive element 50 includes, for example, a plurality of image signals, and the control unit 60 calculates the surface information of the workpiece 40 according to these image signals to selectively control the processing light source 30 and at least one first scanning device. 26 and a second scanning device 27, wherein the second scanning device 27 is composed of at least one lens, for example. For example, when the surface 41 of the workpiece 40 to be processed has grooves 43A or 43B with large undulations, the control unit 60 may control the first scanning device 26 to adjust the irradiation position or angle of the processing light 31, for example, adjustment The irradiation position or angle in a direction perpendicular to the surface 41, and the processing light 31 is focused by the second scanning device 27, so that the processing device 10A can move or change the placement position or angle of the workpiece 40 The grooves 43A, 43B on the surface 41 are processed.

圖5是根據本創作所揭露的再一實施例,表示加工裝置的架構示意圖。請參考圖5,加工裝置10B與加工裝置10、10A相似,相同的元件以相同的標號表示,在此不再加以贅述。加工裝置10B與加工裝置10、10A的差異在於,第二掃描裝置27位於加工光線31的光路徑上,其中加工光線31例如是依序經由第二掃描裝置27與至少一第一掃描裝置26以對工件40加工,而輔助光線241則經由第一掃描裝置26掃描工件40的表面41,而沒有通過第二掃描裝置27進行聚焦。FIG. 5 is a schematic diagram showing a structure of a processing device according to still another embodiment disclosed in the present invention. Referring to FIG. 5, the processing device 10B is similar to the processing devices 10 and 10A, and the same components are denoted by the same reference numerals, and details are not described herein again. The difference between the processing device 10B and the processing devices 10 and 10A is that the second scanning device 27 is located on the light path of the processing light 31. The processing light 31 is sequentially passed through the second scanning device 27 and at least one first scanning device 26, for example. The workpiece 40 is processed, and the auxiliary light 241 scans the surface 41 of the workpiece 40 through the first scanning device 26 without being focused by the second scanning device 27.

圖6是根據本創作所揭露的再一實施例,表示加工裝置的架構示意圖。請參考圖6,加工裝置10C與加工裝置10、10A、10B相似,相同的元件以相同的標號表示,在此不再加以贅述。加工裝置10C與加工裝置10、10A、10B的差異在於,光學組件20不具備場鏡模組29,輔助光線241與加工光線31經由第一掃描裝置26改變行進方向後,由出光口23直接照射工件40的表面41。此外,本實施例的加工裝置10C的光學組件20不具備第二掃描裝置27,然而光學組件20也能夠於適當位置裝設第二掃描裝置27以聚焦輔助光線241或加工光線31,本創作並不以此為限。FIG. 6 is a schematic diagram showing a structure of a processing device according to still another embodiment disclosed in the present invention. Referring to FIG. 6, the processing device 10C is similar to the processing devices 10, 10A, and 10B, and the same components are denoted by the same reference numerals, and details are not described herein again. The difference between the processing device 10C and the processing devices 10, 10A, and 10B is that the optical component 20 does not have a field lens module 29. The auxiliary light 241 and the processing light 31 change the traveling direction through the first scanning device 26, and are directly irradiated by the light outlet 23 Surface 41 of the workpiece 40. In addition, the optical component 20 of the processing device 10C of this embodiment does not include the second scanning device 27. However, the optical component 20 can also be provided with a second scanning device 27 at an appropriate position to focus the auxiliary light 241 or the processing light 31. Not limited to this.

綜上所述,在本創作的實施例中,輔助光源發出的輔助光線穿過透鏡模組並經由至少一第一掃描裝置照射工件,其中輔助光線經由透鏡模組轉換光形並於工件表面形成線狀光斑,加工光源發出的加工光線經由至少一第一掃描裝置加工工件,如此一來加工裝置可在不額外安裝機械手臂或滑軌等移動設備的狀況下掃描工件表面並取得整個工件表面的表面資訊,提高加工裝置本身的工作效能。In summary, in the embodiment of the present invention, the auxiliary light emitted by the auxiliary light source passes through the lens module and irradiates the workpiece through at least one first scanning device, wherein the auxiliary light transforms the light shape through the lens module and is formed on the surface of the workpiece. Linear light spot. The processing light emitted by the processing light source processes the workpiece through at least one first scanning device. In this way, the processing device can scan the surface of the workpiece and obtain the entire surface of the workpiece without additional mobile devices such as a robot arm or a slide rail. Surface information to improve the working efficiency of the processing device itself.

惟以上所述者,僅為本創作之較佳實施例而已,當不能以此限定本創作實施之範圍,即大凡依本創作申請專利範圍及新型內容所作之簡單的等效變化與修飾,皆仍屬本創作專利涵蓋之範圍內。另外本創作的任一實施例或申請專利範圍不須達成本創作所揭露之全部目的或優點或特點。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本創作之權利範圍。此外,本說明書或申請專利範圍中提及的“第一”、“第二”等用語僅用以命名元件(element)的名稱或區別不同實施例或範圍,而並非用來限制元件數量上的上限或下限。However, the above are only the preferred embodiments of this creation. When the scope of the implementation of this creation cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and new content of this creation, all Still within the scope of this creation patent. In addition, any embodiment of this creation or the scope of patent application need not achieve all the purposes or advantages or features disclosed in the creation. In addition, the abstract section and title are only used to assist the search of patent documents and are not intended to limit the scope of rights of this creation. In addition, the terms "first" and "second" mentioned in this specification or the scope of the patent application are only used to name the element or to distinguish between different embodiments or ranges, not to limit the number of elements. Upper or lower limit.

10、10A、10B、10C‧‧‧加工裝置10, 10A, 10B, 10C‧‧‧ processing equipment

20‧‧‧光學組件 20‧‧‧ Optical components

21‧‧‧殼體 21‧‧‧shell

22‧‧‧透鏡模組 22‧‧‧Lens Module

221‧‧‧光形調整透鏡 221‧‧‧light shape adjustment lens

222‧‧‧切換結構 222‧‧‧Switch structure

223‧‧‧位置 223‧‧‧Location

23‧‧‧出光口 23‧‧‧light exit

24‧‧‧輔助光源 24‧‧‧Auxiliary light source

241‧‧‧輔助光線 241‧‧‧ auxiliary light

242‧‧‧反射光 242‧‧‧Reflected light

26‧‧‧第一掃描機構 26‧‧‧First Scanning Agency

27‧‧‧第二掃描機構 27‧‧‧Second scanning agency

28‧‧‧分光鏡 28‧‧‧ Beamsplitter

29‧‧‧場鏡模組 29‧‧‧field lens module

30‧‧‧加工光源 30‧‧‧Processing light source

31‧‧‧加工光線 31‧‧‧Processing light

40‧‧‧工件 40‧‧‧Workpiece

41‧‧‧表面 41‧‧‧ surface

42‧‧‧線狀光斑 42‧‧‧Linear light spot

43A、43B‧‧‧凹槽 43A, 43B‧‧‧Groove

50‧‧‧感光元件 50‧‧‧ Photosensitive element

60‧‧‧控制單元 60‧‧‧Control unit

圖1是根據本創作所揭露的一實施例,表示加工裝置的架構示意圖;
圖2是根據圖1所揭露的實施例,表示加工裝置的系統方塊示意圖;
圖3是根據本創作所揭露的另一實施例,表示加工裝置的架構示意圖;
圖4是根據圖3的實施例,表示加工裝置的系統方塊示意圖;
圖5是根據本創作所揭露的再一實施例,表示加工裝置的架構示意圖;以及
圖6是根據本創作所揭露的再一實施例,表示加工裝置的架構示意圖。
FIG. 1 is a schematic diagram showing a structure of a processing device according to an embodiment disclosed in the present invention; FIG.
FIG. 2 is a system block diagram of a processing device according to the embodiment disclosed in FIG. 1; FIG.
FIG. 3 is a schematic diagram showing a structure of a processing device according to another embodiment disclosed in the present invention; FIG.
FIG. 4 is a system block diagram of a processing device according to the embodiment of FIG. 3; FIG.
FIG. 5 is a schematic diagram showing the architecture of a processing device according to yet another embodiment disclosed in this creation; and FIG. 6 is a schematic diagram showing the architecture of a processing device according to yet another embodiment disclosed in this creation.

Claims (8)

一種加工裝置,用於加工一工件,包括:
一光學組件,包括一透鏡模組、一輔助光源以及至少一第一掃描裝置,該輔助光源用於發出一輔助光線,該輔助光線穿過該透鏡模組並經由該第一掃描裝置照射該工件,其中該輔助光線經由該透鏡模組轉換光形並於該工件的一表面形成線狀光斑,且該加工裝置透過該線狀光斑掃描該工件以獲得該工件的表面資訊;以及
一加工光源,發出一加工光線至該光學組件,其中該加工光線經由該第一掃描裝置加工該工件。
A processing device for processing a workpiece includes:
An optical component includes a lens module, an auxiliary light source, and at least a first scanning device. The auxiliary light source is used to emit an auxiliary light. The auxiliary light passes through the lens module and irradiates the workpiece through the first scanning device. Wherein the auxiliary light transforms the light shape through the lens module and forms a linear spot on a surface of the workpiece, and the processing device scans the workpiece through the linear spot to obtain surface information of the workpiece; and a processing light source, A processing light is emitted to the optical component, wherein the processing light processes the workpiece through the first scanning device.
如申請專利範圍第1項的加工裝置,還包括一感光元件以及一控制單元,該輔助光線照射該工件並形成一反射光,其中該控制單元電性連接於該透鏡模組、該輔助光源、該至少一第一掃描裝置、該加工光源以及該感光元件,且該感光元件感測該反射光並對應發出一感測訊號至該控制單元。For example, the processing device of the scope of application for a patent includes a photosensitive element and a control unit. The auxiliary light illuminates the workpiece and forms a reflected light. The control unit is electrically connected to the lens module, the auxiliary light source, The at least one first scanning device, the processing light source, and the photosensitive element, and the photosensitive element senses the reflected light and correspondingly sends a sensing signal to the control unit. 如申請專利範圍第2項的加工裝置,其中該控制單元根據該感測訊號控制該加工光源與該至少一第一掃描裝置以加工該工件。For example, the processing device according to the second patent application range, wherein the control unit controls the processing light source and the at least one first scanning device to process the workpiece according to the sensing signal. 如申請專利範圍第2項的加工裝置,其中該光學組件還包括一第二掃描裝置,該控制模組電性連接於該第二掃描裝置,且該加工光線依序經由該第二掃描裝置與該至少一第一掃描裝置以加工該工件。For example, the processing device of the second patent application range, wherein the optical component further includes a second scanning device, the control module is electrically connected to the second scanning device, and the processing light passes through the second scanning device and the second scanning device in sequence. The at least one first scanning device is used to process the workpiece. 如申請專利範圍第4項的加工裝置,其中該感測訊號包括多個影像訊號,且該控制單元根據該些影像訊號計算該工件的該些表面資訊以選擇性地控制該加工光源、該至少一第一掃描裝置與該第二掃描裝置。For example, the processing device under the scope of patent application, wherein the sensing signal includes a plurality of image signals, and the control unit calculates the surface information of the workpiece according to the image signals to selectively control the processing light source, the at least A first scanning device and the second scanning device. 如申請專利範圍第2項的加工裝置,其中該透鏡模組包括一光形調整透鏡以及一切換結構,且該控制單元控制該切換結構以使該光形調整透鏡移入或移離該輔助光線的光路徑。For example, the processing device of the second scope of the patent application, wherein the lens module includes a light shape adjusting lens and a switching structure, and the control unit controls the switching structure to move the light shape adjusting lens into or away from the auxiliary light. Light path. 如申請專利範圍第1項的加工裝置,其中該光學組件還包括一場鏡模組,且該場鏡模組聚焦該加工光線以加工該工件。For example, the processing device according to the first patent application scope, wherein the optical component further includes a field lens module, and the field lens module focuses the processing light to process the workpiece. 如申請專利範圍第1項的加工裝置,其中該光學組件還包括一分光鏡,且該加工光線的光路徑與該輔助光線的光路徑至少部分重合於該分光鏡。For example, the processing device of the first patent application range, wherein the optical component further includes a beam splitter, and a light path of the processing light and a light path of the auxiliary light at least partially overlap the light splitter.
TW108208750U 2019-07-05 2019-07-05 Processing apparatus TWM585675U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110243316A (en) * 2019-07-05 2019-09-17 新代科技(苏州)有限公司 A kind of processing unit (plant)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110243316A (en) * 2019-07-05 2019-09-17 新代科技(苏州)有限公司 A kind of processing unit (plant)
CN110243316B (en) * 2019-07-05 2024-08-02 新代科技(苏州)有限公司 Processing device

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