CN109719387B - Laser processing device and method, laser packaging method and laser annealing method - Google Patents
Laser processing device and method, laser packaging method and laser annealing method Download PDFInfo
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- CN109719387B CN109719387B CN201711048772.2A CN201711048772A CN109719387B CN 109719387 B CN109719387 B CN 109719387B CN 201711048772 A CN201711048772 A CN 201711048772A CN 109719387 B CN109719387 B CN 109719387B
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Abstract
The invention provides a laser processing device and method, a laser packaging method and a laser annealing method, wherein the laser processing device comprises a laser module, a laser scanning module, a light splitting module and a control unit, wherein the laser module provides laser for processing, the laser passes through the laser scanning module and then enters the light splitting module, the light splitting module splits the laser to form reflected light and refracted light, and the laser scanning module controls the reflected light and the refracted light to symmetrically scan a material to be processed according to a scanning path; the control unit is connected with the laser module and the laser scanning module and is used for controlling the laser module and the laser scanning module. The invention adopts the light splitting module to split light, the utilization rate of the laser module is more than 2 times of that of the prior art, the requirement on the rotation angle of the equipment is reduced by 2 times or even more than that of the prior art, and the yield is improved by more than 2 times.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a laser processing device and method, a laser packaging method and a laser annealing method.
Background
The existing laser packaging technology is to provide a laser beam, set the material to be packaged on a workpiece table, the laser beam irradiates the material to be packaged through a relevant shaping device, so that the glass material on the material to be packaged is melted and condensed to complete the packaging.
In order to improve the yield and the speed of processing products, light splitting treatment is carried out on a light path in a shaping device, so that one set of laser packaging device can package a plurality of materials to be packaged at the same time. For example, chinese patents CN201410603985.7 (published: 2016, 6, 11), cn201010180148.x (published: 2011, 11, 23), and CN201020235578.2 (published: 2011, 3, 2) all disclose processes for splitting light to improve yield.
The chinese patents CN201410603985.7 (published: 2016, 6, 11) and cn201010180148.x (published: 2011, 11, 23) are all split after the light source fiber emits light and before the laser scanning device. The former uses a single galvanometer scanning device, and the control of the optical path can be realized only by necessarily requiring the lens of the galvanometer to be large enough, if the multipath packaging is realized, the special requirement is provided for the lens on the galvanometer of the scanning device, thereby increasing the precision requirement and the rotating speed requirement on the galvanometer, realizing the synchronous packaging of a plurality of optical paths, and having limitation on the requirement on the galvanometer; the laser scanning device is additionally provided with a scanning device, light is split after light is emitted from the light source optical fiber, the light path is divided into multiple paths through the reflecting mirror, multiple scanning devices are used for packaging, the requirement on the scanning device is similar to a common packaging and marking mode, the packaging effect is improved, the cost of one laser scanning device is increased, and the effect is not optimal.
The above schemes all greatly improve the yield, but for the existing schemes, the yield is optimized under the condition of sacrificing the cost, and the cost is not really saved and the yield is improved.
Disclosure of Invention
The invention provides a laser processing device and method, a laser packaging method and a laser annealing method, which are used for solving the problems.
In order to achieve the above object, the present invention provides a laser processing apparatus, including a laser module, a laser scanning module, a light splitting module and a control unit, wherein the laser module provides laser for processing, the laser passes through the laser scanning module and then enters the light splitting module, the light splitting module splits the laser to form reflected light and refracted light, and the laser scanning module controls the reflected light and the refracted light to symmetrically scan a material to be processed according to a scanning path; the control unit is connected with the laser module and the laser scanning module and is used for controlling the laser module and the laser scanning module.
Preferably, the processing device further includes a lens module, configured to refract the light beam emitted from the light splitting module into light beams with mutually parallel light paths.
Preferably, the light splitting module includes a first reflecting mirror and a light splitting mirror, the laser light enters the first reflecting mirror after passing through the laser scanning module, the first reflecting mirror reflects the laser light to the light splitting mirror, and then the laser light is split by the light splitting mirror to form the reflected light and the refracted light.
Preferably, the beam splitter is perpendicular to the lens module.
Preferably, the beam splitting module further includes a second reflecting mirror and a third reflecting mirror, the second reflecting mirror and the third reflecting mirror are respectively disposed on both sides of the beam splitter, the mirror surface of the second reflecting mirror is perpendicular to the lens module, the beam splitter is inclined to the lens module, one of the reflected light and the refracted light is incident on the lens unit, and the other light is reflected to the lens module by the second reflecting mirror and the third reflecting mirror in sequence.
Preferably, the beam splitting module further includes a second reflecting mirror and a third reflecting mirror, the second reflecting mirror and the third reflecting mirror are respectively disposed on two sides of the beam splitter, the mirror surface of the second reflecting mirror is perpendicular to the lens module, the beam splitter is perpendicular to the lens module, the reflected light enters the second reflecting mirror, the refracted light enters the third reflecting mirror, and then the reflected light is reflected to the lens module.
Preferably, an included angle β is formed between the first reflecting mirror and the lens module, and the included angle β and the rotation angle ψ of the laser scanning module satisfy the following condition:
preferably, the light beams emitted after passing through the light splitting module enter the same lens module.
Preferably, the light beam emitted after passing through the light splitting module enters different lens modules.
Preferably, the material to be processed comprises a material to be packaged and a material to be annealed.
The invention also provides a laser processing method, wherein laser provided by the laser module enters the light splitting module after passing through the laser scanning module, reflected light and refracted light are formed after light splitting by the light splitting module, and the laser scanning module adjusts the laser according to the scanning path of the material to be processed, so that the reflected light and the refracted light can simultaneously scan a single material to be processed in any symmetrical shape according to the scanning path, or scan two symmetrical materials to be processed in any shape respectively.
Preferably, when a single material to be processed with an arbitrary symmetrical shape is processed, the light spots formed by the reflected light and the refracted light at the initial positions of the scanning paths have an overlapping region.
The invention also provides a laser packaging method, which is used for carrying out laser packaging.
The invention also provides a laser annealing method, which is used for carrying out laser annealing.
Compared with the prior art, the invention has the following advantages:
1. the light splitting module is arranged behind the laser scanning module, and the size of the internal view field of the laser scanning module is not considered;
2. the light splitting module is used for splitting light, so that the utilization rate of the laser module is improved, and the utilization rate of the laser module is more than 2 times that of the prior art;
3. the light splitting module is used for splitting light, so that the requirement on the equipment angle of the laser scanning module is reduced, and the requirement on the rotation angle of the equipment is reduced by 2 times or even more compared with the prior art;
4. the light splitting module is used for splitting light, so that the yield is improved, and compared with the prior art, the packaging yield is improved by more than 2 times;
5. the light splitting module is used for splitting light, the size of an incident mirror surface of the focusing lens is not required, only the view field of one material to be processed is met, and the number of the focusing lenses is increased if the view field is not enough when a plurality of materials to be processed are packaged, so that the cost is reduced;
6. in the processing process, the processing equipment is fixed and is only used for controlling the movement of the light spots in the processing stage, so that the control difficulty is reduced, and the efficiency is improved;
7. the laser beams are processed in a symmetrical mode, so that multiple-beam processing can be carried out on a single material in a symmetrical shape, a plurality of processing units in any shapes which are arranged in a symmetrical mode can be processed simultaneously, the processing efficiency is improved, the requirement of simultaneously processing a plurality of materials to be processed can be met by only one laser processing device, the compatibility is improved, and the cost is reduced;
8. and the motion of a plurality of light spots is not required to be controlled simultaneously, and only the light beams output by the laser scanning module are required to be controlled, so that the control difficulty is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a laser processing apparatus according to a first embodiment of the present invention;
FIG. 2 is a top view of the material to be encapsulated in FIG. 1;
FIG. 3 is a schematic diagram of a first embodiment of the present invention;
FIG. 4 is a schematic view of a light path for scanning a blind spot according to an embodiment of the present invention;
FIG. 5 is a schematic view of a plurality of materials to be processed being processed simultaneously according to an embodiment of the present invention;
FIG. 6 is a schematic view of a light scanning path on the material to be processed in FIG. 5;
FIG. 7 is a schematic view of a plurality of F-theta mirrors provided in accordance with the present invention to increase the field of view;
FIG. 8 is a schematic view of a scanning dead-angle-free fully-symmetric split optical path according to a second embodiment of the present invention;
FIG. 9 is a structural diagram of a second embodiment of the present invention, in which a single material to be processed is scanned symmetrically and the scanning rates at two sides are consistent;
FIG. 10 is a schematic view of a light scanning path on the material to be processed in FIG. 9;
FIG. 11 is a schematic view of a three-scan dead-corner-free path symmetric split optical path according to an embodiment of the present invention;
fig. 12 and fig. 13 are schematic diagrams of the beam splitting path of the beam splitter in fig. 11;
FIG. 14 is a structural diagram illustrating a structure of a third embodiment of the present invention in which a single material to be processed is scanned symmetrically and scanning rates at two sides are not consistent;
FIG. 15 is a schematic view of a light scanning path on the material to be processed in FIG. 14;
FIG. 16 is a schematic view of a scanning path of a linearly symmetric processing light according to a third embodiment of the present invention;
FIG. 17 is a schematic diagram of three-circularly symmetric processing light paths according to an embodiment of the present invention;
FIG. 18 is a schematic view of three-ellipse symmetrical processing light paths according to an embodiment of the present invention.
In the figure: 110-an upper computer, 120-a controller module, 130-a laser scanning module, 140-a laser module, 200-a light splitting module, 210-a first reflector, 220-a light splitter, 230-a second reflector, 240-a third reflector, 300-a material to be processed, 310-cover plate glass, 340-frit, 330-substrate glass, 350-an electrode, 360-an OLED layer, 400-F-theta mirror, 1301-a portal frame and 1302-a galvanometer unit;
12. 14-18-ray, 13-mirror; 21-30-ray.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
Referring to fig. 1, the laser processing apparatus provided by the present invention includes:
the device comprises a control unit, a laser module 140, a laser scanning module 130, a light splitting module 200 and a material to be processed 300.
The control unit comprises an upper computer 110 and a controller module 120 connected with the upper computer 110, and the controller module 120 is in control connection with a laser module 140 and a laser scanning module 130.
The laser module 140 is configured to provide a laser beam for packaging, the laser beam forms a laser for scanning after being integrated by the laser scanning module 130, the laser moves on a scanning path calculated by the host computer 110, and irradiates the material 300 to be processed after passing through the light splitting module 200, and the laser scanning module 130 adjusts the single-beam laser according to the scanning path, so that the reflected light and the refracted light formed after passing through the light splitting module 200 perform laser processing on the material 300 to be processed according to the scanning path.
As shown in fig. 5, the laser processing apparatus further includes a lens module for refracting the light beams emitted from the light splitting module 200 into light beams with mutually parallel light paths.
The lens module includes at least one F-theta mirror 400, and optionally, the lens module includes one F-theta mirror 400, and the light beams emitted from the light splitting module 200 enter the same F-theta mirror 400. Optionally, the lens module includes a plurality of F-theta mirrors 400, and the light beams emitted from the light splitting module 200 enter different F-theta mirrors 400.
The light splitting module 200 provided in this embodiment at least includes a first reflecting mirror 210 and a light splitting mirror 220, the laser passes through the laser scanning module 130 and then is reflected by the first reflecting mirror 210 to enter the light splitting mirror 220, specifically, referring to fig. 3, the first reflecting mirror 210 is obliquely disposed with respect to the F-theta mirror 400, the light splitting mirror 220 is vertically disposed to establish an XY two-dimensional coordinate system, a horizontal direction is a Y-axis direction, a vertical direction is an X-axis direction, an intersection point of a light ray at a spot center of the laser emitted from the laser scanning module 130 and the mirror surface 13 of the first reflecting mirror 210 is an intersection point of the X-axis and the Y-axis, the laser enters the light splitting module 200 after exiting from the laser scanning module 130, and is first reflected by the mirror surface of the obliquely disposed first reflecting mirror 210 to the light splitting mirror 220 to form reflected light and, wherein the inclination angle b of the first reflecting mirror 210 with respect to the F-theta mirror 400 and the rotation angle psi of the laser scanning module 130 satisfy the following condition:
assuming that two side edge light rays selected from the light beams emitted from the laser scanning module 130 are light rays 12 and 14, respectively, the included angle therebetween is ψ, the light ray 14 is reflected by the mirror surface 13 of the first reflecting mirror 210 to form a light ray 16, the light ray 12 is reflected by the mirror surface 13 of the first reflecting mirror 210 to form a light ray 15, and the light ray 15 is split by the beam splitter 220 to form a reflected light 17 and a refracted light 18.
The relationship between the light rays 12 and 14 and the mirror surface 13 of the first reflecting mirror 210 satisfies:
the specific coordinate values of the intersection (x1, y1) of the ray 12 and the mirror 13 and the intersection (x2, y2) of the ray 14 and the mirror 13 can be obtained by the following formula:
for the length L of the first mirror 210dThe following constraints apply:
for the requirement of the beam splitter 220, referring to fig. 3, the light incident to the beam splitter 220 is split into reflected light and refracted light, where the incident angle is θ and the reflection angle is θ1Angle of refraction theta2It must satisfy the condition of theta ═ theta1＝θ2This ensures that the reflected and refracted light always scans in a symmetrical manner during scanning.
During scanning, the laser beam moves along the scanning path, and when the laser beam moves, the incident angle of the laser beam entering the beam splitter 220 inevitably changes, and assuming that the change rate is Δ θ, the change rate of the reflection angle is Δ θ1The rate of change of the angle of refraction is Delta theta2In this case, Δ θ is also satisfied1＝Δθ2。
Assuming that the vertical distance of the laser spot position on the beam splitter 220 relative to the lower working surface (i.e. the refractive surface for refracting light if the lens module is below) is h, the horizontal distance of the light movement before and after the light change can be calculated
Δ d — h (tan (θ + Δ θ) -tan θ), therefore, during the laser beam movement, the scanning path can be controlled based on the above calculation formula.
In this embodiment, a lens module is disposed between the light splitting module 200 and the material to be processed, and the lens module is disposed horizontally, and the refraction surface of the lens module is parallel to the horizontal plane. The reflected light and the refracted light split by the beam splitter 220 are refracted by the lens module to form light beams with parallel light paths, and then the light beams irradiate on the material to be processed. Since the reflected and refracted light split by the beam splitter 220 are directed in two different directions, in general, if the field of view requirement is met, the lens module includes an F-theta mirror 400, see fig. 5, which greatly utilizes the field of view and reduces the cost; if the field of view is required to be large, a plurality of F-theta mirrors 400 can be used, see fig. 7, so that the light beams emitted from the beam splitter 220 are respectively incident to different F-theta mirrors 400, on one hand, the field of view problem is solved, on the other hand, the light paths are routed in such a way that the light paths are closer to the axial center position of the F-theta mirror 400, the edge position of the F-theta mirror 400 where multiple light beams are scanned due to large field of view when the light beams are incident to the same F-theta mirror 400 can be avoided, and the problem of dead angle of partial scanning of the axial center of the F-theta mirror 400 is avoided.
Referring to fig. 5, the laser scanning module 130 includes a gantry 1301 and a galvanometer unit 1302, the galvanometer unit 1302 is slidably mounted on the gantry 1301, the material 300 to be processed is located below the gantry 1301, and the gantry 1301 may be replaced by another laser scanning stage.
The material 300 to be processed comprises a material to be packaged, a material to be annealed and the like, and in the case of processing the material to be packaged, referring to fig. 1 and fig. 2, from bottom to top, a substrate glass 330, an OLED layer 360 placed on the substrate glass 330 and a frit 340 placed around the OLED layer 360 are respectively provided, an electrode 350 connected with the OLED layer 360 is arranged on the substrate glass 330, a cover glass 310 covers the structure, the cover glass 310 and the substrate glass 330 are packaged and connected by the frit 340, and during laser packaging, laser emitted by the laser processing device according to the embodiment passes through the cover glass 310 and irradiates on the frit 340, so that the frit 340 is heated and melted, and laser packaging is completed after solidification and molding.
The present invention further provides a laser processing method using the above laser processing apparatus, wherein the laser provided by the laser module 140 passes through the laser scanning module 130 to form a laser moving along a scanning path, the laser moving along the scanning path enters the light splitting module 200, is reflected by the first reflecting mirror 210 and then is split by the light splitting mirror 220 to form a reflected light and a refracted light, and ensures that an incident angle of the incident light to the light splitting mirror 220 is equal to a reflection angle of the reflected light and a refraction angle of the refracted light, the reflected light and the refracted light are refracted by the lens module to form light rays having parallel light paths and are irradiated to the material to be processed, and the material to be processed is subjected to laser processing, the laser scanning module 130 adjusts the laser according to the scanning path of the material to be processed 300, so that the reflected light and the refracted light simultaneously scan the material to be processed 300 in any single symmetrical shape according to the scanning path, or respectively scanning two symmetrical materials 300 to be processed in any shape.
Example two
The difference between the present embodiment and the first embodiment is that, referring to fig. 8, in order to achieve the scanning without dead angle, two reflecting mirrors may be disposed on two sides of the beam splitter 220, which are the second reflecting mirror 230 and the third reflecting mirror 240 located on the left side, respectively, the second reflecting mirror 230 and the third reflecting mirror 240 are symmetrical with respect to the beam splitter 220, and the height of the two reflecting mirrors relative to the material to be processed is smaller than the height of the beam splitter 220 relative to the material to be processed.
The reflected light and the refracted light split by the beam splitter 220 are reflected by the second reflecting mirror 230 and the third reflecting mirror 240, respectively, and enter the lens module, and at this time, the beam splitter 220 and the two reflecting mirrors are perpendicular to the lens module, and at this time, the processing rate and the processing path of the reflected light and the refracted light are the same.
Referring to fig. 9 and 10, the laser processing apparatus and method provided in this embodiment are used to perform laser processing on a single symmetrical material to be processed, so as to avoid the dead angle of the axis scanning of the lens module. In this embodiment, a single arbitrary symmetrical pattern may be symmetrically processed, or two symmetrical arbitrary shapes may be simultaneously processed.
EXAMPLE III
The difference between the present embodiment and the first embodiment is that, referring to fig. 14 and fig. 15:
referring to fig. 11, two reflectors are also required to be disposed, the two reflectors are also vertically disposed, but the heights of the two reflectors are not equal to the height of the material to be processed, and the beam splitter 220 is disposed in an inclined manner, and the angle between the beam splitter and the horizontal plane is α.
In fig. 11, two edge light beams with the largest distance are selected from the laser beams incident to the beam splitter 220, which are 21 and 22, respectively, and two incident points generated when the laser beams are incident to the beam splitter 220 are a point a and a point B, respectively, the light beam projected to the point a is reflected by the beam splitter 220 to form a reflected light beam 23, the light beam projected to the point B is reflected by the beam splitter 220 to form a reflected light beam 24, wherein the light beam 24 is in a vertical direction, and both the two reflected light beams 23 and 24 directly enter the lens module for refraction.
The light rays at the points a and B are refracted by the beam splitter 220 to form refracted light rays 25 and 26, respectively, the light ray 25 is reflected by the third reflector 250 to form a reflected light ray 27, the light ray 26 is reflected by the third reflector 250 to form a reflected light ray 28, the reflection point of the light ray 25 on the third reflector 250 is point C, the reflection point of the light ray 26 on the third reflector 250 is point D, the reflected light ray 27 and the reflected light ray 28 are both incident on the second reflector 240 at points E and F, respectively, the reflected light rays 27 and 28 are reflected by the second reflector 240 to form reflected light rays 29 and 30, and the reflected light rays 29 and 30 both enter the F-theta mirror 400.
Referring to fig. 12, the included angle between the beam splitter 220 and the horizontal axis is α, and the distances between the point a and the point B in the vertical direction and the horizontal direction are respectively obtained
h1＝ΔLsinα
h2＝ΔLcosα
The angle between the reflected light ray 23 and the vertical direction and the angle between the reflected light ray 24 and the vertical direction at this time can be calculated as β -2 θ - Φ
Wherein
The local field of view is now: length1＝(L0+L1+L2+L3)tanβ
length2＝(L0+L1+L2+L3-h1)tanδ
Wherein L0 is the vertical distance between points A and C, L1 is the vertical distance between points C and E, L2 is the distance between points E and F, L3 is the vertical distance between point F and the horizontal plane on which the F-theta mirror 400 is located, and phi is the incident angle of the incident beam at point C,
the incident angle of the incident light beam at point D, and ω is the angle between the incident light beam at point B and the mirror surface of the beam splitter 220, i.e., the incident angle of the incident light beam at point B.
The field of view with the reflected light path is as follows:
S+2Δs＝length1+length2+h2
similarly we can find the field of view of the refracted light as
Wherein S is the aperture radius of the F- theta mirror 400, 2 × Delta S is the overlapping area through which the two light spots pass,
at the same time the parameters satisfy
L1＝L2+L3
In addition, according to the law of refractive index, the refraction angle inside the beam splitter 220 is
Where n is the refractive index of the environment, n1 is the refractive index of the beam splitter, θ is the angle between the incident beam at point a and the mirror surface of the beam splitter, and θ' is the angle between the refracted beam in the beam splitter 220 and the mirror surface of the beam splitter 220 after the incident beam at point a enters the beam splitter 220.
So that there are
Referring to fig. 13, a vertical distance h3 and a horizontal distance h4 between a refraction point entering the beam splitter 220 from point a and an exit point exiting from the other side of the beam splitter 220 after being refracted by the beam splitter 220 are respectively:
h3＝a/tanθ'*sinα
where a is the thickness of the beam splitter 220.
Then the condition is satisfied at this time
s+length2+h2-h4＝(L0-h3)tanφ
After finishing, the method comprises the following steps:
where L is the vertical distance between point C and point D, and Δ L is the length of point A and point B on the mirror surface of the beam splitter 220, where θ, ω, Δ L, L, a, L are known2S, Δ S, θ' are known, and α, L are found0,L1,L3I.e., the placement of beam splitter 220, the vertical distance between beam splitter 220 and third mirror 240, the vertical distance between third mirror 240 and second mirror 230, second mirror 230, from the working surface of the F-theta mirror 400.
At this time, the parameters between beam splitter 220, second reflecting mirror 230 and third reflecting mirror 240 satisfy the following requirements:
when a single symmetrical-shaped graph is processed, the relation among the beam splitter 220, the first reflecting mirror 210, the second reflecting mirror 230 and the third reflecting mirror 240 is adjusted, so that laser is split by the beam splitter 220 and then reflected by the second reflecting mirror 230 and the third reflecting mirror 240 to form laser spots with mutually overlapped areas, and the laser spots are protected to have a slow power rise period at joints and are synchronously heated at the joints, and the processing effect at the joints is optimized.
Referring to fig. 16, when the scanning path of the machining is a straight line, the spots formed by the reflected light and the refracted light at the initial positions are set to be interlaced with each other, and then both scan the respective corresponding tracks at the synchronous machining rate, and since only the angle of the incident beam incident to the beam splitter 220 is changed, the symmetric machining is achieved under the condition that the law of refraction and the law of reflection are satisfied.
Referring to fig. 17, when the scanning path of the processing is a circular arc, the light spots formed by the reflected light and the refracted light at the initial positions are also arranged to be interlaced with each other, and then the two light spots scan the respective corresponding tracks at the synchronous processing rate, so as to achieve a good joint processing effect, and the reflected light and the refracted light are scanned in the opposite directions to each other at the processing start position.
Referring to fig. 18, when the scanning path of the processing is an ellipse, the same situation as above is similar, and the description thereof is omitted here.
The present invention has been described in the above embodiments, but the present invention is not limited to the above embodiments. It will be apparent to those skilled in the art that various changes and modifications may be made in the invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (8)
1. The laser processing device is characterized by comprising a laser module, a laser scanning module, a lens module, a light splitting module and a control unit, wherein the laser module provides laser for processing, the laser passes through the laser scanning module and then enters the light splitting module, the light splitting module comprises a light splitting mirror, a first reflecting mirror, a second reflecting mirror and a third reflecting mirror, the light splitting mirror is inclined to the lens module, the second reflecting mirror and the third reflecting mirror are respectively arranged on two sides of the light splitting mirror and are perpendicular to the lens module, the heights of the second reflecting mirror and the third reflecting mirror relative to a material to be processed are unequal, the light splitting module splits the laser to form reflected light and refracted light, one of the reflected light and the refracted light enters the lens module, and the other light is sequentially reflected by the second reflecting mirror, the third reflecting mirror and the control unit, The third reflector is reflected to the lens module and refracted by the lens module into light beams with mutually parallel light paths; the laser scanning module controls the reflected light and the refracted light to symmetrically scan the material to be processed according to a scanning path, and when the material to be processed in a single random symmetrical shape is processed, light spots formed by the reflected light and the refracted light at the initial position of the scanning path have an overlapping area; the control unit is connected with the laser module and the laser scanning module and is used for controlling the laser module and the laser scanning module.
2. The laser processing apparatus of claim 1, wherein the first mirror forms an angle with the lens module
Angle of inclination
Rotation angle with the laser scanning module
The following conditions are satisfied:
3. the laser processing apparatus according to claim 1, wherein the light beam emitted after passing through the light splitting module is incident on the same lens module.
4. The laser processing apparatus according to claim 1, wherein the light beam emitted after passing through the light splitting module is incident on a different lens module.
5. The laser processing apparatus according to any one of claims 1 to 4, wherein the material to be processed includes a material to be encapsulated and a material to be annealed.
6. A laser processing method using the laser processing device according to any one of claims 1 to 4, wherein the laser provided by the laser module enters the beam splitting module after passing through the laser scanning module, and forms reflected light and refracted light after being split by the beam splitting module, and the laser scanning module adjusts the laser according to the scanning path of the material to be processed, so that the reflected light and the refracted light simultaneously scan a single material to be processed with any symmetrical shape according to the scanning path, or respectively scan two symmetrical materials to be processed with any shape.
7. A laser packaging method characterized in that laser packaging is performed by the laser processing method of claim 6.
8. A laser annealing method, characterized in that laser annealing is performed by the laser processing method according to any one of claim 6.
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| DE1765145C3 (en) * | 1968-04-09 | 1973-11-29 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Process for processing thin layers of electrical circuits with laser beams |
| JP3213882B2 (en) * | 1997-03-21 | 2001-10-02 | 住友重機械工業株式会社 | Laser processing apparatus and processing method |
| JP4459530B2 (en) * | 2000-08-29 | 2010-04-28 | 三菱電機株式会社 | Laser processing equipment |
| US20030217995A1 (en) * | 2002-05-23 | 2003-11-27 | Yosuke Toyofuku | Laser processing method using ultra-short pulse laser beam |
| CN201752818U (en) * | 2010-06-22 | 2011-03-02 | 深圳市大族激光科技股份有限公司 | Laser splitting device |
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2017
- 2017-10-31 CN CN201711048772.2A patent/CN109719387B/en active Active
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