JPS6211954B2 - - Google Patents
Info
- Publication number
- JPS6211954B2 JPS6211954B2 JP57107410A JP10741082A JPS6211954B2 JP S6211954 B2 JPS6211954 B2 JP S6211954B2 JP 57107410 A JP57107410 A JP 57107410A JP 10741082 A JP10741082 A JP 10741082A JP S6211954 B2 JPS6211954 B2 JP S6211954B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- processing
- laser beam
- galvanometer
- dichroic mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003287 optical effect Effects 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 238000009966 trimming Methods 0.000 description 3
- 238000010330 laser marking Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
本発明はレーザトリミング、レーザマーキング
などに用いられるレーザ加工光学装置に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing optical device used for laser trimming, laser marking, etc.
従来、レーザトリミング、レーザマーキングな
どのビームポジシヨナの駆動源として、ガルバノ
メータが使用されることが多い。これは、構造が
簡単で、高速位置決めが可能であることに起因し
ている。しかしながら、ガルバノメータの回転角
の温度ドリフトにより位置決め精度が悪いという
欠点がある。そのため、ガイド光として可視域レ
ーザ光を用い、前記ガイド光を見ながら、適宜、
手動操作によりアナログ的に位置補正を行つてい
た。 Conventionally, a galvanometer is often used as a drive source for a beam positioner for laser trimming, laser marking, etc. This is because the structure is simple and high-speed positioning is possible. However, there is a drawback that positioning accuracy is poor due to temperature drift of the rotation angle of the galvanometer. Therefore, a visible range laser beam is used as the guide light, and while looking at the guide light,
Position correction was performed in an analog manner by manual operation.
本発明は、ビームポジシヨナ部に位置補正機構
を付加することにより、従来のレーザ加工光学装
置の欠点をなくし、常に安定な位置再現性を有す
ることを特徴とするレーザ加工装置を提供するこ
とを目的とする。 The present invention aims to eliminate the drawbacks of conventional laser processing optical devices by adding a position correction mechanism to the beam positioner section, and to provide a laser processing device characterized by always having stable position repeatability. do.
以下に本発明について一実施例を図面を参照し
ながら説明する。第１図は本発明のレーザ加工装
置の一実施例である。 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of the laser processing apparatus of the present invention.
本発明は、可視外域加工用レーザ装置１、可視
域ガイド用レーザ装置８、両レーザ装置から出射
されるレーザ光を混合させるためのミラー２、光
学的走査用ミラー３，４、集光レンズ５、ダイク
ロイツクミラー６、２次元自己走査型光電変換装
置、各制御部１０，１１，１２，１３から構成さ
れる。まず、加工用レーザ装置１から出射された
レーザ光はミラー２により反射され、光学的走査
用ミラー３，４に入射される。光学的走査ミラー
３，４は個々にガルバノメータの軸に取り付けら
れ、それぞれＸ軸用、Ｙ軸用の光学的走査の役割
をもつ。１３はXY両軸のガルバノメータの駆動
部であり、１２はXY両軸のガルバノメータの制
御部である。光学的走査ミラー４から出たレーザ
光は集光レンズ５により集束され、ダイクロイツ
クミラー６により反射され、被加工物７面上に集
光される。一方、ガイド用レーザ装置８から出射
されたレーザ光はミラー２により前記加工用レー
ザ光と混合される。前記ガイド用レーザ光は前記
加工用レーザ光と同一光路を通り、被加工物７面
上で前記加工用レーザ光のスポツトと重なる。ダ
イクロイツクミラーに入射したガイド用レーザ光
の一部はそのまま透過して２次元自己走査型光電
変換装置に集光される。前記２次元走査型光電変
換装置９に受光された映像信号は電気信号に変換
され、前処理部１０にてノイズが除去され、基準
信号と比較し二値化され、ビツトパターンとし
て、コンピユータ部１１に読み込まれる。前記ビ
ツトパターンを解析することにより、ガイド用レ
ーザ光の中心位置を求めることができる。したが
つて、基準位置が既知であれば、それとの偏差を
知ることができ、その値を補正量として、制御部
１２、駆動部１３を通して、ガルバノメータにフ
イードバツクさせれば、ガイド用レーザ光の位置
ずれ、最終的には加工用レーザ光の位置ずれを修
正することができる。 The present invention includes a laser device 1 for processing in the visible region, a laser device 8 for visible region guide, a mirror 2 for mixing the laser beams emitted from both laser devices, mirrors 3 and 4 for optical scanning, and a condenser lens 5. , a dichroic mirror 6, a two-dimensional self-scanning photoelectric conversion device, and control sections 10, 11, 12, and 13. First, a laser beam emitted from a processing laser device 1 is reflected by a mirror 2 and enters optical scanning mirrors 3 and 4. Optical scanning mirrors 3 and 4 are individually attached to the axis of the galvanometer and have the role of optical scanning for the X-axis and Y-axis, respectively. Reference numeral 13 represents a drive unit for the galvanometers on both the X and Y axes, and 12 represents a control unit for the galvanometers on both the X and Y axes. The laser light emitted from the optical scanning mirror 4 is focused by a condenser lens 5, reflected by a dichroic mirror 6, and focused onto the surface of a workpiece 7. On the other hand, the laser beam emitted from the guide laser device 8 is mixed with the processing laser beam by the mirror 2. The guide laser light passes through the same optical path as the processing laser light and overlaps the spot of the processing laser light on the surface of the workpiece 7. A portion of the guide laser light incident on the dichroic mirror is transmitted as it is and is focused on a two-dimensional self-scanning photoelectric conversion device. The video signal received by the two-dimensional scanning photoelectric conversion device 9 is converted into an electric signal, noise is removed in a preprocessing section 10, and it is compared with a reference signal and binarized, and then sent as a bit pattern to a computer section 11. is loaded into. By analyzing the bit pattern, the center position of the guiding laser beam can be determined. Therefore, if the reference position is known, the deviation from it can be known, and if the value is used as a correction amount and fed back to the galvanometer through the control unit 12 and drive unit 13, the position of the guide laser beam can be determined. It is possible to correct the deviation, and ultimately the positional deviation of the processing laser beam.
以下に、上記の構成からなる本発明のレーザ加
工装置の位置補正の一例について詳細に説明す
る。 Below, an example of position correction of the laser processing apparatus of the present invention having the above-mentioned configuration will be explained in detail.
まず、ある時点にてレーザ光の位置を次の手順
にて求める。ここで、ガイド用レーザ光と加工用
レーザ光が被加工物７面上でスポツトが一致して
いるものとする。レーザ光のスポツトが被加工物
７面上の走査範囲の中心点あるいは目印点にくる
ように光学的走査ミラー３，４を位置決めする。
これは制御部１２に位置座標データ（Ｘ、Ｙ）を
入力することにより行われる。ここでＸはＸ座標
値、ＹはＹ座標値を示す。この状態にて、ガイド
用レーザ光が２次元自己走査型光電変換装置９の
受光面のほぼ中心にくるように前記光電変換装置
９の位置を調整する。これらの準備の後、位置設
定指令を出すことにより、ガイド用レーザ光のス
ポツトのビツトパターンが読み込まれ中心点
（X0Y0）が求められる。次に任意の時間が経過し
た時点、たとえば１枚の基板のレーザトリミング
が終了した時点に、位置座標データ（Ｘ、Ｙ）を
入力し、光学的走査ミラーを位置決めしてから位
置補正指令を出し、再び、ガイド用レーザ光のス
ポツトのビツトパターンを読み込み、中心点
（X1、Y1）を求める。従つて、光学的走査ミラー
３，４の時間的ドリフト量はＸ軸、Ｙ軸それぞれ
（X0−X1）、（Y0−Y1）となる。すなわち、前記ド
リフト量を補正量として制御部１２、駆動部１３
にフイードバツクすれば、レーザ光スポツトのズ
レは補正される。前記の処置はコンピユータ部１
１にて行われる。なお、コンピユータ部１１、制
御部１２、駆動部１３はレーザ加工装置の制御部
の一部にて代用できる。 First, the position of the laser beam at a certain point in time is determined by the following procedure. Here, it is assumed that the spots of the guiding laser beam and the processing laser beam coincide on the surface of the workpiece 7. The optical scanning mirrors 3 and 4 are positioned so that the spot of the laser beam is at the center point of the scanning range or the landmark point on the surface of the workpiece 7.
This is done by inputting position coordinate data (X, Y) to the control section 12. Here, X indicates an X coordinate value, and Y indicates a Y coordinate value. In this state, the position of the photoelectric conversion device 9 is adjusted so that the guiding laser beam is located approximately at the center of the light receiving surface of the two-dimensional self-scanning photoelectric conversion device 9. After these preparations, by issuing a position setting command, the bit pattern of the spot of the guiding laser beam is read and the center point (X 0 Y 0 ) is determined. Next, after an arbitrary period of time has elapsed, for example, when laser trimming of one substrate is completed, position coordinate data (X, Y) is input, the optical scanning mirror is positioned, and a position correction command is issued. , again read the bit pattern of the guide laser beam spot and find the center point (X 1 , Y 1 ). Therefore, the temporal drift amounts of the optical scanning mirrors 3 and 4 are (X 0 -X 1 ) and (Y 0 -Y 1 ) on the X-axis and Y-axis, respectively. That is, the control section 12 and the drive section 13 use the drift amount as a correction amount.
If feedback is given to the laser beam spot, the deviation of the laser beam spot can be corrected. The above procedure is carried out in the computer section 1.
It will be held at 1. Note that the computer section 11, the control section 12, and the drive section 13 can be replaced by a part of the control section of the laser processing apparatus.
第２図はガイド用レーザ光のスポツトのビツト
パターン例である。点１９，１９′は前記点
（X0、Y0）、点２０，２０′は前記点（X1、Y1）に
対応する。ひとます１４の白黒はビツト０，１に
対応する。なお、光電変換装置の分解能とガルバ
ノメータの分解能との対応はあらかじめデータと
して求められている。 FIG. 2 shows an example of a bit pattern of a spot of a guiding laser beam. Points 19 and 19' correspond to the points (X 0 , Y 0 ), and points 20 and 20' correspond to the points (X 1 , Y 1 ). The black and white in square 14 corresponds to bits 0 and 1. Note that the correspondence between the resolution of the photoelectric conversion device and the resolution of the galvanometer is obtained in advance as data.
以上説明したように、本発明によれば、ガルバ
ノメータを使用したビームポジシヨナにより構成
されるレーザ加工装置に対して、前記位置補正機
構を付加することにより、ガルバノメータの温度
による角度ドリフトを気にすることなく、常に安
定した位置再現性が得られるレーザ加工を行うこ
とができる。なお、前記位置補正操作はレーザ加
工の段取時間内に自動的に行うことができ、生産
性に影響を及ぼすことはない。 As explained above, according to the present invention, by adding the position correction mechanism to a laser processing apparatus configured with a beam positioner using a galvanometer, there is no need to worry about angular drift due to the temperature of the galvanometer. , it is possible to perform laser processing that always provides stable position repeatability. Note that the position correction operation can be automatically performed within the setup time of laser processing, and does not affect productivity.
第１図は本発明の一実施例を示す図である。第
２図はレーザ光のスポツトのビツトパターン例で
ある。
図において、１は可視外域加工用レーザ装置、
３，４は光学的走査ミラー、５は集光レンズ、６
はダイクロイツクミラー、９は２次元自己走査型
光電変換装置、１０は前処理部、１１はコンピユ
ータ部、１２は制御部、１３は駆動部である。ま
た、１４は１ビツトパターンを示し、１９，１
９′はドリフト前のスポツトの中心、２０，２
０′はドリフト後のスポツトの中心を示す。
FIG. 1 is a diagram showing an embodiment of the present invention. FIG. 2 shows an example of a bit pattern of a laser beam spot. In the figure, 1 is a laser device for processing outside the visible range;
3 and 4 are optical scanning mirrors, 5 is a condensing lens, and 6
9 is a dichroic mirror, 9 is a two-dimensional self-scanning photoelectric conversion device, 10 is a preprocessing section, 11 is a computer section, 12 is a control section, and 13 is a driving section. Also, 14 indicates a 1-bit pattern, 19, 1
9' is the center of the spot before drifting, 20,2
0' indicates the center of the spot after drifting.
Claims (1)
タを使用した２次元走査型ビームポジシヨナと、
集光レンズと、光軸を変換するダイクロイツクミ
ラーにより構成されるレーザ加工装置において、
前記ビームポジシヨナを共有し、光軸が一致する
可視域ガイド用レーザ装置と、前記ダイクロイツ
クミラーを透過した前記ガイド用レーザ光を検出
するための２次元自己走査型光電変換装置により
構成される前記加工用レーザの集光位置補正機構
を具備することを特徴とするレーザ加工装置。1. A laser device for processing outside the visible range, a two-dimensional scanning beam positioner using a galvanometer,
In laser processing equipment consisting of a condensing lens and a dichroic mirror that converts the optical axis,
The processing is composed of a visible range guiding laser device that shares the beam positioner and whose optical axes coincide, and a two-dimensional self-scanning photoelectric conversion device that detects the guiding laser beam that has passed through the dichroic mirror. 1. A laser processing device comprising a laser convergence position correction mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57107410A JPS58224088A (en) | 1982-06-22 | 1982-06-22 | Laser processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57107410A JPS58224088A (en) | 1982-06-22 | 1982-06-22 | Laser processing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58224088A JPS58224088A (en) | 1983-12-26 |
| JPS6211954B2 true JPS6211954B2 (en) | 1987-03-16 |
Family
ID=14458437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57107410A Granted JPS58224088A (en) | 1982-06-22 | 1982-06-22 | Laser processing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58224088A (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0324301Y2 (en) * | 1984-10-22 | 1991-05-27 | ||
| DE3530189A1 (en) * | 1985-08-23 | 1987-03-05 | Zeiss Carl Fa | DEVICE FOR CORRECTING THE POSITION OF A LASER BEAM GUIDED BY A JOINT OPTICS |
| JPS62161489A (en) * | 1986-01-08 | 1987-07-17 | Hitachi Ltd | Laser beam machine |
| JPH0654791B2 (en) * | 1986-11-27 | 1994-07-20 | 日本電気株式会社 | Laser trimming device |
| JPS63230287A (en) * | 1987-01-22 | 1988-09-26 | Jido Hosei Syst Gijutsu Kenkyu Kumiai | Correcting method for machining error in laser beam machining |
| US4941082A (en) * | 1988-04-25 | 1990-07-10 | Electro Scientific Industries, Inc. | Light beam positioning system |
| US5011282A (en) * | 1989-11-16 | 1991-04-30 | Amada Company, Limited | Laser beam path alignment apparatus for laser processing machines |
| US5536916A (en) * | 1994-09-30 | 1996-07-16 | Sanyo Machine Works, Ltd. | Method for performing automatic alignment-adjustment of laser robot and the device |
| ATE414585T1 (en) * | 2007-03-30 | 2008-12-15 | Innolas Gmbh | SYSTEM AND ASSOCIATED METHOD FOR CORRECTING A LASER BEAM DEFLECTION UNIT |
| JP6480725B2 (en) * | 2014-12-16 | 2019-03-13 | 花王株式会社 | Laser irradiation apparatus and laser irradiation method |
| CN106152971B (en) * | 2016-07-28 | 2018-07-17 | 南京航空航天大学 | Laser three-dimensional scanning marker method under machine vision auxiliary |
| JP6632781B1 (en) * | 2019-04-01 | 2020-01-22 | 三菱電機株式会社 | Laser processing apparatus, laser processing method, and error adjustment method |
-
1982
- 1982-06-22 JP JP57107410A patent/JPS58224088A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58224088A (en) | 1983-12-26 |
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