CN110243316A - A kind of processing unit (plant) - Google Patents

A kind of processing unit (plant) Download PDF

Info

Publication number
CN110243316A
CN110243316A CN201910603316.2A CN201910603316A CN110243316A CN 110243316 A CN110243316 A CN 110243316A CN 201910603316 A CN201910603316 A CN 201910603316A CN 110243316 A CN110243316 A CN 110243316A
Authority
CN
China
Prior art keywords
light
workpiece
plant
processing unit
scanning means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910603316.2A
Other languages
Chinese (zh)
Inventor
邱国育
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Syntec Technology Suzhou Co Ltd
Original Assignee
Syntec Technology Suzhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Syntec Technology Suzhou Co Ltd filed Critical Syntec Technology Suzhou Co Ltd
Priority to CN201910603316.2A priority Critical patent/CN110243316A/en
Publication of CN110243316A publication Critical patent/CN110243316A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/30Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces

Abstract

A kind of processing unit (plant) is suitable for one workpiece of processing, comprising: optical module and light source for processing.Optical module includes lens module, secondary light source and at least one first scanning means, secondary light source issues auxiliary light, auxiliary light passes through lens module and irradiates the workpiece via at least one first scanning means, wherein auxiliary light forms linear hot spot via lens module conversion light shape and in workpiece surface, and processing unit (plant) passes through linear beam spot scans workpiece to obtain the surface information of light part.The process light that light source for processing issues processes the workpiece via at least one first scanning means.Processing unit (plant) of the invention can scan workpiece surface under the situation of the mobile devices such as not additional installation manipulator arm or sliding rail and obtain the surface information of entire workpiece surface, improve the task performance of processing unit (plant) itself.

Description

A kind of processing unit (plant)
Technical field
The invention relates to a kind of processing unit (plant)s, have secondary light source to scan workpiece surface in particular to one kind The processing unit (plant) of information.
Background technique
Existing optical manufacturing device is usually all to irradiate to be issued by light source to workpiece using the optical system inside device Light, to carry out mark (marking), exposure (exposure), etching (etching), punching (punching), delineation (scribing) or cutting (dicing) etc. work.And the work surface of workpiece is not necessarily smooth plane, may have A kind of optical scanner of external hanging type is also needed at multiple apparent concave-convex fluctuatings, therefore in existing optical manufacturing device, For scanning the surface information of workpiece with the machining accuracy of improving optical processing unit (plant).
However optical scanner and optical manufacturing device are two equipment independent, therefore optical manufacturing device Manufacturer or equipment integrate manufacturer and have to voluntarily integrate both equipment, such as optical scanner and optical manufacturing are filled Respective coordinate system is set mutually to convert etc..And the optical scanner of this external hanging type can only obtain workpiece a part Surface information, need in addition to replace optical scanner installation manipulator to obtain the work surface information of workpiece entirety The mobile mechanisms such as arm, sliding rail, crawler belt thus will increase dramatically cost needed for equipment.In addition, existing optical manufacturing device When work, need first to set processing time-histories (or program) according to the drawing of workpiece, further according to the surface obtained from optical scanner Information modifies the position to be processed, and thus whole working hour also will increase dramatically.Therefore, it is still necessary to providing a kind of processing dress It sets to solve the disadvantage that existing optical manufacturing device.
Prior art paragraph is used only to help to understand the content of present invention, therefore disclosed content is fallen in previous technical It may be comprising some without constituting known techniques known to those of ordinary skill in the art.In previous technical Disclosed content is fallen, the content or the one or more embodiments of present invention problem to be solved are not represented, in this hair Known or recognized by those of ordinary skill in the art before bright application.
Summary of the invention
Disadvantage according to prior art, the object of the present invention is to provide a kind of processing unit (plant)s, can sweep with secondary light source Workpiece surface to be processed is retouched, to obtain the surface information of entire workpiece surface.
It is a further object of the present invention to provide a kind of processing unit (plant)s, and it is mobile to be not necessary to additionally mounted mechanical arm or sliding rail etc. Equipment can be scanned workpiece to be processed surface, to improve the task performance of processing unit (plant) itself.
Other objects and advantages of the present invention can from disclosed herein technical characteristic in be further understood.
It is up to part or all of above-mentioned purpose or other purposes, one embodiment of the invention discloses a kind of processing dress It sets, for processing a workpiece, including optical module and light source for processing, optical module includes lens module, secondary light source and extremely Few one first scanning means, for issuing auxiliary light, auxiliary light passes through lens module and via at least 1 the secondary light source One scanning means irradiates workpiece, and light is assisted to form linear hot spot via lens module conversion light shape and in workpiece surface, processes Device passes through linear beam spot scans workpiece to obtain the surface information of workpiece, and light source for processing is for issuing process light to optics group Part, wherein process light is via at least one first scanning means workpieces processing.
In one embodiment, processing unit (plant) further includes photosensitive element and control unit, and auxiliary light irradiates workpiece and shape At reflected light, wherein control unit is electrically connected at lens module, secondary light source, at least one first scanning means, light source for processing And photosensitive element, and photosensitive elements sense reflected light and the corresponding sensing signal that issues are to control unit.
In one embodiment, control unit controls light source for processing at least one first scanning means to add according to sensing signal Work workpiece.
In one embodiment, optical module further includes the second scanning means, and control module is electrically connected at the second scanning dress It sets, and process light is sequentially via the second scanning means and at least one first scanning means with workpieces processing.
In one embodiment, sensing signal includes multiple image signals, and control unit is calculated according to these image signals Workpiece surface information is selectively to control light source for processing, at least one first scanning means and the second scanning means.
In one embodiment, lens module includes light shape adjustment lens and switching construction, control unit control switching knot Structure is so that light shape adjustment lens move into or be moved away from the light path of auxiliary light.
In one embodiment, optical module further includes field lens module, and field lens module focuses process light with workpieces processing.
In one embodiment, optical module further includes spectroscope, and the optical path of the light path of process light and auxiliary light Diameter at least partly coincides with spectroscope.
Based on above-mentioned, the embodiment of the present invention at least have effects that following one of advantage or.In implementation of the invention In example, there is lens module in optical module, the auxiliary light that secondary light source issues is converted by lens module and via at least One first scanning means irradiates workpiece, and forms linear hot spot on the surface of the workpiece, thus can be in not additional fitting machine Workpiece surface is scanned under the situation of the mobile devices such as tool arm or sliding rail and obtains the surface information of entire workpiece surface, is improved and is added Tooling sets the task performance of itself.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and cooperate institute's accompanying drawings It is described in detail below.
Detailed description of the invention
Fig. 1 is an embodiment disclosed according to the present invention, indicates the configuration diagram of processing unit (plant);
Fig. 2 is the embodiment according to disclosed by Fig. 1, indicates the system block schematic diagram of processing unit (plant);
Fig. 3 is another embodiment disclosed according to the present invention, indicates the configuration diagram of processing unit (plant);
Fig. 4 is the embodiment according to Fig. 3, indicates the system block schematic diagram of processing unit (plant);
Fig. 5 is another embodiment disclosed according to the present invention, indicates the configuration diagram of processing unit (plant);And
Fig. 6 is another embodiment disclosed according to the present invention, indicates the configuration diagram of processing unit (plant).
10,10A, 10B, 10C processing unit (plant)
20 optical modules
21 shells
22 lens modules
221 smooth shapes adjust lens
222 switching constructions
223 positions
23 light-emitting windows
24 secondary light sources
241 auxiliary light
242 reflected lights
26 first scanning means
27 second scanning means
28 spectroscopes
29 field lens modules
30 light source for processing
31 process lights
40 workpiece
41 surfaces
42 linear hot spots
43A, 43B groove
50 photosensitive elements
60 control units
Specific embodiment
The invention will now be described in further detail with reference to the accompanying drawings.
It is preferable with reference to one of schema in following cooperation in relation to addressing other technologies content, feature and effect before the present invention In the detailed description of embodiment, can clearly it present.The direction term being previously mentioned in following embodiment, such as: upper and lower, left, It is right, front or rear etc., it is only the direction with reference to annexed drawings.Therefore, the direction term used is intended to be illustrative and not intended to limit The present invention.
Fig. 1 is an embodiment disclosed according to the present invention, indicates the configuration diagram of processing unit (plant).Referring to FIG. 1, plus Tooling sets 10 and is suitable for workpieces processing 40, and processing unit (plant) 10 includes optical module 20 and light source for processing 30.Optical module 20 further includes Lens module 22, secondary light source 24 and at least one first scanning means 26 (are schematically schematically shown as 2 first to sweep in Fig. 1 Imaging apparatus 26, but be not limited thereto), secondary light source 24 is for issuing auxiliary light 241, wherein auxiliary light 241 is across saturating Mirror module 22 simultaneously irradiates workpiece 40 via at least one first scanning means 26, and assists light 241 will via lens module 22 Light shape is converted to threadiness by dotted, and forms linear hot spot 42 in the surface of workpiece 40 41, in this way, which processing unit (plant) 10 can lead to The surface 41 that linear hot spot 42 scans workpiece 40 is crossed, to obtain the surface information on surface 41.For example, the first scanning means 26 E.g. rotatable reflecting mirror, the direction of illumination of changeable fill-in light line 241 when the rotation of the first scanning means 26, also It is to say to can change linear hot spot 42 in the position on the surface of workpiece 40 41, processing unit (plant) 10 is enable to sweep by linear hot spot 42 Retouch other regions on surface 41.
With continued reference to FIG. 1, light source for processing 30 is for issuing process light 31 to optical module 20, wherein process light 31 Via at least one first scanning means 26 with workpieces processing 40, that is to say, that process light 31 exposes to the first scanning means After 26, the direction of illumination of changeable process light 31 when the rotation of the first scanning means 26, to adjust process light 31 in work The Working position on the surface 41 of part 40.In the present embodiment, secondary light source 24 and light source for processing 30 are, for example, laser source, wherein plus The power of work light source 30 is higher than the power of secondary light source 24.For example, secondary light source 24 is, for example, the radium-shine of power about 20mW Light source, it is preferred that use blue light or green light laser source, to improve sensing accuracy, the e.g. power of light source for processing 30 is about The laser source of 20w to 2kW, to carry out radium-shine processing to workpiece 40, wherein laser source is, for example, that He-Ne is radium-shine, titanium dioxide Carbon is radium-shine, laser diode or other laser sources appropriate, in addition, secondary light source 24 may be designed in light source for processing 30 The light such as feux rouges, infrared light, ultraviolet light etc. of other wavelength can be issued, it is possible to use the enough light sources of other power replace radium Light source is penetrated, invention is not limited thereto.
Fig. 2 is an embodiment disclosed according to the present invention, indicates the system block schematic diagram of processing unit (plant).Please refer to figure 1 and Fig. 2, processing unit (plant) 10 further include photosensitive element 50 and control unit 60, and auxiliary light 241 will form when irradiating workpiece 40 Reflected light 242, wherein control unit 60 is electrically connected at lens module 22, secondary light source 24, the first scanning means 26, processing light Source 30 and photosensitive element 50, and photosensitive element 50 senses reflected light 242 and the corresponding sensing signal that issues to control unit 60.This In embodiment, photosensitive element 50 is, for example, CCD (Charge-coupled Device, photosensitive coupling element) lighting apparatus, control Unit 60 is, for example, the central processing unit (Central Processing Unit, CPU) for having single core or multi-core, or The general service of other programmables or microprocessor (Microprocessor), the digital signals processor of specific use (Digital Signal Processor, DSP), programmable controller, special application integrated circuit (Application Specific IntegratedCircuit, ASIC) or other similar element or said elements combination collocation, the present invention is to this And it is without restriction.
Please continue to refer to Fig. 1 and Fig. 2, lens module 22 includes light shape adjustment lens 221 and switching construction 222, light shape tune Whole lens 221 are installed on switching construction 222, and control unit 60 controls switching construction 222 so that light shape adjustment lens 221 move into Or it is moved away from the light path of auxiliary light 241.For example, when being not required to the surface 41 to workpiece 40 and being scanned, control unit Light shape adjustment lens 221 are moved to position 223 by 60 controllable switching constructions 222.In the present embodiment, light shape adjusts lens 221 E.g. cylindrical lenses (columnar lens), Bao Weier lens (Powell lens) or other shaped laser spot can be existed Linear optical element is extended on one specific direction, switching construction 222 is, for example, using pneumatic type switching mechanism, rotatably cuts Change planes structure, track module or other suitable mechanisms, and invention is not limited thereto.
Please refer to Fig. 1 and Fig. 2, it is however generally that, usually there are multiple uneven places (to show in figure on the surface 41 of workpiece 40 2 groove 43A, 43B with geometry in particular are painted to meaning property, but not limited to this), when the processing that processing unit (plant) 10 issues When light 31 processes one of groove 43A, control unit 60 can control secondary light source 24 simultaneously to form Line of light Spot 41 scans another groove 43B.Sensing signal of the photosensitive element 50 further according to sending corresponding to the reflected light 242 received, example It in this way include the image information of each groove 43A, 43B, control unit 60 is according to these image informations progress workpiece surface 41 and respectively The calculating of the surface information of groove 43A, 43B converses various machining informations, such as workpiece compensation further according to these surface informations Amount, welding bead position coordinates etc., thus control unit 60 can control light source for processing 60 and first according to these machining informations Scanning means 26 is to process workpiece 40.Compared to existing optical machining device, processing unit (plant) 10 of the invention can be not Workpiece surface is scanned under the situation of the additional mobile devices such as installation manipulator arm or sliding rail and obtains the surface information of entire workpiece, Improve the task performance of processing unit (plant) 10 itself.In addition, the present embodiment changes the light shape of auxiliary light 241 via lens module 22 And linear hot spot 42 is formed on workpiece surface 41, therefore workpiece 40 can be directly scanned by linear hot spot 42, to obtain table The surface information in face 41 is simultaneously converted to machining information by control unit 60 in real time.Furthermore when needing to process multiple workpiece When, processing unit (plant) 10 can also scan multiple workpiece simultaneously by linear hot spot 42 simultaneously, can thus be greatly decreased and add The time required to work.
Referring to FIG. 1, processing unit (plant) 10 further includes shell 21 in the present embodiment, shell 21 is coated in optical module 20 All elements and photosensitive element 50 improve processing unit (plant) in this way, which user does not need voluntarily to integrate or assemble these elements 10 ease of use.In addition, optical module 20 further include an at least spectroscope 28 (1 is schematically painted in figure, but not with This is limited), spectroscope 28 is, for example, semi-penetration semi-reflective mirror, and spectroscope 28 can reflect auxiliary light 241 and enable in the present embodiment Process light 31 penetrates, and thus assists light 241 and process light 31 in at least portion for being transferred to the first scanning means 26 Light splitting path be it is shared, the complexity of 20 inside light path of optical module can be simplified.In addition, optical module 20 is also optionally Field lens module 29 is set, and field lens module 29 is, for example, to use including F- θ lens (F-theta lens, also known as f-theta lens) With autofocus assist light line 241 and process light 31, however the present invention is not limited thereto, and F- θ lens can be focused with other The lens of light replace, and optical module 20 can also be not provided with field lens module 29 to reduce equipment cost.
Fig. 3 is another embodiment disclosed according to the present invention, indicates the configuration diagram of processing unit (plant),
Fig. 4 is the embodiment according to disclosed by Fig. 3, indicates the system block schematic diagram of processing unit (plant).Please refer to Fig. 3 and figure 4, processing unit (plant) 10A is similar to processing unit (plant) 10 disclosed by Fig. 1, Fig. 2, and identical element is indicated with identical label, herein It is not repeated here.Processing unit (plant) 10A and the difference of processing unit (plant) 10 are, further include the second scanning means in optical module 20 27, control unit 60 is electrically connected at the second scanning means 27, and the auxiliary light 241 that secondary light source 24 is issued is sequentially via The surface 41 of two scanning means 27 and at least one first scanning means 26 scanning workpiece 40, to obtain the surface information on surface 41, The process light 31 that light source for processing 30 is issued is sequentially via the second scanning means 27 and at least one first scanning means 26, with right Workpiece 40 is processed.In addition, it includes multiple image signals that the sensing signal that is issued of photosensitive element 50, which is, for example,, control unit 60 The calculating of the surface information of workpiece 40 is carried out, according to these image signals selectively to control light source for processing 30, at least one first Scanning means 26 and the second scanning means 27, wherein the second scanning means 27 is, for example, at least lens composition.For example, when When there is the groove 43A or 43B of big rise and fall on the surface 41 of workpiece 40 to be processed, controllable first scanning of control unit 60 Device 26 is to adjust the irradiation position or angle of process light 31, and e.g. adjustment is perpendicular to the irradiation position on the direction on surface 41 It sets or angle, and process light 31 is focused by the second scanning means 27, thus processing unit (plant) 10A can not moved Groove 43A, 43B on surface 41 are processed in the case of placement position that is dynamic or changing workpiece 40 or angle.
Fig. 5 is another embodiment disclosed according to the present invention, indicates the configuration diagram of processing unit (plant).Referring to FIG. 5, Processing unit (plant) 10B is similar to processing unit (plant) 10,10A, and identical element is indicated with identical label, is not repeated here herein. Processing unit (plant) 10B and the difference of processing unit (plant) 10,10A are that the second scanning means 27 is located on the light path of process light 31, Wherein process light 31 is, for example, sequentially via the second scanning means 27 and at least one first scanning means 26 to add to workpiece 40 Work, and surface 41 of the light 241 then via the first scanning means 26 scanning workpiece 40 is assisted, without passing through the second scanning means 27 are focused.
Fig. 6 is another embodiment disclosed according to the present invention, indicates the configuration diagram of processing unit (plant).Referring to FIG. 6, Processing unit (plant) 10C is similar to processing unit (plant) 10,10A, 10B, and identical element is indicated with identical label, is no longer gone to live in the household of one's in-laws on getting married herein It states.Processing unit (plant) 10C and the difference of processing unit (plant) 10,10A, 10B are that optical module 20 does not have field lens module 29, auxiliary After light 241 and process light 31 change direction of travel via the first scanning means 26, by 23 direct irradiation workpiece 40 of light-emitting window Surface 41.In addition, the optical module 20 of the processing unit (plant) 10C of the present embodiment does not have the second scanning means 27, however optics Component 20 also can install the second scanning means 27 in appropriate location with autofocus assist light line 241 or process light 31, the present invention It is not limited thereto.
In conclusion in an embodiment of the present invention, the auxiliary light that secondary light source issues pass through lens module and via At least one first scanning means irradiates workpiece, wherein auxiliary light forms line via lens module conversion light shape and in workpiece surface Shaped laser spot, the process light that light source for processing issues is via at least one first scanning means workpieces processing, thus processing unit (plant) Workpiece surface can be scanned under the situation of the mobile devices such as not additional installation manipulator arm or sliding rail and obtain entire workpiece surface Surface information, improve processing unit (plant) itself task performance.
Only as described above, is only a preferred embodiment of the present invention, when the model that cannot limit implementation of the invention with this It encloses, i.e., the simple equivalent changes and modifications made generally according to scope of the present invention patent and summary of the invention all still belong to this hair In the range that bright patent covers.In addition any embodiment of the invention or claim are not necessary to reach that disclosed herein it Whole purposes or advantage or feature.It is used in addition, abstract part and title are intended merely to auxiliary patent document search, is not used to Limit the interest field of the present invention.In addition, the terms such as " first " that refers in this specification or claim, " second " are only To name the title of element (element) or distinguish different embodiments or range, and it is quantitative to be not used to restriction element The upper limit or lower limit.

Claims (8)

1. a kind of processing unit (plant), for processing a workpiece, comprising:
One optical module, including a lens module, a secondary light source and at least one first scanning means, the secondary light source are used for An auxiliary light is issued, which passes through the lens module and irradiate the workpiece via first scanning means, wherein should Light is assisted to form linear hot spot via the lens module conversion light shape and in a surface of the workpiece, and the processing unit (plant) passes through Surface information of the threadiness beam spot scans workpiece to obtain the workpiece;And
One light source for processing issues a process light to the optical module, and wherein the process light adds via first scanning means The work workpiece.
2. processing unit (plant) according to claim 1, which is characterized in that it further include a photosensitive element and a control unit, The auxiliary light irradiates the workpiece and forms a reflected light, and wherein the control unit is electrically connected at the lens module, the auxiliary Light source, at least one first scanning means, the light source for processing and the photosensitive element, and the photosensitive elements sense reflected light is simultaneously The corresponding sensing signal that issues is to the control unit.
3. processing unit (plant) according to claim 2, which is characterized in that wherein the control unit is controlled according to the sensing signal The light source for processing and at least one first scanning means are to process the workpiece.
4. processing unit (plant) according to claim 2, which is characterized in that wherein the optical module further includes one second scanning dress It sets, which is electrically connected at second scanning means, and the process light sequentially via second scanning means and is somebody's turn to do At least one first scanning means is to process the workpiece.
5. processing unit (plant) according to claim 4, which is characterized in that wherein the sensing signal includes multiple image signals, And the control unit according to those image signals calculate those surface informations of the workpiece with selectively control the light source for processing, At least one first scanning means and second scanning means.
6. processing unit (plant) according to claim 2, which is characterized in that wherein the lens module includes that a smooth shape adjusts lens And a switching construction, and the control unit controls the switching construction so that light shape adjustment lens move into or be moved away from the fill-in light The light path of line.
7. processing unit (plant) according to claim 1, which is characterized in that wherein the optical module further includes a field lens module, And the field lens module focuses the process light to process the workpiece.
8. processing unit (plant) according to claim 1, which is characterized in that wherein the optical module further includes a spectroscope, and The light path of the light path of the process light and the auxiliary light at least partly coincides with the spectroscope.
CN201910603316.2A 2019-07-05 2019-07-05 A kind of processing unit (plant) Pending CN110243316A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910603316.2A CN110243316A (en) 2019-07-05 2019-07-05 A kind of processing unit (plant)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910603316.2A CN110243316A (en) 2019-07-05 2019-07-05 A kind of processing unit (plant)

Publications (1)

Publication Number Publication Date
CN110243316A true CN110243316A (en) 2019-09-17

Family

ID=67891074

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910603316.2A Pending CN110243316A (en) 2019-07-05 2019-07-05 A kind of processing unit (plant)

Country Status (1)

Country Link
CN (1) CN110243316A (en)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19963010A1 (en) * 1999-12-22 2001-07-05 Fraunhofer Ges Forschung Laser workpiece processing involves controlling light beam deflection depending on current contour position detected by control and evaluation unit via scanning mirror(s), optical detector
JP2007326132A (en) * 2006-06-08 2007-12-20 Olympus Corp Laser beam machining apparatus
KR20080111606A (en) * 2007-06-19 2008-12-24 연세대학교 산학협력단 Scan type laser processing apparatus having measuring unit
CN102066036A (en) * 2008-06-17 2011-05-18 伊雷克托科学工业股份有限公司 Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems
JP2012040574A (en) * 2010-08-16 2012-03-01 Sumitomo Electric Ind Ltd Laser beam machining apparatus
CN203804423U (en) * 2014-03-21 2014-09-03 西门子(中国)有限公司 Laser machining device
TW201630679A (en) * 2015-02-26 2016-09-01 兆陽真空動力股份有限公司 A laser machining method
CN106232283A (en) * 2014-02-28 2016-12-14 Ipg光子公司 Use the multi-beam laser processing of different wave length and/or multiple laser beams in pulse duration
TW201718147A (en) * 2015-11-19 2017-06-01 財團法人金屬工業研究發展中心 Laser machining system and method for real-time machining amount confirmation
CN107617819A (en) * 2016-07-13 2018-01-23 发那科株式会社 Laser processing device and laser-processing system
CN207547874U (en) * 2017-11-03 2018-06-29 伊欧激光科技(苏州)有限公司 Laser processing device
US20180299260A1 (en) * 2017-04-18 2018-10-18 Fanuc Corporation Laser processing system having measurement function
CN109719387A (en) * 2017-10-31 2019-05-07 上海微电子装备(集团)股份有限公司 Laser processing device and method, laser package method, laser anneal method
TWM585675U (en) * 2019-07-05 2019-11-01 新代科技股份有限公司 Processing apparatus
CN210346617U (en) * 2019-07-05 2020-04-17 新代科技(苏州)有限公司 Processing device

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19963010A1 (en) * 1999-12-22 2001-07-05 Fraunhofer Ges Forschung Laser workpiece processing involves controlling light beam deflection depending on current contour position detected by control and evaluation unit via scanning mirror(s), optical detector
JP2007326132A (en) * 2006-06-08 2007-12-20 Olympus Corp Laser beam machining apparatus
KR20080111606A (en) * 2007-06-19 2008-12-24 연세대학교 산학협력단 Scan type laser processing apparatus having measuring unit
CN102066036A (en) * 2008-06-17 2011-05-18 伊雷克托科学工业股份有限公司 Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems
JP2012040574A (en) * 2010-08-16 2012-03-01 Sumitomo Electric Ind Ltd Laser beam machining apparatus
CN106232283A (en) * 2014-02-28 2016-12-14 Ipg光子公司 Use the multi-beam laser processing of different wave length and/or multiple laser beams in pulse duration
CN203804423U (en) * 2014-03-21 2014-09-03 西门子(中国)有限公司 Laser machining device
TW201630679A (en) * 2015-02-26 2016-09-01 兆陽真空動力股份有限公司 A laser machining method
TW201718147A (en) * 2015-11-19 2017-06-01 財團法人金屬工業研究發展中心 Laser machining system and method for real-time machining amount confirmation
CN107617819A (en) * 2016-07-13 2018-01-23 发那科株式会社 Laser processing device and laser-processing system
US20180299260A1 (en) * 2017-04-18 2018-10-18 Fanuc Corporation Laser processing system having measurement function
CN109719387A (en) * 2017-10-31 2019-05-07 上海微电子装备(集团)股份有限公司 Laser processing device and method, laser package method, laser anneal method
CN207547874U (en) * 2017-11-03 2018-06-29 伊欧激光科技(苏州)有限公司 Laser processing device
TWM585675U (en) * 2019-07-05 2019-11-01 新代科技股份有限公司 Processing apparatus
CN210346617U (en) * 2019-07-05 2020-04-17 新代科技(苏州)有限公司 Processing device

Similar Documents

Publication Publication Date Title
CN101856773B (en) Focusing positioning method based on initial laser processing position and laser processing device
CN106964904B (en) Multi-angle visual positioning laser marking machine and laser marking method thereof
TW445189B (en) Laser processing apparatus and method
CN105598579A (en) Laser processing device and method for carrying out vision positioning based on two coaxial CCDs
CN104907691A (en) Laser processing apparatus and laser processing method
JP2008030091A5 (en)
JP2008055455A (en) Laser beam machining method and laser beam machining apparatus
CN201693290U (en) Laser processing device
CN110421253A (en) Laser scanning system and laser engraving system with it
EP3124163B1 (en) System and method for laser processing
CN210451368U (en) Laser scanning system and laser engraving system with same
CN113134681A (en) Process method and equipment for removing AF coating by laser
JP2003220483A (en) Laser beam machining device and deviation correction method for use therein
CN110243316A (en) A kind of processing unit (plant)
CN210346617U (en) Processing device
CN212330015U (en) Ultraviolet laser processing device based on coaxial vision system
JP2007301610A (en) Laser beam machining method and laser beam machining apparatus
CN117283144A (en) Laser re-engraving machine based on visual identification
CN115922068B (en) Feedback type laser pulse processing method and equipment for multilayer composite material
CN115229330B (en) Automatic focusing device and method for laser processing
TWM585675U (en) Processing apparatus
CN114089369A (en) Three-dimensional laser positioning projection device
CN211866864U (en) Laser processing apparatus
KR100480435B1 (en) Device to chase automatically marking-position of laser marking system
JP5142916B2 (en) Laser processing method and laser processing apparatus

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination