TWM582041U - Microelectromechanical fluid device module - Google Patents

Abstract

A microelectromechanical fluid device module includes a package carrier, a plurality of microelectromechanical fluid device chips, and a plurality of wires. The package carrier is a rectangular parallelepiped having a carrier long side and a carrier short side and comprising a plurality of carrier electrodes. The MEMS fluid device wafer is disposed on the package carrier. Each microelectromechanical fluid device chip has a rectangular parallelepiped shape with a long side of a wafer and a short side of the wafer, and includes a wafer body and a plurality of microelectromechanical fluid devices. The microelectromechanical fluid device is disposed on the wafer body and has a plurality of wafer electrodes, respectively. The two ends of each wire are respectively connected with corresponding carrier electrodes and corresponding wafer electrodes.

Description

Microelectromechanical fluid device module

The present invention relates to a microelectromechanical module, and more particularly to a microelectromechanical fluid device module that utilizes novel packaging methods to enhance the efficiency of a microelectromechanical fluid device.

With the rapid development of technology, the conventional fluid delivery device has been oriented toward the miniaturization of the device and the maximization of the flow rate. It is also becoming more and more diversified in application. It can be seen in industrial applications, biomedical applications, medical care, and electronic heat dissipation to the recent popular wearable devices.

In recent years, the microelectromechanical related process has achieved the wafer transport of the fluid transport device in an integrated manner. As shown in FIGS. 1A and 1B, the conventional microelectromechanical fluid device wafers 10a, 10b respectively include a plurality of microelectromechanical fluid devices 11. However, the above-mentioned wafer-formed fluid delivery device has a lower flow rate, head and pressure than conventional fluid delivery devices. Moreover, when the conventional microelectromechanical fluid device wafers 10a, 10b are in operation, the corner portions thereof are deformed by vibration. The production yield is not good, which makes the production cost increase.

Therefore, how to use the novel packaging method to increase the flow rate, head and pressure of the wafer fluid conveying device, and reduce the production cost is an issue that needs to be solved.

The main purpose of the present invention is to provide a microelectromechanical fluid device module that utilizes a novel packaging method to increase the flow, head and pressure of the MEMS fluid device module, and to reduce production costs.

To achieve the above object, a broader embodiment of the present invention provides a MEMS device module comprising a package carrier, a plurality of MEMS device wafers, and a plurality of wires. The package carrier is a rectangular parallelepiped having a carrier long side and a carrier short side and comprising a plurality of carrier electrodes. The MEMS fluid device wafer is disposed on the package carrier. Each microelectromechanical fluid device chip has a rectangular parallelepiped shape with a long side of a wafer and a short side of the wafer, and includes a wafer body and a plurality of microelectromechanical fluid devices. The microelectromechanical fluid device is disposed on the wafer body and has a plurality of wafer electrodes, respectively. The two ends of each wire are respectively connected with corresponding carrier electrodes and corresponding wafer electrodes.

Embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various embodiments, and is not intended to limit the scope of the invention.

Referring to FIG. 2, in the first embodiment of the present invention, the MEMS fluid device module 1a includes a package carrier 21, a plurality of MEMS device wafers A1, A2, A3, and a plurality of wires 24. The package carrier 21 is in the form of a rectangular parallelepiped having a carrier long side 21a and a carrier short side 21b, and includes a plurality of carrier electrodes 21p. The carrier electrode 21p is disposed on opposite sides of the microelectromechanical fluid device wafers A1, A2, A3 and disposed along the extending direction of the carrier long side 21a of the package carrier 21. In the first embodiment of the present invention, the microelectromechanical fluid device module 1a includes three microelectromechanical fluid device wafers A1, A2, and A3. However, the number of the microelectromechanical fluid device wafers may be changed according to design requirements. In the first embodiment of the present invention, the microelectromechanical fluid device wafers A1, A2, and A3 are disposed on the package carrier 21 and disposed in series along the extending direction of the carrier long side 21a of the package carrier 21. Each of the microelectromechanical fluid device wafers A1, A2, and A3 has a rectangular parallelepiped shape, has a wafer long side 22a and a wafer short side 22b, and includes a wafer body 22 and a plurality of microelectromechanical fluid devices 23. In the first embodiment of the present invention, the long side 22a of the wafer of the microelectromechanical fluid device wafers A1, A2, A3 is disposed in parallel with the carrier long side 21a of the package carrier 21. The microelectromechanical fluid device 23 is disposed on the wafer body 22, along the extending direction of the long side 22a of the wafer of the microelectromechanical fluid device wafers A1, A2, A3, and has a plurality of wafer electrodes 22p, respectively. The wafer electrodes 22p are disposed on opposite sides of the microelectromechanical fluid device 23 and are disposed along the extending direction of the wafer long side 22a of the microelectromechanical fluid device wafers A1, A2, A3. The two ends of each of the wires 24 are respectively connected to the corresponding carrier electrode 21p and the corresponding wafer electrode 22p. It should be noted that, in the first embodiment of the present invention, the configuration of the MEMS device wafers A1, A2, and A3 can increase the space usage rate and reduce the flow rate, head, and pressure of the MEMS device module 1a. The volume of the package carrier 21.

Referring to FIG. 3, in the second embodiment of the present invention, the MEMS fluid device module 1b includes a package carrier 21, MEMS device wafers A1, A2, A3, and wires 24. The package carrier 21 has a rectangular parallelepiped shape, has a carrier long side 21a and a carrier short side 21b, and includes a carrier electrode 21p. The carrier electrode 21p is disposed on opposite sides of the microelectromechanical fluid device wafers A1, A2, A3 and disposed along the extending direction of the carrier long side 21a of the package carrier 21. In the second embodiment of the present invention, the microelectromechanical fluid device module 1b includes three microelectromechanical fluid device wafers A1, A2, and A3. However, the number of the microelectromechanical fluid device wafers may be changed according to design requirements. In the second embodiment of the present invention, the MEMS device wafers A1, A2, and A3 are disposed on the package carrier 21 and are staggered along the extending direction of the carrier long side 21a of the package carrier 21. Each of the microelectromechanical fluid device wafers A1, A2, and A3 has a rectangular parallelepiped shape, has a wafer long side 22a and a wafer short side 22b, and includes a wafer body 22 and a microelectromechanical fluid device 23. In the second embodiment of the present invention, the long side 22a of the wafer of the microelectromechanical fluid device wafers A1, A2, A3 is disposed in parallel with the carrier long side 21a of the package carrier 21. The microelectromechanical fluid device 23 is disposed on the wafer body 22, along the extending direction of the long side 22a of the wafer of the microelectromechanical fluid device wafers A1, A2, A3, and has a plurality of wafer electrodes 22p, respectively. The wafer electrodes 22p are disposed on opposite sides of the microelectromechanical fluid device 23 and are disposed along the extending direction of the wafer long side 22a of the microelectromechanical fluid device wafers A1, A2, A3. The two ends of each of the wires 24 are respectively connected to the corresponding carrier electrode 21p and the corresponding wafer electrode 22p. It should be noted that in the second embodiment of the present invention, the configuration of the microelectromechanical fluid device chips A1, A2, and A3 can increase the flow rate, head and pressure of the microelectromechanical fluid device module 1b, and the microelectromechanical fluid device chips A1 and A2. There is an overlap at the intersection of A3, whereby the total length of the package carrier 21 can also be reduced.

Referring to FIG. 4, in the third embodiment of the present invention, the microelectromechanical fluid device module 2a includes a package carrier 21, a plurality of microelectromechanical fluid device wafers B1, B2, and B3, and wires 24. The package carrier 21 has a rectangular parallelepiped shape, has a carrier long side 21a and a carrier short side 21b, and includes a carrier electrode 21p. The carrier electrode 21p is disposed on opposite sides of the microelectromechanical fluid device wafers B1, B2, B3 and disposed along the extending direction of the carrier long side 21a of the package carrier 21. In the third embodiment of the present invention, the MEMS device module 2a includes three MEMS device wafers B1, B2, and B3. However, the number of the MEMS device wafers may be changed according to design requirements. In the third embodiment of the present invention, the microelectromechanical fluid device wafers B1, B2, and B3 are disposed on the package carrier 21 and disposed in series along the extending direction of the carrier long side 21a of the package carrier 21. Each of the microelectromechanical fluid device wafers B1, B2, B3 has a rectangular parallelepiped shape with a wafer long side 22a and a wafer short side 22b, and includes a wafer body 22 and a microelectromechanical fluid device 23. In the third embodiment of the present invention, the long side 22a of the wafer of the microelectromechanical fluid device wafers B1, B2, B3 is disposed in parallel with the carrier short side 21b of the package carrier 21. The microelectromechanical fluid device 23 is disposed on the wafer body 22, along the extending direction of the wafer long side 22a of the microelectromechanical fluid device wafers B1, B2, B3, and has a plurality of wafer electrodes 22p, respectively. The wafer electrodes 22p are disposed on opposite sides of the microelectromechanical fluid device 23 and are disposed along the extending direction of the wafer short side 22b of the microelectromechanical fluid device wafers B1, B2, B3. The two ends of each of the wires 24 are respectively connected to the corresponding carrier electrode 21p and the corresponding wafer electrode 22p. It should be noted that, in the third embodiment of the present invention, the configuration of the MEMS device wafers B1, B2, and B3 can increase the space usage rate and reduce the flow rate, head, and pressure of the MEMS device module 2a. The volume of the package carrier 21.

Referring to FIG. 5, in the fourth embodiment of the present invention, the microelectromechanical fluid device module 2b includes a package carrier 21, microelectromechanical fluid device wafers B1, B2, and B3, and wires 24. The package carrier 21 has a rectangular parallelepiped shape, has a carrier long side 21a and a carrier short side 21b, and includes a carrier electrode 21p. The carrier electrode 21p is disposed on opposite sides of the microelectromechanical fluid device wafers B1, B2, B3 and disposed along the extending direction of the carrier long side 21a of the package carrier 21. In the fourth embodiment of the present invention, the microelectromechanical fluid device module 2b includes three microelectromechanical fluid device wafers B1, B2, and B3. However, the number of the microelectromechanical fluid device wafers may be changed according to design requirements. In the fourth embodiment of the present invention, the microelectromechanical fluid device wafers B1, B2, and B3 are disposed on the package carrier 21 and are staggered along the extending direction of the carrier long side 21a of the package carrier 21. Each of the microelectromechanical fluid device wafers B1, B2, B3 has a rectangular parallelepiped shape with a wafer long side 22a and a wafer short side 22b, and includes a wafer body 22 and a microelectromechanical fluid device 23. In the fourth embodiment of the present invention, the long side 22a of the wafer of the microelectromechanical fluid device wafers B1, B2, B3 is disposed in parallel with the carrier short side 21b of the package carrier 21. The microelectromechanical fluid device 23 is disposed on the wafer body 22, along the extending direction of the wafer long side 22a of the microelectromechanical fluid device wafers B1, B2, B3, and has a wafer electrode 22p, respectively. The wafer electrodes 22p are disposed on opposite sides of the microelectromechanical fluid device 23 and are disposed along the extending direction of the wafer short side 22b of the microelectromechanical fluid device wafers B1, B2, B3. The two ends of each of the wires 24 are respectively connected to the corresponding carrier electrode 21p and the corresponding wafer electrode 22p. It should be noted that, in the fourth embodiment of the present invention, the configuration of the MEMS device wafers B1, B2, and B3 can increase the flow rate, head, and pressure of the MEMS device module 2b, and can also increase the MEMS device chip. B1, B2, B3 configuration flexibility.

It should be noted that the configurations of the first to fourth embodiments of the present invention have different application levels, and the configuration manners used in actual production are not limited thereto, and may be changed according to actual needs.

Referring to FIG. 6, the fifth embodiment of the present invention extends from the first embodiment of the present invention, but is not limited thereto. Different from the first embodiment of the present invention, the microelectromechanical fluid device module 1a' of the fifth embodiment of the present invention further includes a plurality of auxiliary wires 25, the package carrier 21 further includes a plurality of carrier auxiliary electrodes 211p, and the microelectromechanical fluid device chip A1. A2, A3 also include a plurality of wafer auxiliary electrodes 221p. The carrier auxiliary electrode 211p is connected to the wafer auxiliary electrode 221p through the auxiliary wire 25. In the fifth embodiment of the present invention, the carrier auxiliary electrode 211p and the wafer auxiliary electrode 221p are disposed at the corners of the package carrier 21, such that the microelectromechanical fluid device wafers A1, A2, and A3 are operated, and the corner portions thereof are supported by the carrier auxiliary electrodes. The fixing of the 211p and the wafer auxiliary electrode 221p is not deformed by the vibration, thereby improving the production yield and reducing the production cost.

Please refer to FIG. 7. The sixth embodiment of the present invention extends from the third embodiment of the present invention, but is not limited thereto. Different from the third embodiment of the present invention, the microelectromechanical fluid device module 2a' of the sixth embodiment further comprises an auxiliary wire 25, the package carrier 21 further comprises a carrier auxiliary electrode 211p, and the microelectromechanical fluid device chips B1, B2, B3 are further A wafer auxiliary electrode 221p is included. The carrier auxiliary electrode 211p is connected to the wafer auxiliary electrode 221p through the auxiliary wire 25. In the sixth embodiment of the present invention, the carrier auxiliary electrode 211p and the wafer auxiliary electrode 221p are disposed at the corners of the package carrier 21, such that the microelectromechanical fluid device wafers B1, B2, and B3 are operated, and the corner portions thereof are supported by the carrier auxiliary electrode. The fixing of the 211p and the wafer auxiliary electrode 221p is not deformed by the vibration, thereby improving the production yield and reducing the production cost.

It should be noted that the carrier auxiliary electrode 211p and the wafer auxiliary electrode 221p can be disposed in combination with various microelectromechanical fluid device wafer configurations, and are not limited to the above disclosed manner.

Returning to FIG. 2, in various embodiments of the present invention, the microelectromechanical fluid device module 1a, 1b, 1a', 2a' further includes a control unit (not shown) for driving the microelectromechanical fluid device chip A1. A2, A3, B1, B2, B3, wherein the MEMS device wafers A1, A2, A3, B1, B2, B3 can be driven in different ways. Taking the first embodiment as an example, the control unit can simultaneously drive the microelectromechanical fluid device wafers A1, A2, A3, and the control unit can also individually drive one of the microelectromechanical fluid device wafers A1, A2, A3. Alternatively, the MEMS device wafers A1, A2, and A3 can be divided into a driving group and a standby group, and the control unit can simultaneously drive the driving groups of the MEMS device wafers A1, A2, and A3, but not limited thereto. The driving mode of the electromechanical fluid device chips A1, A2, A3 can be changed by requiring the total flow rate and the demand flow rate. In the embodiment of the present invention, the control unit is a microcontroller (Microcontroller Unit, MCU) or an application specific integrated circuit (ASIC), but not limited thereto, the application of the control unit may be Changed by design requirements.

In summary, the present invention provides a microelectromechanical fluid device module that utilizes a novel packaging method to increase the flow, head and pressure of the MEMS fluid device module and reduce production costs.

This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.

1a, 1b, 2a, 2b, 1a', 2a'‧‧‧ microelectromechanical fluid device modules

A1, A2, A3, B1, B2, B3, 10a, 10b‧‧‧Microelectromechanical fluid device wafer

21‧‧‧Package carrier

21a‧‧‧Long side of the carrier

21b‧‧‧ Carrier short side

21p‧‧‧ Carrier electrode

211p‧‧‧ Carrier auxiliary electrode

22‧‧‧ Chip body

22a‧‧‧Long side of wafer

22b‧‧‧ wafer short side

22p‧‧‧ wafer electrode

221p‧‧‧ wafer auxiliary electrode

11, 23‧‧‧Microelectromechanical fluid devices

24‧‧‧Wire

25‧‧‧Auxiliary wire

Figure 1A is a schematic illustration of a conventional microelectromechanical fluid device wafer. Figure 1B is another schematic view of a conventional microelectromechanical fluid device wafer. 2 is a schematic view of a first embodiment of a microelectromechanical fluid device module of the present invention. Fig. 3 is a schematic view showing a second embodiment of the microelectromechanical fluid device module of the present invention. Fig. 4 is a schematic view showing a third embodiment of the microelectromechanical fluid device module of the present invention. Fig. 5 is a schematic view showing a fourth embodiment of the microelectromechanical fluid device wafer of the present invention. Fig. 6 is a schematic view showing a fifth embodiment of the microelectromechanical fluid device module of the present invention. Figure 7 is a schematic view showing a sixth embodiment of the microelectromechanical fluid device module of the present invention.

Claims (10)

A microelectromechanical fluid device module, comprising: a package carrier, having a rectangular parallelepiped shape, having a carrier long side and a carrier short side, and comprising a plurality of carrier electrodes; a plurality of microelectromechanical fluid device chips disposed in the package Each of the MEMS device wafers has a rectangular parallelepiped shape having a long side of the wafer and a short side of the wafer, and includes a wafer body and a plurality of microelectromechanical fluid devices disposed on the plurality of microelectromechanical fluid devices The wafer body has a plurality of wafer electrodes respectively; and a plurality of wires, each of which is respectively connected to the corresponding carrier electrode and the corresponding wafer electrode. The microelectromechanical fluid device module of claim 1, wherein the microelectromechanical fluid device wafers are arranged in series along a direction in which the long sides of the carrier are extended; the microelectromechanical fluid device wafers are slightly An electromechanical fluid device is disposed along a direction in which the long side of the wafer of the MEMS device wafer extends; the wafer electrodes are disposed on opposite sides of the MEMS device and also along the MEMS device chip The extending side of the long side of the wafer is disposed; and the carrier electrodes are disposed on opposite sides of the microelectromechanical fluid device wafer, and are also disposed along the extending direction of the long side of the carrier of the package carrier. The microelectromechanical fluid device module of claim 1, wherein the microelectromechanical fluid device wafers are staggered along a direction in which the long sides of the carrier are extended; the microelectromechanical fluid device wafers are slightly An electromechanical fluid device is disposed along a direction in which the long side of the wafer of the MEMS device wafer extends; the wafer electrodes are disposed on opposite sides of the MEMS device and also along the MEMS device chip The extending side of the long side of the wafer is disposed; and the carrier electrodes are disposed on opposite sides of the microelectromechanical fluid device wafer, and are also disposed along the extending direction of the long side of the carrier of the package carrier. The microelectromechanical fluid device module of claim 1, wherein the microelectromechanical fluid device wafers are arranged in series along a direction in which the long sides of the carrier are extended; the microelectromechanical fluid device wafers are slightly An electromechanical fluid device is disposed along a direction in which the long side of the wafer of the MEMS device wafer extends; the wafer electrodes are disposed on opposite sides of the MEMS device and along the wafer of the MEMS device wafer The short sides are arranged to extend; and the carrier electrodes are disposed on opposite sides of the microelectromechanical fluid device wafer, and are also disposed along the extending direction of the carrier long side of the package carrier. The microelectromechanical fluid device module of claim 1, wherein the microelectromechanical fluid device wafers are staggered along a direction in which the long sides of the carrier are extended; the microelectromechanical fluid device wafers are slightly An electromechanical fluid device is disposed along a direction in which the long side of the wafer of the MEMS device wafer extends; the wafer electrodes are disposed on opposite sides of the MEMS device and along the wafer of the MEMS device wafer The short sides are arranged to extend; and the carrier electrodes are disposed on opposite sides of the microelectromechanical fluid device wafer, and are also disposed along the extending direction of the carrier long side of the package carrier. The MEMS device module of claim 1, further comprising a plurality of carrier auxiliary electrodes, a plurality of chip auxiliary electrodes, and a plurality of auxiliary wires, wherein the carrier auxiliary electrodes are respectively connected to the auxiliary wires Wafer auxiliary electrode. The MEMS device module of claim 6, wherein the carrier auxiliary electrodes and the wafer auxiliary electrodes are disposed adjacent to a corner of the package carrier. The MEMS device module of claim 1, further comprising a control unit for driving the MEMS device wafers, the control unit simultaneously driving the MEMS device wafers. The MEMS device module of claim 1, further comprising a control unit for driving the MEMS device wafers, the control unit separately driving one of the MEMS device wafers. The MEMS device module of claim 1, further comprising a control unit for driving the MEMS device wafers, the MEMS device wafers being divided into a driving group and a standby group, The control unit simultaneously drives the drive groups of the MEMS device wafers.