TWI726281B - Micro-electromechanical system pump module - Google Patents

Abstract

A micro-electromechanical system pump module is disclosed and includes a micro-electromechanical system chip. The micro-electromechanical system chip includes a chip body, plural micro-electromechanical system pumps, plural first connection points, plural second connection points, at least one first control electrode and at least one second control electrode. The chip body is rectangular and includes two long sides and two short sides. The micro-electromechanical system pumps are disposed on the chip body, and each of the micro-electromechanical system pumps includes a first electrode and a second electrode. The first connection points are disposed on the chip body and are electrically connected to the first electrodes of the micro-electromechanical system pumps. The second connection points are disposed on the chip body and are electrically connected to the second electrodes of the micro-electromechanical system pumps. The first control electrode is disposed on the chip body and is electrically connected to the first connection points. The second control electrode is disposed on the chip body and is electrically connected to the second connection points. The at least one first control electrode and the at least one second control electrode are disposed on the two opposite sides of the chip body, respectively.

Description

MEMS pump module

This case is about a MEMS pump module, especially a MEMS pump module that uses a novel layout method to reduce the chip area.

With the rapid development of science and technology, the traditional fluid conveying device has been moving towards miniaturization of the device and maximizing the flow rate. The application is also becoming more and more diversified, from industrial applications, biomedical applications, medical care, electronic heat dissipation to the recently popular wearable devices, it can be seen.

In recent years, the micro-electromechanical-related manufacturing process has achieved the chipization of the fluid delivery device in an integrated manner. As shown in FIG. 1, the conventional microelectromechanical pump module 9 includes a wafer body 90 and a plurality of microelectromechanical pumps 91. A plurality of microelectromechanical pumps 91 are integrally formed on the wafer body 90, and each microelectromechanical pump 91 has a plurality of control electrodes 91a.

However, the control electrode 91a included in the wafer-based fluid delivery device often occupies a large area, so that the cost of the wafer cannot be reduced. Therefore, how to use an innovative structure to reduce the area occupied by the control electrode 91a, thereby reducing the cost of the chip, is an issue that needs to be resolved at present.

The main purpose of this case is to provide a MEMS pump module that uses a novel layout method to minimize the number of control electrodes, thereby reducing the overall chip area and thereby reducing the chip cost.

In order to achieve the above objective, the broader implementation aspect of this case is to provide a MEMS pump module, which includes a MEMS chip. The microelectromechanical chip includes: a chip body with a rectangular shape and two long sides and two short sides; a plurality of microelectromechanical pumps arranged on the chip body and each having a first electrode and a second electrode; and a plurality of microelectromechanical pumps. The first connection point is arranged on the wafer body and is electrically connected to the first electrode of the MEMS pump; a plurality of second connection points are arranged on the wafer body and are electrically connected to the second electrode of the MEMS pump; at least one first The control electrode is arranged on the chip body and is electrically connected to the first connection point; and at least one second control electrode is arranged on the chip body and is electrically connected to the second connection point. At least one first control electrode and at least one second control electrode are respectively arranged on opposite sides of the chip body.

The embodiments embodying the features and advantages of this case will be described in detail in the later description. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of the case, and the descriptions and diagrams therein are essentially for illustrative purposes, rather than limiting the case.

Please refer to FIG. 2. In the first embodiment of the present invention, the MEMS pump module 100I includes a MEMS chip 100. The microelectromechanical chip 100 includes a chip body 10, a plurality of microelectromechanical pumps 20, at least one first control electrode 30I, a plurality of first connection points 31, at least one second control electrode 40I, and a plurality of second connection points 41. The chip body 10 has a rectangular shape and has two opposite long sides 11 and two opposite short sides 12. The microelectromechanical pump 20 is disposed on the wafer body 10, and each microelectromechanical pump 20 has a first electrode 21a and a second electrode 21b, respectively. The first connection points 31 are arranged on the wafer body 10 and are respectively electrically connected to the first electrodes 21 a of the MEMS pump 20. The second connection points 41 are disposed on the chip body 10, and each second connection point 41 is electrically connected to the corresponding second electrodes 21b of the plurality of microelectromechanical pumps 20, for example, but not limited to the two corresponding ones. The second electrode 21b of a plurality of MEMS pumps 20. At least one first control electrode 30I is disposed on the chip body 10 and is electrically connected to all the first connection points 31. At least one second control electrode 40I is disposed on the chip body 10 and is electrically connected to all the second connection points 41. At least one first control electrode 30I and at least one second control electrode 40I are respectively disposed on opposite sides of the wafer body 10 and are respectively adjacent to the two short sides 12 of the wafer body 10. The distance between the at least one first control electrode 30I and the at least one second control electrode 40I is equal to the two long sides 11 of the chip body 10. In the first embodiment of the present case, the number of the first control electrode 30I and the number of the second control electrode 40I is one each, but it is not limited to this. The number of the first control electrode 30I and the second control electrode 40I can be designed according to design requirements. And change.

Referring to Figure 3, in the second embodiment of the present invention, the micro-electromechanical pump module 100II has roughly the same structure as the micro-electromechanical pump module 100I of the first embodiment of the present invention. The difference is that in the second embodiment of the present invention, the first embodiment The distances between the first control electrode 30II and the second control electrode 40II and the two long sides 11 of the wafer body 10 are not equal. The two long sides 11 of the wafer body 10 are a first long side 11a and a second long side 11b, respectively. In the second embodiment of the present invention, the first control electrode 30II and the second control electrode 40II are disposed adjacent to the first long side 11a. In the second embodiment of the present case, the number of the first control electrode 30II and the number of the second control electrode 40II is one each, but it is not limited to this. The number of the first control electrode 30II and the second control electrode 40II can be designed according to design requirements. And change.

Please refer to Figure 4, in the third embodiment of the present invention, the micro-electromechanical pump module 100III and the second embodiment of the micro-electromechanical pump module 100II are roughly the same in structure. The difference is that in the third embodiment of the present invention, the first A control electrode 30III and a second control electrode 40III are disposed adjacent to the second long side 11b. In the third embodiment of the present invention, the number of the first control electrode 30III and the number of the second control electrode 40III is one each, but it is not limited to this. The number of the first control electrode 30III and the second control electrode 40III can be designed according to design requirements. And change.

Please refer to Figure 5. In the fourth embodiment of the present invention, the micro-electromechanical pump module 100IV has roughly the same structure as the micro-electromechanical pump module 100I of the first embodiment of the present invention. The difference is that in the fourth embodiment of the present invention, each A first connection point 31 is electrically connected to the corresponding first electrodes 21a of a plurality of MEMS pumps 20, for example, but not limited to, electrically connected to the first electrodes 21a of the corresponding two MEMS pumps 20; first control The electrode 30IV and the second control electrode 40IV are respectively disposed on opposite sides of the wafer body 10 and are respectively adjacent to the two long sides 11 of the wafer body 10; and the first control electrode 30IV and the second control electrode 40IV are connected to the two short sides of the wafer body 10 The distances between sides 12 are equal. In the fourth embodiment of the present case, the number of the first control electrode 30IV and the number of the second control electrode 40IV is one each, but it is not limited to this. The number of the first control electrode 30IV and the second control electrode 40IV can be designed according to design requirements. And change.

Please refer to Figure 6. In the fifth embodiment of the present invention, the MEMS pump module 100V and the fourth embodiment of the MEMS pump module 100IV have roughly the same structure. The difference is that in the fifth embodiment of the present invention, the chip The two short sides 12 of the body 10 are respectively a first short side 12a and a second short side 12b. The first control electrode 30V and the second control electrode 40V are not the same distance from the two short sides 12 of the wafer body 10, and the first control electrode 30V and the second control electrode 40V are arranged adjacent to the first short side 12a. In the fifth embodiment of the present case, the number of the first control electrode 30V and the number of the second control electrode 40V is one each, but it is not limited to this. The number of the first control electrode 30V and the second control electrode 40V can be designed according to design requirements. And change.

Please refer to Figure 7. In the sixth embodiment of the present invention, the MEMS pump module 100VI and the fifth embodiment of the MEMS pump module 100V have roughly the same structure. The difference lies in the sixth embodiment of the present invention. A control electrode 30VI and a second control electrode 40VI are arranged adjacent to the second short side 12b. In the sixth embodiment of the present case, the number of the first control electrode 30VI and the number of the second control electrode 40VI is one each, but it is not limited to this. The number of the first control electrode 30VI and the second control electrode 40VI can be designed according to design requirements. And change.

It is worth noting that, compared with the second embodiment and the third embodiment of the present invention, in the first embodiment of the present invention, the distance between the first control electrode 30I and the second control electrode 40I and the two long sides 11 of the chip body 10 is equal. , The impedance between the first electrode 21a and the first control electrode 30I of the microelectromechanical pump 20 and the impedance distribution between the second electrode 21b and the second control electrode 40I of the microelectromechanical pump 20 are even, thereby The power loss of the first electrode 21a and the second electrode 21b is relatively even. Similarly, compared with the fifth embodiment and the sixth embodiment of the present invention, in the fourth embodiment of the present invention, since the first control electrode 30IV and the second control electrode 40IV are the same distance from the two short sides 12 of the chip body 10, The impedance distribution between the first electrode 21a and the first control electrode 30IV of the electromechanical pump 20 and the impedance distribution between the second electrode 21b and the second control electrode 40IV of the microelectromechanical pump 20 are even, so that the first The power loss of the electrode 21a and the second electrode 21b is relatively even.

Please refer to FIG. 8. In each embodiment of the present application, each MEMS pump 20 further includes a piezoelectric element 21 c. The first electrode 21a and the second electrode 21b transfer the voltage to the piezoelectric element 21c, so that the piezoelectric element 21c is deformed due to the piezoelectric effect, thereby changing the internal pressure of each microelectromechanical pump 20 to deliver fluid. The first electrode 21a of each MEMS pump 20 is electrically connected to a microprocessor (not shown) through a first connection point 31, and each second electrode 21b is electrically connected to the microprocessor through a second connection point 41 (Picture not shown). In the first control method, a control signal output by the microprocessor includes a certain voltage and a variable voltage. In each embodiment of the present case, the variable voltage can be a voltage value switched between a first voltage and a second voltage. And the voltage value of the constant voltage is between the voltage value of the first voltage and the voltage value of the second voltage. The first control electrodes 30I, 30II, 30III, 30IV, 30V, 30VI receive constant voltages, and the second control electrodes 40I, 40II, 40III, 40IV, 40V, 40VI receive variable voltages. The variable voltages can be between the first voltage and the first voltage. The continuously changing voltage between the two voltages causes the piezoelectric element 21c to deform due to the continuously changing voltage difference between the first electrode 21a and the second electrode 21b, so as to transfer fluid.

Please refer to Figures 9A to 9C. In each embodiment of the first control method of this case, the first aspect of the control signal can be a square wave as shown in Figure 9A, and the second aspect can be as shown in Figure 9B. A sine wave is shown in the figure, and the third aspect can be a triangular wave as shown in Fig. 9C, but it is not limited to this. The waveform of the control signal can be changed according to requirements.

Please refer to Figures 9D to 9F. In the second control method, the control signal provided by the microprocessor includes two variable voltages, and the variable voltages can be continuously alternating voltages. The first control electrodes 30I, 30II, 30III, 30IV, 30V, 30VI receive the first variable voltage, and the second control electrodes 40I, 40II, 40III, 40IV, 40V, 40VI receive the second variable voltage, the first variable voltage and the second The variable voltage has a high voltage point (High) and a low voltage point (Low). Taking Fig. 9D to illustrate, in the first time interval T1, the first variable voltage is the High signal and the second variable voltage is the Low signal; in the second time interval T2, the first variable voltage is the Low signal and the second variable voltage Is a High signal; and in the third time interval T3, the first variable voltage is a High signal and the second variable voltage is a Low signal, so that alternate signals are continuously provided, so that the piezoelectric element 21c is caused by the first electrode 21a and the second electrode 21b. The continuously changing voltage difference between the two produces deformation, which is used to transfer fluid. The fourth aspect of the control signal can be a two square wave as shown in Figure 9D, the fifth aspect can be a two-half sine wave as shown in Figure 9E, and the sixth aspect can be a two-half sine wave as shown in Figure 9F. The second triangle half wave, but not limited to this, the waveform of the control signal can be changed according to requirements. In each embodiment of the present case, the Low signal of the first variable voltage and the second variable voltage is 0V, but it is not limited to this, and can be changed according to requirements.

In summary, this case provides a MEMS pump module that uses a novel layout method to minimize the number of control electrodes, thereby reducing the overall chip area, thereby reducing the cost of the chip, and providing different control signals to drive the MEMS pump , In order to transfer fluid.

This case can be modified in many ways by those who are familiar with this technology, but it is not deviated from the protection of the scope of the patent application.

100I, 100II, 100III, 100IV, 100V, 100VI: MEMS pump module 100: MEMS chip 10: chip body 11: Long side 11a: the first long side 11b: second long side 12: short side 12a: first short side 12b: second short side 20: MEMS pump 21a: first electrode 21b: second electrode 21c: Piezoelectric parts 30I, 30II, 30III, 30IV, 30V, 30VI: the first control electrode 31: The first connection point 40I, 40II, 40III, 40IV, 40V, 40VI: second control electrode 41: second connection point 9: MEMS pump module 90: chip body 91: MEMS pump 91a: control electrode T1~T30: Time interval

Figure 1 is a schematic diagram of a MEMS pump module in the prior art. Figure 2 is a schematic diagram of the MEMS pump module according to the first embodiment of the present invention. Figure 3 is a schematic diagram of the MEMS pump module according to the second embodiment of the present invention. Figure 4 is a schematic diagram of the MEMS pump module according to the third embodiment of the present invention. Figure 5 is a schematic diagram of the MEMS pump module according to the fourth embodiment of the present invention. Figure 6 is a schematic diagram of the MEMS pump module according to the fifth embodiment of the present invention. Figure 7 is a schematic diagram of the MEMS pump module of the sixth embodiment of the present invention. Figure 8 is a schematic diagram of the electrical connection of the MEMS pump in this case. Figure 9A is a schematic diagram of the first aspect of the control signal of the MEMS pump module in this case. Figure 9B is a schematic diagram of the second aspect of the control signal of the MEMS pump module in this case. Figure 9C is a schematic diagram of the third aspect of the control signal of the MEMS pump module in this case. Figure 9D is a schematic diagram of the fourth aspect of the control signal of the MEMS pump module in this case. Figure 9E is a schematic diagram of the fifth aspect of the control signal of the MEMS pump module in this case. Figure 9F is a schematic diagram of the sixth aspect of the control signal of the MEMS pump module in this case.

100I: MEMS pump module

21b: second electrode

100: MEMS chip

30I: the first control electrode

10: chip body

31: The first connection point

11: Long side

40I: second control electrode

12: short side

41: second connection point

20: MEMS pump

21a: first electrode

Claims (12)

A micro-electro-mechanical pump module includes: a micro-electro-mechanical chip, including: a chip body, in a rectangular shape, with two long sides and two short sides; a plurality of micro-electro-mechanical pumps are arranged on the chip body, and each has A first electrode and a second electrode; a plurality of first connection points are arranged on the chip body and electrically connected to the first electrodes of the microelectromechanical pumps; a plurality of second connection points are arranged on the chip body, And electrically connected to the second electrodes of the microelectromechanical pumps; a first control electrode arranged on the chip body and electrically connected to the first connection points; and a second control electrode arranged on the chip body, And electrically connected to the second connection points; wherein, the first control electrode and the second control electrode are respectively arranged on opposite sides of the chip body. For the MEMS pump module described in item 1 of the scope of patent application, the first connection points are respectively electrically connected to the first electrodes of the MEMS pumps. For the MEMS pump module described in item 1 of the scope of patent application, each of the first connection points is electrically connected to the corresponding plurality of the first electrodes of the MEMS pump. For the microelectromechanical pump module described in item 1 of the scope of patent application, each of the second connection points is electrically connected to a plurality of corresponding second electrodes of the microelectromechanical pump. In the microelectromechanical pump module described in claim 1, wherein the first control electrode and the second control electrode are respectively adjacent to the two short sides of the chip body. The microelectromechanical pump module described in item 5 of the scope of patent application, wherein the first control electrode and the second control electrode are equal in distance from the two long sides of the chip body. The microelectromechanical pump module described in item 5 of the scope of patent application, wherein the distance between the first control electrode and the second control electrode and the two long sides of the chip body are not equal. In the microelectromechanical pump module described in claim 1, wherein the first control electrode and the second control electrode are respectively adjacent to the two long sides of the chip body. The microelectromechanical pump module described in item 8 of the scope of patent application, wherein the first control electrode and the second control electrode are equal in distance from the two short sides of the chip body. The microelectromechanical pump module described in item 8 of the scope of patent application, wherein the distance between the first control electrode and the second control electrode and the two short sides of the chip body are not equal. The MEMS pump module described in item 1 of the scope of patent application, wherein: each of the MEMS pumps further includes a piezoelectric element; the first control electrode receives a control signal of a certain voltage, and the second control electrode Receiving a control signal of a variable voltage; and the variable voltage is a voltage value switched between a first voltage and a second voltage, and the voltage value of the constant voltage is between the voltage value of the first voltage and the second voltage Between the voltage values of the voltage, the piezoelectric element is deformed due to the continuously changing voltage difference between the first electrode and the second electrode, so as to transfer fluid. For the micro-electro-mechanical pump module described in item 1 of the scope of patent application, wherein: each micro-electro-mechanical pump further includes a piezoelectric element; the first control electrode receives a control signal of a first variable voltage, and the second The two control electrodes receive a control signal of a second variable voltage; the first variable voltage and the second variable voltage are continuously alternating voltages, and both have a high voltage point and a low voltage point; and The first control electrode and the second control electrode continue to receive alternating signals, so that the piezoelectric element is deformed due to the continuously changing voltage difference between the first electrode and the second electrode, so as to transmit fluid.

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