TWI690658B - Micro electrical-mechanical pump module - Google Patents

Abstract

A micro electrical-mechanical pump module is disclosed and comprises a microprocessor and a micro electrical-mechanical chip. The microprocessor outputs a constant voltage and a variable voltage. The micro electrical-mechanical chip electrically connects to the microprocessor and comprises a chip main body, plural micro electrical-mechanical pumps, plural connecting electrodes and at least one common electrode. The chip main body is a rectangular structure and comprises a longer side. The plural micro electrical-mechanical pumps are disposed on the chip main body and each of them comprises a first electrode and a second electrode. The plural connecting electrodes are disposed on the chip main body, located nearby the longer side, and respectively electrically connected to the first electrodes of the plural micro electrical-mechanical pumps. The at least one common electrode is disposed on the chip main body, located nearby the longer side, and electrically connected to the second electrodes of the plural micro electrical-mechanical pumps. The microprocessor electrically connects to the plural connecting electrodes and the at least one common electrode, so as to transmit the constant voltage and the variable voltage to the plural micro electrical-mechanical pumps.

Description

MEMS pump module

This case relates to a microelectromechanical pump module, in particular to a microelectromechanical pump module that uses the common electrode arrangement to reduce the contacts of the microprocessor, thereby simplifying the microelectromechanical pump contacts and wiring.

With the rapid development of technology, the application of fluid delivery devices is becoming more and more diversified. For example, industrial applications, biomedical applications, medical care, electronic heat dissipation, etc., and even the most popular wearable devices have seen its shadows and traditions. The pump has gradually been towards the miniaturization of the device, but the traditional pump is difficult to reduce the size to the millimeter level, so the current micro-fluid delivery device can only use the piezoelectric pump structure as a micro-fluid transmission device.

Although the MEMS pump can reduce the volume of the pump to the micron level, the micro-electromechanical pump will limit the fluid transmission volume due to the too small volume, so multiple MEMS pumps are required for use, please refer to As shown in Figure 1, the current MEMS pump modules are individually controlled by a high-end microprocessor 1, but the high-end microprocessor 1 itself is costly, and each MEMS pump 2 requires two micro-processing The connection of the device pin 11 increases the cost of the high-end microprocessor 1, which leads to the high cost of the MEMS pump module, which is difficult to popularize. Therefore, how to reduce the cost of the driving end of the MEMS pump module is currently the first to overcome the MEMS pump Difficulties.

The main purpose of this case is to provide a microelectromechanical pump module that reduces the contacts of the microprocessor through the common electrode, reduces the contacts and wiring of the microelectromechanical pump module, and further simplifies the microelectromechanical pump module.

To achieve the above purpose, the broader implementation of this case is to provide a micro-electromechanical pump module, including: a microprocessor, outputting a certain voltage and a variable voltage; a micro-electromechanical chip, electrically connected to the microprocessor, the micro The electromechanical chip includes: a chip body with a rectangular shape and a long side; a plurality of micro-electromechanical pumps arranged on the chip body, respectively having a first electrode and a second electrode; a plurality of connecting electrodes, provided On the wafer body and adjacent to the long side, the connection electrodes are electrically connected to the first electrodes of the microelectromechanical pumps; and at least one common electrode is disposed on the wafer body and adjacent to the long side, the at least one common electrode is electrically connected to the The second electrodes of some microelectromechanical pumps; wherein, the microprocessor is electrically connected to the connection electrodes and the at least one common electrode, respectively, to transmit the constant voltage to the at least one common electrode and the variable voltage to the connection electrodes.

Some typical embodiments embodying the characteristics and advantages of this case will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different forms, which all do not deviate from the scope of this case, and the descriptions and illustrations therein are essentially used for explanation rather than to limit this case.

Please refer to Fig. 2, which is a schematic diagram of the MEMS pump module of this case. The MEMS pump module 100 includes: a microprocessor 3 and a MEMS chip 4. The MEMS chip 4 is electrically connected to the microprocessor 3, and the MEMS chip 4 includes a chip body 41, a plurality of MEMS pumps 42, at least one common electrode 43, and a plurality of connection electrodes 44. The chip body 41 has a rectangular shape, and has a long side 41a and a short side 41b. The MEMS pumps 42 are all disposed on the wafer body 41, and each MEMS pump 42 has a first electrode 42a and a second electrode 42b, respectively. At least one common electrode 43 is also disposed on the wafer body 41 and is adjacent to the long side 41a, and is electrically connected to the second electrodes 42b of all MEMS pumps 42. The connection electrodes 44 are disposed on the wafer body 41 and adjacent to the long side 41a. The connection electrodes 44 are electrically connected to the first electrodes 42a of the microelectromechanical pumps 42 respectively. The connection electrodes 44 on all the wafer bodies 41 are connected to at least one common electrode 43 are electrically connected to the microprocessor 3, respectively, so as to receive the control signal sent by the microprocessor 3. In addition, FIG. 2 is also a schematic diagram of the first embodiment of the microelectromechanical chip of the present case. At least one common electrode 43 includes a first common electrode 43a. In this embodiment, the number of common electrodes 43 is one, and the second electrodes 42b of all MEMS pumps 42 are electrically connected to the first common electrode 43a.

Please refer to FIG. 3, which is a schematic diagram of a second embodiment of the MEMS chip of the MEMS pump module of this case. At least one common electrode 43 includes a first common electrode 43a and a second common electrode 43b. The foregoing plurality of microelectromechanical pumps 42 are divided into a first microelectromechanical pump group 421 and a second microelectromechanical pump group 422 according to positions , Wherein the MEMS pump 42 located in the first MEMS pump group 421, the second electrodes 42b are electrically connected to the first common electrode 43a, and the MEMS pump 42 located in the second MEMS pump group 422, The second electrodes 42b are electrically connected to the second common electrode 43b, so as to achieve the effect of zone control. The number of common electrodes 43 in this embodiment is two.

Please refer to FIG. 4, which is a schematic diagram of a third embodiment of the MEMS chip of the MEMS pump module of this case. The third embodiment is the same as the second embodiment, and there are two common electrodes 43, so the common electrode 43 also has a first common electrode 43a and a second common electrode 43b, but the first common electrode 43a and the second common electrode 43b are separated It is disposed on both sides of the wafer body 41, and the first common electrode 43a and the second common electrode 43b are electrically connected, and the second electrodes 42b of the aforementioned plurality of microelectromechanical pumps 42 are simultaneously electrically connected to the first common electrodes 43a on both sides 43b with the second common electrode. The third embodiment can reduce the impedance between the second electrode 42b of the microelectromechanical pump 42 and the common electrode 43, and reduce the power loss of the second electrode 42b farther from the common electrode 43.

Please refer to FIG. 5, which is a schematic diagram of a fourth embodiment of the MEMS chip of the MEMS pump module in this case. At least one common electrode 43 includes a first common electrode 43a, a second common electrode 43b, and a third The common electrode 43c and a fourth common electrode 43d. The first common electrode 43a and the third common electrode 43c are disposed on one side of the wafer body 41, and the second common electrode 43b and the fourth common electrode 43d are disposed on the other side of the wafer body 41. In this embodiment, the foregoing The plurality of MEMS pumps 42 are divided into a first MEMS pump group 421, a second MEMS pump group 422, a third MEMS pump group 423, and a fourth MEMS pump group 424 according to the location area. The first microelectromechanical pump group 421 is composed of microelectromechanical pumps 42 adjacent to the first common electrode 43a. The first common electrode 43a is provided for the second electrodes 42b of all microelectromechanical pumps 42 located in the first microelectromechanical pump group 421 Electrical connection; the second microelectromechanical pump group 422 is composed of the microelectromechanical pump 42 adjacent to the second common electrode 43b. The second common electrode 43b is provided for the second of all microelectromechanical pumps 42 located in the second microelectromechanical pump group 422 The electrodes 42b are electrically connected; the third MEMS pump group 423 is composed of MEMS pumps 42 adjacent to the third common electrode 43c. The third common electrode 43c is for all MEMS pumps 42 located in the third MEMS pump group 423 The second electrode 42b is electrically connected; the fourth microelectromechanical pump group 424 is composed of the microelectromechanical pump 42 adjacent to the fourth common electrode 43d. The fourth common electrode 43d is provided for all the microcomputers located in the fourth microelectromechanical pump group 424 The second electrode 42b of the electromechanical pump 42 is electrically connected to achieve the effect of zone control.

Please refer to FIG. 6, which is a schematic diagram of a fifth embodiment of the micro-electro-mechanical chip of the micro-electro-mechanical pump module of this case. This embodiment is the same as the fourth embodiment, and has a first common electrode 43a, a second common electrode 43b, a third common electrode 43c, and a fourth common electrode 43d, and their installation positions are also the same, the difference is that the first A common electrode 43a is electrically connected to the second common electrode 43b, a third common electrode 43c is electrically connected to the fourth common electrode 43d, and the foregoing plurality of microelectromechanical pumps 42 are divided into a first microelectromechanical pump group 421 and a second microelectromechanical泵集团422. The first MEMS pump group 421 is composed of the MEMS pump 42 adjacent to the first common electrode 43a or adjacent to the second common electrode 43b, and the second MEMS pump group 422 is adjacent to the third common electrode 43c or adjacent to the fourth common electrode The microelectromechanical pump 42 of the electrode 43d is used to achieve the effect of zone control, and reduce the distance between the common electrode 43 and the second electrode 42b, thereby reducing the loss of power transmission.

Please refer to FIG. 7, which is a schematic diagram of the sixth embodiment of the MEMS chip of the MEMS pump module in this case. This embodiment is the same as the fourth embodiment, and has a first common electrode 43a and a second common electrode 43b, the third common electrode 43c and the fourth common electrode 43d, and their installation positions are also the same, the difference is that in this embodiment, the first common electrode 43a, the second common electrode 43b, the third common electrode 43c and the fourth common electrode The electrodes 43d are electrically connected to each other, so that the aforementioned second electrodes 42b of the plurality of microelectromechanical pumps 42 can be electrically connected to a common electrode 43 that is closer to each other, such as the second electrode 42b of the microelectromechanical pump 42 adjacent to the first common electrode 43a It is electrically connected to the first common electrode 43a, the second electrode 42b of the MEMS pump 42 adjacent to the second common electrode 43b is electrically connected to the second common electrode 43b, and so on, the common electrode 43 is supplied to the MEMS pumps at similar positions 42. The loss of each micro-electromechanical pump 42 in transmitting power can be reduced.

Please refer to Fig. 2, Fig. 8A and Fig. 8B at the same time. Fig. 8A is a schematic diagram of the electrical connection of the micro-electromechanical pump in this case, and Fig. 8B is a diagram of the first embodiment of the control signal output by the microprocessor in this case. The microelectromechanical pump 42 further includes a piezoelectric element 42c. The first electrode 42a and the second electrode 42b transmit the voltage to the piezoelectric element 42c, causing the piezoelectric element 42c to deform due to the piezoelectric effect, thereby changing the interior of the microelectromechanical pump 42 Pressure is used to deliver fluid. The first electrode 42a of the MEMS pump 42 is electrically connected to the microprocessor 3 through the connection electrode 44 and the second electrode 42b is electrically connected to the microprocessor 3 through the common electrode 43. The control signal output by the microprocessor 3 includes Certain voltage and variable voltage. In this embodiment, the variable voltage may be a voltage switched between a first voltage and a second voltage, and the voltage value of the constant voltage is between the voltage value of the first voltage and the voltage value of the second voltage, Moreover, the voltage value of the constant voltage may be ±10% between the voltage value of the first voltage and the voltage value of the second voltage. For example, when the first voltage is 1.5V and the second voltage is -1.5V, the constant voltage is 0V; when the first voltage is 3V and the second voltage is 0V, the constant voltage is 1.5V. The second electrode 42b of the microelectromechanical pump 42 receives a fixed voltage, and the first electrode 42a receives a variable voltage that continuously changes between the first voltage and the second voltage, so that the piezoelectric element 42c is affected by the first electrode 42a and the second electrode 42b. The continuously changing voltage difference is deformed to transfer fluid. In addition, please continue to refer to Figures 8C and 8D. Figure 8C is a schematic diagram of the second embodiment of the control signal output by the microprocessor of this case, and Figure 8D is a schematic diagram of the third embodiment of the control signal output by the microprocessor of this case. The variable voltage can also be a voltage that continuously changes between the first voltage and the second voltage. In addition to the square wave of the first embodiment, the control signal can also use a triangular wave (as shown in FIG. 8C) and a sine wave ( (As shown in Figure 8D).

In summary, this case provides a microelectromechanical pump module. By letting the microprocessor transmit a constant voltage to the second electrode of the microelectromechanical pump through the common electrode, and then transmit the variable voltage to the first electrode of the microelectromechanical pump, only By modulating the voltage on the first electrode, the voltage difference between the first electrode and the second electrode can be changed, and the piezoelectric element of the micro-electromechanical pump can be successfully driven to move the fluid. In addition, the arrangement of the common electrode can greatly reduce the pins of the microprocessor, and in the case of reducing the cost of the microprocessor, it can still effectively control a plurality of microelectromechanical pumps.

This case may be modified by any person familiar with the technology as a craftsman, but none of them may be as protected as the scope of the patent application.

100: MEMS pump module 1: High-end microprocessor 11: microprocessor pin 2: MEMS pump 3: microprocessor 4: MEMS chip 41: Chip body 41a: Long side 41b: Short side 42: MEMS pump 42a: First electrode 42b: Second electrode 42c: Piezo 421: The first MEMS pump group 422: The second MEMS pump group 423: The third MEMS pump group 424: The fourth MEMS pump group 43: Common electrode 43a: the first common electrode 43b: second common electrode 43c: third common electrode 43d: fourth common electrode 44: Connect electrode

Fig. 1 is a schematic diagram of a MEMS pump module in the prior art. Figure 2 is a schematic diagram of the MEMS pump module in this case. FIG. 3 is a schematic diagram of a second embodiment of the MEMS chip of the MEMS pump module in this case. FIG. 4 is a schematic diagram of a third embodiment of the MEMS chip of the MEMS pump module in this case. FIG. 5 is a schematic diagram of a fourth embodiment of the micro-electro-mechanical chip of the micro-electro-mechanical pump module of the present case. FIG. 6 is a schematic diagram of a fifth embodiment of the microelectromechanical chip of the microelectromechanical pump module of the present case. FIG. 7 is a schematic diagram of a sixth embodiment of the microelectromechanical chip of the microelectromechanical pump module of the present case. Figure 8A is a schematic diagram of the electrical connection of the micro-electromechanical pump in this case. Fig. 8B is a schematic diagram of the first embodiment of the control signal output by the microprocessor in this case. FIG. 8C is a schematic diagram of a second embodiment of the control signal output by the microprocessor of this case. FIG. 8D is a schematic diagram of a third embodiment of the control signal output by the microprocessor of this case.

100: MEMS pump module

3: microprocessor

4: MEMS chip

41: Chip body

41a: Long side

41b: Short side

42: MEMS pump

42a: First electrode

42b: Second electrode

43: Common electrode

43a: the first common electrode

44: Connect electrode

Claims (12)

A micro-electromechanical pump module includes: 　a microprocessor, which outputs a certain voltage and a variable voltage; 　a micro-electromechanical chip, which is electrically connected to the microprocessor, the micro-electromechanical chip includes: a chip body, which is a rectangular shape, Has a long side; a plurality of microelectromechanical pumps, which are arranged on the chip body, and have a first electrode and a second electrode, respectively; a plurality of connection electrodes, which are arranged on the chip body and adjacent to the long side, the connection electrodes Electrically connecting the first electrodes of the microelectromechanical pumps; and at least one common electrode disposed on the wafer body and adjacent to the long side, the at least one common electrode is electrically connected to the second electrodes of the microelectromechanical pumps; 　　wherein, the microprocessing The device is electrically connected to the connection electrodes and the at least one common electrode to transmit the constant voltage to the at least one common electrode and the variable voltage to the connection electrodes. The microelectromechanical pump module as described in item 1 of the patent application scope, wherein the at least one common electrode includes a first common electrode. The microelectromechanical pump module as described in item 2 of the patent application scope, wherein the second electrodes of the microelectromechanical pumps are electrically connected to the first common electrode. The microelectromechanical pump module as described in item 2 of the patent application scope, wherein the at least one common electrode further includes a second common electrode. The MEMS pump module as described in item 4 of the patent application scope, wherein the MEMS pumps can be divided into a first MEMS pump group and a second MEMS pump group, the first MEMS pump group The second electrodes are electrically connected to the first common electrode, and the second electrodes of the second MEMS pump group are electrically connected to the second common electrode. The MEMS pump module as described in item 4 of the patent application scope, wherein the second electrodes of the MEMS pumps are electrically connected to the first common electrode and the second common electrode. The MEMS pump module as described in item 4 of the patent application scope, wherein the at least one common electrode further includes a third common electrode and a fourth common electrode. The MEMS pump module as described in item 7 of the patent application scope, wherein the MEMS pumps can be divided into a first MEMS pump group, a second MEMS pump group, and a third MEMS pump group And a fourth microelectromechanical pump group, the second electrodes of the first microelectromechanical pump group are electrically connected to the first common electrode, and the second electrodes of the second microelectromechanical pump group are electrically connected to the first Two common electrodes, the second electrodes of the third MEMS pump group are electrically connected to the third common electrode, and the second electrodes of the fourth MEMS pump group are electrically connected to the fourth common electrode. The MEMS pump module as described in item 7 of the patent application scope, wherein the MEMS pumps can be divided into a first MEMS pump group and a second MEMS pump group, the first MEMS pump group The second electrodes are electrically connected to the first common electrode and the second common electrode, and the second electrodes of the second microelectromechanical pump group are electrically connected to the third common electrode and the fourth common electrode. The MEMS pump module as described in item 7 of the patent application scope, wherein the second electrodes of the MEMS pumps are electrically connected to the first common electrode, the second common electrode, the third common electrode and the fourth common electrode electrode. The microelectromechanical pump module as described in item 1 of the patent application scope, wherein the variable voltage includes a first voltage and a second voltage, and the voltage value of the constant voltage is between the first voltage and the second voltage . The micro-electromechanical pump module as described in item 11 of the patent application range, wherein the voltage value of the constant voltage is ±10% between the voltage value of the first voltage and the voltage value of the second voltage.

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