TWI710700B - Micro electrical-mechanical pump module - Google Patents

Abstract

A micro electrical-mechanical pump module is disclosed and comprises a microprocessor and a micro electrical-mechanical chip. The microprocessor outputs a constant voltage and a variable voltage. The micro electrical-mechanical chip electrically connects to the microprocessor and comprises a chip main body, plural micro electrical-mechanical pumps, plural connecting electrodes and at least one common electrode. The chip main body is a rectangular structure and comprises a shorter side. The plural micro electrical-mechanical pumps are disposed on the chip main body and each of them comprises a first electrode and a second electrode. The plural connecting electrodes are disposed on the chip main body, located nearby the shorter side, and respectively electrically connected to the first electrodes of the plural micro electrical-mechanical pumps. The at least one common electrode is disposed on the chip main body, located nearby the shorter side, and electrically connected to the second electrodes of the plural micro electrical-mechanical pumps. The microprocessor electrically connects to the plural connecting electrodes and the at least one common electrode, so as to transmit the constant voltage and the variable voltage to the plural micro electrical-mechanical pumps.

Description

MEMS pump module

This case is about a MEMS pump module, especially a MEMS pump module that uses a common electrode to reduce the contacts of the microprocessor, thereby simplifying the contacts and wiring of the MEMS pump.

With the rapid development of science and technology, the applications of fluid delivery devices are becoming more and more diversified. For example, industrial applications, biomedical applications, medical care, electronic heat dissipation, etc., even the recent popular wearable devices can be seen in its shadow and tradition. The pump has gradually become a trend toward miniaturization of the device, but the traditional pump is difficult to reduce the size to the millimeter level, so the current micro fluid delivery device can only use the piezoelectric pump structure as a micro fluid delivery device.

Although the MEMS pump can miniaturize the pump volume to the micron level, the micro-level MEMS pump will limit the fluid transmission due to its too small volume, so multiple MEMS pumps are required to be used together, please refer to As shown in Figure 1, the current MEMS pump modules are individually controlled by a high-end microprocessor 1, but the high-end microprocessor 1 itself is expensive, and each MEMS pump 2 requires two microprocessors The connection of the pin 11 of the device increases the cost of the high-end microprocessor 1, resulting in the high cost of the MEMS pump module, which is difficult to popularize. Therefore, how to reduce the cost of the drive end of the MEMS pump module is the first to overcome at present Difficulties.

The main purpose of this case is to provide a MEMS pump module, which reduces the contact points of the microprocessor through the common electrode, reduces the contact points and wiring of the MEMS pump module, and further simplifies the MEMS pump module.

In order to achieve the above purpose, the broader implementation aspect of this case is to provide a microelectromechanical pump module, which includes: a microprocessor, which outputs a certain voltage and a variable voltage; a microelectromechanical chip, which is electrically connected to the microprocessor, The electromechanical chip includes: a chip body, which has a rectangular shape and has a short side; a plurality of microelectromechanical pumps, arranged on the chip body, and respectively has a first electrode and a second electrode; a plurality of connecting electrodes, arranged On the chip body and adjacent to the short side, the connecting electrodes are respectively electrically connected to the first electrodes of the MEMS pumps; and at least one common electrode is disposed on the chip body and adjacent to the short side, and the at least one common electrode is electrically connected to the The second electrode of the MEMS pumps; wherein the microprocessor electrically connects the connection electrodes and the at least one common electrode to transmit the constant voltage to the at least one common electrode and transmit the variable voltage to the connection electrodes.

Some typical embodiments embodying the features and advantages of this case will be described in detail in the following description. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of the case, and the descriptions and illustrations therein are essentially for illustrative purposes, rather than limiting the case.

Please refer to Figure 2. Figure 2 is a schematic diagram of the MEMS pump module in this case. The MEMS pump module 100 includes a microprocessor 3 and a MEMS chip 4. The MEMS chip 4 is electrically connected to the microprocessor 3, and the MEMS chip 4 includes a chip body 41, a plurality of MEMS pumps 42, at least one common electrode 43 and a plurality of connecting electrodes 44. The chip body 41 has a rectangular shape and has a long side 41a and a short side 41b. The MEMS pumps 42 are all disposed on the wafer body 41, and each MEMS pump 42 has a first electrode 42a and a second electrode 42b. At least one common electrode 43 is also disposed on the wafer body 41, adjacent to the short side 41b, and electrically connected to the second electrodes 42b of all the microelectromechanical pumps 42. The connecting electrodes 44 are disposed on the chip body 41 and adjacent to the short side 41 b, and the connecting electrodes 44 are electrically connected to the first electrodes 42 a of the MEMS pumps 42 respectively. Among them, all the connecting electrodes 44 and at least one common electrode 43 on the chip body 41 are electrically connected to the microprocessor 3 so as to receive the control signal sent by the microprocessor 3. In addition, FIG. 2 is also a schematic diagram of the first embodiment of the microelectromechanical chip of the present invention. At least one common electrode 43 includes a first common electrode 43a. In this embodiment, the number of the common electrode 43 is one, and the second electrodes 42b of all MEMS pumps 42 are electrically connected to the first common electrode 43a.

Please refer to FIG. 3, which is a schematic diagram of the second embodiment of the MEMS chip of the MEMS pump module in this case. At least one common electrode 43 includes a first common electrode 43a and a second common electrode 43b. The aforementioned plurality of microelectromechanical pumps 42 are divided into a first microelectromechanical pump group 421 and a second microelectromechanical pump group 422 according to their positions. , The second electrode 42b of the MEMS pump 42 located in the first MEMS pump group 421 is electrically connected to the first common electrode 43a, and the MEMS pump 42 located in the second MEMS pump group 422, The second electrode 42b is electrically connected to the second common electrode 43b, so as to achieve the effect of zone control. The number of common electrodes 43 in this embodiment is two.

Please refer to FIG. 4, which is a schematic diagram of the third embodiment of the MEMS chip of the MEMS pump module in this case. The third embodiment is the same as the second embodiment. There are two common electrodes 43, so the common electrode 43 also has a first common electrode 43a and a second common electrode 43b, but the first common electrode 43a and the second common electrode 43b are separated Are arranged on both sides of the wafer body 41, and the first common electrode 43a is electrically connected to the second common electrode 43b, and the second electrodes 42b of the aforementioned plurality of MEMS pumps 42 are simultaneously electrically connected to the first common electrodes 43a on both sides With the second common electrode 43b. The third embodiment can reduce the impedance between the second electrode 42b of the MEMS pump 42 and the common electrode 43, and reduce the power loss of the second electrode 42b that is far from the common electrode 43.

Please refer to Figure 5. Figure 5 is a schematic diagram of the fourth embodiment of the MEMS chip of the MEMS pump module in this case. At least one common electrode 43 includes a first common electrode 43a, a second common electrode 43b, and a third The common electrode 43c and a fourth common electrode 43d. The first common electrode 43a and the third common electrode 43c are spaced apart on one side of the wafer body 41, and the second common electrode 43b and the fourth common electrode 43d are spaced apart on the other side of the wafer body 41. In this embodiment, the aforementioned The plurality of MEMS pumps 42 are divided into a first MEMS pump group 421, a second MEMS pump group 422, a third MEMS pump group 423, and a fourth MEMS pump group 424 according to location areas. The first microelectromechanical pump group 421 is composed of microelectromechanical pumps 42 adjacent to the first common electrode 43a, and the first common electrode 43a is provided for the second electrodes 42b of all microelectromechanical pumps 42 in the first microelectromechanical pump group 421 Electrically connected; the second MEMS pump group 422 is composed of MEMS pumps 42 adjacent to the second common electrode 43b, and the second common electrode 43b is provided for the second MEMS pumps 42 located in the second MEMS pump group 422 The electrode 42b is electrically connected; the third microelectromechanical pump group 423 is composed of microelectromechanical pumps 42 adjacent to the third common electrode 43c, and the third common electrode 43c is for all microelectromechanical pumps 42 located in the third microelectromechanical pump group 423 The second electrode 42b is electrically connected; the fourth MEMS pump group 424 is composed of MEMS pumps 42 adjacent to the fourth common electrode 43d, and the fourth common electrode 43d is provided for all the MEMS pumps located in the fourth MEMS pump group 424 The second electrode 42b of the electromechanical pump 42 is electrically connected to achieve the effect of zone control.

Please refer to FIG. 6, which is a schematic diagram of the fifth embodiment of the MEMS chip of the MEMS pump module in this case. This embodiment is the same as the fourth embodiment, having a first common electrode 43a, a second common electrode 43b, a third common electrode 43c, and a fourth common electrode 43d, and the arrangement positions thereof are also the same. The difference is the first common electrode in this embodiment. The common electrode 43a is electrically connected to the second common electrode 43b, the third common electrode 43c is electrically connected to the fourth common electrode 43d, and the aforementioned plurality of microelectromechanical pumps 42 are divided into a first microelectromechanical pump group 421 and a second microelectromechanical pump group 421 Pump group 422. The first microelectromechanical pump group 421 is composed of microelectromechanical pumps 42 adjacent to the first common electrode 43a or the second common electrode 43b, and the second microelectromechanical pump group 422 is adjacent to the third common electrode 43c or adjacent to the fourth common electrode 43c. The electrode 43d is composed of the MEMS pump 42 to achieve the effect of zone control, reduce the distance between the common electrode 43 and the second electrode 42b, and reduce the loss of power transmission.

Please refer to Figure 7. Figure 7 is a schematic diagram of the sixth embodiment of the MEMS chip of the MEMS pump module in this case. This embodiment is the same as the fourth embodiment and has a first common electrode 43a and a second common electrode. 43b, the third common electrode 43c, and the fourth common electrode 43d, and their arrangement positions are also the same, the difference is that in this embodiment, the first common electrode 43a, the second common electrode 43b, the third common electrode 43c and the fourth common electrode 43c The electrodes 43d are electrically connected to each other, so that the second electrodes 42b of the aforementioned plurality of MEMS pumps 42 can be electrically connected to the common electrode 43 that is closer to them, such as the second electrode 42b of the MEMS pump 42 adjacent to the first common electrode 43a. It is electrically connected to the first common electrode 43a, and the second electrode 42b of the MEMS pump 42 adjacent to the second common electrode 43b is electrically connected to the second common electrode 43b, and so on, the common electrode 43 is supplied to the MEMS pump at a similar position. 42, can reduce the power loss of each MEMS pump 42 in transmission.

Please refer to Fig. 2, Fig. 8A and Fig. 8B at the same time. Fig. 8A is a schematic diagram of the electrical connection of the micro-electromechanical pump of the present invention, and Fig. 8B is a schematic diagram of the first embodiment of the control signal output by the microprocessor of the present invention. The microelectromechanical pump 42 further includes a piezoelectric element 42c. The first electrode 42a and the second electrode 42b transmit voltage to the piezoelectric element 42c, so that the piezoelectric element 42c is deformed due to the piezoelectric effect, thereby changing the interior of the microelectromechanical pump 42 Pressure to transport fluid. The first electrode 42a of the MEMS pump 42 is electrically connected to the microprocessor 3 through the connecting electrode 44, and the second electrode 42b is electrically connected to the microprocessor 3 through the common electrode 43, wherein the control signal output by the microprocessor 3 includes A certain voltage and a variable voltage. In this embodiment, the variable voltage can be a voltage switched between a first voltage and a second voltage, and the voltage value of the constant voltage is between the voltage value of the first voltage and the voltage value of the second voltage, And the voltage value of the constant voltage can also be ±10% between the voltage value of the first voltage and the voltage value of the second voltage. For example, when the first voltage is 1.5V and the second voltage is -1.5V, the constant voltage is 0V; when the first voltage is 3V and the second voltage is 0V, the constant voltage is 1.5V. The second electrode 42b of the MEMS pump 42 receives a fixed voltage, and the first electrode 42a receives a variable voltage that continuously changes between the first voltage and the second voltage, so that the piezoelectric element 42c is caused by the difference between the first electrode 42a and the second electrode 42b. The continuously changing voltage difference between the two produces deformation, thereby transferring fluid. In addition, please continue to refer to Figs. 8C and 8D. Fig. 8C is a schematic diagram of the second embodiment of the control signal output by the microprocessor of the present invention, and Fig. 8D is a schematic diagram of the third embodiment of the control signal output by the microprocessor of the present invention. The variable voltage can also be a voltage that continuously changes between the first voltage and the second voltage. In addition to the square wave of the first embodiment, the control signal can also use a triangle wave (as shown in Figure 8C) and a sine wave ( As shown in Figure 8D).

To sum up, this project provides a MEMS pump module. By allowing the microprocessor to transfer a constant voltage to the second electrode of the MEMS pump through the common electrode, and then transfer the variable voltage to the first electrode of the MEMS pump, only By adjusting the voltage on the first electrode, the voltage difference between the first electrode and the second electrode can be changed, and the piezoelectric element of the microelectromechanical pump can be successfully driven to actuate to transfer fluid. In addition, the arrangement of the common electrode can greatly reduce the pins of the microprocessor, and while reducing the cost of the microprocessor, it can still effectively control a plurality of MEMS pumps.

This case can be modified in many ways by those who are familiar with this technology, but it is not deviated from the protection of the patent application.

100: MEMS pump module 1: high-end microprocessor 11: microprocessor pin 2: MEMS pump 3: microprocessor 4: MEMS chip 41: chip body 41a: long side 41b: short side 42: micro Electromechanical pump 42a: first electrode 42b: second electrode 42c: piezoelectric element 421: first microelectromechanical pump group 422: second microelectromechanical pump group 423: third microelectromechanical pump group 424: fourth microelectromechanical Pump group 43: common electrode 43a: first common electrode 43b: second common electrode 43c: third common electrode 43d: fourth common electrode 44: connecting electrode

Figure 1 is a schematic diagram of a MEMS pump module in the prior art. Figure 2 is a schematic diagram of the MEMS pump module in this case. Figure 3 is a schematic diagram of the second embodiment of the MEMS chip of the MEMS pump module in this case. Figure 4 is a schematic diagram of the third embodiment of the MEMS chip of the MEMS pump module of the present invention. Figure 5 is a schematic diagram of the fourth embodiment of the MEMS chip of the MEMS pump module in this case. Figure 6 is a schematic diagram of the fifth embodiment of the MEMS chip of the MEMS pump module of the present invention. Figure 7 is a schematic diagram of the sixth embodiment of the MEMS chip of the MEMS pump module of the present invention. Figure 8A is a schematic diagram of the electrical connection of the MEMS pump in this case. Figure 8B is a schematic diagram of the first embodiment of the control signal output by the microprocessor of the present invention. Figure 8C is a schematic diagram of the second embodiment of the control signal output by the microprocessor of the present invention. Figure 8D is a schematic diagram of the third embodiment of the control signal output by the microprocessor of the present invention.

100: MEMS pump module

3: Microprocessor

4: MEMS chip

41: chip body

41a: Long side

41b: short side

42: MEMS pump

42a: first electrode

42b: second electrode

43: common electrode

43a: first common electrode

44: Connect the electrodes

Claims (13)

A microelectromechanical pump module includes: 　a microprocessor, which outputs a certain voltage and a variable voltage; 　a microelectromechanical chip, which is electrically connected to the microprocessor, the microelectromechanical chip includes: a chip body, which is a rectangular shape, It has a short side; a plurality of microelectromechanical pumps are arranged on the chip body, and each has a first electrode and a second electrode; a plurality of connection electrodes are arranged on the chip body and adjacent to the short side, the connection electrodes Are electrically connected to the first electrodes of the MEMS pumps; and at least one common electrode is disposed on the chip body and adjacent to the short side, and the at least one common electrode is electrically connected to the second electrodes of the MEMS pumps; 　　, the micro processing The device is electrically connected to the connecting electrodes and the at least one common electrode to transmit the constant voltage to the at least one common electrode and to transmit the variable voltage to the connecting electrodes. According to the MEMS pump module described in claim 1, wherein the at least one common electrode includes a first common electrode. For the MEMS pump module described in item 2 of the scope of patent application, the second electrodes of the MEMS pumps are electrically connected to the first common electrode. According to the MEMS pump module described in item 2 of the scope of patent application, the at least one common electrode further includes a second common electrode. For example, the MEMS pump module described in item 4 of the scope of patent application, wherein the MEMS pumps can be divided into a first MEMS pump group and a second MEMS pump group. The first MEMS pump group The second electrodes of the second electrode are electrically connected to the first common electrode, and the second electrodes of the second MEMS pump group are electrically connected to the second common electrode. The MEMS pump module described in item 4 of the scope of patent application, wherein the second electrodes of the MEMS pumps are electrically connected to the first common electrode and the second common electrode. According to the MEMS pump module described in claim 4, the at least one common electrode further includes a third common electrode and a fourth common electrode. For example, the MEMS pump module described in item 7 of the scope of patent application, wherein the MEMS pumps can be divided into a first MEMS pump group, a second MEMS pump group, and a third MEMS pump group And a fourth microelectromechanical pump group, the second electrodes of the first microelectromechanical pump group are electrically connected to the first common electrode, and the second electrodes of the second microelectromechanical pump group are electrically connected to the first common electrode Two common electrodes, the second electrodes of the third MEMS pump group are electrically connected to the third common electrode, and the second electrodes of the fourth MEMS pump group are electrically connected to the fourth common electrode. For example, in the MEMS pump module described in item 7 of the scope of patent application, the MEMS pumps can be divided into a first MEMS pump group and a second MEMS pump group. The first MEMS pump group The second electrodes are electrically connected to the first common electrode and the second common electrode, and the second electrodes of the second MEMS pump group are electrically connected to the third common electrode and the fourth common electrode. For example, in the MEMS pump module described in claim 7, wherein the second electrodes of the MEMS pumps are electrically connected to the first common electrode, the second common electrode, the third common electrode, and the fourth common electrode. electrode. The microelectromechanical pump module described in item 1 of the scope of patent application, wherein the variable voltage includes a first voltage and a second voltage, and the voltage value of the constant voltage is between the first voltage and the second voltage . For the MEMS pump module described in item 11 of the scope of patent application, the voltage value of the constant voltage is ±10% of the middle value of the voltage value of the first voltage and the voltage value of the second voltage. The MEMS pump module described in item 11 of the scope of patent application, wherein the voltage value of the constant voltage is the middle value of the voltage value of the first voltage and the voltage value of the second voltage.

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