TWM578409U - Cold plate and thermosyphon heat exchanger thereof - Google Patents

Abstract

A thermpsyphon heat exchanger includes a cold plate and a radiator. The cold plate has a first outlet, a first inlet, an evaporation chamber and a water return chamber. The first outlet is connected to the evaporation chamber, and the first inlet is connected to the water return chamber. The evaporation chamber and the return water chamber are connected by a gap, and the internal space of the evaporation chamber is larger or equal to the internal space of the return water chamber. The radiator has a second inlet and a second outlet, the second inlet is in fluid communication with the first outlet, and the second outlet is in fluid communication with the first inlet.

Description

Heat absorption head and siphon type heat radiation device using the same

This creation relates to a siphon-type heat sink, especially a heat sink that uses the principle of siphon-type heat dissipation under a traditional water-cooled architecture.

The traditional water-cooled heat dissipation device is composed of a heat absorption head, a condensing row, a fan, a pump, and a pipeline connecting the components. The circulation path is filled with a liquid working medium. When the water-cooled heat dissipation device is in operation, the heated working medium is sent from the heat absorption head to the condensation row, and the temperature is reduced by the fan and the fins, and finally returned to the heat absorption head by the pump.

However, if the working medium can be used to perform liquid-gas conversion similar to the siphon type heat sink under the water-cooled architecture, it can take away more heat from the heat source. Therefore, there is still room for improvement in the traditional water-cooled heat sink.

In view of the above-mentioned objectives, a siphon-type heat sink is proposed in this case, which includes a heat-absorbing head and a condensing row. The heat absorption head has a first water outlet, a first water inlet, a steam chamber, and a return water chamber. The first water outlet is connected to the steam chamber, the first water inlet is connected to the return water chamber, and the steam chamber and the return water chamber are borrowed. Connected by a gap, and the internal space of the steam chamber is greater than or equal to the internal space of the return water chamber. The condensate drain has a second water inlet and a second water outlet. The second water inlet is in communication with the first water outlet, and the second water outlet is in communication with the first water inlet.

In one embodiment, the siphonic heat sink further includes a pipeline connected to the first water outlet. And the second water inlet, and the second water outlet and the first water inlet are connected.

In one embodiment, the pipeline may be selected from a rigid pipe or a hose.

In one embodiment, the material of the pipeline may be selected from plastic materials or non-plastic materials.

In one embodiment, the siphonic heat dissipation device further includes a pump disposed between the second water outlet and the first water inlet.

In one embodiment, the heat absorption head includes an upper cover and a base. The upper cover and the base jointly define a steam chamber and a water return chamber. One bottom surface of the base is in thermal contact with a heat source, and the shortest distance from the gap to the bottom surface is less than The shortest distance from a water outlet to the bottom.

In one embodiment, the upper cover has a guide inclined surface for guiding the heated working medium to be transmitted in the direction of the first water outlet.

In one embodiment, the condensation row includes a first cavity, a second cavity, a third cavity, and a fourth cavity. The first cavity system is in communication with the second water inlet, and the fourth cavity system is in communication with the first cavity. The two water outlets communicate, the first cavity and the second cavity system communicate with each other through a first group of flow channels, the second cavity and the third cavity system communicate with each other through a second group of flow channels, and the third cavity It communicates with the fourth cavity system through a third group of runners. The flow direction of the first group of runners is opposite to that of the second group of runners, and the flow direction of the second group of runners is the same as that of the third group of runners. in contrast.

In an embodiment, the first cavity and the third cavity are located on one side of the condensation row, and the first cavity is located above the third cavity, and the second cavity and the fourth cavity are located on the other side of the condensation row. Side, and the second cavity is located above the fourth cavity.

In an embodiment, the condensing row includes a plurality of cavities and a flow channel communicating with the plurality of cavities. Among the plurality of cavities, one cavity is in communication with the second water outlet, and the cavity is internally compared with other cavities. Minimal space.

In one embodiment, the condensing row includes a plurality of cavities and a plurality of flow channels communicating with the plurality of cavities. Among the plurality of cavities, a first cavity is in communication with the second water outlet, and the first cavity is connected by The first group of flow channels communicates with a second cavity, wherein the internal space of the second cavity is larger than the internal space of the first cavity.

In one embodiment, when the siphon-type heat sink is installed in an electronic device, the vertical height of the second water inlet is higher than the vertical height of the second water outlet.

In one embodiment, when the siphon-type heat sink is installed in an electronic device, the vertical height of the first water outlet is higher than the vertical height of the first water inlet.

In one embodiment, the siphon type heat sink is filled with a working medium. The working medium is a low-boiling electronic engineering liquid or water, and two phases of liquid-gas and gas-liquid are switched during heating and cooling.

The present invention provides a siphon-type heat sink in another embodiment, which includes a heat-absorbing head and a condensation row. The heat absorption head has a first water outlet, a first water inlet, an upper cover, a base, a steam chamber, a return water chamber and a gap. The upper cover and the base jointly define the steam chamber and the return water chamber, and the first outlet The water inlet is connected to the steam chamber, and the first water inlet is connected to the return water chamber. The steam chamber and the return water chamber communicate with each other through a gap. The heat absorption head is filled with a working medium. The working medium in the steam chamber is converted from a liquid state to a gaseous state when heated. It is discharged from the first water outlet, and the working medium in the return water chamber is in a liquid state, and is absorbed into the vapor chamber by the capillary action of the gap. The condensate drain has a second water inlet and a second water outlet. The second water inlet is in communication with the first water outlet, and the second water outlet is in communication with the first water inlet. The condensate drain is used to change the working medium from a gaseous state to Liquid.

In another implementation, the siphon type heat sink further includes a pipeline connecting the first water outlet and the second water inlet, and connecting the second water outlet and the first water inlet.

In another implementation, the siphonic heat dissipation device further includes a pump disposed between the second water outlet and the first water inlet.

In another implementation, one bottom surface of the base is in thermal contact with a heat source, and the shortest distance from the gap to the bottom surface is less than the shortest distance from the first water outlet to the bottom surface.

In another implementation, the upper cover has a guide inclined surface for guiding the heated working medium to be transmitted in the direction of the first water outlet.

In another implementation, the condensation row includes a first cavity, a second cavity, a third cavity, and a fourth cavity. The first cavity system is in communication with the second water inlet, and the fourth cavity system is in communication with the first cavity. The two water outlets communicate, the first cavity and the second cavity system communicate with each other through a first group of flow channels, the second cavity and the third cavity system communicate with each other through a second group of flow channels, and the third cavity It communicates with the fourth cavity system through a third group of runners. The flow direction of the first group of runners is opposite to that of the second group of runners, and the flow direction of the second group of runners is the same as that of the third group of runners. in contrast.

In another implementation, the first cavity and the third cavity are located on one side of the condensation row, the first cavity is above the third cavity, and the second cavity and the fourth cavity are located on the other side of the condensation row. One side, and the second cavity is located above the fourth cavity.

In another implementation, the condensation row includes a plurality of cavities and a flow channel connecting the plurality of cavities. Among the plurality of cavities, one cavity is in communication with the second water outlet, and the cavity is internally compared with other cavities. Minimal space.

In another implementation, the condensing row includes a plurality of cavities and a plurality of flow channels communicating with the plurality of cavities. Among the plurality of cavities, a first cavity is in communication with the second water outlet, and the first cavity is connected by The first group of flow channels communicates with a second cavity, wherein the internal space of the second cavity is larger than the internal space of the first cavity.

In another implementation, when the siphon-type heat sink is installed in an electronic device, the vertical height of the second water inlet is higher than the vertical height of the second water outlet.

In another implementation, when the siphon-type heat sink is installed in an electronic device, the vertical height of the first water outlet is higher than the vertical height of the first water inlet.

In another implementation, the working medium is a low-boiling electronic engineering liquid or water, and liquid-gas and gas-liquid two-phase conversion is performed during heating and cooling.

The present invention provides a heat absorption head in still another embodiment, including a water outlet, a water inlet, a steam chamber, and a return water chamber. The water outlet is connected to the steam chamber, and the water inlet is connected to the return water chamber. In the case of a heating source, the water inlet is located on the side of the heat absorption head, and when the heat absorption head is attached upright to the heat source, the water inlet is located at the bottom of the heat absorption head opposite.

In yet another embodiment, the steam chamber and the return water chamber are communicated through a gap, and the gap includes a plurality of slits.

1‧‧‧Siphonic heat sink

11‧‧‧heat absorption head

111‧‧‧outlet

112‧‧‧Inlet

113‧‧‧ Upper cover

1131‧‧‧wall

1132‧‧‧ Guide Bevel

114‧‧‧base

1141‧‧‧Three-dimensional structure

1142‧‧‧ underside

115‧‧‧backwater room

116‧‧‧Steam chamber

117‧‧‧Gap

12, 12’‧‧‧ condensate drain

121, 121’‧‧‧ Outlet

122, 122’‧‧‧ Inlet

123A, 123A’‧‧‧ cavity

123B, 123B’‧‧‧ cavity

123C, 123C’‧‧‧ cavity

123D, 123D’‧‧‧ cavity

124A, 124A’‧‧‧ runner group

124B, 124B’‧‧‧ runner group

124C, 124C’‧‧‧ runner group

125‧‧‧ fins

126, 126’‧‧‧ wall

13, 14‧‧‧ pipeline

15‧‧‧ heat source

16‧‧‧PCB

17‧‧‧Pu

18‧‧‧ electronic device

A‧‧‧arrow

D111, D117‧‧‧‧shortest distance

H121, H122‧‧‧ Vertical distance

H111 、 H112‧‧‧Vertical distance

H17‧‧‧Vertical distance

FIG. 1A is a schematic three-dimensional view of a heat dissipating device provided according to an embodiment of the present invention when it is placed in a horizontal position.

FIG. 1B is a three-dimensional schematic diagram of the heat dissipating device provided according to an embodiment of the present invention when it is operated in an upright position.

Fig. 2 is a schematic cross-sectional view of the heat sink obtained along the line 2-2 in Fig. 1A.

FIG. 3 is a schematic three-dimensional cross-sectional view of a heat absorption head in a heat dissipation device provided according to an embodiment of the present invention.

FIG. 4 is a heat absorbing head in a heat sink provided according to an embodiment of the present invention Another three-dimensional cross-sectional view.

Fig. 5 is a schematic cross-sectional view of the condensation row obtained along the line 5-5 in Fig. 1A.

Figure 6 is the flow channel design of another condensation row provided by the author.

According to an embodiment of the present invention, a siphon type heat sink 1 is provided. The siphon type heat sink 1 includes a heat absorbing head 11 and a condensation row 12. The heat absorption head 11 has a water outlet 111 and a water inlet 112, and the condensing row 12 has a water outlet 121 and a water inlet 122. The water outlet 111 of the heat absorption head 11 is in communication with the water inlet 122 of the condensation row 12, and the condensation row The water outlet 121 of 12 is in communication with the water inlet 112 of the thermal head 11. In addition, the water outlet 111 of the heat absorption head 11 and the water inlet 122 of the condensation head 12 may be integrated or directly connected, and the water outlet 121 of the condensation head 12 and the water inlet 112 of the heat absorption head 11 may also be integrated or directly connected. When together. In addition, the siphon type heat sink 1 may also be provided with additional pipes to connect the heat sink 11 and the condensation row 12, such as a pipe 13 to connect the water outlet 111 of the heat sink 11 and the water inlet 122 of the condensation row 12, or The pipeline 14 is provided to connect the water outlet 121 of the condensing drain 12 and the water inlet 112 of the heat absorption head 11. The pipes 13 and 14 can be selected from a hard pipe, such as a plastic hard pipe or a metal snake pipe, or can be selected from a hose. The material can also be selected from a plastic material or a non-plastic material according to the requirements or the characteristics of the application target. Material (such as metal), this creation is not limited.

In addition, in other embodiments according to the present creation, the heat absorption head 11 may be additionally provided with a second water outlet, and the condensation row 12 may also be provided with a second water inlet through a second pipeline between each other. 13 to connect. Similarly, the heat absorption head 11 can be additionally provided with a second water inlet, and the condensation row 12 can also be provided with a second water outlet, which are communicated with each other through a second pipeline 14.

Please refer to FIG. 1A, FIG. 1B, and FIG. 2 at the same time. For the siphon type heat sink 1 provided in this creation, the heat absorption head 11 can be attached to the heat source 15 (the PCB in the electronic device 18 horizontally or vertically). 16 above), so that the electronic device 18 to which the siphonic heat sink 1 is applied has more flexibility in space configuration.

Please refer to Figure 2. The heat sink 11 is assembled from the upper cover 113 and the base 114. The bottom surface 1142 of the base 114 can be in thermal contact with the heat source 15, including directly attached to the heat source 15, or sandwiched between the two. Thermal paste, adhesive or solder and other media. The upper cover 113 and the base 114 of the heat absorption head jointly define a backwater chamber 115 and a steam chamber 116, wherein the water inlet 112 is connected to the backwater chamber 115 and the water outlet 111 is connected to the steam chamber 116. The heat absorption head 11 may be evacuated in advance and filled with a working medium, and the working medium filled in the vapor chamber 116 is converted from a liquid state to a gaseous state after being heated, and is discharged toward the water outlet 111. In this work, a gap 117 is set between the steam chamber 116 and the return water chamber 115, so that the steam chamber 116 and the return water chamber 115 can communicate with each other by the gap 117. The reason for setting the gap 117 is to avoid the steam chamber 116 When the working medium (not shown) absorbs heat and changes to a gaseous state, it flows back to the backwater chamber 115. At the same time, the capillary working of the gap 117 allows the liquid working medium in the backwater chamber 115 to continuously move to the steam chamber 116 ( delivery). In addition, the internal space of the steam chamber 116 of the heat absorption head 11 is greater than or equal to the internal space of the return water chamber 115, so that the working medium (not shown) of the steam chamber 116 can also be prevented from absorbing heat and converting to the return water chamber 115. countercurrent.

In this embodiment, the gap 117 is formed in a retaining wall 1131 extending downward from the upper cover 113 (the gap 117 penetrates the retaining wall 1131), but this creation does not limit the formation position or structure of the gap, such as in According to other embodiments of the present creation, the gap 117 may also be formed on a retaining wall extending upward from the base 114, or the junction of the upper cover 113 and the base 114 may be disconnected or partially connected to form the gap 117. It can also be implemented in accordance with the spirit of this creation. Shi. In addition, when arranging the position of the gap 117, the shortest distance D117 of the gap 117 to the bottom surface 1142 can be shorter than the shortest distance D111 of the water outlet 111 to the bottom surface 1142, thereby ensuring the working medium that is heated and evaporated, because The relationship between the structure and the pressure moves in the direction of the higher water outlet 111, and does not move in the direction of the gap 117 that is lower and filled with the liquid working medium.

Please refer to the cross-sectional schematic diagram in Figure 2 and the three-dimensional cross-sectional schematic diagram of the heat absorption head 11 shown in Figure 3. This creation is based on the base 114 to form a three-dimensional structure 1141 that helps to boil. For example, the gap is small and the density is very high. Skived fins, or other three-dimensional structures that can increase surface area, such three-dimensional structures 1141 can absorb thermal energy and quickly change the working medium after the bottom surface 1142 of the base 114 is in thermal contact with the heat source 15 It is gaseous and erupts toward the water outlet 111 due to the structural design of the steam chamber 116.

In this creation, the siphon type heat sink 1 is filled with a working medium during operation. The working medium can be water or a low boiling point electronic engineering liquid, such as 3M Fluorinert FC-72 (boiling point is 56 ° C), 3M Novec. Fluids 7000 (boiling point 34 ° C), or 3M Novec Fluids 7100 (boiling point 61 ° C), etc., but it is not limited, as long as the working medium can be converted to a gaseous state when flowing through the three-dimensional structure 1141, and it is in the process of expansion and pressure Just take a lot of thermal energy.

The design of the steam chamber 116 of the heat sink 11 provided in this creation can be observed from Figures 1A, 2 and 3, which is a gradually changing direction from the return water chamber 115 (or the gap 117) to the water outlet 111. At the same time, the cross-sectional schematic diagram of the heat absorption head 11 shown in FIG. 2 is more observable. Above the base 114, especially the three-dimensional structure 1141, a guide slope 1132 is formed inside the upper cover 113, so that it can guide the gaseous state. After being heated, the working medium or liquid-gas mixture is transferred in the direction of arrow A to the direction of the water outlet 111 of the heat absorption head 11.

Please refer to Figure 1A and Figure 1B at the same time. In the thermal device 1, in order to allow the working medium to be stably transmitted unidirectionally, the water inlet 122 of the condensing row 12 is specially set at a vertical height H122 higher than the vertical height H111 of the water outlet 111 of the heat sink 11 and the condensing row 12 The vertical height H122 of the water inlet 122 is higher than the vertical height H121 of the water outlet 121 of the condensate drain 12, so that when the siphon type heat sink 1 is operated, the gaseous working medium will evaporate upward and enter the water inlet of the condensate drain 12. 112, and when the gaseous working medium is converted into a liquid state by the condensation of the condensing row 12, it can also flow by gravity to the water outlet 121 of the condensing row 12 and flow back to the heat sink 11 via the pipe 14. The water chamber 115 achieves the effect of self-circulation.

In this creation, in order to ensure that the working medium can smoothly move from the heat absorption head 11 to the condensation head 12 or return from the condensation head 12 to the heat absorption head 11, the water outlet 121 and the heat absorption head 11 of the condensation head 12 can also be used as required. A pump is set between the water inlets 112. For example, a pump 17 is connected to the pipeline 14 as shown in FIG. 1A, which helps the working medium after cooling to move smoothly from the condensation row 12 to the heat sink 11 to avoid A backflow has occurred. In addition, in other implementations, a pump may be provided between the water outlet 111 of the heat absorption head 11 and the water inlet 122 of the condensing row 12 as necessary, for example, an additional pump is connected to the pipeline 13 (not shown) , To help the working medium smoothly move from the heat absorption head 11 to the condensation row 12. And because the working medium used in this creation can be a working medium that can cause two-phase change, in the choice of pumps, it is better to choose a pump that resists pitting corrosion (also known as vacancy and cavitation). . The number of pumps 17 may be a plurality of pumps 17 connected in series on one pipeline, such as 13 or 14. If the number of pipelines 13 and 14 is plural, it may also be installed on each pipeline. There are pumps 17 installed, so that there is a parallel setting between pumps 17, this creation is not limited.

Please refer to FIG. 1A and FIG. 1B at the same time. In the siphon type heat dissipation device 1 proposed in this embodiment of the present invention, the water inlet 112 of the heat absorption head 11 is located in the heat absorption head 11 as shown in FIG. 1A. The side position when lying down. In this way, when the heat absorption head 11 is attached upright to the heat source as shown in FIG. 1B, the position of the water inlet 112 can be located at a relatively low point of the heat absorption head 11. At this time, The vertical height H111 of the water outlet 111 of the heat absorption head 11 is higher than the vertical height H112 of the water inlet 112, and the vertical height H112 of the water inlet 112 of the heat absorption head 11 may be lower than the vertical height H121 of the water outlet 121 of the condensing drain 12 or lower. Vertical height H17 of pump 17. In this creation, the vertical height of each water outlet, water inlet, and even the pump is a relative comparison value, as long as it is based on the same horizontal reference, such as a base plate or a casing of the electronic device 18. In addition, when the siphon type heat sink 1 provided in this creation is installed with the pump 17, the influence of gravity on the siphon type heat sink can be reduced, and it is not necessary to fully follow the aforementioned water outlets, water inlets and pumps at vertical heights. Under the above setting rules, the circulation of the working medium in the pipeline can also be successfully completed.

Please refer to FIG. 4, which is another schematic three-dimensional cross-sectional view of the heat absorption head 11 in the siphon type heat sink 1 provided in this embodiment. In this three-dimensional sectional view, the arrangement of the return water chamber 115 and the gap 117 can be shown. When the liquid working medium returns to the heat absorption head 11 through the pipeline 14, it does not directly enter the steam chamber 116 of the heat absorption head 11, but After being stored in the return water chamber 115 of the heat absorption head 11, it enters the steam chamber 116 through the capillary action of the gap 117. The gap 117 may be composed of at least one slit or opening. The three-dimensional schematic diagram shown in FIG. 4 shows the situation when the gap 117 is composed of a plurality of slits. The horizontal layout of this slit is roughly the same as that of the backwater chamber 115. The width is the same, or the two ends of the return water chamber 115 are touched. Therefore, even when the heat absorption head 11 is set upright as shown in FIG. 1B, the working medium can still return to the steam chamber 116 through a part of the gap 117.

Please refer to FIG. 5, which is a flow channel design of the condensing row 12 in the siphonic heat sink 1 provided in this embodiment. It can be seen from the sectional schematic diagram that the cavity 12 is provided with cavities 123A, 123B, 123C, 123D, three flow channel groups, and a plurality of fins sandwiched between the flow channels. 125. The cavity 123A and the cavity 123C are located on the side of the water inlet 122, the cavity 123A is located above the cavity 123C, and a retaining wall 126 is provided between the cavity 123A and the cavity 123C. The cavity 123B and the cavity 123D are located on the side of the water outlet 121, the cavity 123B is located above the cavity 123D, and a retaining wall 127 is also provided between the cavity 123B and the cavity 123D.

Please continue to refer to FIG. 5, the flow channel group 124A is connected between the cavity 123A and the cavity 123B so that the two can communicate with each other. After the gaseous (or liquid-gas mixed) working medium flows into the cavity 123A from the water inlet 122 of the condensing row 12, it can be divided by the flow channel group 124A and moved to the cavity 123B. The runner group 124B is connected between the cavity 123B and the cavity 123C, so that the two can communicate with each other, and the flow direction of the runner group 124B is opposite to that of the runner group 124A, so the working medium can be borrowed after the cavity 123B is assembled. From the runner group 124B, it is turned to move to the cavity 123C. The runner group 124C is connected between the cavity 123C and the cavity 123D so that the two can communicate with each other. The flow direction of the runner group 124C is opposite to that of the runner group 124B. After the working medium is collected in the cavity 123C, The flow channel group 124C turns to move toward the cavity 123D. Through the above S-shaped flow channel design, the working medium can naturally move from a horizontal high point to a low point by gravity, and the design that the internal space of each cavity is larger than the diameter of each flow channel can also be It is ensured that the working medium is maintained in one-way transmission without backflow, and is finally discharged from the water outlet 121 of the condensing drain 12.

When the working medium moves in the condensing row 12, the heat energy contained in it can be transferred to the fins 125 through the flow channels in the flow channel groups 124A, 124B, 124C, and through a matching fan (not shown in the figure) or other A device capable of generating air flow to take away the heat energy, in addition to allowing the working medium to be converted from a gaseous state to a liquid state, the temperature is also reduced and returned to the return water chamber 115 of the heat absorption head 11 to prepare for the next liquid-gas cycle. In order to ensure that the working medium is in a liquid state when the water outlet 121 of the condensing row 12 is discharged, it is more conducive to the operating conditions of the pump 17. Therefore, this creation can connect the condensing row 12 internally. The cavity 123D of the water outlet 121 is designed to have the smallest internal space when compared with other cavities; or the penultimate cavity 123C is also larger in internal space than the inner space of the last water cavity 123D In addition, the flow channel group 124C used for communication between the two is also smaller in diameter than the chambers 123C and 123D, so it is more able to ensure that the working medium will be liquid before it is transmitted to the chamber 123D and passes through the water outlet 121. discharge.

Regarding the planning and design of the inner cavity and the flow channel of the condensation row 12, it is not limited to only operate in the S-type direction shown in FIG. 5, and there can be other different implementations, for example, as shown in FIG. 6 The internal structure of another condensing row 12 'provided by this creation is structurally a mirror image design of condensing row 12 in Fig. 5. From this schematic sectional view, it can be seen that there are cavities 123A', 123B 'in the condensing row 2' 123C ', 123D', three flow channel groups, and a plurality of fins 125 'sandwiched between the flow channels. The cavity 123A 'and the cavity 123C' are located on the side of the water inlet 122 ', and the cavity 123B' and the cavity 123D 'are located on the side of the water outlet 121', and between the cavity 123A 'and the cavity 123C A retaining wall 126 'is provided between the', and a retaining wall 127 'is also provided between the cavity 123B' and the cavity 123D '. The runner group 124A 'is connected between the cavity 123A' and the cavity 123B ', so that the gaseous (or liquid-gas mixture) working medium can flow from the water inlet 122' of the condensation row 12 'into the cavity 123A' , Can be shunted and moved to the cavity 123B '. The runner group 124B 'is connected between the cavity 123B' and the cavity 123C ', so that the working medium is collected in the cavity 123B' and then turned to move to the cavity 123C '. The runner group 124C 'is connected between the cavity 123C' and the cavity 123D ', so that the working medium can be turned to move to the cavity 123D' after the cavity 123C 'is collected. Through the above-mentioned S-shaped flow channel design, the working medium can also naturally move from a horizontal high point to a low point by gravity, and finally flows out from the water outlet 121 'of the condensate drain 12'. When the working medium moves in the condensing row 12 ', the heat energy contained in it will still pass through the flow channel groups 124A', 124B ', Each flow channel in 124C 'is transmitted to the fin 125', and the heat energy is taken away by a matching fan (not shown in the figure) or other air generating device.

The internal flow channel design of the condensing row shown in Figures 5 and 6 above is only an illustration to illustrate this creation. In other embodiments based on this creation, it can also be used with left to right, right to left The flow channel design from top to bottom, top left to bottom right, or top right to bottom left, the number of cavities can be more (for example, 5 or 6) or less (for example, 3), as long as it ensures operation The vertical height of the water inlet 122 of the condensing drain 12 may be greater than the water outlet 121 at this time.

In the siphon type heat sink 1 provided in this embodiment, the base 114 of the heat absorbing head 11 may be selected from metals with good thermal conductivity, such as silver, copper, gold, aluminum, iron, etc., or alloys containing the above metals, or It is other non-metals with good thermal conductivity such as graphite, and the upper cover 113 can also be selected from the same or different thermally conductive material as the base 114, which is not limited in this creation.

The above is only a preferred embodiment of the creation, and is not intended to limit the creation. Therefore, all other equivalent changes or modifications that do not depart from the spirit revealed by the creation should be included in the creative concept of the case. .

Claims (28)

A siphon type heat dissipation device includes a heat absorption head having a first water outlet, a first water inlet, a steam chamber, and a return water chamber. The first water outlet is connected to the steam chamber, and the first The water inlet is connected to the return water chamber, and the steam chamber and the return water chamber communicate with each other through a gap, and the internal space of the steam chamber is greater than or equal to the internal space of the return water chamber; and a condensing row having a second A water inlet and a second water outlet, the second water inlet is in communication with the first water outlet, and the second water outlet is in communication with the first water inlet. According to the siphon-type heat sink of the scope of the patent application, the siphon-type heat dissipation device further includes a pipeline connecting the first water outlet and the second water inlet, and connecting the second water outlet and the first water inlet. According to the siphon-type heat dissipation device of the second patent application scope, the pipeline may be selected from a rigid pipe or a hose. According to the siphon-type heat dissipation device of the scope of the patent application, the material of the pipe can be selected from plastic materials or non-plastic materials. According to the siphon-type heat dissipation device of the first patent application scope, a pump is further provided between the second water outlet and the first water inlet. According to the siphon type heat dissipation device of the scope of patent application, the heat absorption head includes an upper cover and a base, the upper cover and the base jointly define the steam chamber and the return water chamber, and a bottom surface of the base is connected with a heat source. Thermal contact, and the shortest distance from the gap to the bottom surface is less than the shortest distance from the first water outlet to the bottom surface. According to the siphon-type heat sink of item 6 of the patent application, the upper cover has a guide slope for guiding the heated working medium to be transmitted in the direction of the first water outlet. According to the siphon-type heat sink of the first patent application scope, the condensing row includes a first cavity, a second cavity, a third cavity, and a fourth cavity. The first cavity system and the second cavity The water inlet is in communication, the fourth cavity system is in communication with the second water outlet, the first cavity is in communication with the second cavity system through a first set of flow channels, and the second cavity is in communication with the third cavity The system is connected by a second group of flow channels, and the third cavity is in communication with the fourth cavity system by a third group of flow channels. The flow direction of the first group of flow channels is connected to the second group of flow channels. The flow direction of the second group of flow channels is opposite to that of the third group of flow channels. According to the siphon-type heat dissipation device of the eighth aspect of the patent application, wherein the first cavity and the third cavity are located on one side of the condensation row, and the first cavity is located above the third cavity, the first cavity is located above the third cavity. The two cavities and the fourth cavity are located on the other side of the condensation row, and the second cavity is located above the fourth cavity. According to the siphon-type heat sink of the first patent application scope, the condensing row includes a plurality of cavities and a flow channel communicating with the plurality of cavities, and one cavity in the plurality of cavities is in communication with the second water outlet. And compared with other cavities, the cavity has the smallest internal space. According to the siphon type heat sink of the first patent application scope, the condensing row includes a plurality of cavities and a plurality of flow channels communicating with the plurality of cavities. There is a first cavity and the second cavity in the plurality of cavities. The water outlet is in communication, and the first cavity is in communication with a second cavity through a first group of flow channels, wherein the internal space of the second cavity is larger than the internal space of the first cavity. According to the siphon-type heat sink of item 1 of the patent application scope, when the siphon-type heat sink is installed in an electronic device, the vertical height of the second water inlet is higher than the vertical height of the second water outlet. According to the siphon-type heat sink of item 1 of the patent application scope, when the siphon-type heat sink is installed in an electronic device, the vertical height of the first water outlet is higher than the vertical height of the first water inlet. According to the siphon-type heat sink of the first patent application scope, a working medium is filled inside, and the working medium is a low-boiling electronic engineering liquid or water, and during the process of heating and cooling, liquid-gas and gas-liquid two Phase conversion. A siphon type heat dissipation device includes a heat absorption head having a first water outlet, a first water inlet, an upper cover, a base, a steam chamber, a water return chamber and a gap. The upper cover and the The base jointly defines the steam chamber and the return water chamber, the first water outlet is connected to the steam chamber, the first water inlet is connected to the return water chamber, and the steam chamber and the return water chamber communicate through the gap. The heat absorbing head is filled with a working medium, wherein the working medium in the steam chamber is converted from a liquid state to a gaseous state and discharged from the first water outlet after being heated. The working medium in the return water chamber is liquid and passes through the gap. Capillary to be adsorbed to the steam chamber; and a condensation row having a second water inlet and a second water outlet, the second water inlet is in communication with the first water outlet, and the second water outlet is connected with the The first water inlet is connected, and the condensate drain is used to change the working medium from a gaseous state to a liquid state. According to the siphon-type heat dissipation device of the scope of application patent No. 15, it further comprises a pipeline connecting the first water outlet and the second water inlet, and connecting the second water outlet and the first water inlet. According to the siphon type heat dissipation device of the scope of application for patent, the pump further includes a pump disposed between the second water outlet and the first water inlet. According to the siphon-type heat sink of the scope of application patent No. 15, one bottom surface of the base is in thermal contact with a heat source, and the shortest distance from the gap to the bottom surface is smaller than the shortest distance from the first water outlet to the bottom surface. According to the siphon-type heat dissipation device of the scope of application patent No. 15, the upper cover has a guide inclined surface for guiding the heated working medium to be transmitted in the direction of the first water outlet. According to the siphon type heat dissipation device of the scope of application for patent, the condensing row includes a first cavity, a second cavity, a third cavity, and a fourth cavity, the first cavity system and the second cavity The water inlet is in communication, the fourth cavity system is in communication with the second water outlet, the first cavity is in communication with the second cavity system through a first set of flow channels, and the second cavity is in communication with the third cavity The system is connected by a second group of flow channels, and the third cavity is in communication with the fourth cavity system by a third group of flow channels. The flow direction of the first group of flow channels is connected to the second group of flow channels. The flow direction of the second group of flow channels is opposite to that of the third group of flow channels. According to the siphon-type heat dissipation device of claim 20, wherein the first cavity and the third cavity are located on one side of the condensation row, and the first cavity is located above the third cavity, the first cavity is located above the third cavity. The two cavities and the fourth cavity are located on the other side of the condensation row, and the second cavity is located above the fourth cavity. According to the siphon-type heat dissipation device of the scope of application patent No. 15, the condensing row includes a plurality of cavities and a flow channel communicating with the plurality of cavities, and a cavity in the plurality of cavities communicates with the second water outlet, And compared with other cavities, the cavity has the smallest internal space. According to the siphon-type heat dissipation device of the scope of application for patent, the condensing row includes a plurality of cavities and a plurality of flow channels communicating with the plurality of cavities, and there is a first cavity and the second cavity in the plurality of cavities. The water outlet is in communication, and the first cavity is in communication with a second cavity through a first group of flow channels, wherein the internal space of the second cavity is larger than the internal space of the first cavity. According to the siphon-type heat sink of item 15 of the application, when the siphon-type heat sink is installed in an electronic device, the vertical height of the second water inlet is higher than the vertical height of the second water outlet. According to the siphon-type heat dissipation device of the scope of application patent No. 15, when the siphon-type heat dissipation device is installed in an electronic device, the vertical height of the first water outlet is higher than the vertical height of the first water inlet. According to the siphon type heat dissipation device of the scope of application for patent, the working medium is a low boiling point electronic engineering liquid or water, and the two phases of liquid-gas and gas-liquid are switched during the process of heating and cooling. A heat absorption head includes a water outlet, a water inlet, a steam chamber, and a water return chamber. The water outlet is connected to the steam chamber, and the water inlet is connected to the water return chamber. When the heat absorption head is horizontally attached to a heat source, The water inlet is located at the side of the heat absorption head, and when the heat absorption head is attached upright to the heat source, the water inlet is located at the opposite bottom point of the heat absorption head. According to the thermal head of claim 27, wherein the steam chamber and the return water chamber are communicated by a gap, the gap includes a plurality of slits.