TWM576958U - Temperature-keeping laminated structure - Google Patents
Temperature-keeping laminated structure Download PDFInfo
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- TWM576958U TWM576958U TW107216897U TW107216897U TWM576958U TW M576958 U TWM576958 U TW M576958U TW 107216897 U TW107216897 U TW 107216897U TW 107216897 U TW107216897 U TW 107216897U TW M576958 U TWM576958 U TW M576958U
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Abstract
一種保溫層疊結構,其包括有基材層、膠水層以及保溫層,基材層包括有外周部與內周部,以及環繞於該內周部的外邊界的連環部,又連環部一體連接內周部與外周部之間,膠水層具有相對的結合側其中一者設置於內周部,又膠水層未設置於外周部;保溫層具有內圍部以及圍繞於內圍部之外圍部,內圍部的內面側設置於該二結合側中的另一者。如此能提供一種新型態之保溫層疊結構,不同於習知技術使用熱融熱壓間接聚合物層,藉以避免習知技術所產生的相關缺陷。 An insulation laminate structure comprising a substrate layer, a glue layer and an insulation layer, the substrate layer comprising a peripheral portion and an inner peripheral portion, and a connecting portion surrounding the outer boundary of the inner peripheral portion, and the connecting portion is integrally connected Between the peripheral portion and the outer peripheral portion, the glue layer has an opposite joint side disposed on the inner peripheral portion, and the glue layer is not disposed on the outer peripheral portion; the heat insulating layer has an inner circumference portion and a peripheral portion surrounding the inner circumference portion, The inner surface side of the circumference is provided on the other of the two joint sides. In this way, a novel thermal insulation laminate structure can be provided, which is different from the prior art in that a hot melt hot press indirect polymer layer is used to avoid the related defects caused by the prior art.
Description
本創作是關於具有保溫效果並可裝成物品的器具,特別是指該器具的層疊結構者。 The present invention relates to an appliance having a heat insulating effect and can be assembled into an article, in particular, a laminated structure of the appliance.
例如台灣新型專利第M556563號,其為一種「用於製作保溫容器之疊層結構」。此專利案為申請人先前開發所創作的產品,主要係利用刀具結構同時有壓合部與刀刃,因此在裁切發片材時,刀具的壓合部除了有壓抵發泡片材外,同時還以壓合部進行熱能傳遞至發泡片材,在間接熱熔位於紙質層的聚合物層,而得以將發泡片材黏合於聚合物層上。 For example, Taiwan's new patent No. M556563 is a "laminated structure for making an insulated container". This patent is a product previously developed by the applicant, mainly using a cutter structure with a nip and a blade at the same time. Therefore, when cutting the hair sheet, the nip portion of the cutter is pressed against the foam sheet. At the same time, thermal energy is transferred to the foamed sheet by the nip, and the polymer layer located in the paper layer is indirectly thermally melted to bond the foamed sheet to the polymer layer.
然而上述新型專利所使用此種方式,在生產過程中出現下列缺陷問題: However, the above-mentioned new patents use this method, and the following defects occur in the production process:
其一,需要有額外加熱器對刀具結構直接或間接加熱,為了達到聚合物熱熔溫度,刀具需加熱達到攝氏100度至110度,這樣會除了會造成刀具結構熱脹,導致其刀刃變形失去原有準確裁切位置,以致裁切誤差擴大。 First, an additional heater is required to directly or indirectly heat the tool structure. In order to achieve the polymer hot melt temperature, the tool needs to be heated to 100 degrees Celsius to 110 degrees Celsius, which will cause the tool structure to expand and cause the blade deformation to be lost. The original cutting position is accurate, so that the cutting error is enlarged.
其二,刀具結構因被直接或間接加熱情況下,也容易造成刀具接觸發泡片材部位產生局部熱融,容易發生發泡片材 支局部熱熔更沾黏了刀具結構的壓合部、刀刃,而不易從發泡片材分離刀具結構,因此在操作使用上有其不便之處。 Second, when the tool structure is directly or indirectly heated, it is also likely to cause partial hot melt of the tool contacting the foamed sheet, and the foamed sheet is likely to occur. The partial hot melt adheres to the nip portion and the cutting edge of the cutter structure, and the tool structure is not easily separated from the foamed sheet, so that it is inconvenient in operation and use.
其三,刀具結構的壓合部因高溫並壓抵於發泡片材,容易在發泡片材表面留下壓印痕跡,以致發泡片材的表面不夠平整,影響後續發泡片材的表面印刷效果。 Thirdly, the nip portion of the cutter structure is pressed against the foamed sheet due to high temperature, and it is easy to leave an embossed mark on the surface of the foamed sheet, so that the surface of the foamed sheet is not flat enough to affect the subsequent foamed sheet. Surface printing effect.
其四,發泡片材需要含有相同聚合物層材料之聚合物質,因此在聚合層與發泡片材的材料選擇有其使用限制。 Fourth, the foamed sheet needs a polymer material containing the same polymer layer material, and thus there is a limitation in the use of the material of the polymer layer and the foamed sheet.
根據上述缺陷問題勢必需要開發新型態的保溫層結構,才能符合業界生產製造的需求。 According to the above defects, it is necessary to develop a new type of insulation layer structure in order to meet the needs of the industry's manufacturing.
本創作提供一種新型態之保溫層疊結構,不同於習知技術使用熱融熱壓間接聚合物層,藉以避免習知技術所產生的相關缺陷。 The present invention provides a novel thermal insulation laminate structure that differs from conventional techniques in the use of hot melt hot compressive indirect polymer layers to avoid the associated drawbacks of conventional techniques.
為了達成前述目的與功效,提供一種保溫層疊結構,其包括有一基材層、一膠水層以及一保溫層,其中:該基材層其包括有一外周部與一內周部,以及環繞於該內周部的外邊界的一連環部,又該連環部一體連接該內周部與該外周部之間;該膠水層其具有相對的二結合側其中一者係設置於該內周部,又該膠水層未設置於該外周部;該保溫層,其具有一內圍部以及圍繞於該內圍部之一外圍部,該內圍部的一內面側設置於該二結合側中的另一者。 In order to achieve the foregoing objects and effects, an insulating laminate structure is provided, comprising a substrate layer, a glue layer and a heat insulating layer, wherein: the substrate layer includes an outer peripheral portion and an inner peripheral portion, and surrounds the inner layer a connecting portion of the outer boundary of the circumference, the connecting portion is integrally connected between the inner peripheral portion and the outer peripheral portion; the glue layer has one of the opposite two combined sides disposed on the inner peripheral portion, and a glue layer is not disposed on the outer peripheral portion; the heat insulating layer has an inner circumference portion and a peripheral portion surrounding the inner circumference portion, and an inner surface side of the inner circumference portion is disposed on the other of the two joint sides By.
10‧‧‧基材層 10‧‧‧Substrate layer
11‧‧‧外周部 11‧‧‧The outer part
12‧‧‧內周部 12‧‧‧ Inner Week
13‧‧‧連環部 13‧‧‧Chain Department
2‧‧‧膠水層 2‧‧‧ glue layer
20‧‧‧膠水層 20‧‧‧ glue layer
21‧‧‧結合側 21‧‧‧ joint side
30‧‧‧保溫層 30‧‧‧Insulation
31‧‧‧內圍部 31‧‧‧ Inner circumference
32‧‧‧外圍部 32‧‧‧External Department
33‧‧‧內面側 33‧‧‧ inside side
500‧‧‧柔版轉印機 500‧‧‧Flexible transfer machine
501‧‧‧輸送機構 501‧‧‧Transportation agency
502‧‧‧膠機構 502‧‧‧Glue mechanism
503‧‧‧貼附機構 503‧‧‧ Attachment
第一圖係本創作基材層示意圖。 The first figure is a schematic diagram of the substrate layer of the present creation.
第二圖係第一圖塗佈有膠水層示意圖。 The second figure is a schematic view of the first figure coated with a glue layer.
第三圖係本創作基材層塗佈有膠水層剖面示意圖。 The third figure is a schematic cross-sectional view of the substrate layer coated with the glue layer.
第四圖係本創作保溫層疊結構剖面示意圖。 The fourth figure is a schematic cross-sectional view of the insulated laminate structure of the present invention.
第五圖係本創作經由柔版轉印機製作示意圖。 The fifth picture is a schematic diagram of the creation of the creation through a flexographic transfer machine.
第六圖係本創作基材層塗佈膠水層為簍空狀示意圖。 The sixth figure is a schematic diagram of the glue layer coated with the substrate layer of the present invention.
第七圖係本創作基材層塗佈膠水層為間隔狀示意圖。 The seventh figure is a schematic diagram of the glue layer coated with the base layer of the present invention.
請參閱第一圖至第五圖所示,本創作保溫層疊結構,其包括有一基材層10、一膠水層20以及一保溫層30,其中:本實施例的基材層10包括有一外周部11與一內周部12,以及環繞於該內周部12的外邊界的一連環部13,又該連環部13一體連接該內周部12與該外周部11之間;該膠水層20其具有相對的二結合側21其中一者係設置於該內周部12,又該膠水層20未設置於該外周部11;該保溫層30,其具有一內圍部31以及圍繞於該內圍部31之一外圍部32,該內圍部31的一內面側33設置於該二結合側21中的另一者。 Referring to the first to fifth figures, the inventive heat insulating laminate structure comprises a substrate layer 10, a glue layer 20 and a heat insulating layer 30, wherein: the substrate layer 10 of the embodiment comprises a peripheral portion. 11 and an inner peripheral portion 12, and a connecting portion 13 surrounding the outer boundary of the inner peripheral portion 12, the connecting portion 13 is integrally connected between the inner peripheral portion 12 and the outer peripheral portion 11; the glue layer 20 One of the opposite two joint sides 21 is disposed on the inner peripheral portion 12, and the glue layer 20 is not disposed on the outer peripheral portion 11; the heat insulating layer 30 has an inner periphery portion 31 and surrounds the inner circumference One of the outer peripheral portions 32 of the portion 31, and an inner surface side 33 of the inner peripheral portion 31 is disposed on the other of the two joined sides 21.
於下列說明製作保溫層疊結構由柔版轉印機500製作流程,首先已輸送機構501捲送基材層10,輸送基材層10至上膠機構502,以致基材層10的內周部12表面形成膠水層20,以致膠水 層20一側的結合側21固定於基材層10的內周部12表面,另以貼附機構503將保溫層30貼附於膠水層20另一結合側21,且保溫層30對應此結合側21為內圍部31,而非對應結合側21則為外圍部32。 The following procedure is used to fabricate the thermal insulation laminate structure from the flexographic transfer machine 500. First, the transport mechanism 501 winds up the substrate layer 10, and transports the substrate layer 10 to the gumming mechanism 502 so that the inner peripheral portion 12 of the substrate layer 10 is surfaced. Forming a glue layer 20 so that glue The bonding side 21 on one side of the layer 20 is fixed on the surface of the inner peripheral portion 12 of the substrate layer 10, and the insulating layer 30 is attached to the other bonding side 21 of the glue layer 20 by the attaching mechanism 503, and the insulating layer 30 corresponds to the combination. The side 21 is the inner circumference 31, and the non-corresponding side 21 is the outer portion 32.
本創作透過膠水層20可以將保溫層30穩固結合在基材層10的內周部12位置,避免以往習知刀具結構使用熱融、熱壓所產生刀具因熱膨脹變形導致加工誤差、刀具易沾黏,以及表面有壓痕,以及材料選擇上的麻煩與缺陷。 In the present invention, the insulating layer 30 can be firmly bonded to the inner peripheral portion 12 of the substrate layer 10 through the glue layer 20, so as to avoid the processing error caused by the thermal expansion deformation of the tool generated by the conventional tool structure using hot melt and hot pressing, and the tool is easy to be stained. Stickiness, as well as indentations on the surface, as well as troubles and defects in material selection.
又實施例中,該膠水層20於該二結合側21之間的最短距離係小於該基材層10的厚度尺寸。 In another embodiment, the shortest distance between the two bonding sides 21 of the glue layer 20 is less than the thickness dimension of the substrate layer 10.
又實施例中,該保溫層30厚度尺寸大於該基材層10厚度尺寸。 In another embodiment, the thickness of the insulating layer 30 is greater than the thickness of the substrate layer 10.
又實施例中,該基材層10包括有一紙質部分與一防水部分層疊構成。 In another embodiment, the substrate layer 10 includes a paper portion and a waterproof portion laminated.
又實施例中,該連環部13與該內周部12係呈扇形或矩形。 In still another embodiment, the link portion 13 and the inner peripheral portion 12 are fan-shaped or rectangular.
值得一提的是,本創作除了可以將膠水層20整個塗佈在基材層10的內周部12形成有如滿版的扇形(如第二圖所示)之外,亦可進一步將膠水層20塗佈於連環部13以及未完全塗佈於內周部12形成有如簍空狀(如第六圖所示),或膠水層20進一步塗佈於連環部13以及間隔塗佈於內周部12形成間隔狀(如第七圖所示)。 It is worth mentioning that, in addition to the fact that the glue layer 20 can be entirely coated on the inner peripheral portion 12 of the substrate layer 10 to form a full-shaped fan shape (as shown in the second figure), the glue layer can be further 20 is applied to the joint portion 13 and not completely coated on the inner peripheral portion 12 to be formed in a hollow shape (as shown in FIG. 6), or the glue layer 20 is further applied to the joint portion 13 and spaced apart from the inner peripheral portion. 12 is formed in a spacer shape (as shown in the seventh figure).
Claims (7)
Priority Applications (1)
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TW107216897U TWM576958U (en) | 2018-12-12 | 2018-12-12 | Temperature-keeping laminated structure |
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TW107216897U TWM576958U (en) | 2018-12-12 | 2018-12-12 | Temperature-keeping laminated structure |
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TWM576958U true TWM576958U (en) | 2019-04-21 |
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