JP3560684B2 - Apparatus and method for peeling adhesive film - Google Patents

Description

[0001]
[Industrial applications]
The present invention provides an adhesive film such as an anisotropic conductive film (ACF), which is thermally transferred to an object such as a glass plate and bonded thereto, and then the adhesive film is peeled off from the adhesive film. The present invention relates to a film peeling device and a film peeling method.
[0002]
[Prior art]
For example, when a TAB type terminal (TAB: Tape Automated Bonding) is thermocompression-bonded to a terminal of a glass plate such as a liquid crystal panel, it is performed via an anisotropic conductive film (ACF).
Such an anisotropic conductive film is finely sliced, and it is necessary to attach the finely divided anisotropic conductive film to a liquid crystal panel.
[0003]
In such a case, a conventional attaching method as shown in FIG. 29 is used.
That is, the adhesive film 1, which is an anisotropic conductive film, is fed out corresponding to the adherend 3 and cut at the portion 2. Thereby, the adhesive film 1 corresponding to the length of the adherend 3 is obtained. Then, the adhesive film 1 is thermocompression-bonded to the adherend 3 by the hot press 4. Thereafter, the adhesive film 6 is left for a certain time, the adhesive tape 6 is laminated on the cover film 5 of the adhesive film 1, the cover film 5 is peeled off from the adhesive film 1, and the peeled cover film 5 and adhesive tape 6 are bobbin. Take up to 7.
[0004]
FIG. 30 shows another conventional method of attaching an adhesive film.
The adhesive film 9 in the form of a reel is rolled onto the adherend 3 by the laminating roll 10, and the adhesive film 9 is adhered between the rolls 11 and 12 with a certain size.
[0005]
[Problems to be solved by the invention]
However, the conventional bonding method shown in FIG. 29 requires a large number of steps and a long tact time. Moreover, setup is required depending on the shape and size of the head 4 of the hot press.
In the conventional bonding method shown in FIG. 30, when the release film is peeled off from the adhesive film 9, the temperature of the lami roll 10 is equal to or higher than the softening point of the adhesive of the adhesive film. Is weak, cohesive failure 9a may be caused between the peeling film and the adherend 3 in the middle of the adhesive film 9. Therefore, the adhesive film cannot be stuck to the adherend 3 reliably.
[0006]
Therefore, the present invention has been made in order to solve the above-mentioned problems, and it is possible to cleanly peel a release film from an adhesive film, and furthermore, it is possible to shorten a tact time,Glass plate or liquid crystal panel with terminalsIt is an object of the present invention to provide a peeling device and a peeling method of a film for peeling an adhesive film, which can perform thermal transfer stably on the adhesive film.
[0007]
[Means for Solving the Problems]
The above object is achieved by claim 1, 2In the invention of the above, the adhesive film having a release filmGlass plate or liquid crystal panel with terminalsAfter heat transfer to the adhesive film, the adhesive film is a peeling device for peeling the adhesive film for peeling the peeling film from the adhesive film, the adhesive film isGlass plate or liquid crystal panel with terminalsA heat transfer means for heat transfer to the heat transfer means, after cooling the heat transferred adhesive layer of the adhesive film to a softening point or lower, in order to peel the peeling film from the adhesive film, a predetermined with respect to the heat transfer means Peeling means provided at intervals, the peeling means, the adhesive film having a cooling means for cooling the adhesive film by cooling the peeling means when peeling the peeling film from the adhesive film This is achieved by a peeling device for a peeling film.
Claim3In the invention, the thermal transfer unit and the peeling unit are preferably arranged between a winding section of the adhesive film and a winding section of the peeling film.
Claim4In the invention of the, preferably the adhesive filmGlass plate or liquid crystal panel with terminalsTransport means capable of moving the thermal transfer means and the peeling means at the predetermined interval along a direction in which the heat transfer means and the peeling means are adhered to each other.
Claim5Preferably, the thermal transfer means has a pressure roller.
Claim6Preferably, the peeling means is in the form of a block or a roller.
Claim7Preferably, the adhesive film includes an anisotropic conductive film.
Claim8Preferably, the adhesive film is a belt-shaped film.
[0008]
In addition, the above-mentioned object is described in the claims.9In the invention of the above, the adhesive filmGlass plate or liquid crystal panel with terminalsA method of peeling a film for peeling an adhesive film for peeling the film for peeling from the adhesive film after heat transfer and bonding to the adhesive film.Glass plate or liquid crystal panel with terminalsThe temperature of the adhesive of the adhesive film is reduced by a cooling means provided in a peeling means arranged at a predetermined distance from the thermal transfer means. This is achieved by a method for peeling an adhesive film from the adhesive film, wherein the adhesive film is peeled from the adhesive film by cooling to the following temperature.
Claim10Preferably, the adhesive film includes an anisotropic conductive film.
Claim11Preferably, the adhesive film is a belt-shaped film.
Claim12Preferably, the adhesive film is cooled by a cooling liquid or a cooling gas.
[0009]
In addition, the above-mentioned object is described in the claims.13In the invention of the above, the adhesive film having a release filmGlass plate or liquid crystal panel with terminalsAfter heat transfer to the adhesive film, the adhesive film is a peeling device for peeling the adhesive film for peeling the peeling film from the adhesive film, the adhesive film isGlass plate or liquid crystal panel with terminalsA heat transfer unit having a pressure roller and a heating block for heat transfer to the heat transfer unit, and cooling the adhesive layer of the heat-transferred adhesive film to a softening point or lower by a cooling unit provided in a peeling unit, and then from the adhesive film. The present invention is achieved by a film peeling device for peeling an adhesive film, comprising: a peeling means arranged at a predetermined distance from the thermal transfer means for peeling the peeling film.
Claim14In the invention, the thermal transfer unit and the peeling unit are preferably arranged between a winding section of the adhesive film and a winding section of the peeling film.
ClaimFifteenIn the invention of the, preferably the adhesive filmGlass plate or liquid crystal panel with terminalsTransport means capable of moving the thermal transfer means and the peeling means at the predetermined interval along a direction in which the heat transfer means and the peeling means are adhered to each other.
Claim16Preferably, the heating block of the thermal transfer unit is disposed between two pressure rollers.
Claim17Preferably, the pressure roller of the thermal transfer unit is disposed between the heating blocks.
Claim18Preferably, the heating block and the pressure roller of the thermal transfer unit are separate from each other.
Claim19Preferably, the heating block of the thermal transfer means includes a hot air blower for supplying hot air.
Claim20Preferably, the heating block of the thermal transfer unit is an infrared irradiation device.
Claim21Preferably, the heating block of the thermal transfer unit is separated from the peeling film by a predetermined distance.
[0010]
[Action]
Claim 112According to the invention, the thermal transfer means forms the adhesive filmGlass plate or liquid crystal panel with terminalsHeat transfer to The peeling means is arranged at a predetermined interval with respect to the thermal transfer means, and after cooling the adhesive layer of the thermally transferred adhesive film to a softening point or lower by a cooling means provided in the peeling means, from the adhesive film. Peel off the release film.
Claims13-21According to the invention, the adhesive film is formed by using the pressure roller and the heating block of the thermal transfer means.Glass plate or liquid crystal panel with terminalsSince the thermal transfer is performed on the adhesive, the range of conditions (for example, the amount of heat applied, the pressure, and the pressing time) for the pressure bonding is expanded, and the adhesive film can be thermally transferred to the object stably without bubbles. Clean thermal transfer without protrusion is possible. The peeling means is arranged at a predetermined interval with respect to the thermal transfer means, and after cooling the adhesive layer of the thermally transferred adhesive film to a softening point or lower by a cooling means provided in the peeling means, from the adhesive film. Peel off the release film.
[0011]
【Example】
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
In addition, since the Example described below is a preferable specific example of the present invention, various technically preferable limitations are added, but the scope of the present invention particularly limits the present invention in the following description. The embodiments are not limited to these embodiments unless otherwise described.
[0012]
Example 1
FIG. 1 shows an adhesive film sizing and sticking apparatus equipped with a preferred embodiment 1 of the adhesive film peeling film peeling apparatus of the present invention. FIG. 2 is an enlarged view of a portion G of FIG. 1, and FIG. 3 is a structure of a preferred embodiment of a film peeling device for peeling an adhesive film of the present invention of FIG. 1 and a tape of an anisotropic conductive film. It is a figure showing a path.
[0013]
First, reference is made to FIGS.
The adhesive film sizing device includes the following elements.
The main body 20 includes an adhesive film unwinding unit 22, a peeling film winding unit 24, a cover tape winding unit 26, a sticking robot 30, a cutter unit 32, a base 42, and the like.
The sticking robot 30 is disposed substantially between the peeling film winding section 24 and the adhesive film unwinding section 22. On the base 42, for example, a liquid crystal panel 40, also referred to as an adherend or an object, is arranged.
[0014]
As shown in FIG. 3, the path of the film extends from the adhesive film unwinding section 22 to the peeling film winding section 24 via the rollers R1, R2, R3, R4, R7, R8, R9, R10, and R11. It has become.
The adhesive film ST (shown by a portion P1 in FIG. 3) unwound from the adhesive film unwinding section 22 is shown in an enlarged manner in FIG. As shown in FIG. 4, in the adhesive film ST, a release film TH is applied to one surface of the anisotropic conductive film ACF, and a cover tape CT is applied to the other surface of the anisotropic conductive film ACF. Has been adhered. The release film TH is also called a base tape or a base film. The cover tape CT is also called a cover film.
[0015]
3 is for winding only the cover tape CT shown in FIG. 4 from the anisotropic conductive film ACF. That is, when the adhesive film ST in FIG. 3 is unwound from the adhesive film unwinding section 22 via the rollers R1, R2, R3, and R4, the cover tape CT is transferred via the rollers R5 and R6 as shown in FIG. And is wound around the cover tape winding section 26.
[0016]
FIG. 5 is an enlarged view of the portion P2 of FIG. 3, FIG. 6 is an enlarged view of the portion P3 of FIG. 3, and FIG. 7 is an enlarged view of the portion P4 of FIG.
The cutter unit 32 shown in FIG. 3 includes two blades 32a at predetermined intervals as shown in FIG. 6, and forms grooves 88, 88 at predetermined intervals to cut only the anisotropic conductive film ACF. Thus, the peeling film TH is not cut.
[0017]
The cut sensor 32b detects whether the cutter unit 32 has cut only the anisotropic conductive film ACF.
The connection sensors 32c and 32d operate as follows. That is, the adhesive film ST is connected at a certain length, and is wound on the reel 22 in FIG. 3. In particular, when the adhesive film ST is lengthened, it is shown in FIG. Such a connecting part JJ enters. Since the connecting portion JJ has a connecting tape JT and no anisotropic conductive film ACF, the connecting portion JJ must not be transferred to the liquid crystal panel 40.
In FIG. 6, the lower part of the anisotropic conductive film ACF cut by the blades 32a, 32a is a part to be transferred to the liquid crystal panel 40. Therefore, the sensors 32c and 32d detect whether the connecting portion JJ (FIG. 4) of the adhesive film ST is above, below, or between the half cut portions, and there is a defective connecting tape JT. The anisotropic conductive film ACF (ACF missing portion) is prevented from being transferred to the liquid crystal panel 40 as a work.
[0018]
Next, the sticking robot 30 will be described.
The attaching robot 30 shown in FIG. The transporting means 31 can move the thermal transfer means 60 and the peeling means 70 in the directions of arrows X1 and X2 integrally along the guide 80.
The clamps C1 and C2 are clamps for feeding the adhesive film ST in the direction of the arrow AR. The clamp C2 is provided on the peeling means 70.
[0019]
The thermal transfer means 60 and the peeling means 70 have a structure as shown in FIG.
The thermal transfer unit 60 includes a copy roller 61 as a pressure roller and a heater (not shown), and the peeling unit 70 includes a peeling block 71. The distance between the center of the copy roller 61 and the front end of the peeling block 71 is the cooling distance A of the adhesive film ST. Both the thermal transfer means 60 and the peeling means 70 can move up and down in the direction of arrow Y.
[0020]
The thermal transfer means 60 and the peeling means 70 shown in FIG. 3 can be integrally moved in the directions of the arrows X1 and X2 between the sticking start position PS1 (part indicated by imaginary line) and the sticking end position PS2 (part indicated by solid line). And its stroke is indicated by B. This stroke B is the same as the fixed size of the anisotropic conductive film ACF described above.
The distance between the center of the copy roller 61 of the thermal transfer means 60 and the rear end of the peeling block 71 is indicated by A. The distance between the center of the copy roller 61 and the center of the cutter 32a is indicated by C.
Only the anisotropic conductive film ACF of the adhesive film ST is thermocompression-bonded to the liquid crystal panel 40 by the copy roller 61 of the attaching robot 30, and is peeled off from the anisotropic conductive film ACF of the adhesive film ST by the peeling block 71. The film TH is peeled off.
[0021]
Then, after the peeling film TH is peeled off from the anisotropic conductive film ACF, it is wound up by the peeling film winding section 24. FIG. 7 shows a portion P4 of the release film TH.
[0022]
The copy roller 61, which is also called the thermal transfer roller in FIG. 3, applies heat to the adhesive film ST to heat the adhesive beyond its softening point. The copy roller 61 may be a non-rotating roller other than the roller, and may be, for example, a heat block such as an iron. In any case, a roller or a heat block that reduces the friction between the anisotropic conductive film ACF and the tape is preferable. As the copy roller 61, a metal coated with Teflon is preferably used.
[0023]
As shown in FIG. 3, the peeling block 71 has a portion 71a. The portion 71a is a portion where the peeling film TH is rapidly pulled up substantially perpendicularly from the anisotropic conductive film ACF. However, the peeling block 71 is not limited to the block, and may be a roller-shaped rotating body. As the rotating body, for example, a needle-shaped roller of about 1.2 mm can be adopted.
Moreover, as shown in FIG.The separation block 71 has a cooling liquidAlternatively, a cooling means 71b for supplying cooling air is provided. The cooling means 71b is for actively cooling the peeling block 71 and rapidly cooling the adhesive layer of the adhesive film ST.
[0024]
Next, an example of operation of the adhesive film sticking apparatus of FIG. 3 will be described with reference to FIGS.
FIG. 8 shows a state before the anisotropic conductive film ACF in the adhesive film ST is attached to the glass surface of the liquid crystal panel 40 as an adherend. In this state, the thermal transfer roller 61 is retracted upward.
[0025]
As shown in FIG. 9, the bonding of the adhesive film ST to the liquid crystal panel 40 is started. In this case, the copy roller 61 presses the adhesive film ST against the liquid crystal panel 40 in the direction of arrow Y1, for example, with a pressing force of 3 kg. Moreover, the peeling block 71 is also lowered in the arrow Y1 direction. However, in this case, the gap CL1 between the lower surface of the peeling block 71 and the liquid crystal panel 42 is, for example, 0.05 to 0.5 mm. However, when the separation block 71 has a rotating body, the gap CL1 may be zero.
[0026]
Next, as shown in FIG. 10, the copy roller 61 and the separation block 71 are moved synchronously in the direction of arrow X1. Thus, the adhesive film ST is thermally transferred to the upper surface of the liquid crystal panel 40 by the copy roller 61. Then, only the release film TH is separated from the anisotropic conductive film ACF by the portion 71a at a distance A contributing to cooling. Then, only the peeling film TH is wound on the peeling film winding unit 24 from the roller R11 in FIG.
[0027]
As described above, after being thermocompression-bonded by the copy roller 61, the cooling roller passes through a cooling distance A that is a length contributing to cooling.The peeling block 71 is cooled by the cooling means 71b.After the adhesive film ST is cooled, the release film TH is released from the anisotropic conductive film ACF, so that the adhesive layer of the adhesive film ST can be automatically cooled to a temperature lower than the softening point.
Therefore, the release film TH and the anisotropic conductive film ACF can be peeled very cleanly without causing peeling failure in the conventional release film TH and the anisotropic conductive film ACF. In addition, by making the angle of the portion 71a, for example, a right angle, the peeling angle can be increased, and local peeling is suddenly caused, and the peeling film TH is easily peeled from the anisotropic conductive film ACF.
[0028]
Next, as shown in FIG. 11, when the copy roller 61 reaches the sticking end position PS2, only the copy roller 61 is lifted in the direction of arrow Y2.
Next, as shown in FIG. 12, when the portion 71a of the peeling block 71 reaches the sticking end position PS2, the peeling block 71 is lifted in the direction of arrow Y2, and the distance CL2 between the lower surface of the peeling block 71 and the liquid crystal panel 40 is For example, it is set to 0.3 to 1 mm.
In this manner, as shown in FIG. 3, only the anisotropic conductive film ACF can be attached to the liquid crystal panel 40, and the release film TH can be removed from the anisotropic conductive film ACF cleanly. Can be.
[0029]
When the anisotropic conductive film ACF shown in FIGS. 8 to 12 is attached, the clamp C2 is open, and the clamp C1 is closed to hold the release film TH. Then, when the thermal transfer means 60 and the peeling means 70 return from the sticking end position PS2 of FIG. 3 to the sticking start position PS1, the clamp C1 is opened, the clamp C2 is closed, and the adhesive film ST is moved by the stroke B in the X1 direction.
[0030]
Next, the relationship between the cooling temperature of the adhesive film and the releasability of the release film TH will be described.
13 to 15 show the temperature of the adhesive layer of the adhesive film, the distance between the peeling block and the copy roller, and the transfer property.
In FIG. 13, the temperature of the copy roller as the laminating head is set to 60 degrees Celsius, and the anisotropic conductive film (CP7131, 2.5 mm width × 25 M (manufactured by Sony Chemical, adhesive softening point temperature 40 degrees Celsius)) is used. Used. FIG. 13 plots the relationship between the distance between the copy roller and the peeling block, the temperature of the adhesive layer, and the peelability for each line speed.
The glass of the liquid crystal panel as the adherend is a glass with ITO having a thickness of 0.7 mm, and the bonding pressure is 3 kg / cm 2.
[0031]
In FIG. 14, the temperature of the laminating head is 80 degrees Celsius, and CP3131FT, 2.5 mm width × 25 M (manufactured by Sony Chemical, adhesive softening point temperature 48 degrees Celsius) is used as the anisotropic conductive film. The adherend is the same as the example in FIG.
[0032]
In FIG. 15, the temperature of the laminating head is 80 degrees Celsius, and CP7131 is used as the anisotropic conductive film, 2.5 mm width × 25 M (manufactured by Sony Chemical, adhesive softening point temperature 40 degrees Celsius). Then, cooling air is supplied to the separation block from the cooling means. The adherend is the same as in the examples of FIGS.
[0033]
As apparent from FIGS. 13 to 15, at a temperature higher than the softening point of the adhesive of the anisotropic conductive film of the adhesive film, cohesive failure of the adhesive occurs, and the anisotropic conductive film is successfully transferred to the liquid crystal. It could not be transferred to the panel.
Then, as shown in FIGS. 13 and 14, when the distance between the peeling block and the copy roller is 5 mm or more, the temperature of the adhesive layer drops sharply, and transfer becomes possible. That is, the cooling distance A required for cooling shown in FIGS. 2 and 3 is preferably 5 mm or more.
[0034]
In FIG. 15, the temperature of the adhesive layer sharply drops due to the active blowing of cooling air to the peeling block. Thereby, even if the range of the heating temperature of the copy roller 61 (the pressure-bonding portion), which is also referred to as a laminating roll, is increased, the temperature of the adhesive layer can be rapidly lowered. That is, even if the line speed at which the adhesive film ST is fed is increased, the adhesive film is reliably heated by the copy roller 61 (the pressure-bonding portion), and the temperature of the adhesive layer is rapidly decreased, so that the anisotropic conductive film ACF is formed. , The peeling film TH can be reliably peeled off.
[0035]
In the above-described embodiment, after the anisotropic conductive film ACF is thermally transferred to glass such as a liquid crystal panel as an object, cooling is performed until the release film TH, which is also called a base film, is released. Since the adhesive is not softened, the peeling film can be peeled cleanly from the anisotropic conductive film ACF.
In the peeling block 71, by increasing the angle at which the peeling film is peeled, abrupt peeling can be locally caused, and the peeling film is easily peeled from the anisotropic conductive film ACF. Then, the sticking robot 30 shown in FIG. 3 makes it possible to perform fixed-size sticking from roll to roll by the copy roller 61 along the guide 80, thereby reducing the tact time and the process.
[0036]
The roller R4 in FIG. 3 has a built-in sensor for checking how long the anisotropic conductive film ACF (adhesive film ST) has been pulled out.
By the thermal transfer means 60 (and the clamps C1 and C2), the anisotropic conductive film is added by the length obtained by adding the stroke B and the half cut removal length (the length cut by the two blades 32a and 32a in FIG. 6). When the ACF is pulled out, the half-cut portion of the anisotropic conductive film ACF cut by the blades 32a, 32a is removed as unnecessary anisotropic conductive film ACF by a removing unit (not shown).
[0037]
The edge sensor 63 in FIG. 3 is a sensor that detects the position of the leading end BP (see FIG. 8) of the half-cut adhesive film ST. In a state where the clamp C1 in FIG. 3 is closed and the clamp C2 is opened, The position of the head BP is detected.
When the position of the half-cut portion (or the leading portion BP of the anisotropic conductive film ACF) is detected, the clamp C1 in FIG. 3 is opened and the clamp C2 is closed, and the adhesive film ST is moved to the sticking start position PS1 in FIG. . At this time, since the adhesive film ST is pulled out from the roll 22, when a predetermined length (for example, in this case, a length obtained by adding the stroke B and the length of removing the half cut), the blade shown in FIG. The unnecessary anisotropic conductive film ACF is again half-cut by the blades 32a, 32a by the blades 32a, 32a, and is removed by the removing means.
[0038]
After attaching the anisotropic conductive film ACF to the liquid crystal panel 40, the clamp C1 is closed again and the clamp C2 is opened, and the edge sensor 63 detects the leading end BP of the half-cut adhesive film ST and performs the next attachment. Perform the operation.
In this case, the thermal transfer unit 60 and the peeling unit 70 are moved together by the attaching robot 30 as described above.
[0039]
If the connecting portion JJ in FIG. 4 described above is found during a series of operations, the thermal transfer means 60 and the peeling means 70 are moved to open and close the clamps C1 and C2 without the copy roller 61 performing the attaching operation. While the adhesive film ST is being fed idly. That is, when feeding the adhesive film ST, the clamp C1 is opened and the clamp C2 is closed, and the thermal transfer unit 60 and the peeling unit 70 move in the X1 direction. In the case of return, the clamp C1 is closed and the clamp C2 is opened, and the thermal transfer unit 60 and the peeling unit 70 move in the X2 direction.
[0040]
Example 2
Next, with reference to FIGS. 16 to 22, a preferred embodiment 2 of a film peeling device for peeling an adhesive film of the present invention will be described.
First, reference is made to FIGS.
The peeling device shown in FIG. 20 can be applied to the adhesive film fixed size sticking device shown in FIG. This peeling device has a thermal transfer unit 260 and a peeling unit 270 as in the first embodiment of FIG. FIG. 16 is a diagram showing the thermal transfer means 260 of FIG. 20 in detail.
[0041]
In FIG. 20, the thermal transfer means 260 and the peeling means 270 are integrated by the transport means 31 between the sticking start position PS1 and the sticking end position PS2 shown in FIG. And the stroke is the same as the fixed size of the anisotropic conductive film ACF described above.
As shown in FIG. 20, the thermal transfer unit 260 includes a heating block 266, a guide 280, a copy roller 261 as a pressure roller, and the like. The peeling means 270 includes a peeling head 271 and a guide (not shown) provided near the peeling head 271 as shown in FIG.
A heater 267 is provided near the heating block 266 and the copy roller 261 in FIG. The heater 267 heats the heating block 266 and the copy roller 261 to transfer radiant heat to the peeling film TH and the anisotropic conductive film ACF as indicated by an arrow Y1. The distance between the lower surface 266a (pressure bonding surface) of the heating block 266 and the copy roller 261 is set to, for example, 0.01 to 0.5 mm. The heating block 266 radiates radiant heat to the peeling film TH and the anisotropic conductive film ACF through the space DD in the direction of arrow Y1. Similarly, the position of the copy roller 261 emits radiant heat along the direction of arrow Y1.
[0042]
Next, the operation of the second embodiment shown in FIGS. 16 and 20 will be described.
Referring to FIGS. 21 and 22, the peeling head 271 of the peeling means 270 is cooled by the cooling means 271b as in the first embodiment of FIG.
As shown in FIG. 20, the film path passes through the peeling head 271 and its guide via the roller R10, and passes in the direction of the guide 280 side of the thermal transfer means 260.
When the anisotropic conductive film ACF is attached to the liquid crystal panel 40 from the release film TH, the thermal transfer means 260 is lowered in the direction of arrow Y1, as shown in FIGS. Then, the copy roller (also referred to as a transfer roller) 261 comes into contact with the surface of the anisotropic conductive film ACF via the peeling film TH, and the radiant heat generated by the adjacent heating block 266 causes the anisotropic conductive film ACF to come into contact with the anisotropic conductive film ACF. The anisotropic conductive film ACF is attached to the liquid crystal panel 40 by applying heat in advance.
More specifically, referring to FIG. 22, in the area AR3, the anisotropic conductive film ACF is not attached to the liquid crystal panel 40 and is in a peeled state. Then, the heating block 266 preheats the anisotropic conductive film ACF via the peeling film TH in advance, and transfers (sticks) the anisotropic conductive film ACF to the liquid crystal panel 40 during the preheating. Then, the copy roller 261 firmly presses the anisotropic conductive film ACF to the liquid crystal panel 40 via the peeling film TH and affixes (transfers) the preheated anisotropic conductive film ACF to the anisotropic conductive film ACF. ). In this manner, the anisotropic conductive film ACF is attached to the liquid crystal panel 40, and the peeling film TH is smoothly separated from the anisotropic conductive film ACF by the cooled peeling head 271. The film is wound around the peeling film winding section 24 of FIG. 1 via the roller R10.
[0043]
By the way, as described above, the lower surface 266a of the heating block 266 is located at a height of a predetermined distance DD with respect to the copy roller 261, and the lower surface 266a of the heating block 266 is located on the side of the anisotropic conductive film ACF. The heating block 266 never makes contact, and transmits radiant heat to the anisotropic conductive film ACF side.
As described above, by moving the copy roller 261 and the heating block 266 in the direction of the arrow X1, a sufficient amount of heat radiation is supplied to the anisotropic conductive film ACF by the heating block 266. Then, the copy roller 261 passes over the peeling film TH and the anisotropic conductive film ACF, so that the anisotropic conductive film ACF is reliably transferred to the liquid crystal panel 40.
By using both the copy roller 261 and the heating block 266, the selection range of conditions (for example, the amount of heat for pressing, pressure, and pressing time) when the anisotropic conductive film ACF is pressed against the liquid crystal panel 40 is widened and stable. It is possible to stick the anisotropic conductive film ACF. Moreover, by using the combination of the copy roller 261 and the heating block 266, the transfer of the clean anisotropic conductive film ACF without bubbles between the liquid crystal panel 40 and the anisotropic conductive film ACF without protruding ( Attachment) is possible. In addition, the time for attaching the anisotropic conductive film ACF can be reduced.
[0044]
When the second embodiment shown in FIGS. 16 and 20 is used, as shown in the temperature profile of FIG. 17, the temperature T does not change much with the lapse of time, and a sufficient amount of heat is supplied to the anisotropic conductive film ACF. The anisotropic conductive film ACF and the liquid crystal panel 40 can be securely attached.
[0045]
On the other hand, FIG. 18 is a comparative example shown for comparison with the second embodiment, and shows a case where the thermal transfer unit 1060 has only the copy roller 1061. The copy roller 1061 is heated by the heater 1067. Therefore, the copy roller 1061 moves a small amount of heat with respect to the anisotropic conductive film ACF in the direction of arrow Y1. FIG. 19 shows a temperature profile in the comparative example of FIG. In FIG. 19, the temperature T changes greatly with the passage of time, and it is considered that the calorific value of the anisotropic conductive film ACF is insufficient.
This is because the copy roller 1061 presses and heats the anisotropic conductive film ACF in a line contact state.
[0046]
A comparison between the one using the copy roller and the heating block in combination as in the second embodiment in FIGS. 16 and 20 and the one using only the copy roller as in FIG. There is a 15-fold difference in the amount of heat. Here, the calorific value is an area ratio when time × temperature change is calculated by area.
In the second embodiment shown in FIG. 20, it is preferable to provide a heat insulating material between the thermal transfer unit 260 and the peeling unit 270.
[0047]
Example 3
FIG. 23 shows a third embodiment of the present invention.
23, in the thermal transfer unit 360, unlike the case of the second embodiment in FIG. 16, the copy roller 361 is disposed on the heating block 366 in the direction of the arrow X1. That is, the heating block 366 and the copy roller 361 are exchanged. The thermal transfer means 360 is provided with a heater 367.
[0048]
Example 4
In the thermal transfer unit 460 according to the fourth embodiment shown in FIG. 24, copy rollers 461 and 461 are arranged before and after the heating block 466. The thermal transfer unit 460 is provided with a heater 467.
[0049]
Example 5
FIG. 25 shows a fifth embodiment of the present invention. The heating block 566 of the thermal transfer unit 560 according to the fifth embodiment and the copy roller 561 are separate bodies. The heating block 566 has a heater 567, and the copy roller 561 has a heater 567.
[0050]
Example 6
In the thermal transfer unit 660 according to the sixth embodiment shown in FIG. 26, heating blocks 666 are arranged before and after the copy roller 661 in the direction of arrow X1. The thermal transfer unit 660 has a heater 667.
[0051]
Example 7
FIG. 27 shows a seventh embodiment of the present invention. The thermal transfer unit 760 of the seventh embodiment has a copy roller 761 and a heater 767, and has a hot air blower 790 instead of the heating block 766. The hot air blower 790 supplies hot air to the peeling film and the anisotropic conductive film on the liquid crystal panel.
[0052]
Example 8
FIG. 28 shows an eighth embodiment of the present invention. The thermal transfer unit 860 according to the eighth embodiment includes a copy roller 861, a heater 867, and an infrared irradiation device 800 instead of a heating block. The infrared irradiation device 800 supplies heat to the peeling film and the anisotropic conductive film instead of the heating block.
[0053]
In the seventh embodiment shown in FIG. 27, the hot air blower 790 and the copy roller 761 can be arranged in the opposite directions with respect to the arrow X1. In the eighth embodiment shown in FIG. 28, the infrared irradiation device 800 and the copy roller 861 can be arranged at positions opposite to each other with respect to the arrow X1.
[0054]
In the above-described embodiments 2 to 8, not only the copy roller but also a heating block, a hot air blower, or an infrared irradiation device are used in combination with the copy roller. , Bonding time) can be widened, and a stable anisotropic conductive film ACF can be stuck. By performing the combination of the copy roller (transfer roller) and the heating block, no air bubbles enter between the anisotropic conductive film ACF and the liquid crystal panel, and the transfer of the clean anisotropic conductive film ACF without protrusion ( Attachment) is possible. Since the temperature profile of the anisotropic conductive film ACF is stabilized, the time for attaching the anisotropic conductive film ACF can be reduced.
[0055]
The present invention is not limited to the above embodiment.
For example, an anisotropic conductive film and a peeling film are provided as an adhesive film, and a glass plate of a liquid crystal panel is described as an example of an adherend. However, the present invention is not limited to this, and other types of adhesive films and adherends may be used. Also, the present invention can be applied.
[0056]
【The invention's effect】
As described above, according to the present invention, the release film can be peeled cleanly from the adhesive film, and the tact time can be shortened. Further, according to the present invention, the adhesive filmGlass plate or liquid crystal panel with terminalsThe thermal transfer can be performed stably with respect to
[Brief description of the drawings]
FIG. 1 is a diagram showing an adhesive film fixed-size sticking apparatus including a preferred embodiment 1 of an adhesive film peeling film peeling apparatus of the present invention.
FIG. 2 is an enlarged view showing a portion G of FIG. 1;
FIG. 3 is a view showing a tape path of the adhesive film of the adhesive film sizing device of FIG. 1;
FIG. 4 is an enlarged view of a layer structure of an adhesive film showing a portion P1 of FIG. 3;
FIG. 5 is a view showing a portion P2 of FIG. 3;
FIG. 6 is a diagram showing a portion P3 of FIG. 3;
FIG. 7 is a diagram showing a portion P4 of FIG. 3;
FIG. 8 is a diagram showing a state before an adhesive film is attached.
FIG. 9 is a diagram showing a state in which an adhesive film is started to be attached to a liquid crystal panel.
FIG. 10 is a diagram showing a state in which an anisotropic conductive film of an adhesive film is thermocompression-bonded, cooled, and a release film is peeled from the anisotropic conductive film.
FIG. 11 is a diagram showing a state in which thermal transfer has been completed.
FIG. 12 is a diagram showing a state in which a peeling film has been peeled off from an anisotropic conductive film.
FIG. 13 is a diagram showing the relationship between the distance between a peeling block and a copy roller, the temperature of an adhesive layer of an adhesive film, and the transferability of an anisotropic conductive film.
FIG. 14 is a diagram showing the relationship between the distance between a peeling block and a copy roller, the temperature of an adhesive layer of an adhesive film, and the transferability of an anisotropic conductive film.
FIG. 15 is a diagram showing the relationship between the distance between a peeling block and a copy roller, the temperature of an adhesive layer of an adhesive film, and the transferability of an anisotropic conductive film.
FIG. 16 is a view showing a preferred embodiment 2 of the film peeling device for peeling an adhesive film of the present invention.
FIG. 17 is a view showing a temperature profile of the embodiment of FIG. 16;
FIG. 18 is a diagram illustrating a thermal transfer unit shown in comparison with the second embodiment in FIG. 16;
19 is a view showing a temperature profile of the comparative example of FIG. 18 corresponding to the temperature profile of Example 2 of FIG. 17;
FIG. 20 is a diagram showing a more practical structure of the second embodiment.
FIG. 21 is a diagram for explaining the operation of the second embodiment shown in FIGS. 16 and 20;
FIG. 22 is a diagram showing a state of attachment of an anisotropic conductive film in Example 2 in FIGS. 16 and 20;
FIG. 23 is a diagram illustrating a thermal transfer unit according to a third embodiment of the present invention.
FIG. 24 is a diagram illustrating a thermal transfer unit according to a fourth embodiment of the present invention.
FIG. 25 is a diagram showing a thermal transfer unit according to a fifth embodiment of the present invention.
FIG. 26 is a diagram illustrating a thermal transfer unit according to a sixth embodiment of the present invention.
FIG. 27 is a diagram illustrating a thermal transfer unit according to a seventh embodiment of the present invention.
FIG. 28 is a diagram illustrating a thermal transfer unit according to an eighth embodiment of the present invention.
FIG. 29 is a view showing a conventional fixed-size sticking method of a reel-shaped shredding adhesive.
FIG. 30 is a view showing another conventional method of laminating a reel-shaped shredding adhesive.
[Explanation of symbols]
20 body
22 Adhesive film unwinding section
24 Peeling film winding unit
26 Cover tape winding section
30 Sticking robot
32 Cutter section
20 LCD panel(Glass plate with terminals, liquid crystal panel)
42 base
60, 260 thermal transfer means
61, 261 copy roller (also called thermal transfer roller, laminating roll, pressure roller)
70, 270 peeling means
71,271 Peeling block
71a part
71b, 271b Cooling means
266 Heating block
A Cooling distance (predetermined interval)
ST adhesive film
CT cover tape
TH release film
DD predetermined interval

Claims (21)

After the thermal transfer of the adhesive film having the release film to the glass plate having the terminals and bonding, the peeling device of the adhesive film peeling film for peeling the peeling film from the adhesive film,
Thermal transfer means for thermally transferring the adhesive film to a glass plate having the terminals ,
After the adhesive layer of the heat-transferred adhesive film is cooled to a softening point or lower, a peeling means arranged at a predetermined distance from the thermal transfer means to peel the peeling film from the adhesive film. With
The peeling device for peeling a film for peeling an adhesive film, wherein the peeling means includes a cooling means for cooling the peeling means when the peeling film is peeled from the adhesive film to cool the adhesive film. After peeling the adhesive film having a peeling film to the liquid crystal panel by thermal transfer and bonding, the peeling device of the peeling film of the adhesive film for peeling the peeling film from the adhesive film,
Thermal transfer means for thermally transferring the adhesive film to the liquid crystal panel,
After the adhesive layer of the heat-transferred adhesive film is cooled to a softening point or lower, a peeling means arranged at a predetermined distance from the thermal transfer means to peel the peeling film from the adhesive film. With
The peeling device for peeling a film for peeling an adhesive film, wherein the peeling means includes a cooling means for cooling the peeling means when the peeling film is peeled from the adhesive film to cool the adhesive film. 2. The peeling device for a peeling film for an adhesive film according to claim 1, wherein the thermal transfer unit and the peeling unit are arranged between a winding portion of the adhesive film and a winding portion of the peeling film. 3. 4. The transfer device according to claim 1, further comprising a transfer unit configured to move the thermal transfer unit and the peeling unit at the predetermined interval along a direction in which the adhesive film is bonded to the glass plate having the terminals. 5. Film peeling device for peeling adhesive film. The peeling device for a film for peeling an adhesive film according to claim 1 or 3, wherein the thermal transfer unit has a pressure roller. The peeling device for a film for peeling an adhesive film according to claim 1 or 3, wherein the peeling means is a block or a roller. The peeling device of a film for peeling an adhesive film according to claim 1, wherein the adhesive film includes an anisotropic conductive film. The peeling device for a film for peeling an adhesive film according to claim 1 or 3, wherein the adhesive film is a belt-shaped film. After the adhesive film is thermally transferred and bonded to a glass plate having terminals, a method of peeling the adhesive film from the adhesive film for peeling the peeling film from the adhesive film,
  The adhesive film is thermally transferred to a glass plate having the terminals by thermal transfer means,
  The temperature of the adhesive of the adhesive film is cooled to a temperature equal to or lower than the softening point of the adhesive by a cooling means provided in a peeling means arranged at a predetermined distance from the thermal transfer means, and the bonding is performed. A method for peeling a film for peeling an adhesive film, comprising peeling the film for peeling from the film. The method according to claim 9, wherein the adhesive film includes an anisotropic conductive film. The method according to claim 9, wherein the adhesive film is a strip-shaped film. The method according to claim 9, wherein the adhesive film is cooled by a cooling liquid or a cooling gas. An adhesive film having a release film is heated on a glass plate having terminals. After transferring and bonding, a peeling device for a peeling film of the adhesive film for peeling the peeling film from the adhesive film,
Thermal transfer means comprising a pressure roller and a heating block for thermally transferring the adhesive film to a glass plate having the terminals,
After cooling the heat-transferred adhesive layer of the adhesive film to a softening point or lower by a cooling means provided in the peeling means, a predetermined amount of the heat transfer means is peeled off from the adhesive film in order to peel the peeling film from the adhesive film. A peeling device for a film for peeling an adhesive film, comprising: peeling means arranged at intervals. 14. The peeling device for a peeling film for an adhesive film according to claim 13, wherein the thermal transfer unit and the peeling unit are arranged between a winding portion of the adhesive film and a winding portion of the peeling film. 14. The peeling-off of the adhesive film according to claim 13, further comprising a transporting unit capable of moving the thermal transfer unit and the peeling unit at the predetermined interval along a direction in which the adhesive film is bonded to the glass plate having the terminals. Film peeling equipment. 14. The peeling device for a film for peeling an adhesive film according to claim 13, wherein the heating block of the thermal transfer unit is disposed between the two pressure rollers. 14. The film peeling device for peeling an adhesive film according to claim 13, wherein the pressure roller of the thermal transfer unit is disposed between the heating blocks. 14. The peeling device for a film for peeling an adhesive film according to claim 13, wherein the heating block and the pressure roller of the thermal transfer unit are separate bodies. 14. The peeling apparatus for peeling an adhesive film according to claim 13, wherein the heating block of the thermal transfer unit includes a hot air blower for supplying hot air. The peeling device for a film for peeling an adhesive film according to claim 13, wherein the heating block of the thermal transfer unit is an infrared irradiation device. 14. The peeling device for peeling an adhesive film according to claim 13, wherein the heating block of the thermal transfer unit is separated from the peeling film by a predetermined distance.

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