JP5295030B2 - Molding equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a molding apparatus preventing adhesion of a heated resin sheet to a surface of a mold. <P>SOLUTION: The molding apparatus includes the first and second molds (1 and 2) opposite to each other. Substrates (3a and 3b) are laid on the mold surface of the first mold (1), and a resin sheet (5) softened by heating is arranged between the first and second molds. In the first mold (1), a heating means (13) is embedded near the mold surface in contact with the substrates, and a cooling means is embedded near the mold surface (10a) not in contact with the substrates. During molding, since the substrates are heated to appropriate temperatures by the heating means (13), the resin sheet softened by heating is adhered to the surface of the substrates. On the other hand, since a part of the resin sheet in contact with the mold surface of the mold is cooled by the molds, the adhesion of the part decreases so as not to adhere to the mold surface of the molds. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

The present invention relates to a molding apparatus, and more particularly to a molding apparatus in which a resin sheet to be molded is prevented from sticking to a mold.

  A molding method in which a base material is placed on a mold, a heat-softened resin sheet is placed thereon, and the resin sheet is molded on the surface of the base material by clamping or vacuum forming has been put into practical use. In this molding method, in order to adhere the resin sheet onto the surface of the base material, an adhesive is applied to the surface of the base material, and a heat-softened resin sheet is placed thereon to perform mold clamping. However, if the adhesive is applied on the surface of the substrate prior to the molding of the resin sheet, there is a disadvantage that the cost of the adhesive is increased and a step of applying the adhesive is also required, which increases the manufacturing cost.

In order to eliminate the above-mentioned drawbacks, a method of forming using the adhesive performance of a heated resin sheet is used. For example, when polypropylene foam (PPF) pre-coated with an adhesive is used as the resin sheet, heating the PPF to a temperature exceeding the softening point activates the adhesiveness, allowing PPF to be molded on the substrate. It is.

  However, there is a region where the mold surface of the molding die does not come into contact with the base material. Therefore, in the area where the base material does not exist in the mold surface of the mold, the heat-softened resin sheet comes into direct contact with the mold surface when the mold is clamped, causing a problem that the resin sheet sticks to the mold. To do.

  As another molding method, a method of vacuum molding while controlling the temperature in the vicinity of the cavity surface of the mold is known (for example, see Patent Document 1). In this known vacuum forming technique, between two molds facing each other, a cooling cold pipe and a heating hot pipe are alternately provided in the vicinity of the mold surface where the cavity is formed, thereby softening the heating. The mold is heated by the hot pipe until the resin sheet pressed against the mold, and the mold is cooled by the cold pipe as the vacuum forming starts.

JP 2007-182035 A

  As described above, the method of forming a resin sheet on the substrate surface using the adhesive performance of the heated resin sheet has an advantage that the manufacturing cost is low. However, since there is a region where the substrate does not exist on the mold surface of the mold, the heated resin sheet directly contacts the mold surface on such a mold surface portion, so that there is a problem that the resin sheet sticks. .

Moreover, in order to eliminate such a malfunction, even if it uses the metal mold | die of patent document 1, since the whole surface of a metal mold | die is heated and cooled uniformly, sticking of a resin sheet is prevented effectively. It is not possible.

  An object of the present invention is to realize a molding apparatus in which sticking of a heated resin sheet to a mold surface is prevented.

  A molding apparatus according to the present invention has first and second molds facing each other, a base is disposed on a mold surface of the first mold, and the first mold and the second mold In the molding apparatus in which a molded article including the base material is manufactured by placing a heat-softened resin sheet between the two and clamping the mold, the first mold has a mold surface in contact with the base material. The heating means is embedded in the vicinity, and the cooling means is embedded in the vicinity of the mold surface that does not contact the substrate.

  In the present invention, the heating means and the cooling means are embedded in the first mold on which the substrate is mounted. The heating means acts to heat the mounted substrate, and the cooling means acts to cool the resin sheet in contact with the mold surface.

Thus, by forming a temperature distribution corresponding to the substrate to be mounted on the mold surface of the mold to which the substrate is mounted, the substrate is heated at the time of molding, and the resin sheet is bonded to the substrate. Is promoted.

On the other hand, since the resin sheet that is in direct contact with the mold surface of the mold is cooled by the mold when the mold is clamped, the adhesiveness of the resin sheet is reduced and sticking to the mold is prevented.

  A preferred embodiment of the molding apparatus according to the present invention is characterized in that the first mold has a nest contacting the base material, and the nest is provided with the heating means. In this way, if the mold on which the base material is mounted has a nested structure, the nesting can be provided with a heating means, and the formation of a temperature distribution corresponding to the shape of the base material to be molded and the like becomes easy.

  According to the present invention, the heating means and the cooling means are provided in the mold on which the substrate is mounted, and the temperature distribution corresponding to the shape of the substrate is formed on the mold surface of the mold. Is adhered to the surface of the heated substrate. On the other hand, the portion of the resin sheet in direct contact with the mold surface of the resin sheet is cooled by the mold, so that the resin sheet is effectively prevented from sticking to the mold.

It is sectional drawing which shows the state before shaping | molding of the shaping | molding apparatus which concerns on this invention. It is sectional drawing which shows the state at the time of shaping | molding of the shaping | molding apparatus.

  FIG. 1 is a view showing an example of a molding apparatus according to the present invention. The molding apparatus has first and second molds 1 and 2 facing each other. On the mold surface of the first mold (lower mold) 1, two base materials 3a and 3b are arranged. In this example, the base materials 3a and 3b are made of a hard resin material of polypropylene.

  Between the 1st metal mold | die 1 and the 2nd metal mold | die (upper mold | type) 2, the resin sheet 5 hold | gripped by the holding frame 4 and heat-softened is arrange | positioned. In this example, a resin sheet (TPO / PPF) in which an outer skin (TPO) and a polypropylene foam (PPF) are laminated is used as the resin sheet 5, and the resin sheet 5 is based on the adhesiveness of heat-softened PPF. Molding is performed on the materials 3a and 3b to produce a molded product including the base material.

  The first mold 1 has a base mold 10 and two inserts 11 and 12 attached to the base mold 10. The base material 3 a is disposed on the mold surface of the insert 11, and the base material 3 b is disposed on the mold surface of the insert 12. Therefore, the mold surfaces of the inserts 11 and 12 are in contact only with the back surfaces of the base materials 3a and 3b. On the other hand, since there is no base material on the mold surface 10a of the base mold 10, the resin sheet 5 comes into contact with the mold surface 10a of the base mold during molding.

  A plurality of heaters 13 functioning as heating means for heating the base material are embedded in the vicinity of the mold surface of the nest 11, and a plurality of heaters 13 are also embedded in the vicinity of the mold surface of the nest 12. These heaters 13 do not serve to heat the base material to a high temperature, but heat the base material so that the adhesiveness of the resin sheet is satisfactorily exhibited at the time of molding. Heat to keep warm. Therefore, at the time of shaping | molding, the base materials 3a and 3b are maintained from the heat | fever which generate | occur | produces from the heater embed | buried under the nest | insert and is conducted through the mold surface with the nest | insert.

  In the vicinity of the mold surface 10a of the base mold 10, a cooling means 14 for cooling the mold surface 10a is provided. For example, the cooling means is constituted by a cold pipe through which a cold fluid flows. Therefore, the base material of the mold surface of the mold 1 is not disposed, and the region where the resin sheet directly contacts when the mold is clamped is locally cooled.

  Insulating plates 15 and 16 are disposed between the bottom of each insert 11 and 12 and the base mold 10, respectively, to prevent conduction of heat from the insert to the base mold. Further, a clearance is provided between the side portion of the insert 11 and the base mold 10 and between the side portion of the insert 12 and the base mold to form an air layer. In this way, by disposing a heat insulating material around the nest and forming an air layer, the heat generated by the nest is prevented from being conducted to the base mold, and the mold surface that contacts the resin sheet of the base mold Is prevented from rising in temperature.

  The second mold 2 is constituted by a vacuum forming mold. That is, a vacuum suction hole is formed over the entire mold surface of the second mold 2, and the vacuum suction hole is connected to a vacuum pump via a vacuum pulling tube (not shown). Further, a fine concave and convex shape is formed on the mold surface of the second mold, and is transferred to the resin sheet 5 at the time of molding.

  At the time of molding, the base materials 3 a and 3 b are mounted on the first mold 1. These base materials are heated by the heater 13 embedded in the nest of the first mold and maintained at a predetermined temperature. On the other hand, the region of the mold surface where the base material of the first mold does not exist is cooled by the cooling means 14 and maintained at a temperature lower than the surroundings. Subsequently, the heat-softened resin sheet 5 is disposed between the first mold 1 and the second mold 2.

  Thereafter, the second mold is lowered to clamp the first mold and the second mold. Subsequently, evacuation is started. At this time, since the base materials 3a and 3b are heated by the heater 14, the portion of the heat-softened resin sheet 5 that comes into contact with the surface of the base material adheres well to the surfaces of the base materials 3a and 3b. On the other hand, since the mold surface 1a of the first mold is cooled by the cooling means, the portion in contact with the mold surface 1a of the resin sheet is cooled by the first mold, and the adhesiveness of the resin sheet is greatly increased. It is lowered and does not adhere to the mold surfaces of the first and second molds. Further, during molding, the fine concave and convex shape formed on the mold surface of the second mold is transferred to the surface of the resin sheet 5 by vacuum suction of the second mold.

DESCRIPTION OF SYMBOLS 1 1st metal mold | die 2 2nd metal mold | die 3a, 3b Base material 4 Holding frame 5 Resin sheet 10 Base metal mold | die 11,12 Nest 13 Heater 14 Cooling means 15,16 Heat insulation plate

Claims (2)

Resin having first and second molds facing each other, a base material disposed on the mold surface of the first mold, and heat softened between the first mold and the second mold In a molding apparatus in which a molded article including the base material is manufactured by arranging and clamping a sheet,
The first mold has a nest that comes into contact with the base material , a heating unit is embedded in the nest , and a cooling unit is embedded in the vicinity of the mold surface that does not contact the base material. Forming equipment.   2. The molding apparatus according to claim 1, wherein the second mold is a vacuum mold having a concave and convex shape formed on a mold surface, and the concave and convex shape formed on the mold surface of the second mold is A molding device, wherein the molding device is transferred to the resin sheet.

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