KR100585968B1 - Method of adhering a buffer storage pack for keeping warm/cool - Google Patents

Method of adhering a buffer storage pack for keeping warm/cool Download PDF

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Publication number
KR100585968B1
KR100585968B1 KR1020040085188A KR20040085188A KR100585968B1 KR 100585968 B1 KR100585968 B1 KR 100585968B1 KR 1020040085188 A KR1020040085188 A KR 1020040085188A KR 20040085188 A KR20040085188 A KR 20040085188A KR 100585968 B1 KR100585968 B1 KR 100585968B1
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South Korea
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resin film
high temperature
heat
heater
sealing surface
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KR1020040085188A
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Korean (ko)
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KR20060036496A (en
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금용수
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금용수
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B70/00—Making flexible containers, e.g. envelopes or bags
    • B31B70/60—Uniting opposed surfaces or edges; Taping
    • B31B70/64—Uniting opposed surfaces or edges; Taping by applying heat or pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B70/00—Making flexible containers, e.g. envelopes or bags
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B70/00—Making flexible containers, e.g. envelopes or bags
    • B31B70/74—Auxiliary operations
    • B31B70/76—Moistening; Drying; Cooling; Heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B2150/00—Flexible containers made from sheets or blanks, e.g. from flattened tubes
    • B31B2150/001—Flexible containers made from sheets or blanks, e.g. from flattened tubes with square or cross bottom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B2160/00—Shape of flexible containers
    • B31B2160/10—Shape of flexible containers rectangular and flat, i.e. without structural provision for thickness of contents

Abstract

본 발명은 두꺼운 보온재나 에어캡으로 봉투를 제조할시에 열접착식으로 부착할시에 접착면이 떨어지지 않도록 견고하게 접착시킬 수 있는 완충 보온 보냉팩의 접착방법에 관한 것으로, 열가열 접착될 수지필름 재료를 고열히터 절단기로 잘라 재단하는 단계와, 고열히터 절단기에 의해 재단된 수지필름을 합지가 되도록 반으로 접는 단계와, 접혀진 수지필름의 부착될 시일링면 부위를 예리한 핀을 이용해 다수개의 핀홀이 뚫리도록 형성하는 단계와, 접혀진 수지필름에 다수개의 핀홀이 뚫려진 시일링면을 미열히터를 이용해 가압하면서 두께를 줄이는 단계와, 미열히터에 의해 눌려진 수지필름의 시일링면을 고열히터로 가압하면서 접착시키는 단계와, 고열히터에 의해 눌려진 시일링면을 급속하게 냉각시키는 단계로 구성된 특징이 있다.The present invention relates to a method of adhering a buffered thermal insulation pack that can be firmly adhered so that the adhesive surface does not fall when attached to the heat-adhesive method when manufacturing an envelope with a thick heat insulating material or an air cap, and a resin film to be heat-heat-bonded. Cutting and cutting the material with a high temperature heater cutting machine, folding the resin film cut by the high temperature heater cutting machine in half so as to be laminated, and a plurality of pinholes are drilled using sharp pins on the sealing surface to be attached to the folded resin film. Forming a thin film, pressing the sealing surface having a plurality of pinholes into the folded resin film by using a heat heater, and reducing the thickness; and bonding the sealing surface of the resin film pressed by the heat heater with a high temperature heater. And a step of rapidly cooling the sealing surface pressed by the high temperature heater.

발포성 수지필름, 핀Effervescent resin film, pin

Description

완충 보온 보냉팩의 접착방법{METHOD OF ADHERING A BUFFER STORAGE PACK FOR KEEPING WARM/COOL}Adhesion method of buffer thermal insulation pack {METHOD OF ADHERING A BUFFER STORAGE PACK FOR KEEPING WARM / COOL}

도 1 의 (a)∼(c)는 종래의 보온 보냉팩의 접착방법을 나타내는 도면.Figure 1 (a) to (c) is a view showing a bonding method of a conventional thermal insulation cold pack.

도 2 의 (a)∼(f)는 본 발명의 완충 보온 보냉팩의 접착방법의 단계를 나타내는 도면.Figure 2 (a) to (f) is a view showing the steps of the bonding method of the buffered thermal insulation pack of the present invention.

-도면의 주요부분에 대한 부호의 설명-Explanation of symbols on the main parts of the drawing

20: 수지필름 32: 핀20: resin film 32: pin

30: 프레스 22a,22b: 시일링면30: press 22a, 22b: sealing surface

26: 핀홀 40: 미열히터26: pinhole 40: heat heater

50: 고열히터 60: 냉각판 50: high temperature heater 60: cooling plate

본 발명은 완충 보온 보냉팩의 접착방법에 관한 것으로, 더욱 상세하게는 두꺼운 보온재나 에어캡으로 봉투를 제조할시에 열접착식으로 부착할시에 접착면이 떨어지지 않도록 견고하게 접착시킬 수 있는 완충 보온 보냉팩의 접착방법에 관한 것이다.The present invention relates to a method of adhering a buffered thermal insulation pack, and more particularly, a buffered thermal insulation that can be firmly adhered so that the adhesive surface does not fall off when a heat-adhesive adhesive is applied during the manufacture of a bag with a thick thermal insulation material or an air cap. It relates to a method of bonding the cold pack.

일반적으로, 종래에 사용되고 있는 보온 보냉팩의 발포성 수지필름을 도 1 의 (a)와 같이 직사각형으로 재단한다.In general, the foamable resin film of the thermal insulation cold pack is conventionally cut into a rectangle as shown in Fig. 1 (a).

도 1 의 (a)와 같이 발포성 수지 필름(1)을 재단한 후에는 도 1 의 (b)의 도시된 바와 같이 접은 후에 접혀진 길이방향의 양면을 도 1 의 (c)와 같이 양 라인에 시일링 접착 라인(2a),(2b)이 접착면이 형성되면서 봉투를 제조하고 있다.After cutting the foamable resin film 1 as shown in FIG. The ring bonding lines 2a and 2b form an envelope, with the adhesive surface formed.

이때에 형성되는 발포성 수지 필름(1)의 시일링 접착라인(2a),(2b)은 가열절단기를 이용해 커팅하면서 잘려진 면이 부착되는 것으로 부착면이 얇은 라인형태로 끝단면부분만 부착되어 있기 때문에 쉽게 터지는 문제점이 있다.At this time, the sealing adhesive lines 2a and 2b of the expandable resin film 1 formed at this time are attached to the cut surface while cutting using a heat cutter. There is a problem that pops easily.

그러나, 발포성 필름 수지 필름(1) 또는 에어캡 수지 필름 등으로 이루어진 재료는 보온 보냉 효과를 위해 두덮게 형성되어 있기 때문에 프레스를 이용해 열접착시킬시에 수지 필름(1)의 두께에 의해 제대로 눌려지지 않아 접착되는 부위가 제대로 달라 붙지 않는 문제점이 있다. However, since the material made of the expandable film resin film 1 or the air cap resin film is formed to cover the thermal insulation effect, it is not properly pressed by the thickness of the resin film 1 when thermally bonding using a press. There is a problem that does not adhere properly to the bonded area.

상기와 같이 발포성 수지 필름(1) 등이 두꺼운 문제로 인해 제대로 접착되지 않는 문제점도 많이 발생되어 불량품이 많이 발생되고 있다.As described above, the problem that the foamable resin film 1 is not properly adhered due to a thick problem is generated, and a lot of defective products are generated.

이러한 문제는 봉투 제조시에 불량품을 다량으로 발생시키므로 불량품이 증가되어 단가를 상승시키는 문제점을 발생시킬 뿐만 아니라, 완성된 제품의 시일링 접착라인(2a),(2b)은 열접착된 부위가 완전하게 붙지 않은 제품들이 많아 사용중에 터져 보관중인 제품이 쏟아져 나오거나 터진 부분으로 열기 또는 온기가 배출되 보온 보냉 역할을 제대로 하지 못하는 문제점이 발생되고 있다.This problem causes a large amount of defective products during the manufacture of the envelope, so that not only does the defective products increase, resulting in a problem of raising the unit cost, but also the sealing adhesive lines 2a and 2b of the finished product are completely heat-bonded. There are a lot of products that do not stick to the product during use, the product that is stored in the pouring or bursting heat or heat to the rupture part is a problem that does not function properly to keep warm.

따라서, 본 발명은 상기와 같은 종래의 문제점을 감안하여 창출된 것으로, 그목적은 두꺼운 보온재나 에어캡으로 봉투를 제조할시에 열접착식으로 부착할시에 견고하게 부착시킬 수 있는 완충 보온 보냉팩의 접착방법을 제공함에 있다. Accordingly, the present invention has been made in view of the above-described conventional problems, and its purpose is a buffered thermal insulation pack that can be firmly attached when thermally adhesively attached when manufacturing an envelope with a thick thermal insulation material or an air cap. To provide a method of bonding.

상기와 같은 본 발명의 목적을 달성하기 위해, 완충 보온 보냉팩의 접착방법은, 열가열 접착될 수지 필름 재료를 고열히터 절단기로 자르는 단계와, 고열히터 절단기에 의해 절단된 수지 필름을 반으로 접는 단계와, 접혀진 수지필름의 부착될 시일링면 부위를 예리한 핀을 이용해 다수개의 핀홀이 뚫리도록 형성하는 단계와, 접혀진 수지필름에 다수개의 핀홀이 뚫려진 시일링면을 미열히터를 이용해 눌러 두께를 줄이는 단계와, 미열히터에 의해 눌려진 수지필름의 시일링면을 고열히터로 가압하면서 접착시키는 단계와, 고열히터에 의해 눌려진 시일링면을 급속하게 냉각시키는 단계로 구성된다.In order to achieve the object of the present invention as described above, the bonding method of the buffered thermal insulation pack, the step of cutting the resin film material to be heat-heat bonded with a high temperature heater cutter, and folding the resin film cut by the high temperature heater cutter in half And forming a plurality of pinholes on the sealing surface to be attached to the folded resin film by using a sharp pin, and pressing a sealing surface on which the plurality of pinholes are drilled on the folded resin film by using a heat heater to reduce the thickness. And adhering the sealing surface of the resin film pressed by the low heat heater to pressurize with the high heat heater, and rapidly cooling the sealing surface pressed by the high heat heater.

상기와 같이 구성된 본 발명의 완충 보온 보냉팩의 접착방법을 첨부된 도면을 참조하여 아래와 같이 구체적으로 설명한다.With reference to the accompanying drawings, a method of bonding the buffered thermal insulation pack of the present invention configured as described above will be described in detail below.

도 2 의 (a)∼(f)는 본 발명의 완충 보온 보냉팩의 접착방법의 단계를 나타내는 도면이다.2 (a) to (f) is a view showing the steps of the bonding method of the buffered thermal insulation cold pack of the present invention.

본 발명의 완충 보온 보냉팩의 접착방법은, 도 2 의 (a)부분과 같이 발포성 수지 필름 또는 에어캡으로 이루어진 수지 필름을 절단용 고열히터로 규격에 맞게 절단한다.In the bonding method of the buffered thermal insulation pack of the present invention, as shown in part (a) of Figure 2, the resin film made of a foamable resin film or an air cap is cut to a standard with a high temperature heater for cutting.

도 2 의 (b) 와 같이 재단된 수지 필름(20)을 이용해 봉투를 만들기 위해 반 으로 접은 후에는 도 2 의 (c) 와 같이 예리한 핀(32)이 다수개 형성된 프레스(30)를 이용해 눌러서 수지필름(20)의 시일링면(22a),(22b)에 다수개의 핀홀(26)을 형성시킨다.After folding in half to make an envelope using the cut resin film 20 as shown in (b) of FIG. A plurality of pinholes 26 are formed in the sealing surfaces 22a and 22b of the resin film 20.

상기와 같이 발포성 수지필름 또는 에어캡을 갖는 수지필름(20) 등의 시일링면(22a),(22b)에 핀(32)을 이용해 누르게 되면 다수개의 핀홀(26)이 형성되는데 이때의 형성되는 핀홀은 발포성 수지 필름층에 형성된 공기층과 에어캡을 터뜨리는 역할을 하게되는 특징이 있다.As described above, a plurality of pinholes 26 are formed when the pins 32 are pressed on the sealing surfaces 22a and 22b of the resin film 20 having the expandable resin film or the air cap. The air layer and the air cap formed on the foamable resin film layer is characterized in that it serves to burst.

특히, 공기층을 갖는 에어캡 수지 필름은 도시하지는 않았지만, 공기층으로 인해 가열 압착하여 접착시 쉽게 눌려지지 않기 때문에 맞닿아 붙는 시일면의 공기층부분을 미세한 핀(32)으로 터뜨린 후에 열가압착을 하면 쉽게 눌려지면서 부착된다.In particular, although the air cap resin film having the air layer is not shown, since it is not easily pressed during adhesion due to the heat compression due to the air layer, the air layer portion of the seal surface that is in contact with the air is pressed with a fine pin 32, and then easily pressed. Attached to the building.

합지되는 수지필름(20)의 시일링면(22a),(22b)에 미세한 핀(32)에 의해 다수의 핀홀(26)이 형성되며, 도 2 의 (d)와 같이 미열히터(40)를 이용해 누르게 되면 수지필름(20)의 시일링면(22a),(22b)에 형성된 다수의 핀홀(26)을 통해 공기가 빠져 나가면서 두께가 줄어든다.A plurality of pinholes 26 are formed on the sealing surfaces 22a and 22b of the resin film 20 to be laminated by the fine pins 32, and as shown in FIG. When pressed, the thickness of the air is reduced through the plurality of pinholes 26 formed in the sealing surfaces 22a and 22b of the resin film 20.

이때에 미열히터(20)의 온도는 145℃∼155℃의 온도범위로 하는 것이 그 두께를 일차적으로 줄일 수 있는 특징이 있다. At this time, the temperature of the unheated heater 20 is characterized in that the thickness can be primarily reduced to the temperature range of 145 ℃ to 155 ℃.

상기와 같이 수지필름(20)의 시일링면(22a),(22b)에 형성된 핀홀(26)을 통해 공기가 빠지면서 두께가 줄어들게 되면, 도 2 의 (e)와 같이, 195℃∼205℃의 범위의 고열히터(50)를 이용해 강하게 누르면서 시일링면(22a),(22b)을 열접착시킨다.As described above, when the thickness decreases while air is drawn out through the pinholes 26 formed in the sealing surfaces 22a and 22b of the resin film 20, as shown in FIG. While pressing strongly using the high temperature heater 50 of the sealing surfaces 22a and 22b, the heat bonding is carried out.

상기 고열히터(50)의 온도 범위가 상기 온도범위보다 낮으면 접착성이 떨어지며, 상기 온도보다 높으면 수지필름(20)이 눌러녹아버리는 문제점이 발생할 수 있기 때문에 온도범위내에서 실시하는 것이 바람직하다.When the temperature range of the high temperature heater 50 is lower than the temperature range, the adhesion is inferior, and when the temperature is higher than the temperature, the resin film 20 may be pressed and melted.

이때에 가열되는 열은 수지필름(20)의 맞붙는 표면이 열에 의해 서로 녹아서 눌러 붙도록 가압시키면서 붙이기 때문에 다른 접착제를 필요로 하지 않는다.At this time, the heat to be heated does not require another adhesive because the bonding surfaces of the resin film 20 are pressed while being melted and pressed together by heat.

이와 같이 고열히터(50)를 이용해 수지필름(20)의 시일링면(22a),(22b)을 열접착에 의해 부착시킬시, 시일링면(22a),(22b)에 형성된 다수의 핀홀(26)로 인해 도시하지는 않았지만 발포시에 발생된 공기층 등이 터져 있으므로 눌려질시에 바람이 빠지기 때문에 눌려지는 만큼 더 열접착이 잘되는 특징이 있다.As described above, when the sealing surfaces 22a and 22b of the resin film 20 are attached by thermal bonding using the high temperature heater 50, a plurality of pinholes 26 formed in the sealing surfaces 22a and 22b are used. Although not shown due to the air layer generated during foaming, etc., because it is blown off because the air is pressed when pressed, there is a feature that is more thermally bonded as it is pressed.

또한, 고열히터(50)를 이용해 가압되면서 열접착된 수지필름(20)의 시일링면(22a),(22b)은 발포성으로 이루어져 있기때문에 약간의 탄성 복원력이 발생되면서 부착된 부위가 떨어질 수 있기 때문에 고열히터(50)에 의해 가해진 열을 냉각판(60) 등을 이용해 급속하게 식혀주면 접착부위가 잔존된 열에 의해 늘어지지 않고 접착부위가 식으면서 접착력이 높아진다.In addition, since the sealing surfaces 22a and 22b of the resin film 20, which are thermally bonded while being pressed using the high temperature heater 50, are made of foam, the attached portion may fall while generating some elastic restoring force. When the heat applied by the high temperature heater 50 is rapidly cooled by using the cooling plate 60 or the like, the adhesive force is increased while the adhesive part is cooled by the remaining heat rather than being slumped by the remaining heat.

상기 냉각판(60)의 온도는 65℃∼75℃의 온도범위 내에서는 냉각시키는 것이 접착효율이 높다.The cooling efficiency of the cooling plate 60 is high in the temperature range of 65 ° C to 75 ° C.

상기와 같은 접착 단계를 연속적으로 이루어지도록 하면 수지필름(20)의 시일링면(22a),(22b)이 밀착되면서 부착시킬 수 있어 불량품을 현저하게 줄일 수 있을 뿐만 아니라, 대량생산이 용이하다.When the adhesion step is performed continuously, the sealing surfaces 22a and 22b of the resin film 20 can be adhered to each other while being in close contact with each other, thereby significantly reducing defective products and facilitating mass production.

이와 같이 본 발명은 핀(32)을 이용해 수지필름(20)의 접착되는 시일링면 (22a),(22b)에 다수의 핀홀(26)을 형성시켜 가열 압착하여 부착시키기 때문에 고열히터(50)에 의해 가압하면서 수지필름(20)이 쉽게 눌려지기 때문에 두꺼워져도 용이하게 부착시킬 수 있다.As described above, the present invention forms a plurality of pinholes 26 on the sealing surfaces 22a and 22b of the resin film 20 by using the fins 32 and heat-presses them to attach them to the high temperature heater 50. Since the resin film 20 is easily pressed while pressurizing, it can attach easily even if it becomes thick.

따라서, 수지필름(2)의 두께층이 두꺼운 것을 사용할 수 있어 보온 보냉의 효율을 높일 수 있는 특징이 있다.Therefore, a thick layer of the resin film 2 can be used, and there is a feature that can increase the efficiency of thermal insulation cold storage.

상기와 같은 본 발명의 완충 보온 보냉팩의 접착방법에 의해 두꺼운 원단의 수지필름을 이용할시 용이하게 접착시킬 수 있을 뿐만 아니라, 접착 부위를 더욱 견고하게 부착시킬 수 있는 효과가 있다.By the method of bonding the buffered thermal insulation pack of the present invention as described above, not only can be easily adhered when using a resin film of a thick fabric, there is an effect that can be more firmly attached to the adhesive site.

상기 핀을 이용해 시일링면에 핀홀을 형성시킨 후에 가열압착시켜 부착시키기 때문에 접착되는 부위가 견고하게 부착되므로 불량품을 현저하게 낮출수 있어 제조단가를 낮출 수 있는 효과가 있다.
Since a pinhole is formed on the sealing surface using the pin and then heat-compressed to attach, the part to be bonded is firmly attached, thereby significantly lowering the defective product, thereby reducing the manufacturing cost.

Claims (3)

완충 보온 보냉팩의 접착방법에 있어서,In the bonding method of the buffer thermal insulation pack, 열가열 접착될 수지필름 재료를 고열히터 절단기로 잘라 재단하는 단계와,Cutting and cutting the resin film material to be thermally heated with a high temperature heater cutter; 고열히터 절단기에 의해 재단된 수지필름을 합지가 되도록 반으로 접는 단계와,Folding the resin film cut by the high temperature heater cutter in half so as to be laminated, 접혀진 수지 필름의 부착될 시일링면 부위를 예리한 핀을 이용해 다수개의 핀홀이 뚫리도록 형성하는 단계와,Forming a portion of the sealing surface to be attached to the folded resin film so that a plurality of pinholes are drilled using a sharp pin; 접혀진 수지필름에 다수개의 핀홀이 뚫려진 시일링면을 미열히터를 이용해 가압하면서 두께를 줄이는 단계와,Reducing the thickness while pressing a sealing surface having a plurality of pin holes drilled in the folded resin film using a mild heat heater; 미열히터에 의해 눌려진 수지필름의 시일링면을 고열히터로 가압하면서 접착시키는 단계와,Adhering the sealing surface of the resin film pressed by the subheater while pressing with a high temperature heater; 고열히터에 의해 눌려진 시일링면을 냉각판을 이용해 냉각시키는 단계로 이루어진 것을 특징으로 하는 완충 보온 보냉팩의 접착방법.A method of adhering a buffered thermal insulation pack comprising: cooling a sealing surface pressed by a high temperature heater using a cooling plate. 제 1 항에 있어서, 수지필름에 형성된 다수개의 핀홀은, 프레스 평판에 다수개의 핀을 형성시키거나, 또는 롤러의 외주면에 다수개의 핀을 형성시켜 이루어진 것을 특징으로 하는 완충 보온 보냉팩의 접착방법.The method of claim 1, wherein the plurality of pinholes formed in the resin film are formed by forming a plurality of pins on the press plate or by forming a plurality of pins on the outer circumferential surface of the roller. 제 1 항에 있어서, 상기 미열히터의 온도는 145℃∼155℃이고, 고열히터의 온도는 195℃∼205℃이고, 냉각판의 온도는 65℃∼75℃인 것을 특징으로 하는 완충 보온 보냉팩의 접착방법. The method of claim 1, wherein the temperature of the unheated heater is 145 ° C to 155 ° C, the temperature of the high temperature heater is 195 ° C to 205 ° C, the temperature of the cold plate is 65 ° C to 75 ° C Method of adhesion.
KR1020040085188A 2004-10-25 2004-10-25 Method of adhering a buffer storage pack for keeping warm/cool KR100585968B1 (en)

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Publication number Priority date Publication date Assignee Title
JPH0691787A (en) * 1992-09-09 1994-04-05 Toppan Printing Co Ltd Heat sealing method
JPH1170619A (en) 1997-08-29 1999-03-16 Dainippon Printing Co Ltd Packing bag for rice or the like
JP2002053145A (en) 2000-08-09 2002-02-19 Kishimoto Sangyo Co Ltd Plastic sheet bag for sealing article and manufacturing method thereof
KR20020067374A (en) * 2001-02-16 2002-08-22 화인.에프.에이 주식회사 Manufacture device of non-p.v.c bag

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Publication number Priority date Publication date Assignee Title
JPH0691787A (en) * 1992-09-09 1994-04-05 Toppan Printing Co Ltd Heat sealing method
JPH1170619A (en) 1997-08-29 1999-03-16 Dainippon Printing Co Ltd Packing bag for rice or the like
JP2002053145A (en) 2000-08-09 2002-02-19 Kishimoto Sangyo Co Ltd Plastic sheet bag for sealing article and manufacturing method thereof
KR20020067374A (en) * 2001-02-16 2002-08-22 화인.에프.에이 주식회사 Manufacture device of non-p.v.c bag

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