JPS6331505Y2 - - Google Patents
Info
- Publication number
- JPS6331505Y2 JPS6331505Y2 JP12679082U JP12679082U JPS6331505Y2 JP S6331505 Y2 JPS6331505 Y2 JP S6331505Y2 JP 12679082 U JP12679082 U JP 12679082U JP 12679082 U JP12679082 U JP 12679082U JP S6331505 Y2 JPS6331505 Y2 JP S6331505Y2
- Authority
- JP
- Japan
- Prior art keywords
- hot
- adhesive layer
- melt adhesive
- metal foil
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 46
- 239000004831 Hot glue Substances 0.000 claims description 44
- 239000011888 foil Substances 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 239000012943 hotmelt Substances 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 17
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 この考案は面発熱体に関するものである。[Detailed explanation of the idea] [Industrial application field] This invention relates to a surface heating element.
従来の面発熱体は、図面に示すように、第１の
絶縁フイルム１の表面に第１のホツトメルト型接
着材層２で金属箔を貼着し、この金属箔にエツチ
ング処理を施して金属箔ヒータ回路３を形成した
後に金属箔ヒータ回路３の表面および第１のホツ
トメルト型接着材層２の露出面に第２のホツトメ
ルト型接着材層４で第２の絶縁フイルム５を貼着
している。
As shown in the drawing, a conventional surface heating element is made by pasting a metal foil on the surface of a first insulating film 1 with a first hot-melt adhesive layer 2, and etching the metal foil. After forming the heater circuit 3, a second insulating film 5 is attached to the surface of the metal foil heater circuit 3 and the exposed surface of the first hot-melt adhesive layer 2 with a second hot-melt adhesive layer 4. .
この場合、第１および第２のホツトメルト型接
着材層２，４は、ポリエチレン、ポリプロピレ
ン、アイオノマ、ナイロン、EVA等からなる同
材質のホツトメルト樹脂で構成されている。 In this case, the first and second hot melt adhesive layers 2 and 4 are made of the same hot melt resin such as polyethylene, polypropylene, ionomer, nylon, EVA, or the like.
この面発熱体はつぎのようにして製造される。
すなわち、第１の絶縁フイルム１の表面にホツト
メルト樹脂シートを介して金属箔を重ね合わせ、
熱ロールでこれらを加圧加熱することにより、第
１の絶縁フイルム１の表面にホツトメルト樹脂か
らなる第１のホツトメルト型接着材層２で金属箔
を接着し、金属箔の表面にレジストインキで所定
のヒータ回路を印刷し、これをエツチング処理し
て金属箔ヒータ回路３を形成し、この金属箔ヒー
タ回路３の表面および第１のホツトメルト型接着
材層２の露出面にホツトメルト樹脂シートを介し
て第２の絶縁フイルム５を重ね合わせ、これらを
熱ロールで加圧加熱することにより、金属箔ヒー
タ回路３の表面および第１のホツトメルト型接着
材層２の露出面にホツトメルト樹脂からなる第２
のホツトメルト型接着材層４で第２の絶縁フイル
ム５を接着する。 This surface heating element is manufactured as follows.
That is, a metal foil is superimposed on the surface of the first insulating film 1 via a hot melt resin sheet,
By pressurizing and heating these with a hot roll, the metal foil is adhered to the surface of the first insulating film 1 with the first hot-melt adhesive layer 2 made of hot-melt resin, and the surface of the metal foil is coated with resist ink in a predetermined area. A heater circuit is printed and etched to form a metal foil heater circuit 3, and a hot melt resin sheet is applied to the surface of the metal foil heater circuit 3 and the exposed surface of the first hot melt adhesive layer 2. By overlapping the second insulating film 5 and pressing and heating them with a hot roll, a second insulating film made of hot melt resin is applied to the surface of the metal foil heater circuit 3 and the exposed surface of the first hot melt adhesive layer 2.
A second insulating film 5 is bonded with a hot-melt adhesive layer 4 .
ところが、このような従来の面発熱体は、金属
箔ヒータ回路３の表面および第１のホツトメルト
型接着材層２の露出面にホツトメルト樹脂シート
を介して第２の絶縁フイルム５を重ね合わせ、こ
れらを熱ロールで加圧加熱することにより第２の
絶縁フイルム５を接着する際に、第１のホツトメ
ルト型接着材層２が熱で軟化して第１のホツトメ
ルト型接着材層２の金属箔ヒータ回路３に対する
接着力が弱くなり、この結果金属箔ヒータ回路３
が移動して金属箔ヒータ回路３に変形または浮き
上がりなどを生じるおそれがあつた。
However, in such a conventional surface heating element, the second insulating film 5 is superimposed on the surface of the metal foil heater circuit 3 and the exposed surface of the first hot melt adhesive layer 2 via a hot melt resin sheet, and these When bonding the second insulating film 5 by applying pressure and heat with a hot roll, the first hot-melt adhesive layer 2 is softened by the heat and the metal foil heater of the first hot-melt adhesive layer 2 is heated. The adhesive force to the circuit 3 becomes weaker, and as a result, the metal foil heater circuit 3
There was a risk that the metal foil heater circuit 3 would be deformed or lifted due to the movement of the metal foil heater circuit 3.
この考案の目的は、製造時の金属箔ヒータ回路
の変形および浮き上がりを防止することができる
面発熱体を提供することである。 The purpose of this invention is to provide a surface heating element that can prevent deformation and lifting of the metal foil heater circuit during manufacturing.
この考案の面発熱体は、第１の絶縁フイルムの
表面に第１のホツトメルト型接着材層で金属箔を
貼着し、この金属箔にエツチング処理を施して金
属箔ヒータ回路を形成した後に前記金属箔ヒータ
回路の表面および前記第１のホツトメルト型接着
材層の露出面に第２のホツトメルト型接着材層で
第２の絶縁フイルムを貼着した面発熱体におい
て、前記第２のホツトメルト型接着材層を形成す
るホツトメルト樹脂より融点の高いホツトメルト
樹脂で前記第１のホツトメルト型接着材層を形成
したことを特徴とする。
In the surface heating element of this invention, a metal foil is pasted on the surface of a first insulating film using a first hot-melt adhesive layer, and a metal foil heater circuit is formed by etching the metal foil. In the surface heating element in which a second insulating film is adhered to the surface of the metal foil heater circuit and the exposed surface of the first hot-melt adhesive layer with a second hot-melt adhesive layer, the second hot-melt adhesive layer The first hot-melt type adhesive layer is formed of a hot-melt resin having a higher melting point than the hot-melt resin forming the material layer.
この考案の構成によれば、第２のホツトメルト
型接着材層を形成するホツトメルト樹脂より融点
の高いホツトメルト樹脂で第１のホツトメルト型
接着材層を形成したので、第１の絶縁フイルムの
表面に金属箔ヒータ回路を形成後、第２の絶縁フ
イルムを貼着する際に、第２のホツトメルト型接
着材層の加熱温度を第１のホツトメルト型接着材
層の融点より低く設定することにより、第２のホ
ツトメルト型接着材層を溶融させるための熱によ
る第１のホツトメルト型接着材層の金属箔ヒータ
回路に対する接着力の低下がなくなり、金属箔ヒ
ータ回路の変形および浮き上がりを防止すること
ができる。
According to the configuration of this invention, since the first hot melt adhesive layer is formed of a hot melt resin having a higher melting point than the hot melt resin forming the second hot melt adhesive layer, the surface of the first insulating film is coated with metal. After forming the foil heater circuit, when attaching the second insulating film, the heating temperature of the second hot-melt adhesive layer is set lower than the melting point of the first hot-melt adhesive layer. The adhesive force of the first hot-melt adhesive layer to the metal foil heater circuit does not decrease due to the heat used to melt the hot-melt adhesive layer, and deformation and lifting of the metal foil heater circuit can be prevented.
この考案の一実施例を図面に基づいて説明す
る。すなわち、この面発熱体は、第１の絶縁フイ
ルム１の表面に第１のホツトメルト型接着材層２
で金属箔を貼着し、この金属箔にエツチング処理
を施して金属箔ヒータ回路３を形成した後に金属
箔ヒータ回路３の表面および第１のホツトメルト
型接着材層２の露出面に第２のホツトメルト型接
着材層４で第２の絶縁フイルム５を貼着した面発
熱体において、第２のホツトメルト型接着材層４
を形成するホツトメルト樹脂より融点の高いホツ
トメルト樹脂で第１のホツトメルト型接着材層２
を形成したことを特徴とする。
An embodiment of this invention will be described based on the drawings. That is, this surface heating element has a first hot-melt adhesive layer 2 on the surface of a first insulating film 1.
After applying a metal foil and etching the metal foil to form a metal foil heater circuit 3, a second layer is applied to the surface of the metal foil heater circuit 3 and the exposed surface of the first hot melt adhesive layer 2. In the surface heating element to which the second insulating film 5 is attached with the hot-melt adhesive layer 4, the second hot-melt adhesive layer 4
The first hot melt adhesive layer 2 is made of a hot melt resin having a higher melting point than the hot melt resin forming the first hot melt adhesive layer 2.
It is characterized by the formation of
この場合、第１のホツトメルト型接着材層２を
形成するホツトメルト樹脂として、変性ポリプロ
ピレン（アドマーQE305：三井石油化学(株)製）を
用い、第２のホツトメルト型接着材層４を形成す
るホツトメルト樹脂として、低密度ポリエチレン
を用いている。なお、アドマーQE305の融点は
155℃である。 In this case, modified polypropylene (Admer QE305: manufactured by Mitsui Petrochemical Co., Ltd.) is used as the hot melt resin forming the first hot melt adhesive layer 2, and low density polyethylene is used as the hot melt resin forming the second hot melt adhesive layer 4. The melting point of Admer QE305 is
It is 155 degrees Celsius.
その他の構成は従来例と同様である。 The other configurations are the same as the conventional example.
このように構成した結果、第２のホツトメルト
型接着材層４による第２の絶縁フイルム５の接着
時における第１のホツトメルト型接着材層２の溶
融を防止することができ、金属箔ヒータ回路３の
変形および浮き上がりを防止することができる。 As a result of this configuration, it is possible to prevent the first hot melt adhesive layer 2 from melting when the second insulating film 5 is bonded by the second hot melt adhesive layer 4, and the metal foil heater circuit 3 can be prevented from melting. Deformation and lifting can be prevented.
この考案の面発熱体によれば、第２のホツトメ
ルト型接着材層を形成するホツトメルト樹脂より
融点の高いホツトメルト樹脂で第１のホツトメル
ト型接着材層を形成したので、第１の絶縁フイル
ムの表面に金属箔ヒータ回路を形成後、第２の絶
縁フイルムを貼着する際に、第２のホツトメルト
型接着材層の加熱温度を第１のホツトメルト型接
着材層の融点より低く設定することにより、第２
のホツトメルト型接着材層を溶融させるための熱
による第１のホツトメルト型接着材層の金属箔ヒ
ータ回路に対する接着力の低下がなくなり、金属
箔ヒータ回路の変形および浮き上がりを防止する
ことができる。
According to the surface heating element of this invention, since the first hot melt adhesive layer is formed of a hot melt resin having a higher melting point than the hot melt resin forming the second hot melt adhesive layer, the surface of the first insulating film is After forming the metal foil heater circuit, when attaching the second insulating film, by setting the heating temperature of the second hot melt adhesive layer to be lower than the melting point of the first hot melt adhesive layer, Second
The adhesive force of the first hot melt adhesive layer to the metal foil heater circuit is not reduced due to the heat used to melt the hot melt adhesive layer, and deformation and lifting of the metal foil heater circuit can be prevented.
図面は従来例および実施例の面発熱体の断面図
である。
１……第１の絶縁フイルム、２……第１のホツ
トメルト型接着材層、３……金属箔ヒータ回路、
４……第２のホツトメルト型接着材層、５……第
２の絶縁フイルム。
The drawings are cross-sectional views of conventional surface heating elements and embodiments. DESCRIPTION OF SYMBOLS 1... First insulating film, 2... First hot melt adhesive layer, 3... Metal foil heater circuit,
4...Second hot melt adhesive layer, 5...Second insulating film.
Claims (1)
ト型接着材層で金属箔を貼着し、この金属箔にエ
ツチング処理を施して金属箔ヒータ回路を形成し
た後に前記金属箔ヒータ回路の表面および前記第
１のホツトメルト型接着材層の露出面に第２のホ
ツトメルト型接着材層で第２の絶縁フイルムを貼
着した面発熱体において、前記第２のホツトメル
ト型接着材層を形成するホツトメルト樹脂より融
点の高いホツトメルト樹脂で前記第１のホツトメ
ルト型接着材層を形成したことを特徴とする面発
熱体。 A metal foil is pasted on the surface of the first insulating film with a first hot-melt adhesive layer, and the metal foil is etched to form a metal foil heater circuit, and then the surface of the metal foil heater circuit and the In a surface heating element in which a second insulating film is adhered to the exposed surface of the first hot-melt adhesive layer with a second hot-melt adhesive layer, the hot-melt resin forming the second hot-melt adhesive layer is A surface heating element characterized in that the first hot-melt adhesive layer is formed of a hot-melt resin having a high melting point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12679082U JPS5931189U (en) | 1982-08-21 | 1982-08-21 | surface heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12679082U JPS5931189U (en) | 1982-08-21 | 1982-08-21 | surface heating element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5931189U JPS5931189U (en) | 1984-02-27 |
| JPS6331505Y2 true JPS6331505Y2 (en) | 1988-08-23 |
Family
ID=30288176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12679082U Granted JPS5931189U (en) | 1982-08-21 | 1982-08-21 | surface heating element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5931189U (en) |
-
1982
- 1982-08-21 JP JP12679082U patent/JPS5931189U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5931189U (en) | 1984-02-27 |
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