JPS6333517Y2 - - Google Patents
Info
- Publication number
- JPS6333517Y2 JPS6333517Y2 JP12678982U JP12678982U JPS6333517Y2 JP S6333517 Y2 JPS6333517 Y2 JP S6333517Y2 JP 12678982 U JP12678982 U JP 12678982U JP 12678982 U JP12678982 U JP 12678982U JP S6333517 Y2 JPS6333517 Y2 JP S6333517Y2
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- based adhesive
- adhesive layer
- metal foil
- heater circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002904 solvent Substances 0.000 claims description 67
- 239000012790 adhesive layer Substances 0.000 claims description 49
- 239000011888 foil Substances 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052609 olivine Inorganic materials 0.000 description 2
- 239000010450 olivine Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
【考案の詳細な説明】 〔産業上の利用分野〕 この考案は面発熱体に関するものである。[Detailed explanation of the idea] [Industrial application field] This invention relates to a surface heating element.
従来の面発熱体は、図面に示すように、第１の
絶縁フイルム１の表面に第１の溶剤型接着剤層２
で金属箔を貼着し、この金属箔にエツチング処理
を施して金属箔ヒータ回路３を形成した後に金属
箔ヒータ回路３の表面および第１の溶剤型接着剤
層２の露出面に第２の溶剤型接着剤層４で第２の
絶縁フイルム５を貼着している。
As shown in the drawing, a conventional surface heating element has a first solvent-based adhesive layer 2 on the surface of a first insulating film 1.
After applying a metal foil and etching the metal foil to form a metal foil heater circuit 3, a second adhesive layer is applied to the surface of the metal foil heater circuit 3 and the exposed surface of the first solvent-based adhesive layer 2. A second insulating film 5 is attached using a solvent-based adhesive layer 4.
この場合、第１および第２の溶剤型接着剤層
２，４は、同材質の溶剤型接着剤で構成されてい
る。 In this case, the first and second solvent-based adhesive layers 2 and 4 are made of a solvent-based adhesive made of the same material.
この面発熱体はつぎのようにして製造される。
すなわち、第１の絶縁フイルム１の表面に溶剤型
接着剤を塗布することにより第１の溶剤型接着剤
層２を形成し、この第１の溶剤型接着剤層２でも
つて金属箔を第１の絶縁フイルム１に貼り合わ
せ、第１の溶剤型接着剤層２中の溶剤を乾燥させ
たのち、金属箔の表面にレジストインキで所定の
ヒータ回路を印刷し、これをエツチング処理して
金属箔ヒータ回路３を形成し、この金属箔ヒータ
回路３の表面および第１の溶剤型接着剤層２の露
出面に第１の溶剤型接着剤層を構成する溶剤型接
着剤と同材質の溶剤型接着剤を塗布して第２の溶
剤型接着剤層４を形成し、この第２の溶剤型接着
剤層４でもつて金属箔ヒータ回路３の表面および
第１の溶剤型接着剤層２の露出面に第２の絶縁フ
イルム５を貼り合わせ、第２の溶剤型接着剤層４
中の溶剤を乾燥させる。 This surface heating element is manufactured as follows.
That is, a first solvent-based adhesive layer 2 is formed by applying a solvent-based adhesive to the surface of the first insulating film 1, and this first solvent-based adhesive layer 2 is also applied to the first metal foil. After the solvent in the first solvent-based adhesive layer 2 is dried, a prescribed heater circuit is printed on the surface of the metal foil with resist ink, and this is etched to form the metal foil. A solvent-based adhesive that forms the heater circuit 3 and is made of the same material as the solvent-based adhesive that forms the first solvent-based adhesive layer on the surface of the metal foil heater circuit 3 and the exposed surface of the first solvent-based adhesive layer 2. An adhesive is applied to form a second solvent-based adhesive layer 4, which also exposes the surface of the metal foil heater circuit 3 and the first solvent-based adhesive layer 2. A second insulating film 5 is attached to the surface, and a second solvent-based adhesive layer 4 is attached.
Dry the solvent inside.
ところが、このような従来の面発熱体は、金属
箔ヒータ回路３の表面および第１の溶剤型接着剤
層２の露出面に溶剤型接着剤を塗布して第２の溶
剤型接着剤層４を形成し第２の絶縁フイルム５を
貼り合わせる際に、第２の溶剤型接着剤層４中の
溶剤が第１の溶剤型接着剤層２に入り込んで第１
の溶剤型接着剤層２の金属箔ヒータ回路３に対す
る接着力が弱くなり、この結果金属箔ヒータ回路
３が移動して金属箔ヒータ回路３に変形または浮
き上がりなどを生じるおそれがあつた。
However, in such a conventional surface heating element, a solvent-based adhesive is applied to the surface of the metal foil heater circuit 3 and the exposed surface of the first solvent-based adhesive layer 2 to form the second solvent-based adhesive layer 4. When forming and bonding the second insulating film 5, the solvent in the second solvent-based adhesive layer 4 enters the first solvent-based adhesive layer 2 and the first
The adhesive strength of the solvent-based adhesive layer 2 to the metal foil heater circuit 3 was weakened, and as a result, the metal foil heater circuit 3 was likely to move, causing deformation or lifting of the metal foil heater circuit 3.
この考案の目的は、製造時の金属箔ヒータ回路
の変形および浮き上がりを防止することができる
面発熱体を提供することである。 The purpose of this invention is to provide a surface heating element that can prevent deformation and lifting of the metal foil heater circuit during manufacturing.
この考案の面発熱体は、第１の絶縁フイルムの
表面に第１の溶剤型接着剤層で金属箔を貼着し、
この金属箔にエツチング処理を施して金属箔ヒー
タ回路を形成した後に前記金属箔ヒータ回路の表
面および前記第１の溶剤型接着剤層の露出面に第
２の溶剤型接着剤層で第２の絶縁フイルムを貼着
した面発熱体において、前記第２の溶剤型接着剤
層を形成する溶剤型接着剤より流れの小さい溶剤
型接着剤で前記第１の溶剤型接着剤層を形成した
ことを特徴とする。
The surface heating element of this invention has a metal foil attached to the surface of a first insulating film with a first solvent-based adhesive layer,
After etching the metal foil to form a metal foil heater circuit, a second solvent-based adhesive layer is applied to the surface of the metal foil heater circuit and the exposed surface of the first solvent-based adhesive layer. In the surface heating element to which an insulating film is attached, the first solvent-based adhesive layer is formed with a solvent-based adhesive having a smaller flow than the solvent-based adhesive forming the second solvent-based adhesive layer. Features.
この考案の構成によれば、第２の溶剤型接着剤
層を形成する溶剤型接着剤より流れの小さい溶剤
型接着剤で第１の溶剤型接着剤層を形成したの
で、第１の絶縁フイルムの表面に金属箔ヒータ回
路を形成後、第２の絶縁フイルムを貼着する際
に、第２の溶剤型接着剤層に含まれる溶剤による
第１の溶剤型接着剤層の金属箔ヒータ回路に対す
る接着力の低下が少なくなり、金属箔ヒータ回路
の変形および浮き上がりを防止することができ
る。
According to the configuration of this invention, since the first solvent-based adhesive layer is formed with a solvent-based adhesive that has a smaller flow than the solvent-based adhesive that forms the second solvent-based adhesive layer, the first insulating film After forming the metal foil heater circuit on the surface of the first solvent-based adhesive layer, when attaching the second insulating film, the solvent contained in the second solvent-based adhesive layer acts on the metal foil heater circuit of the first solvent-based adhesive layer. Decrease in adhesive strength is reduced, and deformation and lifting of the metal foil heater circuit can be prevented.
この考案の一実施例を図面に基づいて説明す
る。すなわち、この面発熱体は、第１の絶縁フイ
ルム１の表面に第１の溶剤型接着剤層２で金属箔
を貼着し、この金属箔にエツチング処理を施して
金属箔ヒータ回路３を形成した後に金属箔ヒータ
回路３の表面および第１の溶剤型接着剤層２の露
出面に第２の溶剤型接着剤層４で第２の絶縁フイ
ルム５を貼着した面発熱体において、第２の溶剤
型接着剤層４を形成する溶剤型接着剤より流れ
（溶融粘度など）の小さい溶剤型接着剤で第１の
溶剤型接着剤層２を形成したことを特徴とする。
An embodiment of this invention will be described based on the drawings. That is, in this surface heating element, a metal foil is pasted on the surface of a first insulating film 1 with a first solvent-based adhesive layer 2, and this metal foil is subjected to an etching process to form a metal foil heater circuit 3. After that, a second insulating film 5 is attached to the surface of the metal foil heater circuit 3 and the exposed surface of the first solvent-based adhesive layer 2 with a second solvent-based adhesive layer 4. The first solvent-based adhesive layer 2 is formed of a solvent-based adhesive that has a smaller flow (melt viscosity, etc.) than the solvent-based adhesive forming the solvent-based adhesive layer 4 of the first embodiment.
この場合、第１の溶剤型接着剤層２を形成する
溶剤型接着剤として、ウレタン系接着剤（オリバ
インBHS2364：東洋インキ製造(株)製）を用い、
第２の溶剤型接着剤層４を形成する溶剤型接着剤
として、ウレタン系接着剤（アドコート503SJ：
東洋インキ製造(株)製）を用いている。 In this case, a urethane adhesive (Olivine BHS2364: manufactured by Toyo Ink Mfg. Co., Ltd.) is used as the solvent-based adhesive forming the first solvent-based adhesive layer 2.
A urethane adhesive (Adcoat 503SJ:
(manufactured by Toyo Ink Manufacturing Co., Ltd.).
上記のオリバインBHS2364の粘度は300±80C.
P.S（25℃ブルツクフイールドＢ型）であり、硬
化剤（BHS2319：同社製）との配合割合は、
BHS2364が100重量部に対してBHS2319が５重
量部である。 The viscosity of the above Olivine BHS2364 is 300±80C.
PS (25°C Burckfield type B), and the blending ratio with the curing agent (BHS2319: manufactured by the company) is:
BHS2364 is 100 parts by weight and BHS2319 is 5 parts by weight.
一方、アドコート503SJの粘度は500±100C.P.
Sであり、触媒Ｆ（ADF−Ｊ）の粘度は1400C.P.S
であり、これらの配合割合は、AD503SJが100重
量部に対してADF−Ｊが６重量部である。 On the other hand, the viscosity of Adcoat 503SJ is 500±100C.P.
S, and the viscosity of catalyst F (ADF-J) is 1400C.PS
The mixing ratio of these is 100 parts by weight of AD503SJ and 6 parts by weight of ADF-J.
さらに、これらの溶剤には、酢酸エチルまたは
メチルエチルケトンが使用される。 Additionally, these solvents include ethyl acetate or methyl ethyl ketone.
その他の構成は従来例と同様である。 The other configurations are the same as the conventional example.
このように構成した結果、第２の溶剤型接着剤
層４による第２の絶縁フイルム５の溶融接着時に
おける第１の溶剤型接着剤層４の溶融を抑えるこ
とができ、この結果第１の溶剤型接着剤層２の金
属箔ヒータ回路３に対する接着力の低下が少なく
なり、金属箔ヒータ回路３の変形および浮き上が
りを防止することができる。 As a result of this configuration, it is possible to suppress melting of the first solvent-based adhesive layer 4 when the second insulating film 5 is melt-bonded by the second solvent-based adhesive layer 4, and as a result, the first solvent-based adhesive layer 4 can be prevented from melting. The decrease in adhesive strength of the solvent-based adhesive layer 2 to the metal foil heater circuit 3 is reduced, and deformation and lifting of the metal foil heater circuit 3 can be prevented.
この考案の面発熱体によれば、第２の溶剤型接
着剤層を形成する溶剤型接着剤より流れの小さい
溶剤型接着剤で第１の溶剤型接着剤層を形成した
ので、第１の絶縁フイルムの表面に金属箔ヒータ
回路を形成後、第２の絶縁フイルムを貼着する際
に、第２の溶剤型接着剤層に含まれる溶剤による
第１の溶剤型接着剤層の金属箔ヒータ回路に対す
る接着力の低下が少なく、金属箔ヒータ回路の変
形および浮き上がりを防止することができる。
According to the surface heating element of this invention, since the first solvent-based adhesive layer is formed with a solvent-based adhesive that has a smaller flow than the solvent-based adhesive that forms the second solvent-based adhesive layer, After forming the metal foil heater circuit on the surface of the insulating film, when attaching the second insulating film, the metal foil heater of the first solvent-based adhesive layer is removed by the solvent contained in the second solvent-based adhesive layer. There is little decrease in adhesive strength to the circuit, and deformation and lifting of the metal foil heater circuit can be prevented.
図面は従来例および実施例の面発熱体の断面図
である。
１……第１の絶縁フイルム、２……第１の溶剤
型接着剤層、３……金属箔ヒータ回路、４……第
２の溶剤型接着剤層、５…第２の絶縁フイルム。
The drawings are cross-sectional views of conventional surface heating elements and embodiments. DESCRIPTION OF SYMBOLS 1... First insulating film, 2... First solvent-based adhesive layer, 3... Metal foil heater circuit, 4... Second solvent-based adhesive layer, 5... Second insulating film.
Claims (1)
剤層で金属箔を貼着し、この金属箔にエツチング
処理を施して金属箔ヒータ回路を形成した後に前
記金属箔ヒータ回路の表面および前記第１の溶剤
型接着剤層の露出面に第２の溶剤型接着剤層で第
２の絶縁フイルムを貼着した面発熱体において、
前記第２の溶剤型接着剤層を形成する溶剤型接着
剤より流れの小さい溶剤型接着剤で前記第１の溶
剤型接着剤層を形成したことを特徴とする面発熱
体。 A surface heating element comprising a metal foil attached to a surface of a first insulating film with a first solvent-type adhesive layer, the metal foil being etched to form a metal foil heater circuit, and a second insulating film being attached to a surface of the metal foil heater circuit and an exposed surface of the first solvent-type adhesive layer with a second solvent-type adhesive layer,
A planar heating element, wherein the first solvent-based adhesive layer is formed from a solvent-based adhesive having a smaller flow rate than the solvent-based adhesive forming the second solvent-based adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12678982U JPS5931188U (en) | 1982-08-21 | 1982-08-21 | surface heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12678982U JPS5931188U (en) | 1982-08-21 | 1982-08-21 | surface heating element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5931188U JPS5931188U (en) | 1984-02-27 |
| JPS6333517Y2 true JPS6333517Y2 (en) | 1988-09-06 |
Family
ID=30288174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12678982U Granted JPS5931188U (en) | 1982-08-21 | 1982-08-21 | surface heating element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5931188U (en) |
-
1982
- 1982-08-21 JP JP12678982U patent/JPS5931188U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5931188U (en) | 1984-02-27 |
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