JPS61195010A - Microstrip line antenna - Google Patents

Abstract

PURPOSE:To peel off easily a coating layer when a lead wire is connected to an antenna conductor and to improve workability by placing a material layer which can be easily peeled off from the antenna conductor between the surface of a place to be connected to the outer peripheral circuit of the antenna conductor and the coating layer. CONSTITUTION:When a microstrip line antenna 11 is manufactured, a resist ink 21 is printed on a part where the antenna conductor 13 made of a metallic foil 20 is formed, and the dielectric 14a is adhered to the surface opposite to said one, thereby removing all parts except a part becoming the conductor 13 by etching. Then a synthetic resin thin film 18 is adhered through an adhering sheet 19a, facing the surface where the ocnductor 13 is formed, and the material layer 18 which can be easily peeled off from the conductor 13 is placed between the sheet 19a and the conductor 13. And the dielectric 14 is divided into a pair of thin-film-like dielectrics 14a and 14b. Accordingly the thin film used when the lead wire is connected to the conductor 13 can be easily peeled off, and the workability can be improved by the separation of the dielectric 14.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a microstripe line antenna used as a receiving antenna for satellite communications and the like.

BACKGROUND ART FIG. 3 is a perspective view showing a typical prior art. A crank-shaped antenna conductor 3 is formed on one surface of the coating layer 2 of the sweat synthetic resin jacket, and a flat plate-shaped dielectric material 4 made of polyethylene is formed facing the surface of the coating layer 2 on which the antenna conductor 3 is formed. A metal ground conductor 5 is bonded to one surface of the dielectric 4 to form a laminate, and this laminate is heated and pressed to manufacture the microstrip line antenna 1. The process of manufacturing these two microstrip line antennas will be roughly explained in detail using FIG.

FIG. 4 is a sectional view showing the manufacturing process of the microstrip line antenna. First, as shown in FIG. 4+21, the antenna conductor of the metal foil 7 is printed with resist ink 8 for etching.Next, as shown in FIG. A coating layer 2 made of molded resin is adhered to the opposite side of the surface where the resist ink 8 is printed on the substrate 7. These two coating layers are formed to protect the surface of the antenna conductor 3 from corrosion. , Figure 4 (
As shown in 3), the remaining portions other than the portions printed with the sea urchin resist ink 8 are removed by etching.

(J) therefore.

The antenna conductor 3 is formed on the 10,000th surface of the covering layer 2 as shown in FIG. 4(3). Next, I
The covering layer 2 on which the antenna conductor 3 is formed, the flat dielectric 4, and the metal ground conductor 5 are laminated in this order and heated and pressed to form the structure shown in FIG. 4 (5). A microstrip line antenna 1 is constructed as shown in FIG. In addition, in the state shown in FIG. 4 (2).

Covering Ii! 2 and the dielectric 4 and between the dielectric 4 and the ground conductor 5, adhesive sheaths 6a and 6b may be interposed, respectively. These two are laminated together and heated and pressed together to form a microstrip line antenna.

After manufacturing this microstrip line antenna, the satellite communication radio waves received between the antenna conductor 3 and the ground conductor 5 are transmitted to an external circuit such as a converter via a waveguide (not shown). A lead wire must be attached to the antenna conductor. Fi in the microstrip line antenna 1 after being built 1a in this field.

It becomes necessary to peel off the coating layer 2 at the location where the lead wire is fixed. However, the coating layer 2 and 6 in Fig. 4 (
Since it is adhered to the antenna conductor 3 in the step shown by 21, it is difficult to remove it. Even if it could be removed,
This causes problems such as damage to the surface of the antenna conductor 3.

the purpose An object of the present invention is to solve the technical problems described above.

The synthetic resin coating layer provided to protect the surface of the antenna conductor is often peeled off in order to secure the lead wire to the antenna conductor, but this microstrip line antenna is designed to facilitate the peeling process. The goal is to provide the following.

Example FIG. 1 is a perspective view of a light 1 according to an embodiment of the present invention.

An antenna conductor] 3 is formed on the synthetic resin covering layer 12 by an etching method. A dielectric 14 is bonded facing the surface on which the antenna conductor 3 is formed. Also, on the surface opposite to the surface where the antenna conductor 13 of dielectric material 4 is placed, a metal ground conductor 5 is adhered to form a laminate, and this laminate is heated and pressed to form a microstrip. Line 7 y ++ 11 is constructed. In the present invention, when attaching the antenna conductor 3 to the lead wire 6, the part 12a of the covering layer 12 to be peeled off is connected to an external circuit (not shown) in order to be easily peeled off. A material layer indicated by a broken line 18 is interposed between the surface of the antenna conductor 13 and the covering layer 12 at the location where the lead wire 6 is to be fixed.

This material layer [8#-r] is made of a material that can be easily separated from the antenna conductor 13, such as polyethylene terephthalate (PET). In this way, the material layer 18, which is easily separated from the antenna conductor [3], is interposed between the covering layer [2] and the antenna conductor 13. When the lead wire 16 is to be fixed, the portion 2a of the coating layer 12 where the lead wire 16 is to be fixed can be easily peeled off. It goes without saying that the material layer 18XF) of the portion 12a is also small in size.

[Figure] Microstrip line antenna shown in the figure] 1
The manufacturing process will be explained in more detail using FIG.

FIG. 2 is a sectional view showing a process for manufacturing a microstrip line antenna according to the present invention. First, as shown in FIG. 2(1), resist ink 21 is printed on the portion of the metal foil 20 where antenna conductor [3] is to be formed. This printing method is gravure printing.

Any method such as screen printing or photo printing will suffice.

A dielectric 14a is adhered to the surface of the metal foil 20 opposite to the surface on which the resist ink 21 is printed. Furthermore, as shown in FIG. 2(3), the remaining portion of the metal foil 20 other than the portion to become the antenna conductor 13 is removed by etching. In this way, the antenna conductor 13 is formed on one surface of the dielectric 14a. 20 pieces of metal foil are made of aluminum or copper, for example, and have a thickness of about 20 μm. Note that the resist ink 21 may be removed after the antenna conductor 13 is formed on one surface of the dielectric 14a.

Furthermore, as shown in FIG. 2 (4), a synthetic resin coating layer]2. The dielectric 14a on which the antenna conductor 13 is formed, another 10,000 dielectrics 14b, and the graben 415 are laminated in this order and heated and pressed.

A microstrip line antenna 1 shown in FIG. 2 (5) is constructed. In the state shown in FIG. 2 (4).

Facing the surface of the dielectric 14a on which the antenna conductor 13 is formed, a synthetic resin coating layer 2 is an adhesive sheet 19a.
Between the adhesive sheet 19a and the antenna conductor 13, the material layer 18 made of a material that is easily peelable from the antenna conductor 13 is interposed. After this material layer 18 forms the microstrip line antenna 1 as described above, the synthetic resin coating layer 2 is easily attached to the lead wire 16 to the antenna conductor 3. It is for peeling.

Further, in this embodiment, a pair of dielectrics 14a and 14b are laminated to form dielectric 4 shown in FIG. In this way, the dielectric material ]4 is connected to a pair of thin film-like nts bodies 14a,]4
This is to make the dielectrics 14a and 14b thick enough to be wound up when continuously mass producing the microstrip line antenna. Dielectric 1
A four-digit analog is made of polyethylene, tetrafluoroethylene, etc., and its thickness is about #: r] mm, and this thickness of 1 m
The dielectric 14a is divided into a pair of dielectrics 14a and 14b to form a thin film.

14b can be wound up, making it possible to continuously mass-produce microstrip line antennas. In this embodiment, in order to continuously mass-produce the microstrip line antenna, the dielectric 14 is divided into a pair of U)fs* bodies 14a and 14b. Of course, the line antenna 11 may be configured.〇Dielectric 14b17) On the surface of the Buddha opposite to the surface to which the dielectric 14a is bonded, a ground conductor 5 is attached via an adhesive sheet 9b.
is glued. This ground conductor is made of aluminum and has a thickness of about 2 mm. after that,
Laminate them in the X direction shown in Figure 2 (4) and heat and press the edges.
The two microstrip line antennas 1 shown in FIG. 2 (5) are constructed.

In this way, the material layer 18, which is easily separated from the antenna conductor [3], is interposed between the surface of the antenna conductor 13 to be connected to the external circuit and the covering layer [2]. The part 12a to be peeled off in 2 can be easily cut out, and the antenna conductor] 3 has a lead wire]
6 can be easily attached to 17 by folding it.

Although PET was used as the material layer 8 in the embodiments described above, in other embodiments of the present invention, a release paint may be used in place of PET.

According to the present invention, a material layer that is easily separated from the antenna conductor is interposed between the surface of the bottom part of the antenna conductor connected to the external circuit and the covering layer, so that the antenna The work of peeling off the synthetic resin coating layer before fixing the lead wire to be fixed to the conductor becomes easier, and therefore the workability is improved. In addition, 2
That's it.

Damage to the antenna conductor is prevented, and a microstrip line antenna with excellent conductivity characteristics can be realized.

[Brief explanation of drawings]

1 is a perspective view of a microstrip line antenna according to the present invention; FIG. 2 is a sectional view showing the manufacturing process of a microstrip line antenna; FIG. 3 is a perspective view of a typical prior art; FIG. 4 is a sectional view showing the manufacturing process of the microstrip line antenna 1 shown in the prior art. 1.11...Microstrip line antenna. 2.]2...Synthetic resin thin film, 3.13...Antenna conductor,4. i 4, 14a, 1 + b-us body, 5゜15... ground conductor, 7.20... metal foil, ]6...
Lead wire, 17...Kenda]8...Material layer agent Patent attorney Kei Nishi Department Figure 2 N4 S Z] 2 Z] = 7 = 15

Claims (1)

[Claims] In a microstripline antenna configured by laminating a coating layer, an antenna conductor, a dielectric material, and a ground conductor, the surface and coating of a portion of the antenna conductor to be connected to an external circuit. A microstripline antenna characterized in that a material layer that is easily separated from the antenna conductor is interposed between the layers.