JPH11111743A - Manufacture of ic card - Google Patents

Manufacture of ic card

Info

Publication number
JPH11111743A
JPH11111743A JP9275380A JP27538097A JPH11111743A JP H11111743 A JPH11111743 A JP H11111743A JP 9275380 A JP9275380 A JP 9275380A JP 27538097 A JP27538097 A JP 27538097A JP H11111743 A JPH11111743 A JP H11111743A
Authority
JP
Japan
Prior art keywords
card
film
dried
card substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9275380A
Other languages
Japanese (ja)
Other versions
JP3305633B2 (en
Inventor
Masakatsu Suzuki
正勝 鈴木
Koji Himori
宏次 檜森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
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Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP27538097A priority Critical patent/JP3305633B2/en
Publication of JPH11111743A publication Critical patent/JPH11111743A/en
Application granted granted Critical
Publication of JP3305633B2 publication Critical patent/JP3305633B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To smooth a surface of an IC card substrate, by laminating coating sheets previously coated with resin having a specific softening point on both surfaces of the IC card substrate. SOLUTION: HAE-2100 (trade name) of polyester resin having a softening point of 110 deg.C is applied on an IC card substrate and dried as a resin layer 7 such that it has a thickness of 30 μm after it is dried, thereby making a coating sheet 20. The HAE-2100 (trade name) of an adhesive 9 is applied to one surface of MERINEX D364-188 (trade name) made of polyethylene terephthalate such that it has a thickness of 20 μm after it is dried and is dried to make a cover film 8. Next, while separating a film 6 from the coating sheet 20, the adhesives 9 of the cover films 8 are overlaid and placed on both surfaces of an IC card substrate at a temperature of 150 deg.C, a pressure of 20 kgf/cm, and a speed of 1.0 m/min with a continuous roll laminator to make an IC card 700 μm thick. This smoothes the surface of a built-in circuit of the IC card to an unevenness of 2 to 3 μm.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ICカードの製造
方法に関する。
The present invention relates to a method for manufacturing an IC card.

【0002】[0002]

【従来の技術】回路形成されたプラスチックフィルム上
に、電気部品が搭載されたICカード基板を有するIC
カードの製造方法として、図2に示すようにプラスチッ
クフィルム10上に導電性インクを用いて回路導体13
を形成し、電気部品14を搭載した印刷回路板と、電気
部品14の部分がくり抜かれている接着剤付きフィルム
からなるスペーサ層11、及び接着剤付きフィルム12
を積層する方法が、特開平8−216570号公報や、
特開平8−216571号公報により知られている。
2. Description of the Related Art An IC having an IC card substrate on which electric components are mounted on a plastic film on which a circuit is formed.
As a method of manufacturing a card, as shown in FIG. 2, a circuit conductor 13 is formed on a plastic film 10 using conductive ink.
, A printed circuit board on which the electric component 14 is mounted, a spacer layer 11 made of a film with an adhesive in which a part of the electric component 14 is cut out, and a film 12 with an adhesive
The method of laminating is described in JP-A-8-216570,
It is known from JP-A-8-216571.

【0003】[0003]

【発明が解決しようとする課題】特開平8−21657
0号公報や、特開平8−216571号公報に示される
方法は、ロールラミネータによる連続生産が可能であ
り、生産性は改善されるものの、印刷回路の凹凸が、積
層される接着剤付きフィルムの接着剤のみでは平滑化し
きれず、カード表面に印刷回路の凹凸が浮き出てしま
い、表面平滑性が低下するという課題があった。
Problems to be Solved by the Invention
No. 0 or JP-A-8-216571 allows continuous production by a roll laminator and improves productivity, but the unevenness of the printed circuit is reduced by the adhesive-laminated film. There was a problem that the surface of the card could not be smoothed by the adhesive alone, and the unevenness of the printed circuit appeared on the card surface, and the surface smoothness was reduced.

【0004】本発明は、ロールラミネータによる連続生
産が可能であり、かつカードの表面平滑性に優れたIC
カードの製造方法を提供するものである。
[0004] The present invention relates to an IC capable of continuous production by a roll laminator and having excellent card surface smoothness.
A method for manufacturing a card is provided.

【0005】[0005]

【課題を解決するための手段】本発明のICカードの製
造方法は、回路形成されたプラスチックフィルム上に、
電気部品が搭載されたICカード基板と、接着剤層及び
プラスチックを複数層積層して成るICカードにおい
て、ICカード基板表面に予め軟化点が80〜120℃
の樹脂層を被覆してから積層することを特徴とする。
The method for manufacturing an IC card according to the present invention comprises the steps of:
In an IC card formed by laminating a plurality of adhesive layers and plastic layers on an IC card substrate on which electric components are mounted, a softening point of 80 to 120 ° C. is previously applied to the surface of the IC card substrate.
And then laminating the resin layer.

【0006】すなわち、本発明は、ICカード基板を接
着剤付きフィルムで積層する際、予めICカード基板の
回路面に樹脂層を形成させることで、回路の凹凸を吸収
させ、その後で、接着剤付きフィルムを該基板に積層さ
せることで、積層後の表面平滑性を向上できることを見
い出したことによって成されたものである。
That is, according to the present invention, when laminating an IC card substrate with a film with an adhesive, a resin layer is previously formed on a circuit surface of the IC card substrate to absorb irregularities of the circuit, and thereafter, the adhesive This is achieved by finding that the surface smoothness after lamination can be improved by laminating the attached film on the substrate.

【0007】[0007]

【発明の実施の形態】ICカード基板は、金属箔付きの
プラスチックフィルムのエッチング加工、あるいは導電
性インクのプラスチックフィルム上へのスクリーン印刷
等により、形成された回路に、半導体チップ、チップコ
ンデンサ等の電気部品を、導電性接着剤または異方導電
性フィルム等を介して搭載して形成される。ICカード
基板に用いられるプラスチックフィルムは、ポリエチレ
ンテレフタレートフィルム、ポリカーボネートフィル
ム、ポリイミドフィルム等を用いることができるが、特
に限定されるものではない。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An IC card substrate is formed on a circuit formed by etching a plastic film with a metal foil or by screen-printing a conductive ink on the plastic film. It is formed by mounting an electric component via a conductive adhesive or an anisotropic conductive film. As the plastic film used for the IC card substrate, a polyethylene terephthalate film, a polycarbonate film, a polyimide film, or the like can be used, but is not particularly limited.

【0008】ICカード基板表面への樹脂層の被覆は、
離型フィルム上に塗布形成された樹脂の基板表面への転
写、あるいは基板表面への直接塗布によって行われる。
すなわち、離型フィルム上に塗布した樹脂層と、ICカ
ード基板の回路面とを所定の条件にて連続ラミネート
し、被覆後に離型フィルムのみを剥離させて、該基板上
に樹脂層を形成するものである。用いる樹脂としては、
ポリエステル系、ニトリルゴム系、アクリル系、エポキ
シ系等があり必要に応じて架橋させて用いられ、特に樹
脂種は限定されるものではないが、樹脂の軟化点は80
〜120℃の範囲が好ましい。軟化点が80℃より低い
と、基板への転写及び積層時に樹脂の流れ出し量が大き
すぎ、所定の厚さを確保することが困難であり、また連
続ラミネート時のロール汚れの原因等になるため好まし
くない。また、軟化点が120℃を越える樹脂では、逆
に樹脂が流れにくいために、連続ラミネート製法では、
平滑性が不十分である。次いで、樹脂層で被覆したIC
カード基板に、積層後に所定の厚さになるように、接着
剤付きフィルムを複数層貼り合わせICカードを製造す
るものである。
[0008] The resin layer coating on the surface of the IC card substrate
This is carried out by transferring the resin applied and formed on the release film to the substrate surface, or by directly applying the resin to the substrate surface.
That is, the resin layer applied on the release film and the circuit surface of the IC card substrate are continuously laminated under predetermined conditions, and after coating, only the release film is peeled off to form a resin layer on the substrate. Things. As the resin used,
There are polyester type, nitrile rubber type, acrylic type, epoxy type and the like, and they are used by being cross-linked as needed.
The range of -120 ° C is preferred. If the softening point is lower than 80 ° C., the amount of resin flowing out during transfer to the substrate and lamination is too large, and it is difficult to secure a predetermined thickness. Not preferred. In the case of a resin having a softening point exceeding 120 ° C., the resin is difficult to flow.
Insufficient smoothness. Next, an IC covered with a resin layer
An IC card is manufactured by laminating a plurality of layers of a film with an adhesive on a card substrate so as to have a predetermined thickness after lamination.

【0009】[0009]

【実施例】図1(a)に示すように、プラスチック基材
1として、ポリエチレンテレフタレートフィルムである
エンブレットH−188(ユニチカ株式会社製、商品
名)の両面に、導電性インクである銀ペーストLS−5
04J(株式会社アサヒ化学研究所製、商品名)を厚さ
20μm、ライン巾150μmの回路導体2とアンテナ
回路3を連続印刷した。次いで、大きさ3×3mmの半
導体チップ4を異方導電性フィルム5であるAC−83
01Z(日立化成工業株式会社製、商品名)によって接
続し、ロール状のICカード基板を得た。図1(b)に
示すように、離型フィルム6として、ポリプロピレンフ
ィルムであるトレファンBo−60(東レ株式会社製、
商品名)の片面に、樹脂層7として軟化点110℃のポ
リエステル樹脂であるHAE−2100(日立化成工業
株式会社製、商品名)を、乾燥後の厚さが30μmにな
るように塗布乾燥し、被覆用シート20を得た。図1
(c)に示すように、ICカード基板の電気部品搭載面
には、電気部品の部分をくり抜いた被覆用シート20の
樹脂層7の側を、裏面には別の被覆用シート20の樹脂
層7が接するように重ね、温度120℃、圧力20kg
f/cm、速度1.0m/minの条件で、連続ロール
ラミネートにて貼り合わせ、図1(c)に示す構成の基
板を得た。別途、図1(d)に示すような、カバーフィ
ルム8としてポリエチレンテレフタレートフィルムであ
るメリネックスD364−188(アイ・シー・アイ・
ジャパン株式会社製、商品名)の片面に、接着剤9であ
るHAE−2100(日立化成工業株式会社製、商品
名)を、乾燥後の厚さが20μmになるように塗布乾燥
したものを準備した。次いで、被覆用シート20の離型
フィルム6を剥離しながら、カバーフィルム8の接着剤
9をICカード基板の両面に重ねながら温度150℃、
圧力20kgf/cm、速度1.0m/minの条件
で、連続ロールラミネートにて貼り合わせ、図1(e)
に示すような、厚さ700μmのICカードを得た。内
蔵回路部のカードの表面凹凸は、2〜3μmであり、表
面平滑性に優れていた。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 1 (a), as a plastic substrate 1, a silver paste as a conductive ink is applied on both sides of an emblet H-188 (trade name, manufactured by Unitika Ltd.), which is a polyethylene terephthalate film. LS-5
04J (trade name, manufactured by Asahi Chemical Laboratory Co., Ltd.) was continuously printed with a circuit conductor 2 and an antenna circuit 3 having a thickness of 20 μm and a line width of 150 μm. Next, a semiconductor chip 4 having a size of 3 × 3 mm is placed on an AC-83 which is an anisotropic conductive film 5.
01Z (trade name, manufactured by Hitachi Chemical Co., Ltd.) to obtain a rolled IC card substrate. As shown in FIG. 1B, as the release film 6, Torayfan Bo-60 which is a polypropylene film (manufactured by Toray Industries, Inc.
HAE-2100 (product name, manufactured by Hitachi Chemical Co., Ltd.), which is a polyester resin having a softening point of 110 ° C., is applied to one side of the product name) as a resin layer 7 so that the thickness after drying becomes 30 μm and dried. Thus, a covering sheet 20 was obtained. FIG.
As shown in (c), on the electric component mounting surface of the IC card substrate, the side of the resin layer 7 of the covering sheet 20 from which the electric component is cut out, and on the back surface, the resin layer of another covering sheet 20. 7 so that they touch each other, temperature 120 ° C, pressure 20kg
Under a condition of f / cm and a speed of 1.0 m / min, the substrates were bonded by continuous roll lamination to obtain a substrate having a configuration shown in FIG. Separately, as shown in FIG. 1 (d), a polyethylene terephthalate film Melinex D364-188 (ICI.
HAE-2100 (trade name, manufactured by Hitachi Chemical Co., Ltd.) as an adhesive 9 was applied to one side of Japan Co., Ltd. (trade name), and dried and applied so that the thickness after drying was 20 μm. did. Next, while peeling off the release film 6 of the covering sheet 20, the adhesive 9 of the cover film 8 is superimposed on both sides of the IC card substrate at a temperature of 150 ° C.
Under a condition of a pressure of 20 kgf / cm and a speed of 1.0 m / min, lamination was performed by continuous roll lamination, and FIG.
As a result, an IC card having a thickness of 700 μm was obtained. The surface unevenness of the card in the built-in circuit portion was 2-3 μm, and the surface was excellent in surface smoothness.

【0010】比較例 図1(b)に示す被覆用シート20を使用せずに、図1
(a)に示すICカード基板の両面に、図1(d)に示
すカバーフィルム8として実施例1の接着剤9を50μ
mに塗布乾燥したものを、温度150℃、圧力20kg
f/cm、速度1.0m/minの条件で、連続ロール
ラミネートにて貼り合わせ、図3に示すような、厚さ7
00μmのICカードを得た。内蔵回路部のカードの表
面凹凸は、10〜20μmであり、回路形状がカード表
面に浮き出ていた。
Comparative Example FIG. 1 shows a comparative example without using the covering sheet 20 shown in FIG.
On both sides of the IC card substrate shown in (a), the adhesive 9 of Example 1 was applied as a cover film 8 shown in FIG.
m, dried at a temperature of 150 ° C and a pressure of 20 kg
Under a condition of f / cm and a speed of 1.0 m / min, lamination was performed by continuous roll lamination, and a thickness of 7 as shown in FIG.
A 00 μm IC card was obtained. The surface irregularities of the card in the built-in circuit portion were 10 to 20 μm, and the circuit shape was raised on the card surface.

【0011】[0011]

【発明の効果】以上に説明したように、本発明によっ
て、内蔵回路部の凹凸がカード表面へ浮き出すのを抑制
し、カード表面の平滑性に優れたICカードを効率良く
製造することが可能である。
As described above, according to the present invention, it is possible to suppress the unevenness of the built-in circuit portion from floating on the card surface and efficiently manufacture an IC card having excellent card surface smoothness. It is.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(a)〜(e)は、それぞれ本発明の一実施例
の各工程を説明するための断面図である。
FIGS. 1A to 1E are cross-sectional views for explaining respective steps of one embodiment of the present invention.

【図2】従来例を示す断面図である。FIG. 2 is a sectional view showing a conventional example.

【図3】他の従来例を示す断面図である。FIG. 3 is a sectional view showing another conventional example.

【符号の説明】[Explanation of symbols]

1.プラスチック基材 2.回路導
体 3.アンテナ回路 4.半導体
チップ 5.異方導電性フィルム 6.離型フ
ィルム 7.樹脂層 8.カバー
フィルム 9.接着剤 10.プラ
スチックフィルム 11.スペーサ層 12.接着
剤付きフィルム 13.回路導体 14.電気
部品 20.被覆用シート
1. Plastic substrate 2. Circuit conductor 3. Antenna circuit 4. Semiconductor chip 5. Anisotropic conductive film 6. Release film 7. 7. resin layer 8. cover film Adhesive 10. Plastic film 11. Spacer layer 12. Film with adhesive 13. Circuit conductor 14. Electrical components 20. Sheet for coating

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】回路形成されたプラスチックフィルム上
に、電気部品が搭載されたICカード基板と、接着剤層
及びプラスチックフィルムを複数層積層して成るICカ
ードにおいて、ICカード基板表面に予め軟化点が80
〜120℃の樹脂層を被覆してから積層することを特徴
とするICカードの製造方法。
1. An IC card substrate comprising an IC card substrate on which electric components are mounted on a plastic film on which a circuit is formed, and an IC card comprising a plurality of layers of an adhesive layer and a plastic film laminated on each other. Is 80
A method for manufacturing an IC card, which comprises laminating after covering a resin layer at a temperature of up to 120 ° C.
JP27538097A 1997-10-08 1997-10-08 IC card manufacturing method Expired - Fee Related JP3305633B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27538097A JP3305633B2 (en) 1997-10-08 1997-10-08 IC card manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27538097A JP3305633B2 (en) 1997-10-08 1997-10-08 IC card manufacturing method

Publications (2)

Publication Number Publication Date
JPH11111743A true JPH11111743A (en) 1999-04-23
JP3305633B2 JP3305633B2 (en) 2002-07-24

Family

ID=17554691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27538097A Expired - Fee Related JP3305633B2 (en) 1997-10-08 1997-10-08 IC card manufacturing method

Country Status (1)

Country Link
JP (1) JP3305633B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004040508A1 (en) * 2002-10-31 2004-05-13 3B System, Inc. Smart card of a combination type providing with a stable contactless communication apparatus
JP2009205337A (en) * 2008-02-27 2009-09-10 Toppan Printing Co Ltd Ic card and its manufacturing method
KR100958862B1 (en) 2008-02-26 2010-05-20 김영대 Semiconductor Memory Card

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004040508A1 (en) * 2002-10-31 2004-05-13 3B System, Inc. Smart card of a combination type providing with a stable contactless communication apparatus
KR100958862B1 (en) 2008-02-26 2010-05-20 김영대 Semiconductor Memory Card
JP2009205337A (en) * 2008-02-27 2009-09-10 Toppan Printing Co Ltd Ic card and its manufacturing method

Also Published As

Publication number Publication date
JP3305633B2 (en) 2002-07-24

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