TWM574263U - Liquid-cooling device - Google Patents
Liquid-cooling device Download PDFInfo
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- TWM574263U TWM574263U TW107215364U TW107215364U TWM574263U TW M574263 U TWM574263 U TW M574263U TW 107215364 U TW107215364 U TW 107215364U TW 107215364 U TW107215364 U TW 107215364U TW M574263 U TWM574263 U TW M574263U
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- heat
- pipe
- liquid cooling
- heat pipe
- liquid
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- 238000001816 cooling Methods 0.000 title claims abstract description 87
- 239000007788 liquid Substances 0.000 claims abstract description 72
- 238000010521 absorption reaction Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 29
- 239000002826 coolant Substances 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本案係揭露一種液冷散熱裝置，其包括：複數吸熱模組，其分別具有吸熱本體及熱管，吸熱本體連接熱管；以及熱交換模組，其具有熱交換塊體、液冷管及二自閉式快速接頭，熱交換塊體具有液冷管容置槽或液冷管容置通道，及第一熱管容置槽或第一熱管容置通道，液冷管設置於液冷管容置槽或液冷管容置通道，熱管設置於第一熱管容置槽或第一熱管容置通道，自閉式快速接頭設置於液冷管的二端。本案的液冷散熱裝置藉由將液冷管設置於熱交換塊體中形成水路，使得冷卻液水路不直接形成於熱交換塊體中，藉以達到防止漏水的功效。The present invention discloses a liquid cooling heat dissipating device, comprising: a plurality of heat absorbing modules respectively having a heat absorbing body and a heat pipe, the heat absorbing body connecting the heat pipes; and a heat exchange module having a heat exchange block, a liquid cooling tube and a two self-closing type The quick-connecting joint has a liquid-cooled pipe accommodating groove or a liquid-cooled pipe accommodating passage, and a first heat pipe accommodating groove or a first heat pipe accommodating channel, and the liquid cooling pipe is disposed in the liquid cooling pipe accommodating groove or liquid The cold tube accommodates the passage, the heat pipe is disposed in the first heat pipe receiving groove or the first heat pipe receiving channel, and the self-closing quick joint is disposed at the two ends of the liquid cooling pipe. The liquid cooling heat dissipating device of the present invention forms a water path by disposing the liquid cooling pipe in the heat exchange block, so that the coolant water path is not directly formed in the heat exchange block, thereby achieving the effect of preventing water leakage.
Description
本創作係關於一種液冷散熱裝置，更明確地說，係關於一種結合熱管與冷卻循環液的液冷散熱裝置。The present invention relates to a liquid cooling device, and more particularly to a liquid cooling device that combines a heat pipe and a cooling circulating fluid.
隨著個人電腦、工作站、伺服器內部的晶片模組逐漸走向高功率化，水冷式散熱已經越來越廣泛應用於各種類型的電腦裝置。電腦裝置的水冷式散熱系統大致上為利用泵將水箱中的水自水管中抽出，使水帶走電腦裝置的熱之後，回流至水箱並且反覆進行循環。As the chip modules inside personal computers, workstations, and servers are gradually becoming more powerful, water-cooled heat dissipation has become more and more widely used in various types of computer devices. The water-cooled heat dissipation system of the computer device generally uses a pump to draw water from the water tank out of the water pipe, so that the water takes the heat of the computer device, returns to the water tank, and circulates repeatedly.
中國專利公開公報106125872當中公開了一種總線式熱管型水冷散熱系統，其利用熱管先將來自北橋熱沉53/南僑熱沉43/CPU熱沉23/記憶體散熱片33等的熱傳送至一總線熱沉組件1之後，再利用熱管將熱傳送至水冷板散熱組件6，於水冷板散熱組件6中具有循環水管路，循環水流動於其中並且將熱輸送至外部的冷卻循環系統。A bus-type heat pipe type water-cooling heat dissipating system is disclosed in Chinese Patent Publication No. 106125872, which uses heat pipes to first transfer heat from a North Bridge heat sink 53/Nanqiao heat sink 43/CPU heat sink 23/memory heat sink 33, etc. After the bus heat sink assembly 1, the heat is transferred to the water-cooling plate heat-dissipating assembly 6 by the heat pipe, and the circulating water pipe is disposed in the water-cooling plate heat-dissipating assembly 6, and the circulating water flows therein and transfers the heat to the external cooling circulation system.
中國專利公告207516905公開了一種總線式熱管型水冷散熱系統 ，其藉由南橋固定塊42/北橋固定塊52/記憶體導熱固定塊32等將來自各發熱元件的熱管固定於水冷板10並將來自各發熱元件的的熱傳送至水冷板10，再利用熱管將熱傳送至水冷板散熱組件1，再進一步地藉由外循環水將熱帶走。Chinese Patent Publication No. 207 516 905 discloses a bus type heat pipe type water cooling heat dissipating system, which fixes heat pipes from respective heating elements to the water cooling plate 10 by the south bridge fixing block 42 / the north bridge fixing block 52 / the memory heat conducting fixing block 32 , etc. The heat of each of the heat generating components is transferred to the water-cooling plate 10, and the heat is transferred to the water-cooling plate heat-dissipating unit 1 by the heat pipe, and the sea is further moved by the external circulating water.
以上兩種先前技術當中，水冷板中的水路係直接形成於水冷板內部，然後水管接頭直接連接水冷板之後，形成供給循環水的出入口，其中，例如中國專利公開公報106125872圖7所示，熱管62插入至水冷板散熱組件6之後，必須利用熱風對流回流焊製程搭配預設的焊錫槽66，使鉛料留在焊錫槽中以固定熱管。不僅製程複雜繁瑣，更有可能因為焊接處的施工不良、氧化、或是震動等原因而造成漏水的問題。In the above two prior art, the water path in the water-cooled plate is directly formed inside the water-cooled plate, and then the water pipe joint is directly connected to the water-cooled plate to form an inlet and outlet for supplying the circulating water, wherein, for example, as shown in FIG. 7 of Chinese Patent Publication No. 106125872, the heat pipe After the 62 is inserted into the water-cooling plate heat dissipating component 6, the hot air convection reflow process must be matched with the preset solder bath 66 to leave the lead material in the solder bath to fix the heat pipe. Not only is the process complicated and cumbersome, but it is also more likely to cause water leakage due to poor construction, oxidation, or vibration at the weld.
本創作之目的在於提供一種水冷散熱模組，其藉由供水結構的改良以防止漏水問題。The purpose of this creation is to provide a water-cooled heat dissipation module that is protected from water leakage by an improvement in the water supply structure.
為達上述目的及其他目的，本創作提出一種液冷散熱裝置，其包括：複數吸熱模組，其分別具有吸熱本體及熱管，該吸熱本體連接該熱管；以及熱交換模組，其具有熱交換塊體、液冷管及二自閉式快速接頭，該熱交換塊體具有液冷管容置槽或液冷管容置通道，及第一熱管容置槽或第一熱管容置通道，該液冷管設置於該液冷管容置槽或該液冷管容置通道，該熱管設置於該第一熱管容置槽或該第一熱管容置通道，該等自閉式快速接頭設置於該液冷管的二端。In order to achieve the above and other objects, the present invention provides a liquid cooling heat dissipating device, comprising: a plurality of heat absorbing modules respectively having a heat absorbing body and a heat pipe, the heat absorbing body being connected to the heat pipe; and a heat exchange module having heat exchange a block body, a liquid cooling pipe and a two self-closing quick connector, the heat exchange block having a liquid cooling pipe receiving groove or a liquid cooling pipe receiving passage, and a first heat pipe receiving groove or a first heat pipe receiving channel, the liquid The cold pipe is disposed in the liquid cooling pipe accommodating groove or the liquid cooling pipe accommodating channel, the heat pipe is disposed in the first heat pipe accommodating groove or the first heat pipe accommodating channel, and the self-closing quick joints are disposed on the liquid The two ends of the cold tube.
於本創作之一實施例中，該液冷管設置於該液冷管容置槽時，該液冷管的截面呈D形。In an embodiment of the present invention, when the liquid cooling pipe is disposed in the liquid cooling pipe receiving groove, the liquid cooling pipe has a D-shaped cross section.
於本創作之一實施例中，該熱管設置於該第一熱管容置槽時，該熱管的截面呈D形。In an embodiment of the present invention, when the heat pipe is disposed in the first heat pipe receiving groove, the heat pipe has a D-shaped cross section.
於本創作之一實施例中，該液冷管容置槽呈U形或W形。In an embodiment of the present invention, the liquid-cooled tube receiving groove has a U shape or a W shape.
於本創作之一實施例中，該等自閉式快速接頭位於該熱交換塊體的同一側。In one embodiment of the present invention, the self-closing quick connectors are located on the same side of the heat exchange block.
於本創作之一實施例中，各該吸熱本體為塊體，各該吸熱本體具有第二熱管容置槽或第二熱管容置通道，該熱管設置於該第二熱管容置槽或該第二熱管容置通道。In an embodiment of the present invention, each of the heat absorbing bodies is a block, and each of the heat absorbing bodies has a second heat pipe accommodating groove or a second heat pipe accommodating channel, and the heat pipe is disposed in the second heat pipe accommodating groove or the first Two heat pipes accommodate the passage.
於本創作之一實施例中，該熱管設置於該第二熱管容置槽時，該熱管的截面呈D形。In an embodiment of the present invention, when the heat pipe is disposed in the second heat pipe accommodating groove, the heat pipe has a D-shaped cross section.
本創作之液冷散熱裝置藉由將液冷管設置於熱交換塊體中形成水路，使得冷卻液水路不直接形成於熱交換塊體中，藉此達到防止漏水之功效。The liquid cooling device of the present invention forms a water path by disposing a liquid cooling pipe in the heat exchange block, so that the coolant water path is not directly formed in the heat exchange block, thereby achieving the effect of preventing water leakage.
為充分瞭解本創作之目的、特徵及功效，茲藉由下述具體之實施例，並配合所附之圖式，對本創作做一詳細說明，說明如後：In order to fully understand the purpose, features and effects of this creation, the following specific examples, together with the attached drawings, provide a detailed description of the creation, as explained below:
圖2為液冷散熱裝置之頂面的結合示意圖。如圖2所示，液冷散熱裝置10包括熱交換模組30及兩個吸熱模組20。兩個吸熱模組20當中分別具有吸熱本體22、熱管24。各個吸熱模組20與發熱元件連接，例如，於本實施例中其中一個吸熱模組20與北橋晶片連接；另一個吸熱模組20的與南橋晶片連接。各個熱管24分為與吸熱模組20接觸的部分為吸熱端；與熱交換模組30接觸的部分為熱交換端；其餘的部分為中間段。2 is a schematic view showing the combination of the top surface of the liquid cooling heat sink. As shown in FIG. 2, the liquid cooling heat sink 10 includes a heat exchange module 30 and two heat absorption modules 20. The two heat absorbing modules 20 respectively have a heat absorbing body 22 and a heat pipe 24. Each of the heat absorbing modules 20 is connected to the heat generating component. For example, in the embodiment, one of the heat absorbing modules 20 is connected to the north bridge chip; and the other heat absorbing module 20 is connected to the south bridge chip. The portion of each heat pipe 24 that is in contact with the heat absorption module 20 is a heat absorption end; the portion that is in contact with the heat exchange module 30 is a heat exchange end; the remaining portion is an intermediate portion.
本實施例中，各個吸熱本體22分別為由鋁銅合金所構成之四方塊狀體，除了固定熱管之外也發揮均熱的作用，並且也提供與發熱元件確實熱接觸的平整面。於其他實施例中，亦可為其他高導熱性材料，例如鋁、銅、鈦、銀、石墨等所構成。複數熱管24為前後均無通孔的封閉型管，於本實施例中，熱管的管殼由銅構成，於其他實施例中，亦可為其他高導熱性材料，例如鋁、銅、鈦、銀、石墨等所構成。In the present embodiment, each of the heat absorbing bodies 22 is a four-square body composed of an aluminum-copper alloy, and functions as a soaking heat in addition to the fixed heat pipe, and also provides a flat surface that is in thermal contact with the heat generating element. In other embodiments, other high thermal conductivity materials such as aluminum, copper, titanium, silver, graphite, etc. may be used. The heat pipe 24 is a closed pipe having no through holes in the front and the rear. In this embodiment, the heat pipe is made of copper. In other embodiments, other high thermal conductivity materials such as aluminum, copper, titanium, Silver, graphite, etc.
圖3為液冷散熱裝置之底面的結合示意圖。如圖3所示，分別來自各吸熱模組20的熱管24的熱交換端連接至熱交換模組30。如圖2所示，熱交換模組30具有熱交換塊體32、液冷管容置槽34、第一熱管容置槽39及二個自閉式快速接頭38a、38b。於本實施例中，液冷管容置槽34位於熱交換塊體32的頂側；第一熱管容置槽39位於熱交換塊體32的底側。熱交換模組當中30還具有液冷管36，液冷管36可進一步與外部冷卻液系統連接，藉由提供冷卻液進行冷卻循環。於本實施例當中，液冷管36為銅所構成。3 is a schematic view showing the combination of the bottom surface of the liquid cooling heat sink. As shown in FIG. 3, the heat exchange ends of the heat pipes 24 from the respective heat absorbing modules 20 are connected to the heat exchange module 30. As shown in FIG. 2, the heat exchange module 30 has a heat exchange block 32, a liquid cooling tube receiving groove 34, a first heat pipe receiving groove 39, and two self-closing quick connectors 38a, 38b. In the present embodiment, the liquid-cooled tube accommodating groove 34 is located on the top side of the heat exchange block 32; the first heat pipe accommodating groove 39 is located on the bottom side of the heat exchange block 32. The heat exchange module 30 also has a liquid cooling pipe 36 which can be further connected to an external coolant system for providing a cooling fluid for the cooling cycle. In the present embodiment, the liquid cooling pipe 36 is made of copper.
於熱交換模組30當中，位於熱交換塊體32的頂側的液冷管容置槽34供作連接並且容置液冷管36。於本實施例當中，液冷管36配置於液冷管容置槽34中的部分具有D形截面，以使液冷管配置面形成平整之平面，允許較大的配置靈活性。Among the heat exchange modules 30, a liquid cooling pipe accommodating groove 34 located on the top side of the heat exchange block 32 is provided for connection and accommodates the liquid cooling pipe 36. In the present embodiment, the portion of the liquid cooling pipe 36 disposed in the liquid cooling pipe accommodating groove 34 has a D-shaped cross section so that the liquid cooling pipe arranging surface forms a flat surface, which allows for greater configuration flexibility.
於熱交換模組30當中，其底側具有第一熱管容置槽39供作連接並且容置熱管24的熱交換端，並使熱管24的熱交換端橫向貫穿熱交換模組30當中。圖1為液冷散熱裝置的分解示意圖。如圖1所示，於本實施例中，熱管24配置於第一熱管容置槽39中的熱交換端具有D形截面，以使熱交換模組30中的熱管24配置面形成平整之平面，允許較大的配置靈活性。In the heat exchange module 30, the bottom side has a first heat pipe accommodating groove 39 for connecting and accommodating the heat exchange end of the heat pipe 24, and the heat exchange end of the heat pipe 24 is transversely penetrated through the heat exchange module 30. Figure 1 is an exploded perspective view of a liquid cooling heat sink. As shown in FIG. 1 , in the present embodiment, the heat exchange end of the heat pipe 24 disposed in the first heat pipe accommodating groove 39 has a D-shaped cross section, so that the heat pipe 24 in the heat exchange module 30 forms a flat surface. Allows for greater configuration flexibility.
此外，液冷管36配置於液冷管容置槽34之後，可藉由壓合的方式將液冷管36固定於液冷管容置槽34中，亦可使用例如導熱矽膠等接著劑接合加強固定。再者，熱管24的吸熱端配置於第一熱管容置槽39之後，可藉由壓合的方式將熱管24固定於第一熱管容置槽39中，亦可使用例如導熱矽膠等接著劑接合加強固定。由於本創作的冷卻液水路係藉由液冷管36形成，因此，冷卻液不會直接接觸到熱交換塊體32，也不會像習知技術般，由於冷卻液在熱交換塊體32內壁直接形成的水路中流動，容易因為焊接等原因而導致漏水問題。In addition, after the liquid-cooling tube 36 is disposed in the liquid-cooling tube accommodating groove 34, the liquid-cooling tube 36 may be fixed in the liquid-cooling tube accommodating groove 34 by press-fitting, or may be bonded using an adhesive such as a heat-conductive silicone rubber. Strengthen the fixation. In addition, after the heat absorbing end of the heat pipe 24 is disposed in the first heat pipe accommodating groove 39, the heat pipe 24 can be fixed in the first heat pipe accommodating groove 39 by pressing, or can be bonded by using an adhesive such as heat-conductive rubber. Strengthen the fixation. Since the coolant circuit of the present invention is formed by the liquid cooling pipe 36, the coolant does not directly contact the heat exchange block 32, and the coolant is not in the heat exchange block 32 as in the prior art. The water flows directly in the water path formed by the wall, which is liable to cause water leakage due to welding or the like.
如圖2所示，液冷管36於熱交換模組30當中呈W字形彎曲，液冷管36於熱交換模組30的同一側上進出，且於熱交換模組30的同一側之二端分別連接自閉式快速接頭38a、38b。由於自閉式快速接頭38a、38b可以在拉拔的瞬間關閉，因此藉由在同一側設置連接液冷管36的二個自閉式快速接頭38a、38b作為冷卻液的進出端點，可使得例如在伺服器機櫃中安裝或是改變配置時便於拆裝。As shown in FIG. 2, the liquid cooling tube 36 is bent in a W shape in the heat exchange module 30, and the liquid cooling tube 36 enters and exits on the same side of the heat exchange module 30, and is on the same side of the heat exchange module 30. The ends are connected to the self-closing quick connectors 38a, 38b, respectively. Since the self-closing quick joints 38a, 38b can be closed at the moment of drawing, the two self-closing quick joints 38a, 38b connected to the liquid cooling pipe 36 on the same side can be used as the inlet and outlet end points of the coolant, for example, It is easy to disassemble when installing or changing the configuration in the server cabinet.
藉由液冷管36呈現W字形彎曲使得來自外部的冷卻液可充分地流熱交換模組30各處，並且吸收由熱管24傳導至熱交換模組30的熱，以確實、均勻地進行熱交換。於本實施例當中，液冷管36於熱交換模組30當中呈W字形彎曲，於其他實施例當中，液冷管36於熱交換模組30當中亦呈U字形彎曲或其他任何形狀的彎曲。The W-shaped bending is performed by the liquid-cooling tube 36 so that the coolant from the outside can sufficiently flow through the heat exchange module 30 and absorb the heat conducted from the heat pipe 24 to the heat exchange module 30 to perform heat surely and uniformly. exchange. In the present embodiment, the liquid cooling tube 36 is bent in a W shape in the heat exchange module 30. In other embodiments, the liquid cooling tube 36 is also bent in a U shape or any other shape in the heat exchange module 30. .
此外，於本實施例當中，吸熱本體分別設置有複數大致互相平行且間距相等的第二熱管容置槽26，熱管24的吸熱端配置於吸熱本體的第二熱管容置槽26當中。於本實施例當中，熱管24的吸熱端具有D形截面，以使吸熱本體中的熱管配置面形成平整之平面，允許較大的配置靈活性。In addition, in the present embodiment, the heat absorbing body is provided with a plurality of second heat pipe accommodating grooves 26 which are substantially parallel to each other and have the same spacing. The heat absorbing end of the heat pipe 24 is disposed in the second heat pipe accommodating groove 26 of the heat absorbing body. In the present embodiment, the heat absorbing end of the heat pipe 24 has a D-shaped cross section to form a flat surface of the heat pipe arrangement surface in the heat absorbing body, allowing greater configuration flexibility.
此外，熱管24的吸熱端配置於第二熱管容置槽26之後，可藉由壓合的方式將熱管24固定於第二熱管容置槽26中，亦可使用例如導熱矽膠等接著劑接合加強固定。In addition, after the heat absorbing end of the heat pipe 24 is disposed in the second heat pipe accommodating groove 26, the heat pipe 24 can be fixed in the second heat pipe accommodating groove 26 by press-fitting, or can be strengthened by using an adhesive such as a heat-conductive rubber. fixed.
本創作當中之熱管24為封閉型熱管，其具有由銅等高導熱材料所形成之管殼。於本實施例當中，各個熱管具有D形截面，但於其他實施例中亦可為圓形、橢圓形、正方形、矩形等其他形狀。於一實施例中，各個熱管的吸熱端與熱交換端具有D形截面，但中間段為圓形截面。The heat pipe 24 in the present creation is a closed heat pipe having a casing formed of a highly heat conductive material such as copper. In the present embodiment, each heat pipe has a D-shaped cross section, but in other embodiments, it may have other shapes such as a circle, an ellipse, a square, a rectangle, and the like. In one embodiment, the heat absorbing end and the heat exchange end of each heat pipe have a D-shaped cross section, but the middle section has a circular cross section.
熱管24當中可具有水、甲醇、乙醇、丙酮、庚烷等低沸點之液體，該液體吸收各吸熱模組20之熱後相變吸熱蒸發成為熱蒸氣，熱管當中的熱蒸氣藉由熱交換模組當中與冷卻液進行熱交換，降溫後恢復為液態，流回第一、第二吸熱模組之後繼續吸收該處之熱量。也就是說，在熱管將熱帶至熱交換模組的過程當中，已經在進行初步的散熱。當熱管24將熱帶至熱交換模組30之後，又進一步地透過冷卻循環方式進行散熱。冷卻液可為水或其他流動性佳且有利於循環散熱之液體。The heat pipe 24 may have a liquid having a low boiling point such as water, methanol, ethanol, acetone or heptane. The liquid absorbs the heat of each heat absorbing module 20, and the phase change absorbs heat to evaporate into hot steam. The hot steam in the heat pipe is exchanged by the heat exchange mode. The group exchanges heat with the coolant, returns to a liquid state after cooling, and continues to absorb the heat after flowing back to the first and second heat absorption modules. That is to say, in the process of the heat pipe going from the tropical to the heat exchange module, preliminary heat dissipation has been carried out. After the heat pipe 24 has been tropical to the heat exchange module 30, it is further cooled by a cooling cycle. The coolant can be water or other liquid that is fluid and beneficial for heat dissipation.
本創作藉由直接將來自吸熱模組的熱管固定於熱交換模組，實現了相較習知技術中利用固定件連接各組熱管的方式結構簡單，然而又具有高散熱性能的效果。By directly fixing the heat pipe from the heat absorbing module to the heat exchange module, the present invention achieves a simple structure and a high heat dissipation performance by using a fixing member to connect the heat pipes in the prior art.
於前述實施例中，於熱交換塊體30當中容置液冷管36的液冷管容置槽34；熱交換塊體30當中容置熱管的第一熱管容置槽39；吸熱模組20當中容置熱管24的第二熱管容置槽26皆為溝槽狀，也就是於截面上呈現缺口之圓弧形狀；但並不限定於此，於其他實施例中，液冷管容置槽34/第一熱管容置槽39/第二熱管容置槽26可為封閉型的通道，也就是於截面上呈現封閉圓形、方形或其他幾何形狀的液冷管容置通道。且本創作的熱交換模塊中的冷卻液水路係流動於液冷管內，因此，冷卻液不會直接接觸到熱交換塊體，確實地防止了漏水的問題。此外，本創作的液冷管及熱管之固定均不需焊接，製造工藝簡便。In the foregoing embodiment, the liquid-cooling tube accommodating groove 34 of the liquid-cooling tube 36 is accommodated in the heat-exchange block 30; the first heat-tube accommodating groove 39 of the heat-exchange block 30 is accommodated in the heat-exchange block 30; the heat absorbing module 20 The second heat pipe accommodating groove 26 of the accommodating heat pipe 24 is in the shape of a groove, that is, a circular arc shape having a notch in the cross section; however, it is not limited thereto. In other embodiments, the liquid cooling pipe accommodating groove The first heat pipe accommodating groove 39 / the second heat pipe accommodating groove 26 may be a closed type of passage, that is, a liquid cooling pipe accommodating passage which is closed in a circular shape, a square shape or other geometric shapes. Moreover, the coolant water path in the heat exchange module of the present invention flows in the liquid cooling pipe, so that the coolant does not directly contact the heat exchange block, and the problem of water leakage is surely prevented. In addition, the liquid cooling pipe and the heat pipe of the present invention are not required to be welded, and the manufacturing process is simple.
於前述實施例中，吸熱模組的數量為二組，但是並非限定於此，於其他實施例當中，吸熱模組的數量亦可為三、四、五或其他任意數量，以對應不同的機器中可能存在的發熱元件。而在使用的熱管為相同外徑的情況之下，可便於視需要調整各個吸熱模組的連接狀況。In the foregoing embodiment, the number of the heat absorbing modules is two, but is not limited thereto. In other embodiments, the number of the heat absorbing modules may be three, four, five or any other number to correspond to different machines. A heating element that may be present. In the case where the heat pipes used have the same outer diameter, it is convenient to adjust the connection state of each heat absorbing module as needed.
本創作在上文中已以較佳實施例揭露，然熟習本項技術者應理解的是，該實施例僅用於描繪本創作，而不應解讀為限制本創作之範圍。應注意的是，舉凡與該實施例等效之變化與置換，均應設為涵蓋於本創作之範疇內。因此，本創作之保護範圍當以申請專利範圍所界定者為準。The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that the present invention is only intended to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of patent application.
10‧‧‧液冷散熱裝置10‧‧‧Liquid cooling device
20‧‧‧吸熱模組 20‧‧‧heat absorption module
22‧‧‧吸熱本體 22‧‧‧heating body
24‧‧‧熱管 24‧‧‧heat pipe
26‧‧‧第二熱管容置槽 26‧‧‧Second heat pipe accommodating groove
30‧‧‧熱交換模組 30‧‧‧Heat Exchange Module
32‧‧‧熱交換塊體 32‧‧‧Heat exchange block
34‧‧‧液冷管容置槽 34‧‧‧Liquid cooling tube receiving slot
36‧‧‧液冷管 36‧‧‧Liquid cooling tube
38a、38b‧‧‧自閉式快速接頭 38a, 38b‧‧‧ self-closing quick connector
39‧‧‧第一熱管容置槽 39‧‧‧First heat pipe accommodating groove
［圖1］係為本創作一實施例中之液冷散熱裝置的分解示意圖。 ［圖2］係為顯示本創作一實施例中之液冷散熱裝置之頂面的結合示意圖。 ［圖3］係為顯示本創作一實施例中之液冷散熱裝置之底面的結合示意圖。FIG. 1 is an exploded perspective view of a liquid cooling heat dissipating device in an embodiment of the present invention. 2 is a schematic view showing the combination of the top surface of the liquid cooling heat dissipating device in an embodiment of the present invention. [Fig. 3] is a schematic view showing the combination of the bottom surface of the liquid cooling heat dissipating device in an embodiment of the present invention.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107215364U TWM574263U (en) | 2018-11-12 | 2018-11-12 | Liquid-cooling device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107215364U TWM574263U (en) | 2018-11-12 | 2018-11-12 | Liquid-cooling device |
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| Publication Number | Publication Date |
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| TWM574263U true TWM574263U (en) | 2019-02-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390867A (en) * | 2022-01-14 | 2022-04-22 | 四川九洲电器集团有限责任公司 | Six-degree-of-freedom heat transfer device, assembly method thereof and heat transfer method |
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2018
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114390867A (en) * | 2022-01-14 | 2022-04-22 | 四川九洲电器集团有限责任公司 | Six-degree-of-freedom heat transfer device, assembly method thereof and heat transfer method |
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