TWM569492U - Measuring device for detecting roughness and deformation of wafer ring - Google Patents

Abstract

A measuring device for detecting roughness and deformation of a wafer patch ring, comprising: a detecting platform, a three-dimensional transfer mechanism, a roughness meter, and an altimeter, wherein the detecting platform is placed on the wafer patch ring; The three-dimensional transfer mechanism is mounted on the detection platform and can perform a three-dimensional transfer operation such as an X-axis, a Y-axis, and a Z-axis; the roughness meter is mounted on the three-dimensional transfer mechanism, and can detect the wafer on the detection platform. The roughness of the patch ring; the altimeter is mounted on the three-dimensional transfer mechanism, and can detect the deformation degree of the wafer patch ring on the detection platform; thereby providing the roughness of the wafer patch ring in a scientific manner and Deformation, as a basis for replacement.

Description

Measuring device for detecting roughness and deformation of a wafer patch ring

The present invention is a technical field of measuring devices, and in particular, a design for measuring the roughness and deformation of a wafer patch ring.

In semiconductor wafer processing, a wafer patch ring is used. The wafer patch ring is adhered to a film on one of the surfaces, and the excess film is removed by a cutter, and the wafer patch ring is adhered to the wafer by a film to facilitate smooth processing of the subsequent processing. It is also possible to prevent the wafer patch ring from scratching the wafer. After each use, the residual infiltration of the surface of the wafer patch ring is dissolved by the cleaning infiltration device, and then a scraping device is used for the subsequent residue scraping operation. Finally, it is confirmed by manual visual inspection whether the glue is completely removed, whether the surface is scratched or deformed, and the test is qualified and will be used again next time. However, the wafer patch ring is a foil ring with a diameter of 6 to 12 inches and a thickness of only 1 to 2 mm. Sometimes it is not possible to clearly see whether the surface is scratched by visual means, and slight deformation is sometimes difficult to detect. When the adhesion between the film and the wafer is lowered, resulting in failure or card in the subsequent processing, it is known that the wafer patch ring has been damaged, resulting in a significant loss of the production line.

The present invention provides a measuring device for detecting the roughness and deformation of a wafer patch ring, and mainly uses a roughness meter, an altimeter and the like to detect a wafer patch ring, thereby eliminating the uncertainty of the manual visual result. Sex.

For the above purposes, the creation includes: a detection platform, a three-dimensional transfer mechanism, a roughness meter, and an altimeter, wherein the detection platform is placed on the wafer patch ring; the three-dimensional transfer mechanism is mounted on the detection platform. The three-dimensional transfer operation of the X-axis, the Y-axis, and the Z-axis can be performed; the roughness meter is mounted on the three-dimensional transfer mechanism, and can detect the roughness of the wafer patch ring on the detection platform; the altimeter is installed on The three-dimensional transfer mechanism can detect the deformation degree of the wafer patch ring on the detection platform.

In the embodiment of the present invention, the three-dimensional transfer mechanism includes a Z-axis transfer mechanism, a Y-axis transfer mechanism, and an X-axis transfer mechanism, and the Z-axis transfer mechanism is fixed on the detection platform, and the Z-axis shift The loading mechanism is responsible for driving the Y-axis transfer mechanism mounted therein to move in the Z-axis direction, and the Y-axis transfer mechanism is responsible for driving the X-axis mechanism mounted thereon to move in the Y-axis direction, thereby making the roughness The altimeter is used to properly transfer the wafer patch ring for related measurement operations.

In the embodiment of the present invention, the roughness meter and the altimeter are all mounted on the X-axis transfer mechanism, but at the same time, the X-axis transfer mechanism only drives the roughness meter and one of the altimeters. Perform measurement actions.

In an embodiment of the present invention, the control module further includes a control module that controls a three-dimensional detection path of the Z-axis, the Y-axis, and the X-axis of the three-dimensional transfer mechanism, or stores the roughness meter and Roughness and deformation data returned by the altimeter.

The measurement device for detecting the roughness and deformation of the wafer patch ring has the following specific advantages: 1. The creation is measured by a roughness meter and an altimeter to provide correct roughness and Deformation data is used as a basis for replacement, and the situation of misjudgment is eliminated by manual visual observation, which reduces production failure rate and increases production. 2. This creation is driven by a three-dimensional transfer mechanism to drive the roughness meter and altimeter movement, which can shorten the time of manual measurement. Improve production efficiency; 3. This creation is a simple structure and accurate measurement design.

The implementation of the present invention will be described in more detail below with reference to the drawings and component symbols, so that those skilled in the art can implement the present specification after studying the present specification.

As shown in Fig. 1 and Fig. 2, the perspective view and the front view of the creation are respectively. The present invention is a measuring device for detecting a wafer patch ring, including a detecting platform 1, a three-dimensional transfer mechanism 2, a roughness meter 3, and an altimeter 4.

The inspection platform 1 is a work platform having a flat work plane 11 on which the wafer patch ring A to be inspected is placed. In the figure, the wafer patch ring A is only one embodiment, and is not limited to a single shape as shown in the drawing. The wafer patch ring A is used for different sizes of wafers or purposes, and can be used for various types. shape.

The three-dimensional transfer mechanism 2 is mounted on the detection platform 1 and can perform a three-dimensional transfer operation such as a Z-axis, a Y-axis, and an X-axis, and is responsible for carrying the roughness 3 and moving the altimeter 4 to the wafer patch ring. The location of A. The three-dimensional transfer mechanism 2 includes a Z-axis transfer mechanism 21, a Y-axis transfer mechanism 22, and an X-axis transfer mechanism 23. In this embodiment, the Z-axis transfer mechanism 21 is fixed to the detection platform 1, and the Z-axis transfer mechanism 21 is responsible for driving the Y-axis transfer mechanism 22 mounted therein to move in the Z-axis direction. The Y-axis transfer mechanism 22 is responsible for driving the X-axis mechanism 23 attached thereto to move in the Y-axis direction. Both the roughness meter 3 and the altimeter 4 are mounted to the X-axis transfer mechanism 23, but at the same time, only the roughness 3 and one of the altimeters 4 are moved.

The Z-axis transfer mechanism 21 includes a Z-axis track 211 and a Z-axis moving carrier 212. The Z-axis transfer carrier 212 can be slid on the Z-axis track 211 by a power device such as a slide bar and a motor. To move in the Z-axis direction.

The Y-axis transfer mechanism 22 includes a Y-axis track 221 and a Y-axis moving carrier 222. The Y-axis track is fixed to the Z-axis moving carrier 212. The Y-axis transfer carrier 212 can be powered by a power device such as a slide bar. And a motor or the like is slid on the Y-axis rail 221 to move in the Y-axis direction.

The X-axis moving carrier 23 includes the X-axis rail 231, the first moving carrier 232, and the second moving carrier 233. The X-axis rail 231 is fixed to the Y-axis moving carrier 222. The first moving carrier The 232 can be powered by a power unit such as a slider and a motor to slide on the X-axis rail 231. The roughness 3 is fixed to the first moving carrier 232 and can be moved in the X-axis direction. The altimeter 4 is fixed to the second moving carrier 233 and is movable in the X-axis direction. However, the first moving carrier 232 and the second moving carrier 233 do not move at the same time to avoid interference.

In the above embodiment, only one embodiment of the three-dimensional transfer mechanism 2 is not limited to this manner. For example, the Y-axis transfer mechanism may be a gantry type track support, and the re-X-axis transfer mechanism Installed here, the same effect can be achieved by installing the roughness meter and the altimeter at different positions by the Z-axis transfer mechanism.

The altimeter 4 is a laser height tester, and the light is projected downward, and the X-axis transfer mechanism 23 and the Y-axis transfer mechanism 22 are synchronously actuated to drive the altimeter 4 on the surface of the wafer patch ring A. Concentric circle surround, if the measurement result has a deviation value, it means that the wafer patch ring A has been deformed.

The roughness meter 3 is a contact type sensing device, and the Z-axis transfer mechanism 21 can be used to drive the lowering, and the probe 31 at the bottom of the roughness meter 3 is in contact with the surface of the wafer patch ring A. The roughness meter 3 is moved in a radial manner to confirm whether the wafer patch ring A has scratches and scratches, and whether the operation replaces the wafer patch ring A.

In addition, as shown in FIG. 3, the measuring device for detecting the roughness and deformation of the wafer patch ring can be connected with a connection control module such as a controller or a computer to paste according to different wafers. The size of the ring A controls the detection path of the three-dimensional direction such as the Z-axis, the Y-axis, and the X-axis of the three-dimensional transfer mechanism 2 to achieve the purpose of automatic measurement. Furthermore, the creation can also store the roughness and deformation data returned by the roughness meter 3 and the altimeter 4 through the control module to record the detection result of the wafer patch ring A.

This creation is used to measure the roughness and deformation of the wafer patch ring. It has the following specific advantages: 1. This creation is measured by the roughness meter 3 and the altimeter 4 to provide the correct roughness. And the deformation degree data is used as a basis for replacement, and the case of misjudgment is eliminated by manual visual observation, which reduces the production failure rate and increases the output. 2. This creation is driven by the three-dimensional transfer mechanism to move the roughness meter 3 and the altimeter 4, which can shorten the labor. Measuring or judging time, improving production efficiency; 3. This creation is a simple structure and accurate measurement design.

In summary, the present invention is based on a scientific method in which the roughness meter 3 is driven by the three-dimensional transfer mechanism 2 or the altimeter 4 is moved to the wafer patch ring A for non-contact or contact measurement. The method determines the roughness and the degree of deformation, provides the correct data as the basis for replacement, and avoids the need for failure or damage during the production process, and meets the patent application requirements.

The above description is only a preferred embodiment for explaining the present creation, and is not intended to impose any form of restriction on the creation, so that any modification or change related to the creation under the same creative spirit is provided. , should still be included in the scope of this creative intent.

1‧‧‧Testing platform

11‧‧‧Working plane

2‧‧‧3D transfer mechanism

21‧‧‧Z-axis transfer mechanism

211‧‧‧Z-axis orbit

212‧‧‧Z-axis mobile vehicle

22‧‧‧Y-axis transfer mechanism

221‧‧‧Y-axis orbit

222‧‧‧Y-axis mobile vehicle

23‧‧‧X-axis transfer mechanism

231‧‧‧X-axis orbit

232‧‧‧First mobile vehicle

233‧‧‧Second mobile vehicle

3‧‧‧roughness meter

31‧‧‧ probe

4‧‧‧ altimeter

5‧‧‧Control Module

Figure 1 is a perspective view of the creation; Figure 2 is a front view of the creation; Figure 3 is a schematic diagram of the creation of a control module.

Claims (6)

A measuring device for detecting roughness and deformation of a wafer patch ring, comprising: a detecting platform for placing a wafer patch ring thereon, a three-dimensional transfer mechanism mounted on the detecting platform, capable of Performing a three-dimensional transfer operation such as an X-axis, a Y-axis, and a Z-axis; a roughness meter mounted on the three-dimensional transfer mechanism capable of detecting a roughness of the wafer patch ring on the detection platform; and an altimeter, Installed in the three-dimensional transfer mechanism, the deformation degree of the wafer patch ring on the detection platform can be detected. The measuring device for detecting roughness and deformation of a wafer patch ring according to claim 1, wherein the three-dimensional transfer mechanism comprises a Z-axis transfer mechanism, a Y-axis transfer mechanism, and X a shaft transfer mechanism, the Z-axis transfer mechanism is fixed on the detection platform, and the Z-axis transfer mechanism is responsible for driving the Y-axis transfer mechanism mounted therein to move in the Z-axis direction, and the Y-axis transfer mechanism is responsible for The X-axis mechanism mounted thereon is moved in the Y-axis direction. A measuring device for detecting a roughness and a deformation amount of a wafer patch ring as described in claim 2, wherein the roughness meter is mounted to the X-axis transfer mechanism. The measuring device for detecting the roughness and the deformation amount of the wafer patch ring according to the second aspect of the patent application, wherein the altimeter is mounted on the X-axis transfer mechanism. The measuring device for detecting the roughness and the deformation amount of the wafer patch ring according to claim 1, further comprising a control module, wherein the control module controls the Z axis of the three-dimensional transfer mechanism, Detection path in three dimensions such as the Y axis and the X axis. The measuring device for detecting the roughness and the deformation amount of the wafer patch ring according to the fifth aspect of the patent application, wherein the control module can store the roughness returned by the roughness meter and the altimeter. And deformation data.