TWM558908U - Probe test simulation system - Google Patents

Abstract

A probe test simulation system includes a test host, a power distribution box, a power supply, and an electronic load. The test host has an electronic electric cylinder that can be coupled with a probe to be tested. The power provided by the power supply is distributed to the electronic load and the test host, and further includes an electric cylinder control interface for driving the electronic electric cylinder to move the electronic electric cylinder back and forth to drive the probe to be tested and to be repeated The test article is in contact with, and further, a current is applied to the probe to be tested, and the current passing through the probe to be tested is fixed at a set value in conjunction with the electronic load. The author adds a current to the probe to be tested, and simulates the actual working environment of the probe to be tested to detect the actual service life of the probe to be tested.

Description

Probe test simulation system

A probe test system, especially a probe test simulation system.

After the integrated circuit is completed, it is necessary to use the probe to perform signal test on the pin of the integrated circuit to ensure that the pin of the integrated circuit can function normally and can input/output signals normally. The commonly used probe has a spring inside to buffer the impact force when the probe is in contact with the pin. During the contact process, the spring inside the probe will continuously elongate and compress, causing the spring itself to be worn out. When the number of spring type changes reaches a certain level, it will cause elastic fatigue due to exceeding its own elastic limit, making the spring old. Old or damaged, the probe can not be used and must be replaced, which increases the cost of use. Since the semiconductor package is a highly specialized industry, in order to achieve high yield of the product, the process of any link needs to be quite precisely controlled. Life testing of the probe itself is also a procedure that cannot be ignored.

The method for detecting the life of the probe itself by the prior art is to mount a probe to be tested on an electronic electric cylinder, and the probe to be tested is repeatedly moved back and forth by the electronic electric cylinder, so that the probe to be tested repeatedly and repeatedly The solder ball is tested for contact, and the spring in the probe to be tested is continuously elongated and compressed to measure the maximum number of expansions of the probe to be tested within the elastic limit.

However, when the probe is actually used to test the pin of the integrated circuit, a signal current is applied to the probe to test the signal transmission capability of the integrated circuit pin. The signal current may be affected by factors such as the magnitude of the current or the strength of the signal. The nature of the internal spring of the probe, or because the current passes through the temperature, causing the elastic coefficient to change, making it difficult for the spring to re-stretch. However, when the life of the probe itself is detected, the probe to be tested is repeatedly contacted with the test solder ball by means of mechanical energy, so that the spring is in compression. Stretching back and forth multiple times, the estimated number of probes used in this test method is different from the actual number of probes used, and the actual number of uses is less than the estimated number of uses obtained by the test. The probes are replaced by data obtained from the lifetime detection of the probes, which often exceed their elastic limits, causing errors in the pins tested by the probes, thereby reducing the yield of the product.

In view of the fact that the existing probe test system only uses mechanical energy to test the probe, and the actual working environment of the probe is different, and the actual usable life of the probe cannot be effectively evaluated, the main purpose of the present invention is to provide a probe test. The analog system applies current to the probe to be tested, simulating the environment in which the probe actually works, so as to know the true loss of the probe and the actual number of uses.

In order to achieve the foregoing objective, the creation probe test simulation system comprises: a test main body having an electronic electric cylinder, one end of the electronic electric cylinder is provided with an upper module, and the upper module is further connected with a probe to be tested. The electronic module is driven to move the upper module to move, so that the probe to be tested can be moved into contact with a test substrate; a power distribution box is connected to the test host, and has a counter for setting the electronic The number of movements of the electric cylinder; a stroke control unit for controlling the stop time of the upper module; a voltage control unit for controlling the energization time of the upper module; and a power supply connected to the distribution box to provide a direct current To the distribution box, an electronic load is connected to the test host and the distribution box, and the electronic load has a current mode for testing the voltage and resistance change of the probe to be tested during the test.

The author uses the power supply to provide power, and simulates the current with the electronic load, so that the probe to be tested can test the probe to be tested in an environment similar to the case where the package terminal is detected, and then test It is closer to the number of times the probe to be tested can load the workload.

10‧‧‧Test host

11‧‧‧Base

12‧‧‧Electric electric cylinder

121‧‧‧ piston rod

13‧‧‧Upper module

131‧‧‧Guide hole

132‧‧‧guides

14‧‧‧Next module

16‧‧‧Test substrate

161‧‧‧Testing the solder ball

18‧‧‧ Probes to be tested

181‧‧ ‧ spring

182‧‧‧ needle

20‧‧‧ distribution box

21‧‧‧ counter

23‧‧‧Travel Control Unit

231‧‧‧ starting point knob

233‧‧‧End knob

25‧‧‧Voltage Control Unit

251‧‧‧cutoff knob

253‧‧‧Power supply knob

27‧‧‧Electric cylinder control interface

30‧‧‧Power supply

40‧‧‧Electronic load

P1‧‧‧ starting position

P2‧‧‧ end position

T1‧‧‧ starting time

T2‧‧‧ stoppage

T3‧‧‧ deadline

T4‧‧‧Power supply time

Figure 1: Circuit block diagram of the authoring probe test simulation system.

Figure 2: Schematic diagram of the test host for this creation.

Figure 3: Schematic diagram of the probe test action of this creation.

Figure 4: Timing diagram of the probe test action of this creation.

Referring to FIG. 1 to FIG. 2 , a probe test simulation system includes a test host 10 , a power distribution box 20 , a power supply 30 , and an electronic load 40 .

The test host 10 includes a base 11, an electronic electric cylinder 12, an upper module 13, and a lower module 14. The electronic electric cylinder 12, the upper module 13 and the lower module 14 are all mounted on the base 11. In the embodiment, the electronic electric cylinder 12 has a piston rod 121, and the piston rod 121 can move back and forth; One end of the upper module 13 is connected to one end of the piston rod 121 of the electronic electric cylinder 12 and is driven by the piston rod 121. The upper module 13 has a plurality of guide rod holes 131, and the guide rod holes 131 are provided for corresponding plurality of guides. The rod 132 is disposed to enable the upper module 13 to move up and down within the length of the guide rods 132. The lower module 14 is disposed below the upper module 13 for erecting the guide rods 132 and a test. The substrate 16 is electrically connected to the lower module 14 .

The power distribution box 20 is connected to the test host 10. The positive end of the power distribution box 20 is electrically connected to the upper module 13 and includes a counter 21, a stroke control unit 23 and a voltage control unit 25.

The counter 21 can set the repeated round trip movement of the electronic electric cylinder 12 and display the number of times the current round trip has been performed.

The power distribution box 20 is further connected to the electronic electric cylinder 12, and the power distribution box 20 further has an electric cylinder control interface 27 for controlling and setting the movement condition of the electronic electric cylinder 12.

A power supply 30 is coupled to the distribution box 20 for supplying a DC voltage source to the distribution box 20 to operate the distribution box 20.

An electronic load 40 is connected to the test host 10 and the power distribution box 20, wherein a positive pole of the electronic load 40 is electrically connected to the lower module 14, and a negative pole of the electronic load 40 and a negative terminal of the power distribution box 20 are electrically connected. The electronic load 40 provides an impedance value to determine a fixed current value such that the current flowing through the probe 18 to be tested is a fixed value set by the electronic load 40.

Before the test, the probe 18 to be tested is mounted to the upper module 13, the test substrate 16 is mounted to the lower module 14, the probe 18 to be tested is not in contact with the test substrate 16, and the distribution box 20 is not yet powered. The upper module 13, firstly, the power supply 30 supplies a set of voltage currents to the distribution box 20 for working power, and the distribution box 20 distributes the working power to the test host 10, the electronic electric cylinder 12 and the electronic The load 40 enables the components to function properly; then the counter 21 on the distribution box 20 sets the number of times to be tested.

With further reference to FIG. 3, the test substrate 16 further has a plurality of test solder balls 161, which may be in the form of spheres, sheets or other shapes. In this embodiment, the probe 18 to be tested has an elongated pen shape and has a spring 181 and a needle 182. The spring 181 is used to buffer the probe 18 to be tested when the needle 182 contacts the test solder balls. The shape of the needle 182 may be hemispherical, needle-shaped, pen-shaped or other shape, and the corresponding test solder ball 161 may be selected according to different types of the needle 182.

Referring to FIG. 4, in the embodiment, the stroke control unit 23 has a point knob 231 and an end knob 233. The start knob 231 sets a pause period T1 together by a rotation adjustment manner. The start pause period T1 is When the probe 18 to be tested has not been in contact with the test substrate 16, the end knob 233 sets an end pause period T2 by means of rotation adjustment, and the end pause period T2 is the probe 18 to be tested and the test substrate 16 The time of contact.

During the test, if the probe 18 is first subjected to a current, and then the probe to be tested is brought into contact with the test substrate 16, the tip of the probe 18 to be tested generates a maximum voltage, thereby affecting the accuracy of the test. Therefore, in the embodiment, the voltage control unit 25 has a cutoff knob 251 and a power supply knob 253. The cutoff knob 251 can set a cutoff time T3 by means of rotation adjustment, and the cutoff time T3 is the test to be tested. When the needle 18 is not energized, the power supply knob 253 can set a power supply time T4 by rotating adjustment, and the power supply time T4 is a time when the probe 18 to be tested is connected to the current.

When the test is performed, the upper module 13 first stays at the point position P1 for a period of time, that is, the set start period pause period T1, and then the piston rod 121 of the electronic electric cylinder 12 moves for a moving time, so that the upper module 13 moves from the starting position P1 to an ending position P2. When the upper module 13 moves to the end position P2, it will stay for a set period of the end point pause period T2, at which time the probe 18 to be tested is in contact with one of the test solder balls 161 on the test substrate 16, In the end point suspension period T2, after the set end time T3 is first passed, the distribution box 20 then supplies a voltage to the upper module 13, so that the upper module 13, the probe to be tested 18, the test substrate 16 and the lower portion The module 14 is simultaneously turned on to generate a test current and flows through the electronic load 40; after the power supply time T4, the distribution box 20 stops supplying the voltage to the upper module 13, and when the end time pause period T2 is over, the electronic electric The cylinder 12 will move again to move the upper module 13 from the end position P2 back to the starting position P1. After a set period of the starting time pause period T1, the upper module 13 moves to the end position P2 again, thus following the above. In the step, the probe is continuously contacted with the test solder balls 161, and the number of tests set by the counter 21 is repeated back and forth.

When the test current flows through the upper module 13, the probe 18 to be tested, the test substrate 16 and the lower module 14 to enter the electronic load 40, the electronic load 40 is fixed to the set current according to the setting. The set value is such that the test current flowing through the probe 18 to be tested is the same as the current value set by the electronic load 40. The test host 10 performs a plurality of test cycles on the probe 18 to be tested. Generally, the probe 18 to be tested is subjected to a power-on test 10,000 times in one detection cycle. In the power-on test performed 100 times, the new test substrate 16 is replaced, so that the test substrate 16 is repeatedly replaced in each detection cycle to keep the probe 18 to be tested in contact with each other. The test balls 161.

After the test, the impedance and elasticity test of the probe 18 itself is performed by a probe tester, and the tip wear of the probe 18 to be tested is analyzed by using a scanning electron microscope (SEM). Sticky situation. When the probe 18 to be tested is worn or stained, the probe 18 to be tested is cleaned and cleaned by a laser cleaner to restore its appearance to the original appearance, and the probe to be tested is detected by a probe tester. 18 impedance and elastic condition. When the impedance and the elastic capability of the probe 18 to be tested meet the data provided by the manufacturer of the probe 18 to be tested, the probe 18 to be tested is reset back to the test host 10, and the detection period is reduced. Up to 5000 times, the probe 18 to be tested is repeatedly tested, and the detection period is sequentially decreased until the probe 18 to be tested cannot be restored to the original impedance value and elastic ability after being cleaned and cleaned. The number of times the probe 18 can be used, as well as the difference between the data provided by the supplier and the actual number of uses.

This creation uses an electrical method to increase the voltage and current of the probe to be measured, so as to simulate the working environment of the probe when it is actually applied to the detection of the package terminal, and then cooperate with the existing probe tester and electronic scanning microscope to detect the The number of times the probe actually passes through the compression test is old and even damaged. Compared with the traditional method of pressing only the test, the creation can obtain a more accurate probe service life.

Claims (4)

A probe test simulation system includes: a test main body having an electronic electric cylinder, one end of the electronic electric cylinder is provided with an upper module, and the upper module is further connected with a probe to be tested, by the electronic The electric cylinder drives the upper module to move repeatedly, so that the probe to be tested can be moved into contact with a test substrate; a distribution box is connected to the test host, and has: a counter for setting the number of movements of the electronic electric cylinder a stroke control unit for controlling the stop time of the upper module; a voltage control unit for controlling the energization time of the upper module; a power supply connected to the distribution box to provide a direct current to the distribution box An electronic load connected to the test host and the power distribution box, the electronic load having a current mode for fixing a current value of the probe to be tested during the test. The probe test simulation system of claim 1, further comprising an electric cylinder control interface for setting the movement of the electronic electric cylinder. The probe test simulation system of claim 2, the stroke control unit comprises: a point knob together for setting a point pause period, wherein the start pause period is a time at which the probe to be tested stays at a point position together, The test probe is not in contact with the test substrate when it stays at the starting position; a stop knob is used to set an end pause period, which is the time at which the upper module is at an end position. The probe test simulation system of claim 3, wherein the voltage control unit comprises: a cutoff knob for setting a cutoff time in the pause period of the end point, the cutoff time is that the probe to be tested is not yet energized A power supply knob for setting a power supply time during the pause period of the end point, the power supply time being a time when the probe is energized.