JP2016102772A - Circuit board inspection device and circuit board inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately specify a mechanical error in a movement mechanism with high efficiency while preventing the breakage of a probe.SOLUTION: A circuit board inspection device comprises a movement mechanism 14 for moving a probe 13 in an approaching/separating direction, a control unit 17 for specifying an error between a first position at which the probe 13 is actually located when the movement mechanism 14 moves the probe 13 in the approaching/separating direction and a target position, and a measurement unit 15 for measuring electrostatic capacitance between the probe 13 and an electrode plate 12. In a state in which the movement mechanism 14 moves the probe 13 in the approaching/separating direction from the first position, the control unit 17 specifies, on the basis of a change in the electrostatic capacitance measured by the measurement unit 15, that a conductor pattern 101 and the probe 13 have shifted from a non-contact state to a contact state, and also specifies the actual distance of movement of the probe 13 from the first position in the approaching/separating direction when shifted from the non-contact state to the contact state, and specifies a differential value between the theoretical distance of movement corresponding to the actual distance of movement and the actual distance of movement as an error.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate inspection apparatus and a substrate inspection method for inspecting a substrate by bringing a probe into contact with a conductor portion of the substrate.

  As this type of substrate inspection apparatus, a contact probe movable substrate double-side inspection apparatus (hereinafter also referred to as “substrate inspection apparatus”) disclosed in Patent Document 1 below is known. The substrate inspection apparatus includes a plurality of XY robots, a plurality of vertical slide mechanisms, a plurality of contact probes, a calculator, a control information processing unit, and the like. In this board inspection apparatus, the control information processing unit controls each XY robot based on CAD data or the like, and individually moves each contact probe in the XY direction. The control information processing unit controls each vertical slide mechanism to move each contact probe upward or downward, thereby bringing each contact probe into contact (contact) with the substrate. Further, the calculator measures the resistance value based on the electric signal input through each contact probe, and the control information processing unit organizes the measurement data.

  Here, in this type of substrate inspection apparatus, generally, when the contact probe is moved, the lost motion due to processing accuracy, backlash, elastic deformation, etc. of the XY robot and the mechanical parts constituting the vertical slide mechanism is affected. As a result, an error occurs between the target position (intended position) and the actually moved position. Therefore, in order to bring the contact probe into contact with the substrate with certainty, it is necessary to specify an error during the movement and correct the movement distance when moving the contact probe by the amount of the error. In this case, the vertical error is generally specified by the following specifying method. First, a substrate for specifying errors is placed on a mounting table, the pair of vertical slide mechanisms are controlled to move the contact probes toward the substrate, and the contact probes are brought into contact with the same conductor portion of the substrate. In this case, the movement distance for moving the contact probe to each vertical slide mechanism is, for example, that the contact probe is moved from the standby position (reference position) to the conductor portion with the standby position of the contact probe as a theoretical (design) reference position. The total distance of the theoretical distance (first distance) to the contact position to contact and the theoretical distance (second distance) to further move the contact probe from the contact position to ensure that the contact probe is in contact with the conductor portion. It is defined by (first distance + second distance). Next, the resistance between the contact probes is measured while controlling one of the upper and lower slide mechanisms and moving one of the contact probes upward little by little. At this time, the movement distance until the resistance becomes maximum (impossible to be measured), that is, the movement distance (third distance) until one of the moved contact probes is separated from the conductor portion is specified. In this case, the difference value between the third distance and the second distance is an error for one of the vertical slide mechanisms. Then, the error about the other up-and-down slide mechanism is specified in the above procedure.

JP-A-7-35808 (page 6, FIG. 1)

  However, the conventional board inspection apparatus that specifies an error by the above-described specifying method has the following problems to be improved. That is, in the conventional board inspection apparatus, it is necessary to control a pair of vertical slide mechanisms when specifying an error for one vertical slide mechanism, and thus there is a problem that the specific work is complicated and the efficiency is low. Further, in the conventional substrate inspection apparatus, when the measured value of the resistance is maximized, it is determined that the contact probe is separated from the conductor portion. Therefore, when the contact resistance between the conductor portion of the substrate and the contact probe is large, If this determination is not performed accurately, it may be difficult to specify the error accurately. Further, in the conventional substrate inspection apparatus, when the error of the vertical slide mechanism is large, in the step of identifying the error, the theoretical movement distance (the total distance of the first distance and the second distance described above) for moving the contact probe first. ) Exceeds the elastic deformation amount of the contact probe, and as a result, the contact probe may be damaged. In this case, a method may be considered in which the safety factor is specified largely and the theoretical moving distance is specified short. However, with this method, when the moving distance is too short, the contact probe may not contact the conductor portion. For this reason, in the conventional substrate inspection apparatus that moves the contact probe with respect to the pair of vertical slide mechanisms, when the errors in the vertical slide mechanisms are greatly different from each other, the contact probes are prevented from being damaged, and the contact probes are It is difficult to define an appropriate theoretical movement distance common to each vertical slide mechanism that satisfies the condition of reliably contacting the conductor portion. Specifically, when the error of one of the vertical slide mechanisms in the pair of vertical slide mechanisms is large and the error of the other vertical slide mechanism is small, the theoretical movement distance is set according to the vertical slide mechanism having the large error. If it is defined to be sufficiently short, the moving distance by the other slide mechanism with a small error may be too short and the contact probe may not contact the conductor portion. On the other hand, if the theoretical moving distance is specified to be a little shorter according to the other vertical sliding mechanism with small error, the moving distance by one sliding mechanism with large error may be too long and the contact probe may be damaged. There is.

  The present invention has been made in view of such a problem, and provides a substrate inspection apparatus and a substrate inspection method that can efficiently and accurately specify a mechanical error of a moving mechanism while preventing breakage of a probe unit. The main purpose.

  In order to achieve the above object, a substrate inspection apparatus according to claim 1, wherein a moving mechanism that moves a probe portion in a contacting / separating direction with respect to the substrate and a conductor portion of the substrate by the moving mechanism are provided. An inspection unit for inspecting the substrate based on an electrical signal input / output via the probe unit, wherein the moving mechanism is configured to position the probe unit at a target position. Specified when moving the probe unit in the contact / separation direction, and a processing unit for identifying an error between the first position where the probe unit is actually located and the target position when the probe unit is moved in the contact / separation direction A control unit that corrects the designated distance based on the error and controls the moving mechanism by the designated distance after the correction, and the conductor portion is positioned between the probe unit and the reference electrode. A measuring unit that measures the capacitance between the probe unit and the reference electrode, and the processing unit connects the probe unit positioned at the first position from the first position to the contact point. In a state of further movement in the separation direction, the conductor portion and the probe portion are in a non-contact state based on the change in the capacitance between the probe portion and the reference electrode measured by the measurement portion And the contact state of the probe part from the first position when the state is shifted from the one state to the other state. The actual moving distance in the direction is specified, and the difference value between the theoretical moving distance corresponding to the actual moving distance and the actual moving distance is specified as the error.

  The substrate inspection apparatus according to claim 2 is the substrate inspection apparatus according to claim 1, wherein the non-contact state is defined as one of the states.

  According to a third aspect of the present invention, there is provided the substrate inspection method according to the first aspect in which the probe unit is actually positioned when the moving mechanism moves in the approaching / separating direction in which the probe unit is moved toward and away from the substrate to position the probe unit at the target position. An error between the position and the target position is specified, a specified distance specified when the probe unit is moved in the approaching / separating direction is corrected based on the error, and the moving mechanism is controlled by the specified distance after correction. And a substrate inspection method for inspecting the substrate based on an electrical signal input / output via the probe portion that is brought into contact with the conductor portion of the substrate by the moving mechanism, the probe portion and the reference electrode, In the state in which the moving mechanism further moves the probe portion positioned at the first position from the first position in the contact / separation direction with the conductor portion positioned between The capacitance between the probe portion and the reference electrode is measured, and based on the change in the capacitance between the measured probe portion and the reference electrode, the conductor portion and the probe portion are not It is specified that one of the contact state and the contact state has shifted to the other state, and the probe portion from the first position when the transition has been made from any one of the states to the other state The actual moving distance in the contact / separation direction is specified, and the difference value between the theoretical moving distance corresponding to the actual moving distance and the actual moving distance is specified as the error.

  According to a fourth aspect of the present invention, in the substrate inspection method according to the third aspect, the non-contact state is defined as one of the states.

  The substrate inspection apparatus according to claim 1 and the substrate inspection method according to claim 3, wherein the moving mechanism moves the probe portion in the contact / separation direction from the first position in a static state between the probe portion and the reference electrode. The capacitance is measured, and it is determined based on the change in capacitance that the conductor portion and the probe portion have shifted from one of the non-contact state and the contact state to the other state. The actual moving distance of the probe unit 13 in the contact / separation direction from the first position is specified, and the difference value between the theoretical moving distance and the actual moving distance is specified as an error. Therefore, according to the substrate inspection apparatus and the substrate inspection method, when specifying an error for one moving mechanism, only the moving mechanism needs to be controlled. Control of the moving mechanism when moving the probe unit to an appropriate target position (first position) that can prevent the breakage of each probe unit, as compared with the conventional configuration and method that require a pair of moving mechanisms to be controlled As a result, the efficiency of the work for identifying the error can be sufficiently improved. Moreover, according to this board | substrate inspection apparatus and board | substrate inspection method, it is based on the change of an electrostatic capacitance that the conductor part and the probe part shifted to the other state from any one of a non-contact state and a contact state. In order to identify, the influence of contact resistance between the conductor part and the probe part compared to the conventional configuration and method of measuring the resistance between the two probe parts and identifying the transition based on the change of the resistance value As a result, it is possible to accurately identify that the transition has occurred.

  Moreover, in the board | substrate inspection apparatus of Claim 2, and the board | substrate inspection method of Claim 4, a non-contact state is prescribed | regulated as any one state of a non-contact state and a contact state. In this case, in the configuration in which the contact state is defined as one of the non-contact state and the contact state, the conductor portion and the probe portion are in contact with each other as the target position where the probe portion should first be located when specifying the error. Therefore, when the error of the moving mechanism is large, the actual position when the probe unit is moved to be positioned at the target position is too close to the substrate, and the probe unit collides with the substrate. There is a risk of damage. On the other hand, in this board inspection apparatus and board inspection method, when specifying an error, the target position where the probe part should be first positioned can be set to a position where the conductor part and the probe part are not in contact with each other. Therefore, it is possible to reliably prevent the probe portion from being damaged by setting the position expected to be sufficiently separated from the conductor portion as the target position.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. It is the 1st explanatory view explaining a specific method of error Lr. It is the 2nd explanatory view explaining a specific method of error Lr. It is explanatory drawing explaining a board | substrate inspection method.

  Hereinafter, embodiments of a substrate inspection apparatus and a substrate inspection method will be described with reference to the drawings.

  Initially, the structure of the board | substrate inspection apparatus 1 shown in FIG. 1 as an example of a board | substrate inspection apparatus is demonstrated. As shown in the figure, the substrate inspection apparatus 1 includes a mounting table 11, an electrode plate 12, a probe unit 13, a plurality of moving mechanisms 14 (only one moving mechanism 14 is shown in the figure), and a measuring unit. 15, the memory | storage part 16 and the control part 17 are provided, and it is comprised so that the board | substrate 100 can be test | inspected.

  The mounting table 11 is made of a non-conductive material, and is configured to be able to mount the electrode plate 12 and the substrate 100 as shown in FIG. Further, as an example, the mounting table 11 is configured to be able to adsorb and fix the electrode plate 12 and the substrate 100 by suction of air by an unillustrated air intake device.

  The electrode plate 12 corresponds to a reference electrode, and is configured in a plate shape from a conductive material. The electrode plate 12 is formed with a large number of small-diameter vent holes (not shown), and the placed substrate 100 can be adsorbed by air suction by the placing table 11.

  As an example, as shown in FIG. 1, the probe unit 13 includes a probe pin 31, an arm unit 32 that holds the probe pin 31, and a support unit 33 that supports the arm unit 32. In this case, the arm portion 32 is formed of a material having non-conductivity and elasticity, and in the later-described probing process executed by the moving mechanism 14, as shown in FIG. 4, the probe pin 31 (the tip of the probe pin 31) The probe pin 31 is configured to press the conductor pattern 101 by its elastic force when it is elastically deformed in a state where the portion is in contact with the conductor pattern 101 of the substrate 100.

  The moving mechanism 14 is placed on the electrode plate 12 in the XY direction (the direction along the surface of the substrate 100 placed on the electrode plate 12) and the Z direction (up and down direction) under the control of the control unit 17. The probe portion 13 is moved in the contact / separation direction (in this example, the orthogonal direction) that contacts and separates from the surface of the substrate 100.

  The measurement unit 15 includes a power supply unit (not shown) that outputs a measurement AC voltage Va. The measurement unit 15 is connected to the conductor pattern 101 via the probe pin 31 that is in contact with the conductor pattern 101 (conductor portion) on the substrate 100. An alternating current flowing between the probe pin 31 and the electrode plate 12 when the voltage Va is supplied is detected, and based on the current value, the voltage value of the alternating voltage Va, and the phase difference between the alternating current and the alternating voltage Va, A measurement process for measuring the capacitance Ca between the probe pin 31 (probe unit 13) and the electrode plate 12 is executed.

  The storage unit 16 stores the capacitance Ca measured by the measurement unit 15. In addition, the storage unit 16 stores an error Lr specified in an error specifying process (described later) executed by the control unit 17. In addition, the storage unit 16 is used in an inspection process to be described later executed by the control unit 17, and includes substrate information Db (for example, information indicating the position of the conductor pattern 101) related to the substrate 100 to be inspected and a capacitance reference. The value Cd is stored.

  In addition, the storage unit 16 is used in an error specifying process and a probing process, which will be described later, executed by the control unit 17, and a standby position P1 (see FIG. 2) and a movement start position P2 (corresponding to a target position) for the moving mechanism 14. : See the same figure), and a theoretical movement distance L3 when the probe portion 13 is moved from the movement start position P2 until the probe pin 31 contacts the conductor pattern 101 of the substrate 100 placed on the electrode plate 12 (see FIG. 3) is stored. In this case, the standby position P <b> 1 is the probe unit 13 (when the moving mechanism 14 is standing by with the probe unit 13 positioned above the electrode plate 12 (above the substrate 100 placed on the electrode plate 12)). Specifically, it is a theoretical (design) position where the lower end portion of the support portion 33 in the probe portion 13 (see FIG. 2) should be located, and is defined in advance for each moving mechanism 14. The movement start position P2 is a position spaced downward from the standby position P1 by a predetermined distance, such as the position of the mounting surface (upper surface) of the mounting table 11, the thickness of the electrode plate 12 and the substrate 100, and the like. In consideration of the above, the position where the probe pin 31 does not contact the substrate 100 is defined in advance for each moving mechanism 14.

  The control part 17 controls each component which comprises the board | substrate inspection apparatus 1 according to operation with respect to the operation part outside a figure. Specifically, the control unit 17 controls the moving mechanism 14 to move the probe unit 13 and execute a probing process in which the probe pins 31 are brought into contact with the conductor pattern 101 of the substrate 100. In addition, the control unit 17 controls the measurement unit 15 to execute measurement processing.

  Moreover, the control part 17 comprises a process part with the measurement part 15, and performs an error specific process. In this error specifying process, the control unit 17 determines the position (target position) at which the probe unit 13 should be positioned due to the processing accuracy of the mechanical parts constituting the moving mechanism 14, the lost motion due to backlash, elastic deformation, and the like. A mechanical error Lr (distance in the Z direction between the target position and the first position Pr) generated between the actual position (hereinafter also referred to as “first position Pr”) is specified. In this case, the control unit 17 corrects the specified distance L4 (see FIG. 4) when the probe unit 13 is moved in the Z direction (contact / separation direction) in the probing process by the moving mechanism 14 based on the error Lr. The control unit 17 constitutes an inspection unit together with the measurement unit 15, and executes an inspection process for inspecting the substrate 100 by comparing the capacitance Ca measured by the measurement unit 15 with the reference value Cd.

  Next, a substrate inspection method for inspecting the substrate 100 using the substrate inspection apparatus 1 will be described with reference to the drawings.

  First, prior to the inspection of the substrate 100 to be inspected, the mechanical error Lr of the moving mechanism 14 is specified. Specifically, the electrode plate 12 is mounted on the mounting table 11, and then, as shown in FIG. 1, the error specifying substrate 100 on which the conductor pattern 101 having a large area is generated is placed on the electrode plate 12. Placed on. Subsequently, the intake device (not shown) is operated. At this time, the electrode plate 12 is fixed to the mounting table 11 and the substrate 100 is fixed to the electrode plate 12 by suction of air from the suction holes formed in the mounting table 11.

  Next, an operation unit (not shown) is operated to instruct execution of the error specifying process. In response to this, the control unit 17 executes an error specifying process. In this error specifying process, the control unit 17 reads the position information Dp from the storage unit 16. Subsequently, the control unit 17 selects one of the moving mechanisms 14 and specifies the standby position P1 for the moving mechanism 14 (hereinafter also referred to as “processing target moving mechanism 14”) from the position information Dp. Next, the control unit 17 controls the moving mechanism 14 to be processed, and moves the probe unit 13 so that the lower end portion of the support unit 33 in the probe unit 13 is positioned at the standby position P1 as indicated by a broken line in FIG. Move.

  Subsequently, the control unit 17 specifies the movement start position P2 for the movement mechanism 14 to be processed from the position information Dp. Next, the control unit 17 specifies a theoretical (design) separation distance L1 (see FIG. 2) in the Z direction between the standby position P1 and the movement start position P2. Subsequently, the moving mechanism 14 to be processed is controlled so as to move the probe unit 13 in the Z direction by the specified separation distance L1. In this case, as shown in the figure, due to the lost motion of the movement mechanism 14 to be processed, the probe unit 13 is actually located at the first position Pr below the movement start position P2. To do.

  Next, the control unit 17 controls the moving mechanism 14 to start a moving process for moving the probe unit 13 positioned at the first position Pr gradually (at a low speed) in the Z direction (down in this example). In addition, the control unit 17 controls the measurement unit 15 to start the measurement process in accordance with the start of the movement process. In this measurement process, the measurement unit 15 outputs an AC voltage Va for measurement from the power supply unit, and when an AC current flows between the probe pin 31 and the electrode plate 12 due to the output of the AC voltage Va, An alternating current is detected, and the capacitance Ca between the probe pin 31 and the electrode plate 12 is measured based on the current value, the voltage value of the alternating voltage Va, and the phase difference between the alternating current and the alternating voltage Va. In this case, since the probe pin 31 is not in contact with the conductor pattern 101 at the start of the movement process (see FIG. 2), the measurement unit 15 measures the capacitance Ca of 0F (or almost 0F), This state continues until the probe pin 31 contacts the conductor pattern 101.

  Subsequently, as shown in FIG. 3, when the probe pin 31 comes into contact with the conductor pattern 101, the capacitance Ca having a certain size according to the physical properties between the conductor pattern 101 and the electrode plate 12 is measured by the measurement unit 15. Measured by. That is, when the probe pin 31 contacts the conductor pattern 101, the capacitance Ca changes from 0F (or almost 0F) to a certain level. At this time, the control unit 17 shifts the conductor pattern 101 and the probe pin 31 from the non-contact state to the contact state (an example of transition from one of the non-contact state and the contact state to the other state). Is determined. That is, the control unit 17 specifies that the conductor pattern 101 and the probe pin 31 have shifted from the non-contact state to the contact state based on the change in the capacitance Ca.

  Next, the control unit 17 ends the movement process and stops the movement of the probe unit 13 by the movement mechanism 14. Subsequently, the control unit 17 determines the actual movement distance L2 in the Z direction of the probe unit 13 from the first position Pr when the conductor pattern 101 and the probe pin 31 are shifted from the non-contact state to the contact state (see FIG. 3). ). Next, the controller 17 moves from the movement start position P2 until the probe pin 31 comes into contact with the conductor pattern 101 until the theoretical movement distance L3 (that is, the theoretical movement distance L2 corresponding to the actual movement distance L2). Is determined from the position information Dp. Subsequently, the control unit 17 calculates (specifies) the difference value between the actual moving distance L2 and the theoretical moving distance L3 as an error Lr (see the figure). Next, the control unit 17 stores the error Lr in the storage unit 16.

  In this case, when the actual movement distance L2 and the theoretical movement distance L3 are different, that is, when the difference value between the actual movement distance L2 and the theoretical movement distance L3 is other than “0”, the movement as the target position is performed. The start position P2 is different from the first position Pr where the probe unit 13 is located when the probe unit 13 is moved in the Z direction to position the probe unit 13 at the movement start position P2. The error between the position P2 and the first position Pr (the distance in the Z direction between the movement start position P2 and the first position Pr) corresponds to the error Lr described above.

  Subsequently, the control unit 17 selects another moving mechanism 14, specifies the error Lr by the above-described procedure, and stores it in the storage unit 16. Next, when the specification of the error Lr for all the moving mechanisms 14 and the storage in the storage unit 16 are completed, the control unit 17 ends the error specifying process.

  Subsequently, when inspecting the substrate 100 to be inspected, as shown in FIG. 4, the substrate 100 is placed on the electrode plate 12, and then the suction device is operated to fix the electrode plate 12 and the substrate 100. . Subsequently, the operation unit is operated to instruct the start of the inspection process. In response to this, the control unit 17 starts an inspection process. In this inspection process, the control unit 17 reads the substrate information Db for the substrate 100 to be inspected from the storage unit 16. Next, the control unit 17 specifies the position of the conductor pattern 101 from the board information Db, controls the moving mechanism 14 to move the probe unit 13 in the XY direction, and moves the probe unit 13 to the standby position P1 above the conductor pattern 101. Position.

  Subsequently, based on the position information Dp and the board information Db, the control unit 17 makes the probe pin 31 come into contact with the conductor pattern 101 and further the arm part of the probe unit 13 in order to make the probe pin 31 contact with the conductor pattern 101 reliably. A theoretically (designed) designated distance L4 (see FIG. 4) in the Z direction from the standby position P1 necessary for elastically deforming (deflecting) 32 is specified. Next, the control unit 17 reads the error Lr for the moving mechanism 14 stored in the storage unit 16, and corrects the specified distance L4 by increasing or decreasing the error Lr with respect to the specified distance L4 (in this example, decreasing). To do. Subsequently, the control unit 17 controls the moving mechanism 14 to move the probe unit 13 in the Z direction by the corrected specified distance L5. Thereby, the probe pin 31 contacts the conductor pattern 101 as shown in FIG. At this time, the probe pin 31 presses the conductor pattern 101 by an elastic force generated by the arm portion 32 being bent. For this reason, the probe pin 31 reliably contacts the conductor pattern 101.

  Next, the control unit 17 controls the measurement unit 15 to execute measurement processing. At this time, as described above, the measurement unit 15 outputs the AC voltage Va for measurement, and the current value of the AC current flowing between the probe pin 31 and the electrode plate 12 by the output of the AC voltage Va, the AC The electrostatic capacitance Ca between the probe pin 31 and the electrode plate 12 is measured based on the voltage value of the voltage Va and the phase difference between the alternating current and the alternating voltage Va. Subsequently, the control unit 17 compares the electrostatic capacitance Ca measured by the measurement unit 15 with the reference value Cd stored in the storage unit 16 to determine whether the conductor pattern 101 is acceptable.

  In this case, as an example, the control unit 17 determines that the conductor pattern 101 is good when the capacitance Ca is within the reference range centered on the reference value Cd. Further, when the capacitance Ca exceeds the upper limit value of the reference range, the control unit 17 determines that the conductor pattern 101 is in a short-circuit state with another conductor pattern 101 or the like, and the capacitance Ca is the reference. When it is less than the lower limit of the range, it is determined that the conductor pattern 101 is in a defective state in which the conductor pattern 101 is disconnected. Next, the control unit 17 similarly determines pass / fail in the other conductor patterns 101, determines pass / fail of the substrate 100 based on pass / fail results for each conductor pattern 101, and the determination result (inspection result). Is displayed on the display unit (not shown), and the inspection process is terminated.

  As described above, in the substrate inspection apparatus 1 and the substrate inspection method, the probe pin 31 (probe portion 13), the electrode plate 12, and the electrode plate 12 in a state where the moving mechanism 14 moves the probe portion 13 from the first position Pr in the Z direction. The capacitance Ca is measured, and the fact that the conductor pattern 101 and the probe pin 31 have shifted from the non-contact state to the contact state is specified based on the change in the capacitance Ca, and the first when the transition is made The actual movement distance L2 in the Z direction of the probe unit 13 from the position Pr is specified, and the difference value between the theoretical movement distance L3 and the actual movement distance L2 is specified as the error Lr. For this reason, according to the substrate inspection apparatus 1 and the substrate inspection method, when the error Lr for one moving mechanism 14 is specified, only the moving mechanism 14 needs to be controlled. Compared to a conventional configuration and method that requires a pair of moving mechanisms 14 to be controlled when specifying Lr, the probe unit 13 can be moved to an appropriate movement start position P2 (first position Pr) that can prevent damage to each probe unit 13. As a result of easily controlling the moving mechanism 14 when moving the probe unit 13, it is possible to sufficiently improve the efficiency of the work for specifying the error Lr. Moreover, according to this board | substrate inspection apparatus 1 and a board | substrate inspection method, in order to specify based on the change of the electrostatic capacitance Ca, it has specified that the conductor pattern 101 and the probe pin 31 transfered from the non-contact state to the contact state. Compared with the conventional configuration and method for measuring the resistance between the probe pins 31 and identifying the transition based on the change in the resistance value, the influence of the contact resistance between the conductor pattern 101 and the probe pin 31 is reduced. As a result, it is possible to accurately identify the migration.

  In the substrate inspection apparatus 1 and the substrate inspection method, the non-contact state is defined as one of the non-contact state and the contact state. In this case, in the configuration in which the contact state is defined as one of the non-contact state and the contact state, the movement start position P2 (target position) where the probe unit 13 should be first positioned when the error Lr is specified is a conductor. Since it is necessary to set the position where the pattern 101 and the probe pin 31 are in contact with each other, when the error Lr of the moving mechanism 14 is large, the actual time when the probe unit 13 is moved to be positioned at the movement start position P2. Since the position is too close to the substrate 100, the probe unit 13 may collide with the substrate 100 and be damaged. On the other hand, in this board | substrate inspection apparatus 1 and a board | substrate inspection method, when specifying an error, the conductor pattern 101 and the probe part 13 will be in a non-contact state in the movement start position P2 which should position the probe part 13 first. Since the position can be set, the position expected to be sufficiently separated from the conductor pattern 101 is set as the movement start position P2, so that the probe portion 13 can be reliably prevented from being damaged.

  The substrate inspection apparatus and the substrate inspection method are not limited to the above configuration and method. For example, in the error specifying process, the example in which the position at which the conductor pattern 101 and the probe pin 31 are not in contact with each other on the substrate 100 is defined as the movement start position P2 has been described above, but the probe pin 31 and the conductor pattern 101 are in contact with each other. And the structure and method which prescribe | regulate as the movement start position P2 the position from which the arm part 32 will be in the state which elastically deforms (deflection) can also be employ | adopted. In this case, in this configuration and method, the probe portion 13 is gradually raised from the movement start position P2, and the change in the capacitance Ca indicates that the probe pin 31 and the conductor pattern 101 have shifted from the contact state to the non-contact state. Based on the change in capacitance based on

  In addition, although an example using the electrode plate 12 that is separate from the mounting table 11 has been described above, a configuration in which the mounting table 11 and the electrode plate 12 are integrated, or the mounting table 11 has conductivity (the mounting table 11 itself is It is also possible to adopt a configuration that also functions as the electrode plate 12 and a method using these.

  In addition, when a conductor pattern having a large area such as a reference electrode (a ground pattern, a power supply pattern, etc.) is formed on the inside or the back surface of the substrate 100, a configuration and method using the conductor pattern as the electrode plate 12 may be employed. it can.

  In the above example, the quality of the conductor pattern 101 is also determined based on the capacitance Ca in the inspection process for inspecting the substrate 100 to be inspected. It is also possible to measure the resistance value between them and determine the quality of the conductor pattern 101 based on the measured value (resistance value).

1 Substrate inspection device 1
12 Electrode Plate 13 Probe Unit 14 Movement Mechanism 15 Measurement Unit 17 Control Unit 100 Substrate 101 Conductor Pattern Ca Capacitance Lr Error L2 Movement Distance L3 Separation Distance P2 Movement Start Position Pr First Position

Claims (4)

A moving mechanism for moving the probe portion in a contacting / separating direction with respect to the substrate, and an electric signal input / output via the probe portion which is brought into contact with the conductor portion of the substrate by the moving mechanism. A substrate inspection apparatus comprising an inspection unit for inspecting a substrate,
A process of specifying an error between the target position and the first position where the probe section is actually located when the moving mechanism moves the probe section in the approaching / separating direction to position the probe section at the target position. And
A control unit that corrects a specified distance specified when moving the probe unit in the approaching / separating direction based on the error and controls the moving mechanism by the specified distance after correction;
A measuring unit that measures the capacitance between the probe unit and the reference electrode in a state where the conductor unit is located between the probe unit and the reference electrode;
The processing unit includes the probe unit measured by the measurement unit and the probe unit in a state where the moving mechanism further moves the probe unit located at the first position from the first position in the approaching / separating direction. Based on the change in capacitance between the reference electrode and the reference electrode, the conductor portion and the probe portion are specified to have shifted from one of a non-contact state and a contact state to the other state, and A theoretical movement distance corresponding to the actual movement distance is specified by specifying an actual movement distance of the probe portion from the first position when moving from one state to the other state in the approaching / separating direction. And a substrate inspection apparatus that specifies a difference value between the actual movement distance as the error.   The substrate inspection apparatus according to claim 1, wherein the non-contact state is defined as one of the states. Specifying the error between the target position and the first position where the probe part is actually located when the moving mechanism moves the probe part in the approaching / separating direction so as to position the probe part at the target position; Based on the error, the designated distance designated when moving the probe part in the approaching / separating direction is corrected based on the error, and the moving mechanism is controlled by the designated distance after the correction. A substrate inspection method for inspecting the substrate based on an electrical signal input / output via the probe unit being contacted,
The moving mechanism further moves the probe unit located at the first position from the first position in the contact / separation direction with the conductor portion located between the probe unit and the reference electrode. In the state, the capacitance between the probe unit and the reference electrode is measured, and based on the measured change in the capacitance between the probe unit and the reference electrode, the conductor unit and the probe unit And the probe from the first position when the state has shifted from one of the non-contact state and the contact state to the other state, A substrate inspection method in which an actual movement distance in the contact / separation direction of a part is specified, and a difference value between a theoretical movement distance corresponding to the actual movement distance and the actual movement distance is specified as the error.   4. The substrate inspection method according to claim 3, wherein the non-contact state is defined as one of the states.

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