TWM553242U - Material-feeding device - Google Patents

Material-feeding device Download PDF

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Publication number
TWM553242U
TWM553242U TW106214215U TW106214215U TWM553242U TW M553242 U TWM553242 U TW M553242U TW 106214215 U TW106214215 U TW 106214215U TW 106214215 U TW106214215 U TW 106214215U TW M553242 U TWM553242 U TW M553242U
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TW
Taiwan
Prior art keywords
substrates
pick
feeding device
feeding
place
Prior art date
Application number
TW106214215U
Other languages
Chinese (zh)
Inventor
Kai Ming Xu
Zhen Rong Chen
ying yu Qiu
Yao Hui He
Yue Jie Wang
Original Assignee
Walsin Tech Corp
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Publication date
Application filed by Walsin Tech Corp filed Critical Walsin Tech Corp
Priority to TW106214215U priority Critical patent/TWM553242U/en
Publication of TWM553242U publication Critical patent/TWM553242U/en

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Description

進料裝置Feeding device

本創作是關於一種進料裝置,特別是關於一種用於天線基板焊接時的進料裝置。This creation relates to a feeding device, and more particularly to a feeding device for welding an antenna substrate.

現有技術將各種電子元件、電路元件、晶片、或基板焊接於電路板時,往往是以人工方式將各元件或基板放置於電路板後再以機器進行焊接。然後,人工方式將元件或基板放置於電路板的過程不僅效率低落,還容易發生錯誤,甚至可能造成危險。因此,以人工方式將元件或基板放置於電路板存在許多問題。In the prior art, when various electronic components, circuit components, wafers, or substrates are soldered to a circuit board, each component or substrate is often manually placed on a circuit board and then soldered by a machine. Then, the process of manually placing the component or substrate on the board is not only inefficient, but also prone to errors and even dangerous. Therefore, there are many problems in manually placing components or substrates on a circuit board.

有鑑於此,提出一種更佳的改善方案,乃為此業界亟待解決的問題。In view of this, it is an urgent problem to be solved in the industry to propose a better improvement solution.

本創作的主要目的在於,提出一種進料裝置,其能自動地供應基板進行後續加工,以提升生產效率。The main purpose of this creation is to propose a feeding device that can automatically supply substrates for subsequent processing to increase production efficiency.

為達上述目的,本創作所提出的進料裝置具有: 一承載座; 一進料匣,其可拆卸地設置於該承載座;該進料匣的後側面形成有一開口,且該進料匣的前側面形成有一間隙,該等基板容置於該進料匣內,且該等基板能通過該間隙; 一推送機構,其具有一推抵件,該推抵件選擇性地移動進入該進料匣的該開口,並將容置於該進料匣內的其中一該基板推出通過該間隙;以及 一取放機構,其能拿取並移動被該推送機構所推出的該其中一基板。In order to achieve the above object, the feeding device proposed by the present invention has: a carrier; a feeding magazine detachably disposed on the carrier; an opening formed on a rear side of the feeding magazine, and the feeding device Forming a gap on the front side, the substrates are received in the feed cassette, and the substrates can pass through the gap; a pushing mechanism having a pushing member, the pushing member selectively moving into the gap The opening of the magazine and one of the substrates received in the feed cassette is pushed out through the gap; and a pick-and-place mechanism that can pick up and move the one of the substrates pushed out by the push mechanism.

因此,本創作的優點在於,透過進料匣與推送機構相配合,能自動化地一次供應一個基板。而透過取放機構,能將所供應的基板移動至定位並轉至預定角度,以放置於電路板上進行後續焊接等加工。因此,本創作能自動地化供應基板並進行上料,相較於以人工拿取基板進行上料能有較高的效率及精確度。Therefore, the present invention has an advantage in that one substrate can be automatically supplied at a time through the feeding hopper in cooperation with the pushing mechanism. Through the pick-and-place mechanism, the supplied substrate can be moved to a position and rotated to a predetermined angle to be placed on the circuit board for subsequent welding and the like. Therefore, the present invention can automatically supply the substrate and perform the loading, which is more efficient and accurate than the manual take-up of the substrate.

如前所述之進料裝置中: 該承載座形成有至少一定位凸部;且 該進料匣形成有至少一定位凹部,當該進料匣設置於該承載座時,該至少一定位凸部容置於該至少一定位凹部。In the feeding device as described above, the carrier is formed with at least one positioning protrusion; and the feeding cassette is formed with at least one positioning recess. When the feeding cassette is disposed on the carrier, the at least one positioning convex The portion is placed in the at least one positioning recess.

如前所述之進料裝置中,該進料匣具有: 一容置部,其形成有: 一容置空間,該等基板以堆疊方式容置於該容置空間;及 一長槽,其垂直延伸並連通於該容置空間;以及 一負重塊,其設置於該容置空間內,並放置於該等基板上方;該負重塊形成有一把手,其自該長槽凸出。In the feeding device as described above, the feeding device has: a receiving portion formed with: an accommodating space, the substrates are received in the accommodating space in a stacked manner; and a long groove, Vertically extending and communicating with the accommodating space; and a load block disposed in the accommodating space and placed above the substrates; the load block is formed with a handle protruding from the long groove.

如前所述之進料裝置中,該進料匣具有一基座部,其形成有一移動槽,該移動槽與該進料匣前側面的該間隙連通;當該其中一基板被該推送機構推出後,該推送機構更推動該其中一基板於該移動槽內移動。In the feeding device as described above, the feed cassette has a base portion formed with a movement groove communicating with the gap of the front side of the feed cassette; when the substrate is driven by the push mechanism After the launch, the pushing mechanism further pushes one of the substrates to move in the moving slot.

如前所述之進料裝置中,該推送機構具有一位移組件,該推抵件固設於該位移組件上,且該位移組件能帶動該推抵件往覆移動。In the feeding device as described above, the pushing mechanism has a displacement assembly, the pushing member is fixed on the displacement assembly, and the displacement assembly can drive the pushing member to move over.

如前所述之進料裝置中,該推送機構的該推抵件的寬度等於該等基板。In the feeding device as described above, the pushing member has a width equal to the substrates.

如前所述之進料裝置中,該取放機構具有: 一移動組件;及 一取放組件,其固設於該移動組件並能被該移動組件移動;該取放組件能拿取或釋放被該推送機構所推出的該其中一基板。In the feeding device as described above, the pick-and-place mechanism has: a moving component; and a pick-and-place assembly fixed to the movable component and movable by the moving component; the pick-and-place assembly can be taken or released One of the substrates that is pushed out by the push mechanism.

如前所述之進料裝置中,該取放機構更具有一轉動組件,其固設於該移動組件上,且該取放組件透過該轉動組件固設於該移動組件上。In the feeding device as described above, the pick-and-place mechanism further has a rotating component fixed to the moving component, and the pick-and-place component is fixed to the moving component through the rotating component.

首先請參考圖1。本創作提出一種進料裝置,其用以供應複數個基板9,例如為天線基板。進料裝置具有一承載座10、一進料匣20、一推送機構30、及一取放機構40。Please refer to Figure 1 first. The present application proposes a feeding device for supplying a plurality of substrates 9, such as an antenna substrate. The feeding device has a carrier 10, a feeding magazine 20, a pushing mechanism 30, and a pick-and-place mechanism 40.

接著請參考圖2。承載座10具有一平台,平台的上側面形成有至少一定位凸部11。於本實施例中共有二個定位凸部11,其分別設置於平台的兩側邊緣。Then please refer to Figure 2. The carrier 10 has a platform, and the upper side of the platform is formed with at least one positioning protrusion 11. In this embodiment, there are two positioning protrusions 11 which are respectively disposed on both side edges of the platform.

接著請一併參考圖3至圖5。進料匣20可拆卸地設置於承載座10的平台上。進料匣20的後側面形成有一開口212,且進料匣20的前側面形成有一間隙213。基板9容置於進料匣20內,且基板9能通過間隙213。Please refer to Figure 3 to Figure 5 together. The feed cassette 20 is detachably disposed on the platform of the carrier 10. An opening 212 is formed in the rear side of the feed crucible 20, and a gap 213 is formed on the front side of the feed crucible 20. The substrate 9 is housed in the feed cassette 20, and the substrate 9 can pass through the gap 213.

具體而言,進行匣具有一容置部21、一負重塊22、及一基座部23。容置部21形成有一容置空間及一長槽211,且容置部21的後側面形成有前述開口212,而容置部21的前側面形成有前述間隙213。開口212及間隙213連通於容置空間內。基板9以上下堆疊方式容置於容置空間內。長槽211垂直延伸於容置部21的一側面,且本實施例中為容置部21的後側面,且長槽211連通於容置空間及開口212。Specifically, the cymbal has a receiving portion 21, a load block 22, and a base portion 23. The accommodating portion 21 is formed with an accommodating space and a long groove 211. The rear side surface of the accommodating portion 21 is formed with the opening 212, and the front side surface of the accommodating portion 21 is formed with the gap 213. The opening 212 and the gap 213 are in communication with the accommodating space. The substrate 9 is placed in the upper and lower stacked manners in the accommodating space. The long slot 211 extends perpendicularly to a side surface of the accommodating portion 21, and is a rear side surface of the accommodating portion 21 in the embodiment, and the long slot 211 communicates with the accommodating space and the opening 212.

負重塊22設置於容置空間內,放置於基板9上方。藉此,負重塊22能壓迫基板9,使基板9能保持抵靠於容置空間內的底面。負重塊22形成有一把手220,其自長槽211凸出。負重塊22的寬度可等於基板9的寬度或等於容置空間的寬度,因此負重塊22能沿容置空間內上下移動並壓迫基板9,且同時把手220能沿長槽211上下移動。The load block 22 is disposed in the accommodating space and placed above the substrate 9. Thereby, the load weight 22 can press the substrate 9 so that the substrate 9 can be held against the bottom surface in the accommodating space. The load block 22 is formed with a handle 220 that projects from the elongated slot 211. The width of the load block 22 may be equal to the width of the substrate 9 or equal to the width of the accommodating space, so that the load block 22 can move up and down along the accommodating space and press the substrate 9, and at the same time, the handle 220 can move up and down along the long groove 211.

基座部23固設於容置部21的下端,並形成有至少一定位凹部231及一移動槽232。當進料匣20設置於承載座10時,至少一定位凸部11容置於至少一定位凹部231。於本實施例中,基座部23共有二定位凹部231,且具體而言,各定位凹部231為一貫穿於基座部23的一穿孔。因此,承載座10的二定位凸部11分別容置於基座部23的二定位凹部231,以定位進料匣20及防止進料過程中進料匣20位移。The base portion 23 is fixed to the lower end of the accommodating portion 21 and is formed with at least one positioning recess 231 and a moving groove 232. When the feeding cassette 20 is disposed on the carrier 10 , at least one positioning protrusion 11 is received in the at least one positioning recess 231 . In the embodiment, the base portion 23 has two positioning recesses 231 , and specifically, each of the positioning recesses 231 is a through hole penetrating through the base portion 23 . Therefore, the two positioning protrusions 11 of the carrier 10 are respectively received in the two positioning recesses 231 of the base portion 23 to position the feed cassette 20 and prevent the displacement of the feed cassette 20 during the feeding process.

移動槽232形成於基座部23的上側面,並與進料匣20前側面的間隙213連通,且移動槽232的寬度等於基板9的寬度。藉此,基板9由容置部21的間隙213移出後能於移動槽232內移動。The moving groove 232 is formed on the upper side of the base portion 23 and communicates with the gap 213 of the front side of the feed cassette 20, and the width of the moving groove 232 is equal to the width of the substrate 9. Thereby, the substrate 9 can be moved in the moving groove 232 after being removed by the gap 213 of the accommodating portion 21.

接著請參考圖1及圖5。推送機構30具有一位移組件31及一推抵件32。推抵件32固設於位移組件31上,且位移組件31能帶動推抵件32往覆移動。推送機構30的推抵件32的寬度等於基板9;換言之,也等於移動槽232的寬度。本實施例中,推抵件32為一片體,但不在此限,也可為多個平行間隔設置的桿體而能平均地推動基板9。進料匣20的開口212的形狀對應於推抵件32的形狀。Please refer to FIG. 1 and FIG. 5 next. The pushing mechanism 30 has a displacement assembly 31 and a pushing member 32. The pushing member 32 is fixed on the displacement assembly 31, and the displacement assembly 31 can drive the pushing member 32 to move over. The width of the pushing member 32 of the pushing mechanism 30 is equal to the substrate 9; in other words, it is also equal to the width of the moving groove 232. In this embodiment, the pushing member 32 is a single piece, but not limited thereto, and the plurality of parallel spaced rods can be used to push the substrate 9 evenly. The shape of the opening 212 of the feed port 20 corresponds to the shape of the pusher 32.

當推抵件32往覆移動時,推抵件32移動進入進料匣20的開口212,並通過進料匣20的內部空間後,再由進料匣20的間隙213伸出而於移動槽232內移動。藉此將容置於進料匣20內的其中一基板9推出通過間隙213。When the pushing member 32 moves upward, the pushing member 32 moves into the opening 212 of the feeding bowl 20, passes through the inner space of the feeding cassette 20, and then protrudes from the gap 213 of the feeding cassette 20 to move the groove. Move within 232. Thereby, one of the substrates 9 accommodated in the feed cassette 20 is pushed out through the gap 213.

取放機構40用以拿取並移動被推送機構30所推出的其中一基板9。取放機構40可具有一移動組件41、一轉動組件42、及一取放組件43。The pick-and-place mechanism 40 is configured to take and move one of the substrates 9 pushed out by the pushing mechanism 30. The pick and place mechanism 40 can have a moving component 41, a rotating component 42, and a pick and place assembly 43.

轉動組件42固設於移動組件41上,並可被移動組件41帶動進行三維移動,即轉動組件42可進行上下、前後、及左右移動。取放組件43固設於移動組件41並能被移動組件41移動,且具體而言是固設於轉動組件42上而能連動轉動組件42一起進行三維移動。換言之,取放組件43透過轉動組件42固設於移動組件41上。The rotating component 42 is fixed on the moving component 41 and can be moved by the moving component 41 for three-dimensional movement, that is, the rotating component 42 can move up and down, front and rear, and left and right. The pick-and-place assembly 43 is fixed to the moving assembly 41 and can be moved by the moving assembly 41, and specifically fixed to the rotating assembly 42 to be able to move the rotating assembly 42 together for three-dimensional movement. In other words, the pick-and-place assembly 43 is fixed to the moving assembly 41 through the rotating assembly 42.

取放組件43能拿取或釋放被推送機構30所推出的其中一基板9,例如能以真空方式吸附基板9。而透過轉動組件42,取放組件43能進行轉動,因此能於拿取基板9後,將基板9轉動至正確的方向。The pick-and-place assembly 43 can take or release one of the substrates 9 pushed out by the push mechanism 30, for example, the substrate 9 can be vacuum-adsorbed. By the rotation of the assembly 42, the pick-and-place assembly 43 can be rotated, so that the substrate 9 can be rotated to the correct direction after the substrate 9 is taken.

接著請參考圖6至圖9。於供應基板9前,可先準備多個進料匣20,並將基板9放入進料匣20的容置部21內,再把負重塊22放入進料匣20內而位於基板9的上方。接著,將其中一進料匣20安裝於承載座10上,且使進料匣20的基座部23的定位凹部231對齊承載座10的定位凸部11,使進料匣20能精確對位。Please refer to FIG. 6 to FIG. 9 next. Before the substrate 9 is supplied, a plurality of feed cassettes 20 may be prepared, and the substrate 9 is placed in the receiving portion 21 of the feed cassette 20, and the load weight block 22 is placed in the feed cassette 20 to be located on the substrate 9. Above. Next, one of the feed cassettes 20 is mounted on the carrier 10, and the positioning recess 231 of the base portion 23 of the feed cassette 20 is aligned with the positioning protrusion 11 of the carrier 10 so that the feed cassette 20 can be accurately aligned. .

然後,如圖6所示,啟動推送機構30,使推抵件32由進料匣20的開口212伸入容置空間,並將位於容置空間最下方的基板9由進料匣20的間隙213推出。當容置空間內的其中一基板9被推送機構30推出後,推送機構30的推抵件32更推動其中一基板9於移動槽232內移動。Then, as shown in FIG. 6, the pushing mechanism 30 is activated to extend the pushing member 32 from the opening 212 of the feeding cassette 20 into the accommodating space, and the substrate 9 located at the bottom of the accommodating space is separated by the gap of the feeding cassette 20. 213 launched. After one of the substrates 9 in the accommodating space is pushed out by the pushing mechanism 30, the pushing member 32 of the pushing mechanism 30 further pushes one of the substrates 9 to move in the moving groove 232.

如圖7所示,當基板9被推抵件32推動至移動槽232的底端時,取放機構40的取放組件43即向下移動而拿取該基板9。如圖8或圖9所示,接著取放機構40的移動組件41將取放組件43向上移動並同時水平移動,而取放機構40的轉動組件42將取放組件43轉至預定角度,然後取放組件43再釋放該基板9,完成一次供應。As shown in FIG. 7, when the substrate 9 is pushed by the pushing member 32 to the bottom end of the moving groove 232, the pick-and-place assembly 43 of the pick-and-place mechanism 40 is moved downward to take the substrate 9. As shown in FIG. 8 or FIG. 9, the moving assembly 41 of the pick-and-place mechanism 40 moves the pick-and-place assembly 43 upward and simultaneously moves horizontally, and the rotating assembly 42 of the pick-and-place mechanism 40 rotates the pick-and-place assembly 43 to a predetermined angle, and then The pick and place assembly 43 releases the substrate 9 to complete a supply.

當取放機構40運作時,為了增加供應效率,推送機構30同時將另一基板9由進料匣20推出。另一方面,當進料匣20內的所有基板都供應完畢,可卸下該進料匣20而換上另一裝有基板的進料匣20。When the pick-and-place mechanism 40 operates, the push mechanism 30 simultaneously pushes the other substrate 9 from the feed cassette 20 in order to increase the supply efficiency. On the other hand, when all of the substrates in the feed cassette 20 are supplied, the feed cassette 20 can be removed and replaced with another feed cassette 20 containing the substrate.

綜上所述,本創作透過進料匣20與推送機構30相配合,能自動化地一次供應一個基板9。而透過取放機構40,能將所供應的基板9移動至定位並轉至預定角度,以放置於電路板上進行後續焊接等加工。因此,本創作能自動地化供應基板9並進行上料,相較於以人工拿取基板9進行上料能有較高的效率及精確度。In summary, the present invention cooperates with the push mechanism 30 through the feed cassette 20 to automatically supply one substrate 9 at a time. Through the pick-and-place mechanism 40, the supplied substrate 9 can be moved to a position and rotated to a predetermined angle to be placed on the circuit board for subsequent welding and the like. Therefore, the present invention can automatically supply the substrate 9 and perform the loading, which is more efficient and accurate than the manual taking of the substrate 9.

10‧‧‧承載座
11‧‧‧定位凸部
20‧‧‧進料匣
21‧‧‧容置部
211‧‧‧長槽
212‧‧‧開口
213‧‧‧間隙
22‧‧‧負重塊
220‧‧‧把手
23‧‧‧基座部
231‧‧‧定位凹部
232‧‧‧移動槽
30‧‧‧推送機構
31‧‧‧位移組件
32‧‧‧推抵件
40‧‧‧取放機構
41‧‧‧移動組件
42‧‧‧轉動組件
43‧‧‧取放組件
9‧‧‧基板
10‧‧‧Hosting
11‧‧‧ positioning convex
20‧‧‧Feeding匣
21‧‧‧ 容部
211‧‧‧long slot
212‧‧‧ openings
213‧‧‧ gap
22‧‧‧Loading weight
220‧‧‧Handle
23‧‧‧Base section
231‧‧‧ positioning recess
232‧‧‧Mobile slot
30‧‧‧ Pushing agency
31‧‧‧Displacement components
32‧‧‧Parts
40‧‧‧ pick-and-place mechanism
41‧‧‧Mobile components
42‧‧‧Rotating components
43‧‧‧ pick and place components
9‧‧‧Substrate

圖1為本創作的立體示意圖。 圖2為本創作於進料匣拆卸後的立體示意圖。 圖3為本創作的進料匣的立體示意圖。 圖4為本創作的進料匣的局部放大圖。 圖5為本創作的進料匣的剖面示意圖。 圖6至圖9為本創作的動作示意圖。Figure 1 is a perspective view of the creation. Figure 2 is a perspective view of the creation of the feed hopper after disassembly. Figure 3 is a perspective view of the feed cassette of the present invention. Figure 4 is a partial enlarged view of the feed cassette of the present invention. Figure 5 is a schematic cross-sectional view of the feed crucible of the present invention. 6 to 9 are schematic views of the actions of the present creation.

10‧‧‧承載座 10‧‧‧Hosting

20‧‧‧進料匣 20‧‧‧Feeding匣

21‧‧‧容置部 21‧‧‧ 容部

211‧‧‧長槽 211‧‧‧long slot

22‧‧‧負重塊 22‧‧‧Loading weight

23‧‧‧基座部 23‧‧‧Base section

231‧‧‧定位凹部 231‧‧‧ positioning recess

232‧‧‧移動槽 232‧‧‧Mobile slot

30‧‧‧推送機構 30‧‧‧ Pushing agency

31‧‧‧位移組件 31‧‧‧Displacement components

32‧‧‧推抵件 32‧‧‧Parts

40‧‧‧取放機構 40‧‧‧ pick-and-place mechanism

41‧‧‧移動組件 41‧‧‧Mobile components

42‧‧‧轉動組件 42‧‧‧Rotating components

43‧‧‧取放組件 43‧‧‧ pick and place components

9‧‧‧基板 9‧‧‧Substrate

Claims (8)

一種進料裝置,其用以供應複數個基板,該進料裝置具有: 一承載座; 一進料匣,其可拆卸地設置於該承載座;該進料匣的後側面形成有一開口,且該進料匣的前側面形成有一間隙,該等基板容置於該進料匣內,且該等基板能通過該間隙; 一推送機構,其具有一推抵件,該推抵件選擇性地移動進入該進料匣的該開口,並將容置於該進料匣內的其中一該基板推出通過該間隙;以及 一取放機構,其能拿取並移動被該推送機構所推出的該其中一基板。a feeding device for supplying a plurality of substrates, the feeding device having: a carrier; a feeding cassette detachably disposed on the carrier; an opening formed on a rear side of the feeding magazine, and Forming a gap on the front side of the feed crucible, the substrates are received in the feed cassette, and the substrates can pass through the gap; a pushing mechanism having a pushing member, the pushing member selectively Moving into the opening of the feed cassette, and pushing one of the substrates received in the feed cassette through the gap; and a pick-and-place mechanism that can pick up and move the push-out by the push mechanism One of the substrates. 如請求項1所述之進料裝置,其中: 該承載座形成有至少一定位凸部;且 該進料匣形成有至少一定位凹部,當該進料匣設置於該承載座時,該至少一定位凸部容置於該至少一定位凹部。The feeding device of claim 1, wherein: the carrier is formed with at least one positioning protrusion; and the feeding cassette is formed with at least one positioning recess, when the feeding cassette is disposed on the carrier, the at least A positioning protrusion is received in the at least one positioning recess. 如請求項1所述之進料裝置,其中,該進料匣具有: 一容置部,其形成有: 一容置空間,該等基板以堆疊方式容置於該容置空間;及 一長槽,其垂直延伸並連通於該容置空間;以及 一負重塊,其設置於該容置空間內,並放置於該等基板上方;該負重塊形成有一把手,其自該長槽凸出。The feeding device of claim 1, wherein the feeding cassette has: a receiving portion formed with: an accommodating space, the substrates are stacked in the accommodating space; and a length a slot extending vertically and communicating with the accommodating space; and a load block disposed in the accommodating space and placed above the substrate; the load block forming a handle protruding from the long groove. 如請求項1所述之進料裝置,其中,該進料匣具有一基座部,其形成有一移動槽,該移動槽與該進料匣前側面的該間隙連通;當該其中一基板被該推送機構推出後,該推送機構更推動該其中一基板於該移動槽內移動。The feeding device of claim 1, wherein the feeding cassette has a base portion formed with a moving groove, the moving groove communicating with the gap of the front side of the feeding crucible; when the one of the substrates is After the pushing mechanism is pushed out, the pushing mechanism further pushes one of the substrates to move in the moving slot. 如請求項1至4中任一項所述之進料裝置,其中,該推送機構具有一位移組件,該推抵件固設於該位移組件上,且該位移組件能帶動該推抵件往覆移動。The feeding device of any one of claims 1 to 4, wherein the pushing mechanism has a displacement assembly, the pushing member is fixed on the displacement assembly, and the displacement assembly can drive the pushing member toward Overlay. 如請求項1至4中任一項所述之進料裝置,其中,該推送機構的該推抵件的寬度等於該等基板。The feeding device of any one of claims 1 to 4, wherein the pushing member has a width equal to the substrates. 如請求項1至4中任一項所述之進料裝置,其中,該取放機構具有: 一移動組件;及 一取放組件,其固設於該移動組件並能被該移動組件移動;該取放組件能拿取或釋放被該推送機構所推出的該其中一基板。The feeding device according to any one of claims 1 to 4, wherein the pick-and-place mechanism has: a moving component; and a pick-and-place assembly fixed to the movable component and movable by the moving component; The pick and place assembly can take or release one of the substrates pushed out by the pushing mechanism. 如請求項7所述之進料裝置,其中,該取放機構更具有一轉動組件,其固設於該移動組件上,且該取放組件透過該轉動組件固設於該移動組件上。The feeding device of claim 7, wherein the pick-and-place mechanism further has a rotating component fixed to the moving component, and the pick-and-place component is fixed to the moving component through the rotating component.
TW106214215U 2017-09-25 2017-09-25 Material-feeding device TWM553242U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI724856B (en) * 2020-04-07 2021-04-11 陽程科技股份有限公司 Bobbin material placing device and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI724856B (en) * 2020-04-07 2021-04-11 陽程科技股份有限公司 Bobbin material placing device and method

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