TWM543995U - Chip burning test equipment - Google Patents

Description

Wafer burning test equipment

The present invention relates to a wafer burning test apparatus and method, and more particularly to a wafer burning test apparatus and method for simultaneously testing, burning or pre-burning a plurality of wafers.

Thanks to the development of integrated circuit (IC) technology, the volume of electronic products is becoming smaller and smaller, which not only facilitates people to carry, but also provides powerful arithmetic processing functions. In the process of the wafer, a lot of complicated procedures are required. After the finished product is finished, the program data of the specific function needs to be further burned into the wafer, so that the wafer can achieve a specific function.

At present, the wafer is programmed, and the burned carrier can only place a single wafer at a time. Although multiple vehicles are used in combination to achieve simultaneous multi-programming, it takes a lot of time to place individual wafers on the carrier during burning, especially when a large number of wafers are to be burned. Will cause a lot of time and cost.

The main purpose of the present invention is to provide a burning test apparatus and method for simultaneously burning or testing a plurality of wafers.

To achieve the above objects, the wafer burning test apparatus of the present invention is used to burn or test a plurality of wafers, wherein the plurality of wafers can be placed in a tray and each has a plurality of pins. The novel wafer burning test apparatus includes a base, a carrier, a probe card, a mounting frame, a driving mechanism, and a host device. The carrier can be stacked on the tray and can be flipped over the carrier by flipping the tray and the carrier simultaneously after stacking such that the plurality of pins of each wafer are facing away from the carrier. The probe plate is mounted on the base, and the probe plate includes a plurality of probes. The placement frame is disposed on the base, and the placement frame is configured to provide a corresponding probe plate after the carrier is placed, so that the plurality of pins can be aligned with the plurality of probes. The driving mechanism is disposed on the base, and the driving mechanism is configured to move the probe card or the carrier such that one of the plurality of pins of the plurality of wafers inverted on the carrier contacts the probes. The host device is electrically connected to the probe card, and the host device is configured to test or data the plurality of wafers when the pins contact the probes.

According to an embodiment of the present invention, the placement rack includes a slide rail mechanism that is detachably coupled to the slide rail mechanism and displaced on the placement rack by the slide rail mechanism.

According to an embodiment of the invention, the drive mechanism is a pneumatic cylinder.

According to an embodiment of the present invention, the number of the probe card and the carrier are all plural, and each carrier is placed on the placement frame, and each corresponds to a different probe card.

According to an embodiment of the present invention, after the respective carriers are placed on the placement rack, the plurality of carriers and the plurality of probe boards are staggered in a line.

According to an embodiment of the present invention, the wafer burning test apparatus of the present invention further includes a temperature adjustment box that can be used to provide a test temperature, so that the host device can be used for the plural when the pins contact the probes. The wafer was subjected to a burn-in test.

The present invention further discloses a wafer burn test method for use in a wafer burn test apparatus for burning or testing a plurality of wafers, wherein the plurality of wafers can be placed on a tray and each has a plurality of pins. The wafer burning test apparatus includes a carrier disk and a probe card, wherein the probe card includes a plurality of probes. The wafer burning test method of the present invention comprises the steps of: stacking the carrier on the tray, and flipping the tray and the carrier simultaneously after stacking, so that the plurality of wafers are inverted on the carrier, so that the plurality of wafers are connected The back of the foot is facing the carrier; the carrier is corresponding to the probe card so that one of the plurality of pins can be aligned with each probe; the probe card or the carrier is moved so that one of the plurality of pins contacts each of the pins a probe; and, when the pins of the wafer contact the probe, test or data burn the plurality of wafers.

According to an embodiment of the present invention, the number of the probe card and the carrier are plural, and the step of the carrier corresponding to the probe card is such that each carrier corresponds to a different probe card.

According to an embodiment of the present invention, the steps of the respective carriers corresponding to different probe cards are such that the plurality of carriers and the plurality of probe cards are staggered in a line.

According to an embodiment of the present invention, the wafer burning test method of the present invention further comprises the steps of: providing a test temperature, and performing a burn-in test on the plurality of wafers at the test temperature.

1‧‧‧ wafer burning test equipment

10‧‧‧ Pedestal

20‧‧‧Package

30‧‧‧Probe board

31‧‧‧ probe

40‧‧‧Place rack

41‧‧‧Slide rail mechanism

50‧‧‧ drive mechanism

51‧‧‧Handlebar

511‧‧‧ first end

513‧‧‧ second end

53‧‧‧ linkage rod

55‧‧‧ drive parts

R‧‧‧rail

60‧‧‧ host device

61‧‧‧ Controller

62‧‧‧ memory

70‧‧‧Control device

90‧‧‧ wafer

91‧‧‧ pins

T‧‧‧Tray

F‧‧‧ fixture

A‧‧‧ alignment structure

L‧‧‧ transmission line

1 is a plan view of a wafer burning test apparatus of a first embodiment of the present invention.

Figure 2 is a rear elevational view of the wafer burning test apparatus of the first embodiment of the present invention.

Fig. 3A is a schematic view showing that a tray on which a wafer is loaded is placed on a jig.

Fig. 3B is a schematic view showing the stacking of the carrier on the tray.

Figure 3C is a schematic view showing the simultaneous flipping of the carrier and the tray.

Figure 3D is a schematic illustration of the wafer being placed on a carrier.

Figure 4 is a front elevational view of the wafer burning test apparatus of the first embodiment of the present invention.

Figure 5 is a side elevational view of the wafer burning test apparatus of the first embodiment of the present invention.

Fig. 6 is an enlarged schematic view showing a portion A shown in Fig. 5.

Fig. 7 is a schematic view showing another embodiment of the driving mechanism of the wafer burning test apparatus of the present invention, showing an outline of the driving mechanism before moving the carrier.

Fig. 8 is a schematic view showing another embodiment of the driving mechanism of the wafer burning test apparatus of the present invention, showing the driving mechanism after moving the carrier.

Figure 9 is a front elevational view of the wafer burning test apparatus of the second embodiment of the present invention.

Figure 10 is a front elevational view of the wafer burning test apparatus of the third embodiment of the present invention.

Figure 11 is a flow chart showing the steps of the wafer burning test method of the present invention.

In order to enable the reviewing committee to better understand the technical content of the present invention, the preferred embodiments are described below.

Please refer to Figure 1 to Figure 9 below. 1 is a plan view of a wafer burning test apparatus according to a first embodiment of the present invention; FIG. 2 is a rear view of the wafer burning test apparatus of the first embodiment of the present invention; and FIG. 3A is a tray for loading a wafer placed in a jig. 3B is a schematic view showing the stacking of the carrier on the tray; FIG. 3C is a schematic view showing the tray and the tray being flipped simultaneously; FIG. 3D is a schematic view showing the wafer being placed on the carrier; FIG. The front view of the wafer burning test apparatus of the embodiment; FIG. 5 is a side view of the wafer burning test apparatus of the first embodiment of the present invention; FIG. 6 is an enlarged schematic view of the portion A shown in FIG. 5; A schematic diagram of another embodiment of a driving mechanism of a wafer burning test device, which is a schematic diagram of a driving mechanism before moving a carrier; FIG. 8 is a chip burning test device of the present invention. A schematic view of another embodiment of the drive mechanism, showing the drive mechanism after moving the carrier.

As shown in FIG. 1 and FIG. 2, in the first embodiment of the present invention, the wafer burning test apparatus 1 of the present invention can be used for simultaneously testing or programming a plurality of wafers 90, wherein each Wafer 90 has a plurality of pins 91. In the first embodiment of the present invention, the wafer burning test apparatus 1 includes a base 10, a carrier 20, a probe card 30, a placement frame 40, a drive mechanism 50, a host device 60, and a control device 70.

As shown in FIG. 1 and FIG. 3A-D, in the first embodiment of the present invention, the plurality of wafers 90 can be first fixedly placed in the grooves (not shown) of the tray T, and further, this The tray T at the point is a conventional tray for carrying the wafer 90, so that the wafer 90 is protected from damage during transportation. In the embodiment of the present invention, the tray T carrying the plurality of wafers 90 can be fixedly placed on a special fixture F (as shown in FIG. 3A), and then the carrier tray 20 can be stacked on the tray T (as shown in the figure). 3B), and by the alignment structure A on the special fixture F, the plurality of accommodating grooves (not shown) facing the tray T when the carrier 20 is stacked can face the grooves of the tray T one by one. The wafers 90 are accommodated in a space formed by the accommodating grooves and the grooves. Finally, after stacking the carrier 20 on the rear tray T, by flipping the tray T and the carrier 20 simultaneously, about one hundred and eighty The plurality of wafers 90 can be inverted in the respective receiving grooves of the carrier 20 such that the plurality of pins 91 of the respective wafers 90 face away from the carrier 20 by a degree (as shown in FIG. 3C). After the flipping, the tray T is removed from the loading tray 20, and it can be seen that the pins 91 of the respective wafers 90 are exposed upward (Fig. 3D).

As shown in FIG. 1, FIG. 4 and FIG. 5, in the first embodiment of the present invention, the probe card 30 is disposed on the base 10, where the base 10 can be a table top or other objects that can be fixed. , including the ground. The probe card 30 includes a plurality of probes 31 made of a metal conductor.

As shown in FIG. 1 and FIG. 2, in the first embodiment of the present invention, the placement frame 40 is disposed on the base 10, and the placement frame 40 is used to place the carrier 20 thereon. The placement frame 40 is provided with a slide rail mechanism 41. The two sides of the carrier tray 20 are detachably coupled with the slide rail mechanism 41, so that the carrier tray 20 can be moved through the slide rail mechanism 41 after being placed on the placement frame 40. After the wafer 90 has been displaced from the tray T and placed upside down on the carrier 20, the user can then place the carrier 20 on the placement frame 40 and move the carrier 20 to the positive position by the slide mechanism 41. The position of the probe card 30 (in the direction indicated by the arrow F1 in Fig. 4), even if the carrier 20 corresponds to the probe card 30.

In the first embodiment of the present invention, the drive mechanism 50 is disposed on the base 10. As shown in Figure 4 and Figure 5. When the carrier 20 is moved to a working position and faces the probe card 30, it will also face the driving mechanism 50 at the same time, that is, the carrier 20 is located at this time. The probe card 30 is coupled to the drive mechanism 50. Next, the user can control the driving mechanism 50 to move toward the probe card 30 to move the carrier 20 toward the probe card 30 under the displacement of the driving mechanism 50 (as indicated by the arrow F2 in FIG. 5). The pin 91 of the wafer 90 on the carrier 20 contacts the probe 31. In the specific embodiment of the present invention, the driving mechanism 50 is a pneumatic cylinder, but the present invention is not limited thereto, and other devices or devices having lifting or plane displacement of the object can also be used as the driving mechanism 50 of the present invention, such as a hydraulic elevator. Or a connecting rod device. As shown in FIG. 7, it is a schematic view showing an embodiment in which a link device is used as the drive mechanism 50. In a specific implementation, the driving mechanism 50 can include a handle bar 51, a linkage bar 53 and a driving member 55. The handle bar 51 has a first end 511 and a second end 513, wherein the second end 513 is provided with two through holes; the handle bar 51 is rotatably fixed to the base by a through hole (for example, a screw) 10 on. One end of the linkage rod 53 is connected to the driving member 55, and the other end of the linkage rod 53 is connected to the second end 513 of the handlebar 521 by the other through hole of the fastener. The driving member 55 is disposed in the guide rail R in addition to being coupled to the interlocking lever 53. As shown in FIGS. 7 and 8, when the operator rotates the first end 511 of the handlebar 51 toward the position of the driving member 55 (in the direction indicated by the arrow F3 in FIG. 8), the linkage lever 53 is placed on the handlebar. Under the driving of 51 and the limit of the guide rail R, the driving drive member 55 moves in a linear manner toward the probe card 30 (eg The direction indicated by the arrow F4 in Fig. 8 is to move the carrier 20 positioned between the driving member 55 and the probe card 30 toward the probe card 30.

In addition, it should be noted that in the present embodiment, although the carrier pad 20 is used to bring the pin 91 of the wafer 90 into contact with the probe 31 of the probe card 30, it should be understood by those skilled in the art that In practice, the contact of the pin 91 of the wafer 90 with the probe 31 can also be achieved by moving the probe card 30, or moving the carrier 20 and the probe card 30 simultaneously or sequentially. The present invention is not limited to a specific manner.

As shown in FIG. 2, in the first embodiment of the present invention, the host device 60 is electrically connected to the probe card 30 by the transmission line L. The host device 60 includes a controller 61 and a memory 62, wherein the memory 62 stores a burn-in data. The controller 61 is configured to test the plurality of wafers 90 when the pins 91 of the wafer 90 are in contact with the probes 31, and can program the burned materials into the plurality of wafers 90, that is, to perform data burning. action. Since the testing and data burning of the wafer is familiar to those of ordinary skill in the art, the specific principles and contents thereof have been scattered in many technical or patent documents, and thus will not be further described herein.

As shown in FIG. 1, in the first embodiment of the present invention, the control device 70 is electrically connected to the driving mechanism 50, and the control device 70 is used to provide a user to operate the control driving mechanism 50. The user moves the carrier 20 to the position facing the probe card 30 Thereafter, the carrier 20 will be positioned between the probe card 30 and the drive mechanism 50. At this time, by operating the control device 70, for example, pressing a start button provided on the control device 70, the drive mechanism 50 can be controlled to move the carrier 20 toward the probe card 30 so that the pin 91 of the wafer 90 contacts the probe. 31. When the carrier 20 is moved such that the pin 91 of the wafer 90 contacts the probe 31, the host device 60 can test the plurality of wafers 90 and/or data burn as previously described.

Next, please refer to FIG. 9 for a schematic configuration of the second embodiment of the present invention.

As shown in FIG. 9, in the second embodiment of the present invention, the number of the carrier 10, the probe card 30, and the slide mechanism 41 is plural, and each of the carriers 10 carrying the plurality of wafers 90 is disposed. After the shelf 40 is placed, the different probe cards 30 can be moved by the slide rail mechanisms 41, and the plurality of carriers 10 and the plurality of probe cards 30 are alternately arranged in a line, that is, between the plurality of carriers 10 The two will not be arranged in series. After the respective carriers 10 are moved to the positions facing the respective probe cards 30, the operation mechanism 70 can be controlled to control the drive mechanism 50 to face all the carriers 20 toward the facing probe card 30 at a time. The movement (in the case of FIG. 7, for example, displacement in the Z-axis direction) is such that the pins 91 of all the wafers 90 are in contact with the probe 31. In this embodiment, the plurality of carriers 20 can be controlled to be displaced at one time, so that the pins 91 of the wafer 90 are more simultaneously connected than the first embodiment. The probe 31 is touched, so that a larger number of wafers 90 can be simultaneously tested for testing, burn-in or data burning than the first embodiment.

Next, please refer to FIG. 10 for a schematic structural view of a third embodiment of the present invention.

As shown in FIG. 10, in the third embodiment of the present invention, unlike the foregoing embodiment, the wafer burning test apparatus 1 of the present invention further includes a temperature adjustment box 80, and the wafer is burned before. The components of the test equipment 1 are tested in the temperature adjustment cabinet 80 except for the host device 60 and the control device 70. The temperature adjustment cabinet 80 is used to provide a test temperature different from the normal temperature, specifically, the high and low temperatures required for the burn in test, so that the controller 61 of the host device 60 can be more When the pin 91 of the wafer 90 contacts the probe 31, the wafer 90 is subjected to a burn-in test. Therefore, in the third embodiment of the present invention, the wafer burning test apparatus 1 can be adjusted by the temperature adjustment box 80 in addition to the test or/and data burning of the wafer 90 as described in the foregoing embodiments. The ambient temperature is tested and the wafer 90 is further subjected to a burn-in test. In the specific embodiment of the present invention, the temperature adjustment box 80 is a burn-in chamber, but the present invention is not limited thereto, and the temperature adjustment box 80 can also be a reliability environment test equipment. Since the burn-in test of the wafer is familiar to those of ordinary skill in the art, the specific principles and contents have been scattered in many technologies or In the patent literature, there is no longer any detail here. In addition, in the third embodiment of the present invention, the functions and implementations of other components of the wafer burning test apparatus 1 are the same as those in the first embodiment and the second embodiment, and thus the detailed description thereof will not be repeated here.

Finally, please refer to FIG. 11 for a flow chart of the steps of the method for programming the wafer of the present invention, and please refer to FIG. 1 to FIG. 10 together.

The wafer burning test method of the present invention can be applied to the wafer burning test apparatus 1 shown in the foregoing for synchronously burning or testing a plurality of wafers 90 or performing a burn-in test on the wafers 90. As shown in FIGS. 2 and 3A-E, a plurality of wafers 90 can be placed on the tray T first, and the plurality of wafers 90 each have a plurality of pins. The wafer burning test apparatus 1 includes a carrier 20 and a probe card 30, wherein the probe card 30 includes a plurality of probes 31; here, the number of the carrier 20 and the probe card 30 can each be singular (as shown in FIG. 1). Show), or both can be plural (as shown in Figure 9 or Figure 10). The method of burning a wafer of the present invention includes the following steps.

First, step S1: stacking the carrier on the tray and simultaneously flipping the tray and the carrier so that the plurality of wafers are inverted on the carrier such that the pins of each wafer face away from the carrier.

Since the wafer 90 is placed on the tray T, such as that shown in FIG. 3A, prior to the burn-in, test, and/or burn-in test, the pins 91 of the wafer 90 will face downward when placed. for In order to be able to displace and test a plurality of wafers 90 at a time on the carrier 20 for loading or testing, the first step of the burning method is to stack the carrier 20 on the tray T, and The tray T and the carrier 20 are simultaneously inverted after stacking so that the plurality of wafers 90 are inverted on the carrier 20 such that the pins 91 of the wafers 90 face away from the carrier 20. For the specific implementation of the steps, reference may be made to FIG. 3A to FIG. 3D and the foregoing description. However, it should be noted that the implementation of this step may be performed manually, or assisted by an automated device.

Step S2: The carrier is placed facing the probe card so that the pins of the wafer can be aligned with the probe.

After the step S1 is completed, the carrier 20 carrying the plurality of wafers 90 is then faced to the probe card 30 so that the pins 91 of the wafer 90 can be aligned with the probes 31 of the probe card 30. As shown in FIG. 4, in a specific implementation, the carrier 20 can be moved by a slide rail mechanism 41 and accurately moved to a position facing the wafer 90, but the present invention is not limited thereto. In addition, when the wafer burning test method of the present invention is applied to, for example, the wafer burning test apparatus 1 shown in FIG. 9 or FIG. 10, the step S2 is to make each of the loading trays 20 face different probes respectively. The plate 30 is arranged such that the plurality of carriers 20 and the plurality of probe cards 30 are staggered in line.

Step S3: Move the probe card or the carrier so that the pins of the wafer contact the probe of the probe card.

After the carrier 20 carrying the plurality of wafers 90 is associated with the probe card 30, the probe card 30 or the carrier 20 is moved so that the pins 91 of the wafer 90 contact the probes 31 of the probe card 30. Here, only one of the control probe plates 30 or the carrier 20 can be moved, or both can be controlled simultaneously or sequentially. The present invention is not limited to a specific movement mode. One of the specific implementations of this step is not limited thereto, and the driving of the carrier 20 can be pushed up by a driving mechanism 50 (as shown in FIG. 5), and is applied to, for example, the wafer shown in FIG. When the test device 1 is burned, the step S3 can use the drive mechanism 50 to simultaneously push the respective trays 20 to move, so that the pins 91 of the wafer 90 in each of the carriers 20 are in contact with the corresponding probe cards 30. Probe 31.

Step S4: testing or/and data burning of the plurality of wafers.

After the pin 91 of the wafer 90 is brought into contact with the probe 31 of the probe card 30, the host device 60 of the wafer burning test device 1 can start testing or/and programming the plurality of wafers 90. Homework.

Finally, step S5 is performed: providing a test temperature, and performing a burn-in test on the plurality of wafers at the test temperature.

After the data burning is completed, the temperature is further provided through the temperature adjusting box 80 of the wafer burning test apparatus 1. The so-called test temperature includes the high temperature and low temperature required for performing the burn-in test, and the temperature range thereof is a person skilled in the art. Well known. While the test temperature is being supplied, the host device 60 can perform a burn in test operation on the plurality of wafers 90 while the pins 91 of the wafer 90 are in contact with the probes 31 of the probe card 30.

In summary, the present invention shows its characteristics different from conventional techniques in terms of purpose, means and efficacy. It should be noted that the various embodiments described above are merely illustrative for ease of explanation, and the scope of the claims is intended to be limited by the scope of the claims.

1‧‧‧ wafer burning test equipment

10‧‧‧ Pedestal

20‧‧‧Package

30‧‧‧Probe board

40‧‧‧Place rack

60‧‧‧ host device

70‧‧‧Control device

Claims (6)

A wafer burning test apparatus for burning or testing a plurality of wafers, the plurality of wafers being placed on a tray and each having a plurality of pins, the wafer burning test apparatus comprising: a base; a carrier tray; Stacked on the tray and capable of inverting the plurality of wafers on the carrier by flipping the tray and the carrier simultaneously after stacking, such that the plurality of pins of each of the wafers face away from the carrier; a probe card is disposed on the base, the probe card includes a plurality of probes; a placement frame is disposed on the base to provide a corresponding probe card after the carrier is placed, so that the a plurality of pins can be aligned with the plurality of probes; a driving mechanism is disposed on the base for moving the probe card or the carrier to cause the plurality of the plurality of wafers inverted on the carrier One of the pins contacts each of the probes; and a host device is electrically connected to the probe card, and the host device is configured to test the plurality of wafers when the pins contact the probes (testing) or data programming (programming). The wafer burning test apparatus of claim 1, wherein the placement frame comprises a slide rail mechanism detachably coupled to the slide rail mechanism and disposed through the slide rail mechanism Displacement on the shelf. The wafer burning test apparatus of claim 1, wherein the driving mechanism is a pneumatic cylinder. The wafer burning test apparatus of claim 1, wherein the number of the probe card and the carrier are plural, and each of the carriers is placed on the placement frame, and each of the corresponding probe plates is different. . The wafer burning test apparatus of claim 4, wherein after the carrier is placed in the placement rack, the plurality of carriers and the plurality of probe boards are staggered in a line. The wafer burning test apparatus according to any one of claims 1 to 5, further comprising a temperature adjusting box, the probe board being located in the temperature adjusting box, wherein the temperature adjusting box is used for providing a test The temperature is such that the host device is more capable of performing a burn in test on the plurality of wafers when the pins contact the probes.