TWM528458U - Water cooling equipment - Google Patents

Description

Water cooling device

The present invention relates to a water-cooling device, and more particularly to a water-cooling device which can greatly reduce the overall volume and achieve a thinned structure.

Press, the computing power of today's computers is getting stronger and stronger, and its computing speed is also rapidly increasing. Its overall shape, structure and connection with the motherboard are breaking through the traditional nest. It is a major reform in the computer industry, but also because of The new generation of central processing unit with ultra-fast computing functions also allows the central processor to generate higher temperatures when processing arithmetic instructions, so how to use a good thermal and thermal system to make the central processor at its allowed temperature Normal work has been regarded as a very important issue by the industry. The conventional water-cooling device heat-exchanges the heat absorbed by the heat-generating component (processor or graphics processor) with a cooling liquid inside the water-cooling device, and then circulates the cooling liquid through a pump inside the water-cooling device, and the water-cooling device transmits The plurality of tubes are connected to a heat sink, so that the cooling liquid can be heat-dissipated and cooled between the heat sink and the water-cooling device, thereby rapidly dissipating heat to the heat-generating components. However, the structure of the conventional water-cooling device is a conventional stator assembly, and the conventional stator assembly is composed of a plurality of coils and stacked silicon steel sheets, so that it has a certain thickness and volume, so that the structure of the conventional water-cooling device leads to the overall volume. Too large to be able to have a thinner effect.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a water cooling device which greatly reduces the overall volume. The secondary purpose of this creation is to provide a water-cooling device that can achieve a thinned structure. To achieve the above object, the present invention provides a water-cooling device comprising a pump housing, at least one coil, a driver and a heat exchange member, the pump housing having a top portion and a bottom portion and a side portion and defining a common a pumping chamber, the coil is disposed on a circuit board, and the circuit board is disposed at any one of the top or the bottom or the side, the driver is disposed in the pumping chamber, and the driver corresponds to At least one magnetic element is disposed at the coil position, the heat exchange member is coupled to the pump housing, the heat exchange member has a plurality of heat dissipation fins and forms a heat exchange chamber, and the heat exchange chamber and the pump are The chamber is in communication and a cooling liquid is passed therethrough. Through the design of the structure of the present invention, the arrangement of the magnetic elements corresponding to the coils on the driver can be used to induce the excitation of the coils and the magnetic elements on the circuit board by mutual induction of excitation. The arrangement of the silicon steel sheet in the conventional water-cooling device can be omitted, and the effect of greatly reducing the overall volume of the water-cooling device and achieving a thinned structure can be achieved.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. Please refer to the first, second, and third drawings, which are perspective exploded views and a three-dimensional combined view and a cross-sectional view of the first embodiment of the water cooling device. As shown, a water cooling device 1 includes a pump housing 10. At least one coil 11, a driver 12 and a heat exchange member 14, the pump housing 10 has a top portion 1011 and a bottom portion 1012 and a side portion 1013 and together define a pumping chamber 1014 having the pump housing 10 An inlet 102 is connected to an outlet 103, and the coil 11 is disposed on a circuit board 15 (the coil 11 can be formed on the circuit board in a printing manner or a stacking manner or etching or wiring), and The circuit board 15 can be selectively disposed at any one of the top portion 1011 or the bottom portion 1012 or the side portion 1013. A power line (not shown) is electrically connected to the circuit board 15 to the outside. The purpose is to the water cooling device 1 The power supply is performed to enable the water-cooling device 1 to operate. In the present embodiment, the coil 11 is disposed on the circuit board 15 by means of printing, but is not limited thereto. , the coil 11 can also be passed through the lay according to the needs of the user. Out (layout) or stacked is disposed on the circuit board 15. In addition, in another embodiment, the circuit board 15 may be encapsulated on the inner wall surface of either the top portion 1011 or the bottom portion 1012 or the side portion 1013 by means of integral encapsulation (as shown in FIG. 4). ). The driver 12 is disposed in the pumping chamber 1014. The material of the driver 12 is made of non-metal material (such as plastic, rubber or polymer composite material) and has a mandrel 122 and a plurality of blades 121, each blade Each of the 121 has an upper edge 1211 and a lower edge 1212 and a side edge 1213. The upper edge 1211 or the lower edge 1212 or the side edge 1213 of the blade 121 is provided with at least one magnetic element 13 at a position corresponding to the coil 11; The heat exchange member 14 is coupled to the pump housing 10, and the heat exchange member 14 has a plurality of heat dissipation fins 141 and forms a heat exchange chamber 142. The heat exchange chamber 142 is in communication with the pump chamber 1014 and is provided for Cooling liquids (not shown) pass therethrough, and the heat dissipating fins 141 are disposed in a spaced or staggered arrangement and are in contact with the cooling liquid in the heat exchange chamber 142. Continuing to refer to FIG. 3 , in the present embodiment, since the circuit board 15 is disposed on the surface of the bottom portion 1012 , the magnetic element 13 is correspondingly disposed at the lower edge 1212 of the blades 121 to The magnetic element 13 and the coil 11 on the circuit board 15 can be mutually induced to generate excitation, and the magnetic element 13 and the coil 11 are induced to be excited to cause the driver 12 to operate, thereby driving the interior of the water cooling device 1 to be cooled. The liquid sequentially passes through the inlet 102, the pumping chamber 1014, the heat exchange chamber 142 and the outlet 103, and exchanges heat with the heat dissipating fins 141 for heat dissipation, thereby eliminating the need for the silicon steel sheet of the conventional water cooling device. The arrangement achieves the effect of greatly reducing the overall volume of the water-cooling device 1 and having a thinned structure. Please refer to FIG. 5 and FIG. 1 together with reference to FIG. 1 , which is a cross-sectional view showing the third and fourth embodiments of the water cooling device of the present invention. The corresponding relationship between some components and components of the water cooling device is as described above. The structure of the water-cooling device is the same, so it will not be described here, but the main difference between the water-cooling device and the foregoing is that the circuit board 15 can be disposed on the side portion 1013 and the magnetic element 13 is correspondingly disposed on the water cooling device. The side edge 1213 of the blade 121 (as shown in FIG. 5), or in an embodiment, the circuit board 15 is disposed on the top portion 1011 and the magnetic member 13 is correspondingly disposed on the blades. The upper edge 1211 of the 121 (as shown in Fig. 6) can also cause the coil 11 on the circuit board 15 to act as an excitation corresponding to the magnetic element 13 to achieve the same effect as the first embodiment. As described above, the present invention has the following advantages over the conventional ones: 1. The overall volume of the water-cooling device is greatly reduced; 2. The thinned structure is achieved. The above description has been made in detail, but the above is only a preferred embodiment of the present invention. When it is not possible to limit the scope of the creation of the creation, that is, the equivalent change and modification according to the scope of the present application. Etc., should still be covered by the patents of this creation.

1‧‧‧Water cooling unit
10‧‧‧ pump housing
1011‧‧‧ top
1012‧‧‧ bottom
1013‧‧‧ side
1014‧‧‧ pumping chamber
102‧‧‧ entrance
103‧‧‧Export
11‧‧‧ coil
12‧‧‧ Drive
121‧‧‧ leaves
1211‧‧‧Upper edge
1212‧‧‧ lower edge
1213‧‧‧lateral edge
122‧‧‧ mandrel
13‧‧‧Magnetic components
14‧‧‧Hot exchange parts
141‧‧‧heat fins
142‧‧‧Heat exchange chamber
15‧‧‧Circuit board

1 is a perspective exploded view of a first embodiment of the present water-cooling device; FIG. 2 is a three-dimensional combination view of the first embodiment of the water-cooling device; Fig. 4 is a cross-sectional view showing a second embodiment of the water cooling device of the present invention; Fig. 5 is a cross-sectional view showing a third embodiment of the water cooling device of the present invention; A cross-sectional view of a fourth embodiment of the device.

1‧‧‧Water cooling unit

10‧‧‧ pump housing

1011‧‧‧ top

1012‧‧‧ bottom

1013‧‧‧ side

1014‧‧‧ pumping chamber

102‧‧‧ entrance

103‧‧‧Export

11‧‧‧ coil

12‧‧‧ Drive

121‧‧‧ leaves

1211‧‧‧Upper edge

1212‧‧‧ lower edge

1213‧‧‧lateral edge

122‧‧‧ mandrel

14‧‧‧Hot exchange parts

141‧‧‧heat fins

15‧‧‧Circuit board

Claims (7)

A water cooling device comprising: a pump housing having a top portion and a bottom portion and a side portion and defining a pump chamber together; at least one coil is disposed on a circuit board, and the circuit board is disposed on the a top portion or any one of the bottom portion or the side portion; a driver disposed in the pump chamber, and the driver is provided with at least one magnetic member corresponding to the coil position, thereby inducing excitation with the coil; and a heat An exchange member is coupled to the pump housing, the heat exchange member having a plurality of fins and forming a heat exchange chamber, and the heat exchange chamber is in communication with the pump chamber and a cooling liquid is passed therethrough . The water-cooling device of claim 1, wherein the circuit board is disposed on the inner wall surface of the top or bottom portion or the side portion by means of an envelope. The water cooling device of claim 1, wherein the driver has a mandrel and a plurality of blades, each of the blades having an upper edge and a lower edge and a side edge, wherein the magnetic component is disposed on the Upper or lower edge or side edge. The water-cooling device according to claim 1, wherein the material of the driver is made of a non-metal material. The water-cooling device of claim 1, wherein the pump housing further has an inlet connected to an outlet. The water-cooling device of claim 1, wherein the fins are arranged in a spaced or staggered arrangement and are in contact with a cooling liquid in the heat exchange chamber. The water-cooling device of claim 1, wherein the circuit board is selected to be formed on the circuit board by a printing method or a stacking method or etching or wiring.