JP2014175539A - Both-sided mounting cooling-plate - Google Patents

Both-sided mounting cooling-plate Download PDF

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JP2014175539A
JP2014175539A JP2013048212A JP2013048212A JP2014175539A JP 2014175539 A JP2014175539 A JP 2014175539A JP 2013048212 A JP2013048212 A JP 2013048212A JP 2013048212 A JP2013048212 A JP 2013048212A JP 2014175539 A JP2014175539 A JP 2014175539A
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heat
heat receiving
cooling plate
wall portion
receiving portion
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JP6085196B2 (en
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Koichi Masuko
耕一 益子
Masamune Matsuda
将宗 松田
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Fujikura Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a cooling plate that is able to evenly cool both faces with which electronic components are disposed in contact, in saved space.SOLUTION: A cooling plate 1 has the form of a hollow flat plate as a whole and is designed such that the external faces 2a, 3a of a pair of opposite external wall parts 2, 3 serve as heat receiving parts 2b, 2b that receive heat from electronic components 6, 7 that generate heat by operating and such that a cooling fluid, which cools the heat receiving parts 2b, 3b by depriving the heat of the heat receiving parts 2b, 3b, is circulated in an inter part 1a. In the cooling plate 1, on the internal face 2c of the one external wall part 2 and in a place corresponding to the heat receiving part 2b, a plurality of first radiation fins 12 are vertically provided, which extend toward the internal face 3c of the other external wall part 3. Also, on the internal wall face 3c of the other external wall part 3 and in a place corresponding to the heat receiving part 3b, a plurality of second radiation fins 13 are vertically provided, which extend toward the internal face 2c of the one external wall part 2. The first radiation fins 12 and the second radiation fins 13 are arranged with spaces between them in the thickness direction thereof.

Description

この発明は、電子部品や電子機器等に実装され、通電されて作動することにともなって発熱する発熱体素子を冷却する冷却板に関し、特に発熱体素子で生じる熱を、内部で流動する熱輸送媒体に伝達することにより、発熱体素子を冷却する冷却板に関するものである。   The present invention relates to a cooling plate that cools a heating element that is mounted on an electronic component, an electronic device, or the like and generates heat when it is energized to operate, and in particular, heat transport that causes heat generated in the heating element to flow inside. The present invention relates to a cooling plate that cools a heating element by transmitting to a medium.

近年、パソコンなどの電子機器は、電子制御を行うための電子回路が設けられた基板上に中央演算処理装置（ＣＰＵ）やマイクロプロセッサ（ＭＰＵ）ならびにハードディスク駆動装置（ＨＤＤ）等の高性能な電気・電子部品を実装している。これらの電気・電子部品は、高速での演算、制御等の処理を行うために、集積度および動作周波数の速度がきわめて高くなり、そのため動作中に電気・電子部品自体が高温になり多量の熱を放出する発熱体となる。   In recent years, electronic devices such as personal computers have high-performance electrical equipment such as a central processing unit (CPU), a microprocessor (MPU), and a hard disk drive (HDD) on a substrate on which electronic circuits for electronic control are provided.・ Electronic components are mounted. These electrical / electronic components perform processing such as high-speed computation and control, and therefore the integration density and operating frequency are extremely high. Therefore, the electrical / electronic components themselves become hot during operation and a large amount of heat is generated. It becomes a heating element that emits.

このような発熱体を熱輸送媒体の循環により冷却するように構成した装置の一例が特許文献１に記載されている。特許文献１に記載された構造を簡単に説明すると、冷媒が内部で循環するコールドプレートの両面に、発熱する電源ユニットがそれぞれ密着されている。このようにコールドプレートの両面に発熱する電源ユニットを密着することで、よりコンパクトな空間で冷却することができるとされている。   An example of an apparatus configured to cool such a heating element by circulation of a heat transport medium is described in Patent Document 1. The structure described in Patent Document 1 will be briefly described. Power supply units that generate heat are in close contact with both surfaces of a cold plate in which a refrigerant circulates. In this way, it is said that cooling can be performed in a more compact space by closely contacting the power supply unit that generates heat on both sides of the cold plate.

特開平５−１９８９６４号公報Japanese Unexamined Patent Publication No. 5-198964

ところで、発熱体を冷却する場合、放熱フィンをコールドプレートの内部に一体的に形成することで、熱輸送媒体とコールドプレートとの伝熱性が高まり、発熱体に対する冷却効果がより高められることが知られている。しかしながら、放熱フィンはコールドプレート内部における対面するどちらか一方の内面側に形成されるため、コールドプレートの両面に発熱体が密着された場合、一方の放熱フィンが形成された面側よりも、他方の面側の冷却効果が低下してしまうおそれがある。他方の面側の冷却効果を向上させるためには、コールドプレートを大型化するか、もしくは、放熱フィンが一体に形成されていない面側と放熱フィンとを一体的に接合することが考えられる。しかしながら、平板状であるコールドプレートの内部で溶接やろう接などの加工を施すには、加工作業に必要なコールドプレート内部の空間が狭いために困難な作業を余儀なくされ、これを避けるとすれば作業空間を大きくすることに伴ってコールドプレートが大型化してしまうおそれがある。   By the way, when cooling the heating element, it is known that the heat transfer between the heat transport medium and the cold plate is enhanced by integrally forming the radiating fins inside the cold plate, and the cooling effect on the heating element is further enhanced. It has been. However, since the heat radiating fin is formed on one inner surface side facing inside the cold plate, when the heating element is in close contact with both surfaces of the cold plate, the other side of the heat radiating fin is formed on the other side. There is a possibility that the cooling effect on the side of the surface will be reduced. In order to improve the cooling effect on the other surface side, it is conceivable to increase the size of the cold plate or to integrally bond the surface side on which the heat dissipating fins are not integrally formed with the heat dissipating fins. However, if processing such as welding or brazing is performed inside a flat plate cold plate, the space inside the cold plate required for the processing operation is limited, and it is necessary to do difficult work. There is a risk that the cold plate will become larger as the working space becomes larger.

この発明は、上記の技術的課題に着目してなされたものであり、省スペースで、発熱体が接触されている冷却板の各外面を均等に冷却することができる冷却板を提供することを目的とするものである。   This invention was made paying attention to said technical subject, and provides the cooling plate which can cool each outer surface of the cooling plate with which space-saving and the heat generating body are contacted equally. It is the purpose.

上記の目的を達成するために、請求項１の発明は、全体として中空平板状に形成されるとともに、互いに対向する一対の外壁部の外面が、動作することにより発熱する電子部品から熱を受ける受熱部とされ、その受熱部の熱を奪って受熱部を冷却する冷却用流体が内部に流通させられる冷却板において、一方の前記外壁部の内面で、前記受熱部に対応する箇所に、他方の前記外壁部の内面に向けて延びた複数の第１放熱フィンが垂設され、かつ他方の前記外壁部の内面で、前記受熱部に対応する箇所に、一方の前記外壁部の内面に向けて延びた複数の第２放熱フィンが垂設され、これら第１放熱フィンと第２放熱フィンとが、その厚さ方向に間隔をあけて配置されていることを特徴とするものである。   In order to achieve the above object, the invention according to claim 1 is formed in a hollow flat plate shape as a whole and receives heat from an electronic component that generates heat when the outer surfaces of a pair of outer wall portions facing each other operate. In the cooling plate, which is a heat receiving part, and in which a cooling fluid that cools the heat receiving part by taking heat of the heat receiving part is circulated inside, on the inner surface of one of the outer wall parts, the other part is located at a position corresponding to the heat receiving part. A plurality of first heat dissipating fins extending toward the inner surface of the outer wall portion, and facing the inner surface of one of the outer wall portions at a location corresponding to the heat receiving portion on the inner surface of the other outer wall portion. A plurality of second heat dissipating fins extending vertically are provided, and the first heat dissipating fins and the second heat dissipating fins are arranged at intervals in the thickness direction.

また、請求項２の発明は、全体として中空平板状に形成されるとともに、互いに対向する一対の外壁部の外面が、動作することにより発熱する電子部品から熱を受ける受熱部とされ、その受熱部の熱を奪って受熱部を冷却する冷却用流体が内部に流通させられる冷却板において、一方の前記外壁部の内面で、前記受熱部に対応する箇所に、他方の前記外壁部の内面に向けて延びた複数の第１放熱フィンが垂設され、かつ他方の前記外壁部の内面で、前記受熱部に対応する箇所に、一方の前記外壁部の内面に向けて延びた複数の第２放熱フィンが垂設され、一方の前記外壁部における受熱部と他方の前記外壁部における受熱部とが、前記各放熱フィンの幅方向にずれて配置され、かつそれぞれの受熱部に対応して設けられている前記第１放熱フィンと前記第２放熱フィンとがそれぞれの幅方向にずれて配置されていることを特徴とするものである。   The invention according to claim 2 is formed as a hollow flat plate as a whole, and the outer surfaces of the pair of outer wall portions facing each other are heat receiving portions that receive heat from electronic components that generate heat when operated, and receive the heat. In a cooling plate in which a cooling fluid that cools the heat receiving portion by removing heat from the portion is circulated inside, on the inner surface of one of the outer wall portions, on the location corresponding to the heat receiving portion, on the inner surface of the other outer wall portion A plurality of first heat dissipating fins extending vertically and a plurality of second heat radiation fins extending toward the inner surface of one of the outer wall portions at a position corresponding to the heat receiving portion on the inner surface of the other outer wall portion. A heat radiating fin is vertically provided, and the heat receiving portion in one of the outer wall portions and the heat receiving portion in the other outer wall portion are arranged so as to be shifted in the width direction of each of the radiating fins, and are provided corresponding to the respective heat receiving portions. The first heat radiating fan It is characterized in that the emission and the second heat radiation fins are arranged offset in each width direction.

また、請求項３の発明は、請求項２の発明において、前記第１放熱フィンと前記第２放熱フィンとがその厚さ方向に互いにずれていることを特徴とする冷却板である。   According to a third aspect of the invention, there is provided the cooling plate according to the second aspect, wherein the first radiating fin and the second radiating fin are displaced from each other in the thickness direction.

また、請求項４の発明は、請求項１ないし３の発明において、前記第１放熱フィンは、前記他方の外壁部の内面に向けて延びてその他方の外壁部の内面に接触し、前記第２放熱フィンは、前記一方の外壁部の内面に向けて延びてその一方の外壁部の内面に接触していることを特徴とする冷却板である。   According to a fourth aspect of the present invention, in the first to third aspects of the invention, the first radiating fin extends toward the inner surface of the other outer wall portion and contacts the inner surface of the other outer wall portion. The two radiating fins extend toward the inner surface of the one outer wall portion and are in contact with the inner surface of the one outer wall portion.

さらに、請求項５の発明は、請求項１ないし４のいずれかの発明において、前記冷却用流体は、水を含むことを特徴とする冷却板である。   The invention of claim 5 is the cooling plate according to any one of claims 1 to 4, wherein the cooling fluid contains water.

この請求項１の発明によれば、一方の外壁部の内面で、発熱する電子部品から熱を受ける受熱部に対応する箇所に、他方の外壁部の内面に向けて延びた複数の第１放熱フィンが垂設されており、また他方の外壁部の内面で、受熱部に対応する箇所に、一方の外壁部の内面に向けて延びた複数の第２放熱フィンが垂設されている。これら第１放熱フィンと第２放熱フィンとは、その厚さ方向に間隔をあけて配置されている。外壁部に放熱フィンを垂設する加工作業は、冷却板の内部ではなく解放空間で行うことができるため、その作業を容易に行うことができる。さらに、冷却板の内部に加工作業に必要な空間を考慮する必要がなくなることで、互いに向き合う外壁部をより接近させて、第１放熱フィンと第２放熱フィンとをその厚さ方向に間隔をあけて配置するように構成することができるため、冷却板を薄くすることができる。そして、それら放熱フィンは受熱部に対応する箇所の両内面にそれぞれ形成されるため、電子部品が接触された外壁部の各外面を均等に冷却することができる。したがって、省スペースで、電子部品が接触されている冷却板の各外面を均等に冷却することができる。   According to the first aspect of the present invention, a plurality of first heat radiations extending toward the inner surface of the other outer wall portion at a position corresponding to the heat receiving portion that receives heat from the heat generating electronic component on the inner surface of one outer wall portion. A plurality of second heat radiating fins extending toward the inner surface of the one outer wall portion is suspended from the inner surface of the other outer wall portion at a position corresponding to the heat receiving portion. These 1st radiation fins and 2nd radiation fins are arrange | positioned at intervals in the thickness direction. Since the processing operation of suspending the radiation fins on the outer wall portion can be performed not in the cooling plate but in the open space, the operation can be easily performed. Furthermore, since it is not necessary to consider the space required for the processing operation inside the cooling plate, the outer wall portions facing each other are brought closer to each other, and the first radiating fin and the second radiating fin are spaced apart in the thickness direction. Since it can comprise so that it may open and arrange | position, a cooling plate can be made thin. And since these radiation fins are each formed in both the inner surfaces of the location corresponding to a heat receiving part, each outer surface of the outer wall part which the electronic component contacted can be cooled equally. Therefore, each outer surface of the cooling plate with which the electronic component is in contact can be evenly cooled in a space-saving manner.

また、請求項２の発明によれば、一方の外壁部の内面で、発熱する電子部品から熱を受ける受熱部に対応する箇所に、他方の外壁部の内面に向けて延びた複数の第１放熱フィンが垂設されており、また他方の外壁部の内面で、受熱部に対応する箇所に、一方の外壁部の内面に向けて延びた複数の第２放熱フィンが垂設されている。一方の外壁部における受熱部と他方の外壁部における受熱部とは、各放熱フィンの幅方向にずれて配置され、かつそれぞれの受熱部に対応して設けられている第１放熱フィンと第２放熱フィンとがそれぞれの幅方向にずれて配置されている。外壁部に放熱フィンを垂設する加工作業は、冷却板の内部ではなく解放空間で行うことができるため、その作業を容易に行うことができる。さらに、冷却板の内部に加工作業に必要な空間を考慮する必要がなくなることで、互いに向き合う外壁部をより接近させて、第１放熱フィンと第２放熱フィンとをその厚さ方向に間隔をあけて配置するように構成することができるため、冷却板を薄くすることができる。そして、それら放熱フィンは、各放熱フィンの幅方向にずれて配置されれた受熱部に対応する箇所の各内面にそれぞれ形成されるため、電子部品が接触された外壁部の各外面を均等に冷却することができる。したがって、省スペースで、電子部品が接触されている冷却板の各外面を均等に冷却することができる。   According to the invention of claim 2, a plurality of first surfaces extending toward the inner surface of the other outer wall portion at a position corresponding to the heat receiving portion that receives heat from the electronic component that generates heat on the inner surface of one outer wall portion. A plurality of second radiating fins extending toward the inner surface of one outer wall portion are suspended from a portion corresponding to the heat receiving portion on the inner surface of the other outer wall portion. The heat receiving portion in one outer wall portion and the heat receiving portion in the other outer wall portion are arranged shifted in the width direction of each radiating fin, and the first radiating fin and the second radiating fin provided corresponding to each heat receiving portion. The heat dissipating fins are arranged so as to be shifted in the respective width directions. Since the processing operation of suspending the radiation fins on the outer wall portion can be performed not in the cooling plate but in the open space, the operation can be easily performed. Furthermore, since it is not necessary to consider the space required for the processing operation inside the cooling plate, the outer wall portions facing each other are brought closer to each other, and the first radiating fin and the second radiating fin are spaced apart in the thickness direction. Since it can comprise so that it may open and arrange | position, a cooling plate can be made thin. And since these radiation fins are each formed in each inner surface of the location corresponding to the heat receiving part arrange | positioned shifted | deviated in the width direction of each radiation fin, each outer surface of the outer wall part which the electronic component contacted equally Can be cooled. Therefore, each outer surface of the cooling plate with which the electronic component is in contact can be evenly cooled in a space-saving manner.

（ａ）はこの発明に係る冷却板の具体例を示す長手方向に沿う横断面図である。（ｂ）は図１（ａ）のＡ−Ａ線に沿う垂直断面図である。（ｃ）は図１（ａ）のＢ−Ｂ線に沿う縦断面図である。(A) is a cross-sectional view along the longitudinal direction showing a specific example of the cooling plate according to the present invention. FIG. 2B is a vertical sectional view taken along the line AA in FIG. (C) is a longitudinal cross-sectional view which follows the BB line of Fig.1 (a). この発明に係る冷却板の具体例を示す斜視図である。It is a perspective view which shows the specific example of the cooling plate which concerns on this invention. （ａ）はこの発明に係る冷却板の他の具体例を示す長手方向に沿う横断面図である。（ｂ）は図３（ａ）のＣ−Ｃ線に沿う垂直断面図である。（ｃ）は図３（ａ）のＤ−Ｄ線に沿う縦断面図である。(A) is a cross-sectional view along the longitudinal direction showing another specific example of the cooling plate according to the present invention. FIG. 3B is a vertical sectional view taken along the line CC in FIG. (C) is a longitudinal cross-sectional view which follows the DD line | wire of Fig.3 (a).

つぎに、この発明を具体例に基づいて説明する。この発明は、基板上に実装された発熱体に間接的または直接的に両面でそれぞれ接触し、発熱体の熱を受ける受熱部から冷却用流体に伝達させて、発熱体を冷却する冷却板に関するものである。例えば、その発熱体は、パーソナルコンピュータなどのエレクトロニクス機器に設けられ、基板上に実装される中央演算処理装置（ＣＰＵ）やマイクロプロセッサ（ＭＰＵ）等の高性能な半導体チップならびにハードディスク駆動装置（ＨＤＤ）等があげられる。   Next, the present invention will be described based on specific examples. The present invention relates to a cooling plate that cools a heating element by contacting a heating element mounted on a substrate indirectly or directly on both sides and transmitting the heat from a heat receiving portion that receives heat from the heating element to a cooling fluid. Is. For example, the heating element is provided in an electronic device such as a personal computer, and a high-performance semiconductor chip such as a central processing unit (CPU) or a microprocessor (MPU) mounted on a substrate and a hard disk drive (HDD). Etc.

冷却板（コールドプレート）１は、図１および図２に示すように、全体として平板状に形成されている。また、冷却板１は、その内部１ａが中空であって、その断面が矩形状に形成されている。冷却板１の対面する外壁部２，３の外面２ａ，３ａには、基板４，５上に実装された電子部品（発熱体）６，７が、基板４，５を介して熱伝達可能に間接的にそれぞれ接触している。また、動作することにより電子部品６，７から生じた熱が基板４，５を介して伝達される各外壁部３，４の外面部分２ｂ，３ｂを、受熱部と呼ぶこととする。なお、冷却板は、その外部の熱を内部を流動する冷却用流体に伝達する必要があるため、熱伝導性を有する材料で構成されていることが好ましい。例えば、冷却板は、銅あるいは銅合金などによって形成されることが好ましい。   As shown in FIGS. 1 and 2, the cooling plate (cold plate) 1 is formed in a flat plate shape as a whole. Moreover, the inside of the cooling plate 1 is hollow, and the cross section is formed in a rectangular shape. On the outer surfaces 2a and 3a of the outer wall portions 2 and 3 facing the cooling plate 1, electronic components (heating elements) 6 and 7 mounted on the substrates 4 and 5 can transfer heat via the substrates 4 and 5. Indirect contact with each other. Further, the outer surface portions 2b and 3b of the outer wall portions 3 and 4 through which heat generated from the electronic components 6 and 7 is transmitted through the substrates 4 and 5 by operation are referred to as heat receiving portions. In addition, since it is necessary to transmit the heat of the exterior to the cooling fluid which flows through the inside, it is preferable that the cooling plate is comprised with the material which has heat conductivity. For example, the cooling plate is preferably formed of copper or a copper alloy.

また、冷却板１には、図２に示すように、その内部１ａを冷却用流体が流動するように、冷却用流体が流入する流入口に流入用パイプ８が一方の側面部９に設けられ、冷却用流体が流出する流出口に流出用パイプ１０が他方の側面部１１に設けられている。   Further, as shown in FIG. 2, the cooling plate 1 is provided with an inflow pipe 8 at one side surface portion 9 at an inlet into which the cooling fluid flows so that the cooling fluid flows in the inside 1a. The outflow pipe 10 is provided on the other side surface portion 11 at the outlet from which the cooling fluid flows out.

冷却板１の内部１ａを流れる冷却用流体は、発熱体から吸収した熱を冷却板１の外に排出するために一般的に用いられているものでよく、例えば冷水を用いている。   The cooling fluid flowing through the inside 1a of the cooling plate 1 may be generally used for discharging the heat absorbed from the heating element to the outside of the cooling plate 1, and for example, cold water is used.

また、一方の外壁部２には、その内面２ｃで受熱部２ｂに対応する箇所に、他方の外壁部３の内面３ｃに向けて延びた複数の第１放熱フィン１２が一体的に垂設されている。言い換えると、第１放熱フィン１２は、その厚さ方向に所定の間隔をあけて列を成すように、一方の外壁部２の内面２ｃに一体的に複数形成されている。これら第１放熱フィン１２は、平板状であって、一方の外壁部２の内面２ｃに対面する他方の外壁部３の内面３ｃに向かって延び出ている。これら第１放熱フィン１２は、一方の外壁部２から伝達された電子部品６の熱を冷却用流体に伝達するように構成されている。   In addition, a plurality of first radiating fins 12 extending toward the inner surface 3c of the other outer wall portion 3 are integrally suspended from one outer wall portion 2 at a position corresponding to the heat receiving portion 2b on the inner surface 2c. ing. In other words, a plurality of the first radiating fins 12 are integrally formed on the inner surface 2c of the one outer wall portion 2 so as to form a row at a predetermined interval in the thickness direction. These first radiating fins 12 have a flat plate shape and extend toward the inner surface 3c of the other outer wall portion 3 facing the inner surface 2c of one outer wall portion 2. These first radiating fins 12 are configured to transmit the heat of the electronic component 6 transmitted from one outer wall portion 2 to the cooling fluid.

また、他方の外壁部３には、その内面３ｃで受熱部３ｂに対応する箇所に、一方の外壁部２の内面２ｃに向けて延びた複数の第２放熱フィン１３が垂設されている。言い換えると、第２放熱フィン１３は、その厚さ方向に所定の間隔をあけて列を成すように、他方の外壁部３の内面３ｃに一体的に複数形成されている。これら第２放熱フィン１３は、平板状であって、一方の外壁部２の内面２ｃに向かって延び出ている。この第２放熱フィン１３は、他方の受熱部３ｂから伝達された他の電子部品７の熱を冷却用流体に伝達するように構成されている。なお、第１放熱フィンが一体に形成された一方の外壁部と第２放熱フィンが一体に形成された他方の外壁部とは、同一の構成でもよい。   A plurality of second radiating fins 13 extending toward the inner surface 2c of the one outer wall portion 2 are suspended from the other outer wall portion 3 at a position corresponding to the heat receiving portion 3b on the inner surface 3c. In other words, the plurality of second heat radiation fins 13 are integrally formed on the inner surface 3c of the other outer wall portion 3 so as to form a row at a predetermined interval in the thickness direction. These 2nd radiation fins 13 are flat form, and are extended toward the inner surface 2c of one outer wall part 2. As shown in FIG. The second heat radiating fin 13 is configured to transmit the heat of the other electronic component 7 transmitted from the other heat receiving portion 3b to the cooling fluid. In addition, the same structure may be sufficient as one outer wall part in which the 1st radiation fin was integrally formed, and the other outer wall part in which the 2nd radiation fin was integrally formed.

そして、第１放熱フィン１２と第２放熱フィン１３とは、それらの厚さ方向に間隔をあけて配置されている。具体的には、第１放熱フィン１２におけるフィン１２ａは、第２放熱フィン１３の列におけるフィン１３ａと他のフィン１３ｂとのその厚さ方向の間で、挟まれるように配置される。言い換えると、第１放熱フィン１２と第２放熱フィン１３とは、厚さ方向に間隔をあけて配置されるとともに、それらの幅方向に互いにずれて配置されている。なお、第１放熱フィンが一体に形成された一方の外壁部と第２放熱フィンが一体に形成された他方の外壁部とが同一の構成である場合には、放熱フィンが形成された２つの外壁部をその放熱フィンが互いに向き合うように配置されるとともに、それら放熱フィンがその厚さ方向に間隔をあけて配置されるように構成されている。   And the 1st radiation fin 12 and the 2nd radiation fin 13 are arranged at intervals in those thickness directions. Specifically, the fins 12a in the first radiating fins 12 are arranged so as to be sandwiched between the thickness directions of the fins 13a and the other fins 13b in the row of the second radiating fins 13. In other words, the first radiating fins 12 and the second radiating fins 13 are arranged with an interval in the thickness direction and are shifted from each other in the width direction. In addition, when one outer wall part integrally formed with the first heat radiating fin and the other outer wall part integrally formed with the second heat radiating fin have the same configuration, the two heat radiating fins are formed. The outer wall portion is arranged so that the radiating fins face each other, and the radiating fins are arranged at intervals in the thickness direction.

外壁部２，３に放熱フィン１２，１３を一体的に垂設する加工作業は、冷却板１の内部１ａではなく解放空間で行うことができるため、その作業を容易に行うことができる。さらに、冷却板１の内部１ａにおいて加工作業に必要な空間が必要なくなることで、互いに向き合う外壁部２，３をより接近させて、第１放熱フィン１２と第２放熱フィン１３とをその厚さ方向に間隔をあけて配置するように構成することができるため、冷却板１を薄くすることができる。また、第１放熱フィン１２が一体に形成された一方の外壁部２と第２放熱フィン１３が一体に形成された他方の外壁部３とが同一の構成である場合には、放熱フィン１２，１３と外壁部２，３とが一体となった同一の構成のものを対に配置して冷却板１を構成することができるため、製造コストを低減させることができる。   Since the machining operation for integrally suspending the radiation fins 12 and 13 on the outer wall portions 2 and 3 can be performed in the open space instead of the inside 1a of the cooling plate 1, the operation can be easily performed. Furthermore, since the space required for the machining operation is not required in the inside 1a of the cooling plate 1, the outer wall portions 2 and 3 facing each other are brought closer to each other, and the thickness of the first radiating fins 12 and the second radiating fins 13 is increased. Since it can comprise so that it may arrange | position at intervals in a direction, the cooling plate 1 can be made thin. When one outer wall 2 formed integrally with the first heat radiating fin 12 and the other outer wall 3 formed integrally with the second heat radiating fin 13 have the same configuration, Since the cooling plate 1 can be configured by arranging a pair of the same configuration in which the outer wall portions 2 and 3 and the outer wall portions 2 and 3 are integrated, the manufacturing cost can be reduced.

そして、発熱した電子部品６により受熱部２ｂに伝達された熱は、外壁部２の内面２ｃで受熱部２ｂに対応する箇所に一体的に形成された第１放熱フィン１２に伝熱された後に、第１放熱フィン１２を介して冷却用流体に伝熱される。また、他の電子部品７より他方の受熱部３ｂに伝達された熱は、その内面３ｃで受熱部３ｂに対応する箇所に一体的に形成された第２放熱フィン１３に伝熱された後に、第２放熱フィン１３を介して冷却用流体に伝熱される。したがって、それら放熱フィン１２，１３は、受熱部２ｂ，３ｂに対応する内面２ｃ，３ｃにそれぞれ形成されるため、外壁部２，３の両外面２ａ，３ｂにおける電子部品６，７を均等に冷却することができる。   And after the heat transmitted to the heat receiving part 2b by the heat generated electronic component 6 is transferred to the first radiating fins 12 integrally formed at a position corresponding to the heat receiving part 2b on the inner surface 2c of the outer wall part 2. Then, heat is transferred to the cooling fluid through the first radiation fins 12. In addition, after the heat transmitted from the other electronic component 7 to the other heat receiving portion 3b is transferred to the second heat radiation fin 13 integrally formed at a position corresponding to the heat receiving portion 3b on the inner surface 3c, Heat is transferred to the cooling fluid through the second radiating fins 13. Therefore, since these radiation fins 12 and 13 are formed on the inner surfaces 2c and 3c corresponding to the heat receiving portions 2b and 3b, respectively, the electronic components 6 and 7 on both outer surfaces 2a and 3b of the outer wall portions 2 and 3 are evenly cooled. can do.

したがって、省スペースで、電子部品が接触している冷却板の各外面を均等に冷却することができる。   Therefore, each outer surface of the cooling plate in contact with the electronic component can be evenly cooled in a space-saving manner.

次に、この発明に係る冷却板の他の具体例について説明する。冷却板１４の構成は、前述の具体例における構成とほぼ同様のものであるため、その説明は省略し、受熱部と放熱フィンとに係る構成についてのみ説明する。   Next, another specific example of the cooling plate according to the present invention will be described. Since the configuration of the cooling plate 14 is substantially the same as the configuration in the above-described specific example, the description thereof will be omitted, and only the configuration relating to the heat receiving portion and the radiation fin will be described.

図３（ｂ）に示すように、一方の外壁部２における受熱部２ｄと他方の外壁部３における受熱部３ｄとは、各放熱フィン１５，１６の幅方向にずれて配置されている。言い換えると、一方の外壁部２の外面２ａに配置されている電子部品６と、他方の外壁部３の外面３ａに配置されている他方の電子部品７とは、各放熱フィン１５，１６の幅方向にずれて配置されている。   As shown in FIG. 3 (b), the heat receiving portion 2 d in one outer wall portion 2 and the heat receiving portion 3 d in the other outer wall portion 3 are arranged so as to be shifted in the width direction of the radiating fins 15 and 16. In other words, the electronic component 6 disposed on the outer surface 2a of one outer wall 2 and the other electronic component 7 disposed on the outer surface 3a of the other outer wall 3 are the widths of the heat radiation fins 15 and 16, respectively. They are displaced in the direction.

第１放熱フィン１５は、図３（ａ）および図３（ｃ）に示すように、一方の外壁部２の外面２ａの受熱部２ｄに対応した内面２ｃの箇所に一体的に形成され、その第１放熱フィン１５の厚さ方向に所定の間隔をあけた状態で列を形成している。また、この第１放熱フィン１５の他方端１５ａは、他方の外壁部３の内面３ｃ側に延び出て内面３ｃに接触している。   As shown in FIGS. 3 (a) and 3 (c), the first heat dissipating fin 15 is integrally formed at the location of the inner surface 2c corresponding to the heat receiving portion 2d of the outer surface 2a of one outer wall portion 2, The rows are formed with a predetermined interval in the thickness direction of the first radiating fins 15. Further, the other end 15a of the first heat radiation fin 15 extends toward the inner surface 3c side of the other outer wall portion 3 and is in contact with the inner surface 3c.

第２放熱フィン１６は、他方の外壁部３の外面３ａの受熱部３ｄに対応した内面３ｃの箇所に一体的に形成され、その第２放熱フィン１６の厚さ方向に所定の間隔をあけた状態で列を形成している。この第２放熱フィン１６の他方端１６ａは、一方の外壁部２の内面２ｃ側に延び出て内面に接触している。
これら第１放熱フィン１５と前記第２放熱フィン１６とは、それぞれの幅方向にずれて配置されている。また、第１放熱フィン１５の列と第２放熱フィン１６の列との水平方向の間にはクリアランスが設けられている。 The second radiating fins 16 are integrally formed at a location on the inner surface 3c corresponding to the heat receiving portion 3d of the outer surface 3a of the other outer wall portion 3, and a predetermined interval is provided in the thickness direction of the second radiating fins 16. A row is formed in the state. The other end 16a of the second radiating fin 16 extends toward the inner surface 2c of the one outer wall portion 2 and is in contact with the inner surface.
The first heat radiating fins 15 and the second heat radiating fins 16 are arranged so as to be shifted in the respective width directions. In addition, a clearance is provided between the row of the first radiating fins 15 and the row of the second radiating fins 16.

したがって、この発明に係る冷却板の他の具体例は、この発明に係る冷却板の具体例と同様の効果を得ることができる。   Therefore, the other specific example of the cooling plate according to the present invention can obtain the same effect as the specific example of the cooling plate according to the present invention.

１…冷却板（コールドプレート）、 ２…一方の外壁部、 ２ｂ…（一方の外壁部の）受熱部、 ２ｃ…（一方の外壁部の）内面、 ３…他方の外壁部、 ３ｂ…（他方の外壁部の）受熱部、 ３ｃ…（他方の外壁部の）内面、 １２…第１放熱フィン、 １３…第２放熱フィン。   DESCRIPTION OF SYMBOLS 1 ... Cooling plate (cold plate), 2 ... One outer wall part, 2b ... Heat receiving part (of one outer wall part), 2c ... Inner surface (of one outer wall part), 3 ... Other outer wall part, 3b ... (the other) A heat receiving portion 3c (inside of the other outer wall portion), 12 a first radiating fin, 13 a second radiating fin.

Claims (5)

全体として中空平板状に形成されるとともに、互いに対向する一対の外壁部の外面が、動作することにより発熱する電子部品から熱を受ける受熱部とされ、その受熱部の熱を奪って受熱部を冷却する冷却用流体が内部に流通させられる冷却板において、
一方の前記外壁部の内面で、前記受熱部に対応する箇所に、他方の前記外壁部の内面に向けて延びた複数の第１放熱フィンが垂設され、
かつ他方の前記外壁部の内面で、前記受熱部に対応する箇所に、一方の前記外壁部の内面に向けて延びた複数の第２放熱フィンが垂設され、
これら第１放熱フィンと第２放熱フィンとが、その厚さ方向に間隔をあけて配置されている
ことを特徴とする冷却板。 The outer surface of a pair of outer wall portions opposed to each other as a whole is a heat receiving portion that receives heat from an electronic component that generates heat by operation, and the heat receiving portion is deprived of heat from the heat receiving portion. In the cooling plate in which the cooling fluid to be cooled is circulated,
A plurality of first radiating fins extending toward the inner surface of the other outer wall portion are vertically provided at a position corresponding to the heat receiving portion on the inner surface of the one outer wall portion,
And on the inner surface of the other outer wall portion, a plurality of second radiating fins extending toward the inner surface of one of the outer wall portions are provided vertically at a location corresponding to the heat receiving portion,
The cooling plate, wherein the first heat radiation fins and the second heat radiation fins are arranged at an interval in the thickness direction. 全体として中空平板状に形成されるとともに、互いに対向する一対の外壁部の外面が、動作することにより発熱する電子部品から熱を受ける受熱部とされ、その受熱部の熱を奪って受熱部を冷却する冷却用流体が内部に流通させられる冷却板において、
一方の前記外壁部の内面で、前記受熱部に対応する箇所に、他方の前記外壁部の内面に向けて延びた複数の第１放熱フィンが垂設され、
かつ他方の前記外壁部の内面で、前記受熱部に対応する箇所に、一方の前記外壁部の内面に向けて延びた複数の第２放熱フィンが垂設され、
一方の前記外壁部における受熱部と他方の前記外壁部における受熱部とが、前記各放熱フィンの幅方向にずれて配置され、かつそれぞれの受熱部に対応して設けられている前記第１放熱フィンと前記第２放熱フィンとがそれぞれの幅方向にずれて配置されている
ことを特徴とする冷却板。 The outer surface of a pair of outer wall portions opposed to each other as a whole is a heat receiving portion that receives heat from an electronic component that generates heat by operation, and the heat receiving portion is deprived of heat from the heat receiving portion. In the cooling plate in which the cooling fluid to be cooled is circulated,
A plurality of first radiating fins extending toward the inner surface of the other outer wall portion are vertically provided at a position corresponding to the heat receiving portion on the inner surface of the one outer wall portion,
And on the inner surface of the other outer wall portion, a plurality of second radiating fins extending toward the inner surface of one of the outer wall portions are provided vertically at a location corresponding to the heat receiving portion,
The first heat radiating portion in which the heat receiving portion in one of the outer wall portions and the heat receiving portion in the other outer wall portion are arranged so as to be shifted in the width direction of each of the radiating fins and are provided corresponding to the respective heat receiving portions. The cooling plate according to claim 1, wherein the fins and the second heat dissipating fins are arranged so as to be shifted in the width direction. 前記第１放熱フィンと前記第２放熱フィンとがその厚さ方向に互いにずれていることを特徴とする請求項２の冷却板。   3. The cooling plate according to claim 2, wherein the first radiating fin and the second radiating fin are shifted from each other in the thickness direction. 前記第１放熱フィンは、前記他方の外壁部３の内面に向けて延びてその他方の外壁部の内面に接触し、
前記第２放熱フィンは、前記一方の外壁部２の内面に向けて延びてその一方の外壁部の内面に接触している
ことを特徴とする請求項１ないし３のいずれかに記載の冷却板。 The first radiating fin extends toward the inner surface of the other outer wall portion 3 and contacts the inner surface of the other outer wall portion,
4. The cooling plate according to claim 1, wherein the second radiating fin extends toward an inner surface of the one outer wall portion 2 and is in contact with an inner surface of the one outer wall portion. 5. . 前記冷却用流体は、水を含むことを特徴とする請求項１ないし４のいずれかに記載の冷却板。   The cooling plate according to any one of claims 1 to 4, wherein the cooling fluid contains water.
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