JP2008294196A - Cooler - Google Patents

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JP2008294196A
JP2008294196A JP2007137703A JP2007137703A JP2008294196A JP 2008294196 A JP2008294196 A JP 2008294196A JP 2007137703 A JP2007137703 A JP 2007137703A JP 2007137703 A JP2007137703 A JP 2007137703A JP 2008294196 A JP2008294196 A JP 2008294196A
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convex
substrate
cooler
convex portions
portions
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JP5182604B2 (en
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Hiroshi Miyata
博志 宮田
Yoshio Kuromitsu
祥郎 黒光
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooler that can be manufactured easily even if fins are spaced with shorter intervals. <P>SOLUTION: The cooler comprises: a first substrate 4, and a first projecting substrate 2 having a plurality of first projections 5 projecting from the first substrate 4; and a second substrate 6, and a second projecting substrate 3 having a plurality of second projections 7 projecting from the second substrate 6. The first and second projecting substrates 2, 3 are arranged oppositely so that the first projection 5 projects toward the second substrate 6 and the second projection 7 projects toward the first substrate 4 and at least one second projection 7 is arranged between the two adjacent first projections 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、例えば半導体チップなどの電子部品が実装される回路基板などの発熱体で発生した熱を放散させる冷却器に関するものである。   The present invention relates to a cooler that dissipates heat generated by a heating element such as a circuit board on which an electronic component such as a semiconductor chip is mounted.

従来から、ＤＢＡ（Ａｌ／ＡｌＮ／Ａｌ）やＤＢＣ（Ｃｕ／ＡｌＮ／Ｃｕ）などのように、絶縁セラミックスの両面に接合によって金属層を形成した絶縁回路基板を有するパワーモジュールが知られている。この種のパワーモジュールは、絶縁回路基板上に搭載された電子部品で発生した熱を放散させる液冷式のヒートシンクを備えている。
このようなヒートシンクとして、例えばピン状のフィンを複数突設したものが提案されている（例えば、特許文献１参照）。
特開２００２−１１０８６８号公報 2. Description of the Related Art Conventionally, power modules having an insulating circuit substrate in which metal layers are formed by bonding on both surfaces of insulating ceramics, such as DBA (Al / AlN / Al) and DBC (Cu / AlN / Cu), are known. This type of power module includes a liquid-cooled heat sink that dissipates heat generated by electronic components mounted on an insulating circuit board.
As such a heat sink, for example, one in which a plurality of pin-shaped fins protrudes has been proposed (see, for example, Patent Document 1).
JP 2002-110868 A

しかしながら、上記従来のヒートシンクには、以下の課題が残されている。すなわち、表面積を広くして放熱効果を高めるため、フィンの狭ピッチ化が望まれている。しかし、フィンを狭ピッチ化すると、より微細な加工が求められるために製造が困難になる。   However, the following problems remain in the conventional heat sink. That is, in order to increase the surface area and increase the heat dissipation effect, it is desired to reduce the pitch of the fins. However, if the pitch of the fins is reduced, manufacturing becomes difficult because finer processing is required.

本発明は、前述の課題に鑑みてなされたもので、フィンを狭ピッチ化しても製造が容易な冷却器を提供することを目的とする。   The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a cooler that can be easily manufactured even when fins are narrowed in pitch.

本発明は、上記のような課題を解決するために以下のような手段を採用した。すなわち、本発明の冷却器は、第１基板及び該第１基板に突設された複数の第１凸部を有する第１凸基板と、第２基板及び該第２基板に突設された複数の第２凸部を有する第２凸基板とを備え、前記第１及び第２凸基板は、前記第１凸部が前記第２基板に向けて突出して前記第２凸部が前記第１基板に向けて突出すると共に、隣り合う２つの前記第１凸部の間に少なくとも１つの前記第２凸部が配置されるように対向配置されていることを特徴とする。   The present invention employs the following means in order to solve the above problems. That is, the cooler of the present invention includes a first substrate having a first substrate and a plurality of first protrusions protruding from the first substrate, and a plurality of second substrates protruding from the second substrate. A second convex substrate having a second convex portion, wherein the first and second convex substrates have the first convex portion protruding toward the second substrate and the second convex portion being the first substrate. And at least one second convex portion is disposed opposite to each other between the two adjacent first convex portions.

この発明によれば、隣り合う２つの第１凸部の間に第２凸部を配置することで、第１及び第２凸部をそれぞれ狭ピッチ化させることなく、複数の凸部を狭ピッチで配置することができる。したがって、高い放熱効果を有する冷却器を容易に製造できる。   According to this invention, by arranging the second convex portion between two adjacent first convex portions, the plurality of convex portions can be arranged at a narrow pitch without reducing the pitch of the first and second convex portions, respectively. Can be arranged in. Therefore, a cooler having a high heat dissipation effect can be easily manufactured.

また、本発明の冷却器は、前記複数の第１及び第２凸部が相対的に高い密度で配置された領域と、該複数の第１及び第２凸部が相対的に低い密度で配置された領域とを有することが好ましい。
この発明によれば、第１及び第２凸部の配置状態に粗密分布を形成することで、冷却器の内部に流動抵抗の分布が形成される。そして、冷却器内部を流通する流体は、相対的に流動抵抗の低い領域に沿って流通する。このため、第１及び第２凸部の配置を適宜設定することで、冷却器内部を流通する流体の流路を形成できる。したがって、より高い放熱効果を有する冷却器を製造できる。 In the cooler according to the present invention, the plurality of first and second protrusions are disposed at a relatively high density, and the plurality of first and second protrusions are disposed at a relatively low density. It is preferable to have the area | region made.
According to this invention, the distribution of flow resistance is formed inside the cooler by forming a coarse and dense distribution in the arrangement state of the first and second convex portions. And the fluid which distribute | circulates the inside of a cooler distribute | circulates along the area | region where flow resistance is relatively low. For this reason, the flow path of the fluid which distribute | circulates the inside of a cooler can be formed by setting arrangement | positioning of a 1st and 2nd convex part suitably. Therefore, a cooler having a higher heat dissipation effect can be manufactured.

また、本発明の冷却器は、前記第１及び第２凸部が、ピン状であることとしてもよい。
この発明によれば、第１及び第２凸部をピン状にすることで、第１及び第２凸部の表面積を広げることができる。 Moreover, the cooler of this invention is good also as the said 1st and 2nd convex part being a pin shape.
According to this invention, the surface areas of the first and second convex portions can be increased by forming the first and second convex portions into a pin shape.

また、本発明の冷却器は、前記第１及び第２凸部が、リブ状であることとしてもよい。
この発明によれば、リブ状の凸部が狭ピッチで配置された冷却器を容易に製造できる。 Moreover, the cooler of this invention is good also as the said 1st and 2nd convex part being rib shape.
According to the present invention, a cooler in which rib-shaped convex portions are arranged at a narrow pitch can be easily manufactured.

この発明にかかる冷却器によれば、第１及び第２凸部の形成間隔をそれぞれ狭くすることなく凸部を狭ピッチ化させることができるので、高い放熱効果を有する冷却器を容易に製造できる。   According to the cooler according to the present invention, since the pitch of the convex portions can be reduced without narrowing the formation interval of the first and second convex portions, a cooler having a high heat dissipation effect can be easily manufactured. .

以下、本発明による冷却器の第１の実施形態を、図面に基づいて説明する。なお、以下の説明に用いる各図面では、各部材を認識可能な大きさとするために縮尺を適宜変更している。   Hereinafter, a first embodiment of a cooler according to the present invention will be described with reference to the drawings. In each drawing used in the following description, the scale is appropriately changed to make each member a recognizable size.

本実施形態における冷却器１は、水冷式のヒートシンクであって、図１に示すように、互いに接合された第１及び第２凸基板２、３を備えている。
第１凸基板２は、例えばＣｕ（銅）やＡｌ（アルミニウム）などで構成されており、第１基板４と、第１基板４に突設された複数のピン状の第１凸部５とを備えている。
第１基板４は、箱形状を有しており、平面視でほぼ矩形状の平板部４ａと、平板部４ａの外周に沿って形成された枠状の壁部４ｂとを有している。ここで、壁部４ｂの高さと第１凸部５の高さとは、ほぼ同等となっている。なお、第１基板４と第１凸部５とは、切削加工により第１基板４と一体的に形成されている。
第１凸部５は、ほぼ四角柱形状を有しており、図１（ｂ）に示すように、第１基板４の表面の２方向においてマトリックス状に等間隔となるように立設されている。また、第１凸部５のうち第１基板４に近接する基端部は、図１（ａ）に示すように、第１凸部５の強度を十分に確保するため、他の部分と比較して太くなっている。 The cooler 1 according to the present embodiment is a water-cooled heat sink, and includes first and second convex substrates 2 and 3 joined to each other as shown in FIG.
The first convex substrate 2 is made of, for example, Cu (copper), Al (aluminum), or the like, and includes a first substrate 4 and a plurality of pin-shaped first convex portions 5 protruding from the first substrate 4. It has.
The first substrate 4 has a box shape and includes a substantially rectangular flat plate portion 4a in plan view and a frame-shaped wall portion 4b formed along the outer periphery of the flat plate portion 4a. Here, the height of the wall part 4b and the height of the 1st convex part 5 are substantially equivalent. In addition, the 1st board | substrate 4 and the 1st convex part 5 are integrally formed with the 1st board | substrate 4 by cutting.
The first convex portion 5 has a substantially quadrangular prism shape, and is erected so as to be equally spaced in a matrix form in two directions on the surface of the first substrate 4 as shown in FIG. Yes. In addition, as shown in FIG. 1A, the base end portion of the first convex portion 5 that is close to the first substrate 4 is compared with other portions in order to ensure sufficient strength of the first convex portion 5. And it is getting thicker.

第２凸基板３は、第１凸基板２と同様に、例えばＣｕやＡｌなどで構成されており、第２基板６と、第２基板６に突設された複数の第２凸部７とを備えている。
第２基板６は、平面視でほぼ矩形状の平板形状を有している。なお、第２基板６は、切削加工により第２凸部７と一体的に形成されている。
第２凸部７は、第１凸部５と同様に、ほぼ四角柱形状を有しており、図１（ｂ）に示すように、第２基板６の表面の２方向において等間隔となるように立設されている。
ここで、隣り合う２つの第２凸部７の間隔であるピッチは、第１凸部５のピッチと同等となっている。そして、第１及び第２凸部５、７は、２方向において千鳥状に等間隔となるように配置されている。すなわち、第２凸部７が隣り合う２つの第１凸部５の間に配置されると共に、第１凸部５が隣り合う２つの第２凸部７の間に配置されている。そして、第１及び第２凸部５、７全体でも、２方向においてマトリックス状に等間隔となるように配置されている。
また、第２凸部７のうち第２基板６に近接する基端部は、図１（ａ）に示すように、他の部分と比較して太くなっている。なお、第２凸部５の高さは、第１凸部５とほぼ同等となっている。 The second convex substrate 3 is made of, for example, Cu or Al, like the first convex substrate 2, and includes a second substrate 6 and a plurality of second convex portions 7 protruding from the second substrate 6. It has.
The second substrate 6 has a substantially rectangular flat plate shape in plan view. In addition, the 2nd board | substrate 6 is integrally formed with the 2nd convex part 7 by cutting.
The 2nd convex part 7 has a substantially quadrangular prism shape similarly to the 1st convex part 5, and becomes equal intervals in two directions of the surface of the 2nd board | substrate 6, as shown in FIG.1 (b). So that it is erected.
Here, the pitch that is the interval between two adjacent second convex portions 7 is equal to the pitch of the first convex portions 5. And the 1st and 2nd convex parts 5 and 7 are arrange | positioned so that it may become equidistant in zigzag form in two directions. That is, the second convex portion 7 is disposed between the two adjacent first convex portions 5, and the first convex portion 5 is disposed between the two adjacent second convex portions 7. And the 1st and 2nd convex parts 5 and 7 whole are arrange | positioned so that it may become a matrix form at equal intervals in two directions.
Further, the base end portion of the second convex portion 7 that is close to the second substrate 6 is thicker than the other portions, as shown in FIG. Note that the height of the second convex portion 5 is substantially the same as that of the first convex portion 5.

また、第１及び第２凸基板２、３は、第１凸部５が第２基板６と接触すると共に第２凸部７が第１基板４と接触するように対向配置されている。そして、第１及び第２凸基板２、３は、ロウ付けにより接合固定されている。このように接合固定された第１及び第２凸基板２、３の内部空間に冷却水が流動可能となっている。   Further, the first and second convex substrates 2 and 3 are arranged to face each other so that the first convex portion 5 is in contact with the second substrate 6 and the second convex portion 7 is in contact with the first substrate 4. The first and second convex substrates 2 and 3 are bonded and fixed by brazing. The cooling water can flow into the internal spaces of the first and second convex substrates 2 and 3 thus bonded and fixed.

以上のような構成の冷却器１は、例えば図２に示すようなパワーモジュール１０に用いられる。このパワーモジュール１０は、上述の冷却器１と、冷却器１上に設けられた放熱板１１と、放熱板１１上に固着された被冷却部材である絶縁回路基板１２とを備えている。   The cooler 1 having the above configuration is used for a power module 10 as shown in FIG. 2, for example. This power module 10 includes the above-described cooler 1, a heat sink 11 provided on the cooler 1, and an insulated circuit board 12 that is a member to be cooled fixed on the heat sink 11.

放熱板１１は、平面視でほぼ矩形状の平板形状を有しており、例えばＡｌやＣｕ、ＡｌＳｉＣ（アルミシリコンカーバイド）、Ｃｕ−Ｍｏ（モリブデン）などで形成されている。そして、放熱板１１は、熱伝導グリースなどを介して冷却器１に対してネジ１５により固定されている。
絶縁回路基板１２は、絶縁セラミックス２１と、絶縁セラミックス２１の両面に配置された金属層２２、２３とによって構成されており、金属層２２の上面に発熱体である電子部品２５が配置されている。
絶縁セラミックス２１は、例えばＡｌＮ（窒化アルミニウム）やＡｌ２Ｏ３（アルミナ）、Ｓｉ３Ｎ４（窒化シリコン）などの板状のセラミックス材料によって構成されている。 The heat sink 11 has a substantially rectangular flat plate shape in plan view, and is formed of, for example, Al, Cu, AlSiC (aluminum silicon carbide), Cu—Mo (molybdenum), or the like. And the heat sink 11 is being fixed with the screw | thread 15 with respect to the cooler 1 via heat conductive grease.
The insulated circuit board 12 includes an insulating ceramic 21 and metal layers 22 and 23 disposed on both surfaces of the insulating ceramic 21, and an electronic component 25 that is a heating element is disposed on the upper surface of the metal layer 22. .
The insulating ceramic 21 is made of a plate-like ceramic material such as AlN (aluminum nitride), Al 2 O 3 (alumina), Si 3 N 4 (silicon nitride), or the like.

金属層２２、２３は、例えばＡｌのような高熱伝導率を有する金属により形成されており、ロウ付けにより絶縁セラミックス２１に接合固定されている。
金属層２２には、例えばエッチングや打抜き加工などを行うことで、金属層２２を適宜分断した回路が形成されており、電子部品２５がハンダ層２６によって固着されている。ここで、電子部品２５としては、例えば半導体チップが適用可能であり、半導体チップとしてＩＧＢＴ（Insulated Gate Bipolar Transistor）などのパワーデバイスが挙げられる。
そして、金属層２３の下面は、ハンダ層（図示略）を介して放熱板１１に固着されている。
なお、パワーモジュール１０は、放熱板１１を設けずに冷却器１の上面に絶縁回路基板１２を設ける構成としてもよい。 The metal layers 22 and 23 are made of a metal having a high thermal conductivity such as Al, and are bonded and fixed to the insulating ceramic 21 by brazing.
A circuit in which the metal layer 22 is appropriately divided is formed on the metal layer 22 by, for example, etching or punching, and the electronic component 25 is fixed by the solder layer 26. Here, as the electronic component 25, for example, a semiconductor chip can be applied, and examples of the semiconductor chip include power devices such as an IGBT (Insulated Gate Bipolar Transistor).
The lower surface of the metal layer 23 is fixed to the heat sink 11 via a solder layer (not shown).
The power module 10 may have a configuration in which the insulating circuit board 12 is provided on the upper surface of the cooler 1 without providing the heat sink 11.

このような構成の冷却器１によれば、隣り合う２つの第１凸部５の間に第２凸部７を配置することで、第１及び第２凸部５、７をそれぞれ狭ピッチ化させることなく隣り合う第１及び第２凸部５、７のピッチを狭くできる。これにより、複数の第１及び第２凸部５、７による表面積を広くして高い放熱効果を有する冷却器１を容易に製造できる。ここで、第１及び第２凸部５、７がピン状となっているため、複数の第１及び第２凸部５、７による表面積を容易に広くできる。
なお、本実施形態において、第１及び第２凸部５、７は、それぞれ平面視でほぼ矩形状の平板部４ａのうち互いに直交する２辺に沿って等間隔となるように配置されているが、図３に示すように、平板部４ａのうちの２辺に対して傾いた方向に沿って等間隔となるように配置するなど、他の方向に沿って等間隔となるように配置されてもよい。 According to the cooler 1 having such a configuration, by arranging the second convex portion 7 between the two adjacent first convex portions 5, the first and second convex portions 5, 7 are each narrowed in pitch. The pitch of the 1st and 2nd convex parts 5 and 7 which adjoin can be made narrow, without making it. Thereby, the cooler 1 which makes the surface area by the some 1st and 2nd convex parts 5 and 7 wide, and has a high heat dissipation effect can be manufactured easily. Here, since the 1st and 2nd convex parts 5 and 7 are pin-shaped, the surface area by the some 1st and 2nd convex parts 5 and 7 can be enlarged easily.
In the present embodiment, the first and second convex portions 5 and 7 are arranged at equal intervals along two sides that are orthogonal to each other in the substantially rectangular flat plate portion 4a in plan view. However, as shown in FIG. 3, they are arranged at equal intervals along other directions, for example, arranged at equal intervals along the direction inclined with respect to two sides of the flat plate portion 4a. May be.

次に、本発明による冷却器の第２の実施形態を、図面に基づいて説明する。なお、ここで説明する実施形態は、その基本的構成が上述した第１の実施形態と同様であり、上述の第１の実施形態に別の要素を付加したものである。したがって、図４においては、図１と同一構成要素に同一符号を付し、この説明を省略する。   Next, 2nd Embodiment of the cooler by this invention is described based on drawing. The embodiment described here has the same basic configuration as that of the first embodiment described above, and is obtained by adding another element to the first embodiment described above. Therefore, in FIG. 4, the same components as those in FIG.

第２の実施形態における冷却器５０は、第１及び第２凸基板５１、５２に設けられた第１及び第２凸部５、７が等間隔となるように配置されておらず、第１及び第２凸部５、７の配置に粗密の分布が形成されている。すなわち、例えば図４（ｂ）に示すように、複数の第２凸部７は、複数の第１凸部５が等間隔で配置されている２辺からずらして配置されている。そのため、第１及び第２凸部５、７がそれぞれ等間隔で配置されている２方向に対して傾斜する方向において、第１及び第２凸部５、７が相対的に高い密度で配置された領域と、第１及び第２凸部５、７が相対的に低い密度で配置された領域とが形成されている。
ここで、第１及び第２凸部５、７を高い密度で配置すると、この領域を流通する冷却水の流動抵抗が高くなる。したがって、第１及び第２凸部５、７の配置分布に応じて、流動抵抗分布が形成される。そして、相対的に流動抵抗の低い領域に沿って流体である冷却水が流れるため、相対的に流動抵抗の低い領域に沿って流路５３が形成される。 The cooler 50 in the second embodiment is not arranged so that the first and second convex portions 5 and 7 provided on the first and second convex substrates 51 and 52 are equally spaced, and the first A coarse and dense distribution is formed in the arrangement of the second convex portions 5 and 7. That is, for example, as shown in FIG. 4B, the plurality of second convex portions 7 are arranged shifted from the two sides where the plurality of first convex portions 5 are arranged at equal intervals. Therefore, the first and second convex portions 5 and 7 are arranged at a relatively high density in a direction inclined with respect to the two directions in which the first and second convex portions 5 and 7 are arranged at equal intervals, respectively. And a region where the first and second convex portions 5 and 7 are arranged at a relatively low density.
Here, when the 1st and 2nd convex parts 5 and 7 are arrange | positioned with high density, the flow resistance of the cooling water which distribute | circulates this area | region will become high. Accordingly, a flow resistance distribution is formed according to the arrangement distribution of the first and second convex portions 5 and 7. And since the cooling water which is a fluid flows along the area | region where flow resistance is relatively low, the flow path 53 is formed along the area where flow resistance is relatively low.

このような構成の冷却器５０によっても、上述した第１の実施形態と同様の作用、効果を奏するが、第１及び第２凸部５、７の配置を適宜調整して第１及び第２凸部５、７による流動抵抗分布を形成することで、流路５３を形成できる。したがって、流路５３の形状を適宜設定することにより、より高い放熱効果を有する冷却器５０とすることができる。
なお、本実施形態において、第１及び第２凸部５、７の配置に応じた流動分布が形成できれば、一部の第１及び第２凸部５、７を接触するように配置してもよい。 The cooler 50 having such a configuration also provides the same operations and effects as those of the first embodiment described above, but the first and second projections 5 and 7 are appropriately adjusted to adjust the first and second arrangements. The flow path 53 can be formed by forming the flow resistance distribution by the convex portions 5 and 7. Therefore, the cooler 50 having a higher heat dissipation effect can be obtained by appropriately setting the shape of the flow path 53.
In addition, in this embodiment, if the flow distribution according to arrangement | positioning of the 1st and 2nd convex parts 5 and 7 can be formed, even if it arrange | positions so that a part of 1st and 2nd convex parts 5 and 7 may contact. Good.

次に、本発明による冷却器の第３の実施形態を、図面に基づいて説明する。なお、ここで説明する実施形態は、その基本的構成が上述した第１の実施形態と同様であり、上述の第１の実施形態に別の要素を付加したものである。したがって、図５においては、図１（ｂ）と同一構成要素に同一符号を付し、この説明を省略する。   Next, 3rd Embodiment of the cooler by this invention is described based on drawing. The embodiment described here has the same basic configuration as that of the first embodiment described above, and is obtained by adding another element to the first embodiment described above. Therefore, in FIG. 5, the same components as those in FIG.

第３の実施形態における冷却器６０は、第１及び第２凸基板６１、６２に設けられた複数の第１及び第２凸部６３、６４がリブ形状となっている。
第１凸基板６１は、第１基板６５と第１凸部６３とを備えている。
第１基板６５は、箱形状を有しており、平板部６５ａと、平板部６５ａの外周に沿って形成された枠状の壁部６５ｂとを有している。なお、第１凸部６３と第１基板６５を構成する壁部６５ｂのうち平板部６５ａの延在方向と直交する一部を除く他の部分とは、押出成型により一体的に形成されている。
第１凸部６３は、平面視でほぼ矩形状の平板部６５ａの一辺に沿って立設されていると共に、一辺と直交する他辺に沿って等間隔となるように配列されている。 In the cooler 60 according to the third embodiment, the first and second convex portions 63 and 64 provided on the first and second convex substrates 61 and 62 have a rib shape.
The first convex substrate 61 includes a first substrate 65 and a first convex portion 63.
The first substrate 65 has a box shape, and includes a flat plate portion 65a and a frame-like wall portion 65b formed along the outer periphery of the flat plate portion 65a. The first convex portion 63 and the other portion of the wall portion 65b constituting the first substrate 65 except for a portion orthogonal to the extending direction of the flat plate portion 65a are integrally formed by extrusion molding. .
The first convex portions 63 are erected along one side of the substantially rectangular flat plate portion 65a in plan view, and are arranged at equal intervals along the other side orthogonal to the one side.

第２凸基板６２は、第２基板６と第２凸部６４とを備えている。
第２凸部６４は、平面視でほぼ矩形状の第２基板６の一辺に沿って立設されていると共に、一辺と直交する他辺に沿って等間隔となるように配列されている、ここで、第２凸部６４のピッチは、第１凸部６３のピッチと同等となっている。そして、第１及び第２凸部６３、６４は、交互に配置されると共に、隣り合う第１及び第２凸部６３、６４が等間隔となるように配置されている。なお、第２基板６と第２凸部６４とは、押出成型により一体的に形成されている。 The second convex substrate 62 includes a second substrate 6 and a second convex portion 64.
The second convex portions 64 are erected along one side of the substantially rectangular second substrate 6 in plan view, and are arranged at equal intervals along the other side orthogonal to the one side. Here, the pitch of the second convex portions 64 is equal to the pitch of the first convex portions 63. The first and second convex portions 63 and 64 are alternately arranged, and the adjacent first and second convex portions 63 and 64 are arranged at equal intervals. In addition, the 2nd board | substrate 6 and the 2nd convex part 64 are integrally formed by extrusion molding.

このような構成の冷却器６０によっても、上述した第１の実施形態と同様の作用、効果を奏する。   The cooler 60 having such a configuration also provides the same operations and effects as those of the first embodiment described above.

なお、本発明は上記実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲において種々の変更を加えることができる。
例えば、第１及び第２凸部がそれぞれ同じピッチで配置されているが、異なるピッチで配置された第１及び第２凸部を有する第１及び第２凸基板を対向配置した構成としてもよい。
また、第１及び第２凸部をそれぞれ２方向で等間隔となるように配置しているが、等間隔に限らず、第１及び第２凸部の配置パターンは適宜変更してもよい。
そして、第１及び第２凸部を交互に配置しているが、隣り合う２つの一方の凸部の間に複数の他方の凸部を配置してもよい。
さらに、第１及び第２凸部の先端部がそれぞれ第１及び第２基板と接触しているが、非接触であってもよい。
また、第１及び第２凸部は、四角柱形状やリブ形状となっているが、他の形状であってもよい。
そして、第１及び第２凸部は、内部が中空であってもよい。これにより、第１及び第２凸部を打抜により容易に形成することができる。
さらに、水冷式の冷却器としているが、空冷式の冷却器であってもよい。 In addition, this invention is not limited to the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, the first and second convex portions are arranged at the same pitch, but the first and second convex substrates having the first and second convex portions arranged at different pitches may be arranged to face each other. .
Moreover, although the 1st and 2nd convex part is arrange | positioned so that it may become equally spaced in two directions, respectively, the arrangement pattern of the 1st and 2nd convex part may change suitably not only in equal intervals.
And although the 1st and 2nd convex part is alternately arrange | positioned, you may arrange | position a some other convex part between two adjacent one convex parts.
Furthermore, although the front-end | tip part of a 1st and 2nd convex part is contacting the 1st and 2nd board | substrate, respectively, a non-contact may be sufficient.
Moreover, although the 1st and 2nd convex part is a square pillar shape or rib shape, another shape may be sufficient.
The first and second convex portions may be hollow inside. Thereby, the first and second convex portions can be easily formed by punching.
Further, although a water-cooled cooler is used, an air-cooled cooler may be used.

この発明によれば、フィンを狭ピッチ化しても製造が容易な冷却器に関して、産業上の利用可能性が認められる。   According to the present invention, industrial applicability is recognized for a cooler that is easy to manufacture even if the fins have a narrow pitch.

本発明の第１の実施形態における冷却器を示すもので、（ａ）が構成図、（ｂ）が（ａ）のＡ−Ａ矢視断面図である。The cooler in the 1st Embodiment of this invention is shown, (a) is a block diagram, (b) is AA arrow sectional drawing of (a). 図１の冷却器を備えるパワーモジュールを示す構成図であるIt is a block diagram which shows a power module provided with the cooler of FIG. 第１の実施形態における他の凸部の配置状態を示す説明図である。It is explanatory drawing which shows the arrangement | positioning state of the other convex part in 1st Embodiment. 本発明の第２の実施形態における冷却器を示すもので、（ａ）が構成図、（ｂ）が（ａ）のＢ−Ｂ矢視断面図である。The cooler in the 2nd Embodiment of this invention is shown, (a) is a block diagram, (b) is BB arrow sectional drawing of (a). 本発明の第３の実施形態における冷却器を示すもので、（ａ）が構成図、（ｂ）が（ａ）のＣ−Ｃ矢視断面図である。The cooler in the 3rd Embodiment of this invention is shown, (a) is a block diagram, (b) is CC sectional view taken on the line of (a).

符号の説明Explanation of symbols

１，５０，６０ 冷却器
２，６１ 第１凸基板
３，６２ 第２凸基板
４，６５ 第１基板
５，６３ 第１凸部
６ 第２基板
７，６４ 第２凸部 1, 50, 60 Cooler 2, 61 First convex substrate 3, 62 Second convex substrate 4, 65 First substrate 5, 63 First convex portion 6 Second substrate 7, 64 Second convex portion

Claims (4)

第１基板及び該第１基板に突設された複数の第１凸部を有する第１凸基板と、
第２基板及び該第２基板に突設された複数の第２凸部を有する第２凸基板とを備え、
前記第１及び第２凸基板は、前記第１凸部が前記第２基板に向けて突出して前記第２凸部が前記第１基板に向けて突出すると共に、隣り合う２つの前記第１凸部の間に少なくとも１つの前記第２凸部が配置されるように対向配置されていることを特徴とする冷却器。 A first convex substrate having a first substrate and a plurality of first convex portions protruding from the first substrate;
A second substrate and a second convex substrate having a plurality of second convex portions projecting from the second substrate;
In the first and second convex substrates, the first convex portion protrudes toward the second substrate and the second convex portion protrudes toward the first substrate, and two adjacent first convex portions The cooler is disposed so as to face each other so that at least one second convex portion is disposed between the portions. 前記複数の第１及び第２凸部が相対的に高い密度で配置された領域と、該複数の第１及び第２凸部が相対的に低い密度で配置された領域とを有することを特徴とする請求項１に記載の冷却器。   The plurality of first and second convex portions have a region arranged with a relatively high density, and the plurality of first and second convex portions have a region arranged with a relatively low density. The cooler according to claim 1. 前記第１及び第２凸部が、ピン状であることを特徴とする請求項１または２に記載の冷却器。   The cooler according to claim 1 or 2, wherein the first and second convex portions are pin-shaped. 前記第１及び第２凸部が、リブ状であることを特徴とする請求項１または２に記載の冷却器。   The cooler according to claim 1 or 2, wherein the first and second convex portions are rib-shaped.
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