TWM512210U - Chip implantation conductive platen structure - Google Patents

Description

Wafer implantation pressure guiding disc structure

The present invention relates to a semiconductor process equipment, and more particularly to the technical field of pressing a wafer into a rubber sheet.

Referring to FIG. 7 and FIG. 8 , the general passive component is subjected to a silver plating process, and the wafer 5 is usually implanted on a rubber sheet 6 via a wafer implanter, and then the rubber sheet 6 is loaded into the passive sheet 6 . Dip the silver on the silver machine.

When the wafer 5 is implanted in the rubber sheet 6, the conventional implanting plate 7 is usually arranged below/above the machine table, and a conventional pressure plate 8 is mounted above/below the machine table, and The implanting plate 7 and the pressure plate 8 are respectively provided with a positioning device 72, a receiving hole 71, 81, and the receiving hole 71 of the implanting plate 7 is pre-positioned with the wafer 5 after the shaking device, and then the empty rubber plate is placed. 6 placed on the implant plate 7, through the implant plate 7, the platen 8 is accurately closed by the positioning device to clamp the empty rubber plate 6, the plurality of punch needles 9 on the needle bed of the machine table The accommodating holes 71 corresponding to the implanting plate 7 are inserted into the accommodating holes 71 corresponding to the implanting plate 7, and the wafers 5 are pushed into the pinning holes 61 provided in the rubber plate 6.

The accommodating holes 71 and 81 of the above-mentioned implanted plate 7 and platen 8 are usually formed by mechanical drilling of the integrated plate bodies 70 and 80. However, in view of the increasingly small trend of passive components in the future, It is not conducive to the drilling of the tool on the integrated plate body 70, 80. Even if the tool can be drilled, the tool must be divided into small and special materials, and the positional accuracy required for the holes 71 and 81 is required. Special attention should be paid to the positional accuracy problem, resulting in the receiving hole 71. The processing cost of 81 is very high.

In view of the above-mentioned conventional integrated implant plate 7, the processing holes 71, 81 of the platen 8 are difficult to process The problem is that the creator of the present invention has developed a wafer-embedded pressure-conducting disk structure. Therefore, the main purpose of the present invention is to provide a wafer implantation pressure guide which is easy to process, has a low manufacturing cost, and has an accurate hole position and is not easily broken. The disc structure is designed to provide a smaller, more wafer implant to conform to the trend of passive component wafer miniaturization.

In order to achieve the above object, the present invention utilizes the following technical means: a wafer-embedded pressure-conducting disk structure includes: a wafer-embedded pressure-conducting disk structure for use in pressing a plurality of wafers into a rubber sheet, The pressure guiding plate is composed of a plurality of layers, and the layer system further comprises a plurality of layer through holes, and the layer through holes of each layer correspond to each other, and the through holes of each layer are etched. The processing is formed such that the corresponding layer through holes form a receiving hole. Further, each of the receiving holes of the pressure guiding plate is made finer, thereby providing a finer and more wafer placement, so as to facilitate the subsequent wafer silvering operation.

The plurality of accommodating holes of the pressure guiding disk form a plurality of accommodating regions, and a plurality of first non-accommodating regions are formed between the plurality of accommodating regions, and each accommodating region of the pressure guiding plate is formed. There are a plurality of second non-receiving regions, and the plurality of fixing holes, the coupling holes, the first positioning device or the second positioning device can be disposed on the non-receiving regions.

The accommodating hole of the pressure guiding plate is formed in a straight hole shape, and the lining is used to accommodate the wafer, thereby forming the pressure plate of the present invention; and the two sides of the pressure plate are respectively disposed in the first non-accommodating area. First positioning device.

The accommodating hole of the pressure guiding disc is formed in a shape including a first tapered portion and a second tapered portion. According to the cymbal, the accommodating hole is accommodated and the wafer is loaded, and the accommodating needle is inserted under the accommodating hole. Forming the guide disc of the present invention; and the second non-receiving area of the guide disc is respectively provided with a second positioning device, and the second positioning device is corresponding to the first of the platen The positioning device is configured to align the receiving holes of the pressure plate with the receiving holes of the guiding hole.

The second positioning device of the guiding disc further comprises an upper positioning post and a lower positioning The column, and the upper positioning column and the lower positioning column are in a distance difference manner, and the positioning position of the guiding plate is placed on the needle bed of the machine table.

[This new type]

A‧‧‧Guide

B‧‧‧ Platen

1‧‧‧ dish

11‧‧‧Receiving area

12a, 12b‧‧‧ accommodating holes

121‧‧‧First cone

122‧‧‧Second cone

123‧‧‧Class Department

13‧‧‧First non-receiving area

131‧‧‧Fixed holes

132a, 132b‧‧‧ bonding holes

14‧‧‧Second non-receiving area

2‧‧‧layer

21‧‧‧layer through hole

22‧‧‧layer bonding holes

23‧‧‧layer fixing holes

3‧‧‧First positioning device

4‧‧‧Second positioning device

41‧‧‧Upper positioning column

42‧‧‧ positioning column

[study]

5‧‧‧chip

6‧‧‧ Rubber board

61‧‧‧In the hole

7‧‧‧ implanted board

70‧‧‧Integrated board

71‧‧‧ accommodating holes

72‧‧‧ Positioning device

8‧‧‧ Platen

80‧‧‧Integrated board

81‧‧‧ accommodating holes

9‧‧‧punching needle

Figure 1 is a perspective view of the structure of the novel guide disk.

Figure 2 is a side view of the novel guide disc structure and its top, partial cross-sectional view.

Figure 3 is an enlarged cross-sectional view showing the combination of the receiving holes of the novel guide disk structure.

Figure 4: is a side view of the new platen structure and its top view.

Fig. 5 is an enlarged sectional view showing a combination of fixing holes of the new platen structure.

Figure 6 is an enlarged cross-sectional view showing the combination of the receiving holes of the new platen structure.

Figure 7 is a perspective view of a conventional guide disc structure.

Figure 8 is a schematic illustration of a conventional guide disk structure for implanting a wafer into a rubber sheet.

The present invention relates to a wafer implantation pressure guiding disc structure, which can basically be used as a guiding disc A or a pressing disc B. As shown in FIG. 1 to FIG. 3, it is a guiding disc A, and 4 to FIG. 7 is a platen B, and the guide disk A is engaged with the platen B. As in the prior art, the wafer implantation operation mode is disclosed, and after the plurality of wafers are implanted in the rubber plate, The plurality of wafers can be subjected to subsequent silver staining operations.

The guide plate A, as shown in FIG. 2 and FIG. 3, is formed by stacking a plurality of laminated bodies 2, and the laminated body 2 is pre-etched with a plurality of layer through holes 21 and layer bonding holes 22 in advance. The plurality of layer through holes 21 are more in number, and then aggregate into a plurality of accommodating regions, and the regions not etched into holes are non-accommodating regions, and each of the layer plates 2 is basically provided with four The layer is combined with the hole 22, and the plurality of layer plates 2 are accurately aligned and stacked to form the guide disk A.

Therefore, the plurality of accommodating holes 12a of the guide disk A are formed into a plurality of accommodating regions 11, and a plurality of first non-receiving regions 13 are formed between the plurality of accommodating regions 11, and the guiding disk is further formed. A plurality of second non-receiving regions 14 are formed in each of the accommodating regions 11 of the A, so that the plurality of fixing holes 131 and the second positioning device 4 can be disposed on the non-receiving regions.

Therefore, the layer through holes 21 of the respective plate bodies 2 form the receiving holes 12a of the guide disk A, and the layer bonding holes 22 of the respective plate bodies 2 form the coupling holes 132a of the respective guide disks A, wherein the four The coupling holes 132a are straight holes for respectively inserting into the two upper positioning posts 41 and the two lower positioning posts 42 of the second positioning device 4 (as shown in FIG. 2 ), and the upper positioning posts 41 and the lower positioning posts 42 . In the case of a distance difference, the guide plate is placed on the needle bed of the machine. In particular, the layer bonding holes 22 of the respective layer bodies 2 are inconsistent in size, as shown in FIG. 3, and some are tapered holes, so that the receiving holes 12a form a first tapered portion 121 and a second tapered portion. The portion 122 and the first portion 123, wherein the first tapered portion 121 facilitates the shaking of the wafer into the step portion 123, and the second tapered portion 122 is matched with the shape of the needle of the needle bed to facilitate the needle actuation. The wafer is inside the rubber sheet.

The platen B, as shown in FIG. 4 to FIG. 6, is formed by stacking a plurality of laminated bodies 2, and the laminated body 2 is pre-etched with a plurality of layer through holes 21 and layer bonding holes 22 in advance. The layer fixing hole 23, and the plurality of layer through holes 21 are more in number, and then aggregated into a plurality of accommodating areas, and the area not etched into holes is a non-accommodating area, and each layer board 2 is basically Two layers of bonding holes 22 are disposed thereon, and the plurality of layer plates 2 are accurately aligned and stacked to form the platen B.

Therefore, the plurality of accommodating holes 12b of the platen B are formed into a plurality of accommodating regions 11, and a plurality of first non-receiving regions 13 are formed between the plurality of accommodating regions 11, and the platen B is further A plurality of second non-receiving regions 14 are formed in each of the accommodating regions 11, so that the plurality of fixing holes 131 and the first positioning device 3 can be disposed on the non-receiving regions.

Therefore, the layer through hole 21 of each layer 2 forms the receiving hole 12b of the platen B, and the layer bonding hole 22 of each layer 2 forms the bonding hole 132b of each platen B, wherein the two combinations The holes 132b are straight holes for being respectively inserted into a first positioning device 3 (as shown in FIG. 4), and the layer fixing holes 23 of each layer 2 are set to be large and small, and are to be stacked. The fixing hole 131 is further formed after each layer body 2, and the fixing hole 131 can be inserted into the screw head (as shown in FIG. 5), and the pressure plate B is mounted on the machine table. In particular, the layer bonding holes 22 of the respective layer bodies 2 are uniform in size, so that the receiving holes 12b are formed in a straight hole shape (as shown in FIG. 6), so that the punching needles actuate the wafer in the rubber sheet.

In summary, the novel wafer is embedded in the pressure guiding disc structure, and the main guiding disc structure comprises a guiding disc A or a pressing disc B, and the guiding disc A or the pressing disc B is composed of a plurality of layers. The plate body is formed, and each layer plate body has a plurality of layer through holes and a plurality of layer bonding holes/layer fixing holes in an etching manner. When the plate bodies of the respective layers are assembled and combined into the guide plate A or the platen B, each layer plate body The layer through hole and the layer bonding hole/layer fixing hole respectively form a plurality of receiving holes, bonding holes/fixing holes, thereby achieving the effects of reduction in manufacturing cost, easy processing, difficulty in breaking the needle, and accurate hole position. In order to provide a smaller and more wafer implant, in order to meet the trend of miniaturization of passive component wafers, and its structure has not been seen in various books or public use, it is in line with the requirements of new patent applications, please ask the Bureau to identify, and grant patents as soon as possible. As for the praying; the need to be clear, the above is the specific embodiment of the new model and the technical principles applied, if the changes made according to the concept of the new model, the functional role produced by it does not exceed the specification and Mental time covered by , should be within the scope of this new type, combined with Chen Ming.

A‧‧‧ implanted guide disk

1‧‧‧ dish

11‧‧‧Receiving area

13‧‧‧First non-receiving area

14‧‧‧Second non-receiving area

4‧‧‧Second positioning device

Claims (10)

The invention relates to a wafer embedding pressure guiding disc structure, which is used for pressing a plurality of wafers into a rubber sheet, wherein the pressure guiding disc is composed of a plurality of laminating plates, and the laminating system further comprises plural numbers. The layer through holes and the layer through holes of the respective plate bodies correspond to each other, and the through holes of the respective layers are formed by etching, so that the corresponding layer through holes form a receiving hole. The wafer-embedded pressure-conducting disk structure according to the first aspect of the invention, wherein the plurality of accommodating holes of the pressure-guiding disk form a plurality of accommodating regions, and a plurality of the plurality of accommodating regions are formed between the plurality of accommodating regions. A non-receiving area. The wafer-embedded pressure-conducting disk structure according to claim 2, wherein a plurality of second non-receiving regions are formed in each of the accommodating regions of the pressure-guiding disk. The wafer-embedded pressure-conducting disk structure according to the first aspect of the patent application, wherein the receiving hole of the pressure-guiding disk is formed in a straight hole shape, and accordingly, the wafer is accommodated. The wafer-embedded pressure-conducting disk structure according to the fourth aspect of the invention, wherein the first non-accommodating area of the pressure guiding plate is provided with a plurality of fixing holes and coupling holes. The wafer is embedded in the pressure guiding disc structure according to the first, second, third, fourth or fifth aspect of the patent application, wherein the first non-receiving area of the pressure guiding disc is respectively provided with a first positioning device. . The wafer-embedded pressure-conducting disk structure according to the first aspect of the invention, wherein the receiving hole of the pressure-guiding disk is set to have a first tapered portion and a second tapered portion, and is accordingly accommodated and The wafer is loaded, and the insertion hole is inserted under the receiving hole. The wafer-embedded pressure-conducting disk structure according to claim 7, wherein the first tapered portion and the second tapered portion of the pressure-guiding disk are set to have the same or different combinations of apertures. The wafer is embedded in the pressure guiding disc structure according to the first, second, third, seventh or eighth aspect of the patent application, wherein the second non-receiving area of the pressure guiding disc is respectively provided with a second positioning device. . According to claim 9 of the patent application scope, the wafer is embedded in the pressure guiding disc structure, wherein the second setting The bit device further includes at least one upper positioning post and at least one lower positioning post, and the upper positioning post and the lower positioning post are in a distance difference manner.