TWM506367U - Chip implant structure module - Google Patents

Description

Wafer implant structure module

The invention relates to a semiconductor process equipment, in particular to a needle bed module for pressing a wafer into a rubber sheet.

Referring to FIG. 10 to FIG. 12, generally, the passive component is subjected to a silver plating process, and the wafer 5 is usually implanted on a rubber sheet 6 via a wafer implanter (FIG. 12), and then The rubber sheet 6 is placed on a dipstick machine for silver staining.

Moreover, when the wafer 5 is implanted in the rubber sheet 6, the conventional implanted board 7 is usually placed on the needle bed module 4, and the needle bed module 4 is disposed below/above the machine table. A conventional pressing plate 8 is arranged above/below the machine table, and the implanting plate 7 and the pressing plate 8 are respectively provided with positioning means, receiving holes 71, 81, and the receiving hole 71 of the implanting plate 7 is vibrated After the process of the device, the wafer 5 is pre-positioned, and then an empty rubber sheet 6 is placed on the implant plate 7. The implant plate 7 and the pressure plate 8 are accurately closed by the positioning device to clamp the empty space. After the rubber sheet 6, the plurality of punching pins 9 on the needle bed of the machine board are inserted into the corresponding receiving holes 71 of the implanting plate 7, and then the respective wafers 5 are pushed against the clips provided by the rubber sheet 6. Inside the hole 61.

Referring to FIG. 11 , the receiving hole 411 of the upper plate 41 of the needle bed module 4 is generally formed by mechanical drilling, and the passive component is more and more small in the future. The trend will not be conducive to the drilling of the tool on the one-piece board. Even if the tool can be drilled, the tool must be divided into small and special materials, and the positional accuracy required for the hole 411 is required. Special attention should also be paid to the positional accuracy problem, so that the processing of the receiving hole 411 is performed. The cost is very high.

In view of the difficulty in processing the accommodating hole 411 of the conventional integrated upper plate 41, the creator of the present invention has developed a wafer-implanted structural module, so the main purpose of the novel is to provide easy processing and low processing cost. The wafer-implanted structural module with accurate hole position and easy to break the needle is provided to provide a finer and larger number of wafer implants, thereby reducing the manufacturing cost of the wafer to meet the trend of miniaturization of passive component wafers.

In order to achieve the above object, the present invention utilizes the following technical means: a wafer-implanted structural module, comprising: an upper plate, which is connected to a first plate and connected with a multi-layer plate, and the upper plate is formed with a plurality of plates. a plurality of first bonding holes, second bonding holes and guiding members are arranged in the non-punching area; and a bottom plate is formed on a second plate body a punching needle zone and a non-punching zone, wherein a plurality of punching needles are arranged in each of the punching needle zones, and a plurality of third joint holes, an elastic device and a guide pillar are arranged in the non-punching needle zone, wherein the elastic device is connected a second coupling hole of the upper plate, and the guide post is corresponding to the guiding member. Furthermore, the accommodating holes of the upper and lower plates of the present invention are made finer, and more and finer wafers are implanted in the rubber plates to facilitate the subsequent silver plating process.

The multi-layer board is composed of a plurality of layers, and the layer system further comprises a plurality of layer through-holes, and the layer through-holes of the layers of the layers are corresponding to each other and the inner diameters are uniform, and each layer of the through-holes The through holes of the corresponding layers form an accommodating hole, and the underside of the accommodating hole is provided for the punching needle to be inserted.

The lower root portion of the plurality of punching needles is fixed to the plurality of class holes provided in the bottom plate, and the upper portion of the plurality of punching pins is inserted into the receiving holes of the multilayer plate.

The first bonding hole of the multi-layer board is a class hole (fish eye hole) formed by the layer bonding holes provided in each layer plate corresponding to each other and having an inner diameter difference, and the multi-layer board is locked to The first plate.

The plurality of guiding members of the upper plate are disposed on two sides and respectively disposed on two sides of the upper plate, and the guiding member has a perforation, and the guiding columns of the bottom plate are set to two and are respectively disposed on the The two sides of the bottom plate, and each of the guide posts is nested in the perforation of the corresponding guiding member, so that the upper plate can be accurately sleeved on the lower plate, and the punching area of the upper plate and the lower plate is The hole is placed for precise alignment.

The present invention relates to a wafer implant structure module, which can basically be a lower needle bed structure module 1a or an upper needle bed structure module 1b. As shown in FIG. 1 to FIG. 6, the lower needle bed is used. The structure module 1a, as shown in FIG. 7 to FIG. 9, wherein the lower needle bed structure module 1a is fitted with an upper pressure plate and mounted on the machine table, as disclosed in the prior art, the wafer implantation operation mode is closed. The lower needle bed structure module 1a and the upper pressure plate (equivalent to the conventional pressure plate 8), and after the plurality of wafers are implanted in the rubber sheet, the plurality of wafers can be subjected to subsequent silver staining operations. Similarly, the upper needle bed structure module 1b, the lower pressure plate (equivalent to the conventional pressure plate 8) and mounted on the machine table, close the upper needle bed structure module 1b, the lower pressure plate, and implant a plurality of wafers. After the rubber sheet, the plurality of wafers can be subjected to subsequent silver staining operations. The lower needle bed structure module 1a mainly includes an upper plate 10, a bottom plate 20 and a plurality of positioning members 30. Further, the components included in the present invention are respectively described as follows:

The upper plate 10, as shown in FIG. 2, is connected to a first plate body 11 to be connected with a multi-layer plate 12, and the upper plate 10 is formed with a plurality of punching needle regions 13 and a non-punching needle region 14, and A plurality of first coupling holes 15, second coupling holes 16, and guides 17 are disposed in the non-punching area 14. The multi-layer board 12 is formed by stacking a plurality of layer boards 121, as shown in FIG. 5B, and the layer board 121 further includes a plurality of layer through holes 1211, and layers of each layer board 121. The through holes 1211 are corresponding to each other and have the same inner diameter, and the through holes 1211 of each layer are processed into a very small predetermined fine hole by etching, so that the corresponding layer through holes 1211 are stacked to form a corresponding one. The hole 122 is accommodated, and the receiving hole 122 is inserted into the corresponding punching pin 24 at the bottom of the hole. Further, the first bonding hole 15 of the multilayer board 12 is a class hole formed by the layer bonding holes 123 provided in the respective board bodies 121 corresponding to each other and having an inner diameter difference (the fish eye hole shown in FIG. 5A). However, the second bonding hole 16 of the multilayer board 12 is set as a class hole or a straight hole. In addition, the plurality of guiding members 17 of the upper plate 10 are two and are respectively disposed on two sides of the upper plate 10, and the guiding members 17 have a through hole 171.

The bottom plate 20, as shown in FIG. 2, is also formed on a second plate body 21 with a plurality of punching regions 22 and non-punching regions 23, wherein a plurality of punching pins 24 are connected to each of the punching regions 22. The plurality of third bonding holes 25, the elastic device 26 and the guide post 27 are disposed in the non-punching region 23, wherein the elastic device 26 is connected to the second bonding hole 16 of the upper plate 10, and the guiding column 27 is obtained. Corresponding to the guide member 17 mounted on the upper plate 10. Further, the bottom end of the plurality of punch pins 24 is fixed to the plurality of class holes 28 provided in the bottom plate 20 (as shown in FIG. 5C), and the top ends of the plurality of punch pins 24 respectively penetrate the first plate. The body 11 is inserted into the receiving hole 122 of the multilayer board 12. Further, the guide posts 27 of the bottom plate 20 are disposed on two sides of the bottom plate 20, and the guide posts 27 are nested in the through holes 171 of the corresponding guiding members 17 (see FIG. 3). . and

The plurality of positioning members 30 are generally disposed at two sides and respectively connected to the two sides of the upper plate 10, and each of the positioning members 30 is formed with a shape of a guiding arc for inserting a lower implant plate with a wafer therein. 7. The precision alignment of the rubber sheet 6 and the like is as shown in FIG. 6 so that the clamping holes of the lower implanting plate 7 and the rubber sheet 6 can be aligned with the punching of the lower needle bed structure module 1a.

Therefore, the lower needle bed structure module 1a of the present invention is constituted by the above-mentioned members. As shown in FIG. 1, FIG. 5 and FIG. 6, in the manufacture, the bottom plate 20 is processed with a plurality of class holes 28, and the class holes are formed. 28俾 for assembling the bottom of the plurality of punching pins 24, thereby forming a plurality of punching holes 22, and then providing a plurality of elastic devices 26, third coupling holes 25 and guide posts 27 below the non-punching regions 23, and the upper portion The plate 10 is processed with a plurality of receiving holes 122 and formed into a plurality of punching holes 13 , and a plurality of first bonding holes 15 , second bonding holes 16 and guiding members are processed in the non-punching region 14 of the upper plate 10 . 17. The guide posts 27 of the bottom plate 20 are inserted into the through holes 171 of the corresponding guide members 17 of the upper plate 10 in advance, so that the punching regions 13 and 22 of the upper plate 10 and the bottom plate 20 can be achieved. The precise alignment between the regions 14 and 23, that is, the punching pins 24 installed on the bottom plate 20 are accurately positioned in the receiving holes 122 in the punching region 13 of the upper plate 10, so that the novel structural module is used for the seeding operation. At this time, the punching needle 24 can be prevented from being broken by the upper plate 10. Finally, a connecting rod 261 is disposed on each elastic device 26 to be coupled to the second coupling hole 16 of the upper plate 10, and is coupled to the corresponding first coupling hole 15 of the upper plate 10 by a plurality of screws. The third coupling hole 25 of the bottom plate 20 can be assembled into the lower needle bed structure module 1a.

Referring to FIG. 5 and FIG. 6 , in the present invention, the lower needle bed structure module 1 a and the upper pressure plate 8 are respectively disposed on the machine table, and then the lower implant plate 7 and the rubber plate 6 are sequentially borrowed. The plurality of positioning members 30 are introduced on a multi-layer board 12 of the upper board 10, and then the machine table is actuated to press the pressing board 8 to press the rubber board 6, the lower implant board 7 containing the wafer, and then press the new type. The upper plate 10 of the lower needle bed structure module 1a is such that the upper plate 10 is pressed down and flattened to the bottom plate 20, so that the front ends of the punching pins 24 on the bottom plate 20 respectively penetrate the upper plate 10 and the lower implant plate 7 respectively. The receiving hole 122 further pushes the wafer into the clamping hole of the rubber sheet 6.

For the same reason, as shown in FIG. 7 to FIG. 9 , the components of the upper needle bed structure module 1 b are also substantially the same as the lower needle bed structure module 1 a , and the upper needle bed structure module 1 b is in use. The upper needle bed structure module 1b and the lower pressure plate (known members) are respectively disposed on the machine table, and then the lower implant plate and the rubber plate (preferred member) are sequentially placed on the lower pressing plate. Then, the machine has actuated the upper needle bed structure module 1b to press the implanted plate and the rubber plate containing the wafer, so that the upper plate 10 of the upper needle bed structure module 1b is pressed upwardly to flatten the bottom plate 20 The front ends of the punching pins 24 on the bottom plate 20 respectively penetrate the receiving holes 122 of the upper plate 10 and the lower implanting plate (as shown in FIG. 9A1), thereby pushing the wafer into the clamping holes of the rubber plate.

In summary, the present invention relates to a wafer implant structure module, which can achieve the advantages of easy processing, low processing cost, and accurate hole position to ensure that the punch needle is not easily broken, and is advantageous for a smaller and larger number of wafer implants. In a rubber sheet, the manufacturing cost of the crystallizing operation is reduced to meet the trend of miniaturization of the passive component wafer, and its constituent structure has not been seen in the publications or public use. It is in line with the requirements of the new patent application, and is requested to be approved by the bureau. Patent, for the purpose of praying; need to be clear, the above is the specific embodiment of the new model and the technical principles applied, if the changes made according to the concept of the new model, the functional role produced by it does not exceed the specification And the spirit covered by the schema should be combined with Chen Ming within the scope of this new model.

[This new type]
1a‧‧‧Down bed structure module
1b‧‧‧Upper bed structure module
10‧‧‧Upper board
11‧‧‧ first board
12‧‧‧Multilayer board
121‧‧‧layer
122‧‧‧ accommodating holes
1211‧‧‧layer through hole
123‧‧‧ layer bonding hole
13‧‧‧punching area
14‧‧‧Non-punching area
15‧‧‧First junction hole
16‧‧‧Second junction hole
17‧‧‧Guide
171‧‧‧Perforation
20‧‧‧floor
21‧‧‧Second plate
22‧‧‧punching area
23‧‧‧Non-punching area
24‧‧‧punching needle
25‧‧‧ third junction hole
26‧‧‧Flexible device
261‧‧‧ Connecting rod
27‧‧‧ Guide column
28‧‧‧ class holes
30‧‧‧ Positioning parts [知知]
4‧‧‧ Needle bed module
41‧‧‧Upper board
411‧‧‧ accommodating holes
42‧‧‧floor
5‧‧‧chip
6‧‧‧ Rubber board
61‧‧‧Clamping holes
7‧‧‧ implanted board
70‧‧‧Integrated board
71‧‧‧ accommodating holes
8‧‧‧ pressure plate
80‧‧‧Integrated board
81‧‧‧ accommodating holes
9‧‧‧punching needle

Figure 1: is a three-dimensional appearance of the new type of needle bed structure module. Figure 2: An exploded view of the new lower needle bed structure module. Figure 3: is a top view of the new lower needle bed structure module. Figure 4: is a side view of the new lower needle bed structure module. Fig. 5 is a cross-sectional view showing a portion A, B, and C of Fig. 4 described above. Figure 6 is a schematic diagram of the operation of the new lower needle bed structure module. Figure 7: is a bottom view of the new upper needle bed structure module. Figure 8 is a side view of the new upper needle bed structure module. Fig. 9 is a cross-sectional view showing a part of A1, B1, and C1 of Fig. 8 of the present invention. Figure 10 is a view of a conventional wafer implant structure module. Figure 11 is a cross-sectional view of a portion of the conventional wafer implant structure module B2 of Figure 10 above. Figure 12 is a schematic illustration of a conventional wafer implant structure module for implanting a wafer into a rubber sheet.

1a‧‧‧Down bed structure module

10‧‧‧Upper board

12‧‧‧Multilayer board

13‧‧‧punching area

14‧‧‧Non-punching area

17‧‧‧Guide

20‧‧‧floor

21‧‧‧Second plate

24‧‧‧punching needle

26‧‧‧Flexible device

30‧‧‧ Positioning parts

Claims (7)

A wafer implant structure module includes: an upper plate, a multi-layer plate is connected to a first plate body, and the upper plate is formed with a plurality of punching needle regions and non-punching needle regions, and The non-punching needle region is provided with a plurality of first bonding holes, second bonding holes and guiding members; and a bottom plate is formed on a second plate body to form a plurality of punching needle regions and non-punching needle regions, wherein each a plurality of punching pins are arranged in the punching needle zone, and a plurality of third bonding holes, an elastic device and a guiding column are arranged in the non-punching needle zone, wherein the elastic device is connected to the second bonding hole of the upper plate, and the guiding device The column corresponds to the guide. The wafer-implanted structural module according to claim 1, wherein the multi-layered board is composed of a plurality of layers, and the layer system further comprises a plurality of layer through-holes, and the layers of the layers are penetrated. The holes are corresponding to each other and have the same aperture, and the through-holes of each layer are processed by etching, so that the corresponding layer through-holes form a receiving hole, and the lower part of the receiving hole is provided for punching Nested. The wafer-implanted structure module according to claim 2, wherein the lower portion of the plurality of punch pins is fixed to the plurality of class holes provided in the bottom plate, and the plurality of punch pins are nested above the plurality of punch pins. The receiving hole of the board. The wafer-implanted structure module according to claim 2, wherein the first bonding hole of the multi-layer board is a combination of the layer holes formed by the layer plates of the respective layer plates and the hole diameters are inconsistent. . The wafer-implanted structural module according to claim 1, 2, 3 or 4, wherein the plurality of guiding members of the upper plate are two and are respectively disposed on two sides of the upper plate. The wafer-implanted structural module according to claim 5, wherein the guiding member has a perforation. The wafer-implanted structural module according to claim 6, wherein the guide post of the bottom plate is set to be two and respectively disposed on two sides of the bottom plate, and each guide post is nested in the corresponding guide member. Inside the perforation.